CN106785802B - A kind of compression bonding method of the highly dense connector of welding-free type - Google Patents

A kind of compression bonding method of the highly dense connector of welding-free type Download PDF

Info

Publication number
CN106785802B
CN106785802B CN201611251365.7A CN201611251365A CN106785802B CN 106785802 B CN106785802 B CN 106785802B CN 201611251365 A CN201611251365 A CN 201611251365A CN 106785802 B CN106785802 B CN 106785802B
Authority
CN
China
Prior art keywords
die
connector
circuit board
printed circuit
tank
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201611251365.7A
Other languages
Chinese (zh)
Other versions
CN106785802A (en
Inventor
王芳
李绘娟
劳文贞
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuhan Institute Of Digital Engineering (china Shipbuilding Industry Corp Seventh 0 Nine Institute)
Original Assignee
Wuhan Institute Of Digital Engineering (china Shipbuilding Industry Corp Seventh 0 Nine Institute)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wuhan Institute Of Digital Engineering (china Shipbuilding Industry Corp Seventh 0 Nine Institute) filed Critical Wuhan Institute Of Digital Engineering (china Shipbuilding Industry Corp Seventh 0 Nine Institute)
Priority to CN201611251365.7A priority Critical patent/CN106785802B/en
Publication of CN106785802A publication Critical patent/CN106785802A/en
Application granted granted Critical
Publication of CN106785802B publication Critical patent/CN106785802B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/20Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
    • H01R43/24Assembling by moulding on contact members

Abstract

The invention discloses the compression bonding methods of the highly dense connector of welding-free type, key is the design of frock clamp, the frock clamp includes tank (6), lower die (5) and upper die (2), these frock clamps are applied to the compression bonding method that a kind of highly dense connector of welding-free type is formed in the crimping of connector again, the highly dense connector of welding-free type can be quickly and accurately crimped, and run a crimping process to complete the crimping of the highly dense connector of multiple welding-free types.

Description

A kind of compression bonding method of the highly dense connector of welding-free type
Technical field
The present invention relates to the assembling process technique fields of circuit board, and in particular to a kind of crimping of the highly dense connector of welding-free type Method.
Background technique
Currently, the highly dense connector of welding-free type is to be crimped the pin of connector by press machine with the connection of printed circuit board Into the hole of printed circuit board, forming interference fit connects it closely, the work that crimping is welded again later before eliminating Sequence saves labour and raw material, improves efficiency, while decreasing welding process high temperature and rushing to printed circuit board It hits, improves product quality.However since the aperture on printed circuit board to be crimped is too small, the pin number of connector is inclined More, density is bigger than normal, and in crimping, lower die and printed circuit board slightly have deviation, one or more pin of connector will become Shape causes connector and printed circuit board to be damaged, while the contraposition of lower die and printed circuit board also gives crimping process to increase Time cost.Therefore, how under the premise of both can guarantee crimp quality, moreover it is possible to which improving production efficiency just seems especially heavy It wants.
Summary of the invention
In view of this, can quickly and accurately be pressed the present invention provides a kind of compression bonding method of the highly dense connector of welding-free type The highly dense connector of welding-free type is connect, and run a crimping process to complete the crimping of the highly dense connector of multiple welding-free types.
The present invention is achieved through the following technical solutions:
A kind of compression bonding method of the highly dense connector of welding-free type, this method are based on a kind of including tank, lower die and upper die Frock clamp implement, which includes the following steps:
The design and manufacture of step 1) frock clamp, the frock clamp include tank, lower die and upper die, the tank Interior cavity is identical with the outer dimension of lower die and the outer dimension of printed circuit board to be crimped, and is arranged on the lower die Have multiple with the hole heart position in hole to be crimped on printed circuit board and the consistent hole of quantity, the lower surface setting of the upper die is more A link block being connect with connector;
Step 1) lies in a horizontal plane in the tank in step 1) on the platform of press-connection machine, and the lower die in step 1) is put into In the inner volume of tank, then printed circuit board to be crimped is placed on lower die;
Step 2) by the pin to crimp connector be inserted into corresponding printed circuit board wait crimp in hole, then will be in step 1) Upper die the top surface to crimp connector is placed on by link block;
Assembled tank is pushed to the underface of press-connection machine head by step 3);
Step 4) starts press-connection machine, and pressure head, which moves downward, presses down on upper die, so that the pin of connector is pressed into print In the hole of circuit board processed, forming interference fit connects it closely, that is, completes the connection of connector and printed circuit board.
Cavity in the tank is identical with the outer dimension of lower die and the outer dimension of printed circuit board to be crimped, It is provided on the lower die multiple with the hole heart position in hole to be crimped on printed circuit board and the consistent hole of quantity, the upper pressure Multiple link blocks connecting with connector are arranged in the lower surface of mould.
In above-mentioned compression bonding method, in order to make printed circuit board and lower die can be realized accurate contraposition, it is necessary to guarantee to hold Cavity in slot is identical with the outer dimension of lower die and the outer dimension of printed circuit board to be crimped, and sets on lower die It is equipped with multiple with the hole heart position in hole to be crimped on printed circuit board and the consistent hole of quantity.
Further, the two sidewalls and both ends of tank are respectively arranged with baffle, the gear in the step 1)~step 3) The length of plate is less than the side wall where baffle or the length of end, the sum of the thickness of the baffle and tank side wall compare printed circuit Lower die and printed circuit board both can be fixed on appearance by the sum of the thickness of the thickness of plate and lower die big 2mm, such design In slot, disassembly also can be convenient.
Further, multiple grooves are additionally provided in the bottom surface of the tank, the groove is arc or rectangle, such Design can mitigate the weight of tank, facilitate and pushed and pulled.
Further, the aperture in the hole to be crimped on the boring ratio printed circuit board in the step 1) on lower die is big 0.3mm, in order to increase lower die to the support force of printed circuit board, be additionally provided with and be mounted on print on the lower die The corresponding circular hole of circuit board lower surface processed device and square hole can be avoided in the mounted first device in the face printed circuit board BOT Part.
Further: the step 1)~step 4) is completed in the environment of antistatic.
The beneficial effects of the present invention are:
Crucial place of the invention is that corresponding according to the shape of printed circuit board to be crimped and the Position Design in hole Lower die and tank, then lower die and printed circuit board are put into tank, automatic accurate contraposition may be implemented, eliminate people The process that work is aligned, has saved the time;Simultaneously by the outer dimension of upper die according to the spacing of connector and connector Upper surface shape specifically designs, and allows a upper die to crimp multiple connectors simultaneously, substantially increases crimping efficiency.
Detailed description of the invention
Fig. 1 is state diagram of the present invention when crimping work.
Fig. 2 is the structural schematic diagram of tank of the present invention.
Fig. 3 is the structural schematic diagram of lower die of the present invention.
Fig. 4 is the structural schematic diagram of upper die of the present invention.
Fig. 5 is control principle schematic diagram of the invention.
It is as shown in the figure: 1. press-connection machines, 2. upper dies, 2.1 link blocks, 3. connectors, 4. printed circuit boards, 5. lower dies, 5.1 holes, 5.2 circular holes, 5.3 square holes, 6. tanks, 6.1 baffles, 6.2 grooves, 81. mechanical pressure head stroke controlling units, 82. pressures Power sensing unit, 83. pressure judging units.
Specific embodiment
In order to make the objectives, technical solutions, and advantages of the present invention clearer, right with reference to the accompanying drawings and embodiments The present invention is described further, it should be appreciated that the specific embodiment that this place is described is only used to explain the present invention, not For limiting the present invention.
As shown in Figs 1-4, the compression bonding method of the highly dense connector of a kind of welding-free type, this method be based on it is a kind of include tank 6, under The frock clamp of pressing mold 5 and upper die 2 is implemented, it is characterised in that: the compression bonding method includes the following steps:
The design and manufacture of step 1) frock clamp, the frock clamp include tank 6, lower die 5 and upper die 2,
Step 1) lies in a horizontal plane in the tank 6 in step 1) on the platform of press-connection machine 1, by the lower die 5 in step 1) It is put into the inner volume of tank 6, then printed circuit board 4 to be crimped is placed on lower die 5;
Step 2) by the pin to crimp connector 3 be inserted into corresponding printed circuit board 4 wait crimp in hole, then by step 1) In upper die 2 top surface to crimp connector 3 is placed on by link block 2.1;
Assembled tank 6 is pushed to the underface of 1 head of press-connection machine by step 3);
Step 4) starts press-connection machine 1, and pressure head, which moves downward, presses down on upper die 2, so that the pin of connector 3 is pressed into In the hole of printed circuit board 4, forming interference fit connects it closely, that is, completes the connection of connector 3 and printed circuit board 4.
The outer dimension of cavity and lower die 5 in the tank 6 and the outer dimension phase of printed circuit board 4 to be crimped Together, be provided on the lower die 5 it is multiple with the hole heart position in hole to be crimped on printed circuit board 4 and the consistent hole 5.1 of quantity, Multiple link blocks 2.1 connecting with connector 3 are arranged in the lower surface of the upper die 2.
The two sidewalls and both ends of tank 6 are respectively arranged with baffle 6.1, the baffle in above-mentioned steps step 1)~step 3) 6.1 length is less than the side wall at 6.1 place of baffle or the length of end, and the sum of baffle 6.1 and the thickness of 6 side wall of tank are than printing The big 2mm of the sum of the thickness of the thickness of circuit board 4 and lower die 5, so that lower die 5 and printed circuit board 4 are capable of fixing in tank 6 In.
Hole 5.1 in the step 1) on lower die 5 is 0.3mm bigger than the aperture in the hole to be crimped on printed circuit board 4, no Only play the role of guided connector, also improves the supporting role to compression printed circuit board.
The bottom surface of tank 6 in the step 1)~step 3) is additionally provided with multiple grooves 6.2, and the groove 6.2 is arc Shape or rectangle, groove 6.2 design the weight so that entire tank 6, facilitate and carry out push-and-pull tank 6.
Circular hole corresponding with 4 lower surface device of printed circuit board is mounted on is additionally provided in the step 1) on lower die 5 5.2 and square hole 5.3, the 4 already installed component in lower section of printed circuit can be effectively avoided,
The step 1)~step 4) is completed in the environment of antistatic.
The outer dimension of the upper die 2 can be designed according to the spacing of connector and the upper surface shape of connector, institute The electrolysis for stating upper die is less than 2/3rds of crimping compressing head junction, sets the link block 2.1 of upper die 2 in the present embodiment 3 are counted into, then can crimp 3 connectors simultaneously, the material of the upper die is preferably stainless steel.
A kind of crimped status of the highly dense connector of welding-free type of the present invention is as shown in Figure 1, again as shown in figure 5, this hair Bright control system 8 is mechanical pressure head control system, including mechanical pressure head stroke controlling unit 81, pressure sensitive unit 82 and Pressure judging unit 83, wherein the setting of pressure sensitive unit 82 is in crimping compressing head.The first of mechanical pressure head is set first When height coordinate and terminal height coordinate, threshold value is set by the maximum, force born to the more pins of crimp connector, by the threshold value It is stored in pressure judging unit 83;Make the highly dense connector of the printed board, welding-free type and upper lower die peripheral frame positioning and clamping and pushes away It is put into immediately below mechanical pressure head, when the mechanical pressure head stroke controlling unit 81 issues control signal to action execution unit, drive Motivation tool pressure head starts downward crimping operation stroke to the initial height coordinate set, makes the feeling of stress being arranged in pressure head It answers unit 82 to carry out pressure sensitive test to the lower surface of pressure head, and sends induction test data to pressure judging unit 83, By being compared analysis with the preset threshold being pre-stored in pressure judging unit 83, judge in stroke range until terminal height The pressure head pressure of degree coordinate compression bonding apparatus is less than maximum value, then issues and judges to mechanical pressure head stroke controlling unit 81 Signal, mechanical pressure head stroke controlling unit 81 interrupt downward displacement commands after receiving the judgement signal, start up-on command, drive Motivation tool pressure head uplink makes pressure head leave upper die, completes crimping work.It is controlled in this compression bonding method by using mechanical pressure head System keeps crimping work more accurate, and improves work efficiency, and is suitable for industrial production application.
The part not illustrated in specification is the prior art or common knowledge.The present embodiment is merely to illustrate the invention, Rather than limit the scope of the invention, the modifications such as equivalent replacement that those skilled in the art make the present invention are considered It falls into invention claims institute protection scope.

Claims (6)

1. a kind of compression bonding method of the highly dense connector of welding-free type, this method be based on it is a kind of include tank (6), lower die (5) and on The frock clamp of pressing mold (2) is implemented, it is characterised in that: the compression bonding method includes the following steps:
1) tank (6) is lain in a horizontal plane on the platform of press-connection machine (1), lower die (5) is put into the inner volume of tank (6) In, then printed circuit board (4) to be crimped is placed on lower die (5);
2) by the corresponding printed circuit board (4) of the insertion of the pin to crimp connector (3) wait crimp in hole, then will be in step 1) Upper die (2) is placed on the top surface to crimp connector (3) by link block (2.1);
3) assembled tank (6) is pushed to the underface of press-connection machine (1) head;
4) start press-connection machine (1), pressure head, which moves downward, presses down on upper die (2), so that the pin of connector (3) is pressed into print In the hole of circuit board (4) processed, forming interference fit connects it closely, that is, completes the company of connector (3) and printed circuit board (4) It connects;
Wherein, the outer dimension and printed circuit board to be crimped (4) of the cavity in the tank (6) and lower die (5) is outer Shape size is identical, is provided on the lower die (5) multiple with the hole heart position in hole to be crimped on printed circuit board (4) and quantity Consistent hole (5.1), multiple link blocks (2.1) connecting with connector (3) are arranged in the lower surface of the upper die (2), described The bottom surface of tank (6) is additionally provided with multiple grooves (6.2), and the groove (6.2) is arc or rectangle.
2. a kind of compression bonding method of the highly dense connector of welding-free type according to claim 1, it is characterised in that: the tank (6) two sidewalls and both ends are respectively arranged with baffle (6.1), and the length of the baffle (6.1) is less than the side where baffle (6.1) The length of wall or end.
3. a kind of compression bonding method of the highly dense connector of welding-free type according to claim 2, it is characterised in that: the baffle (6.1) with the sum of the thickness of tank (6) side wall than the big 2mm of the sum of the thickness of printed circuit board (4) and the thickness of lower die (5).
4. a kind of compression bonding method of the highly dense connector of welding-free type according to claim 1, it is characterised in that: the step 1) Hole (5.1) on middle lower die (5) is 0.3mm bigger than the aperture in the hole to be crimped on printed circuit board (4).
5. a kind of compression bonding method of the highly dense connector of welding-free type according to claim 1, it is characterised in that: the step 1) Circular hole (5.2) corresponding with printed circuit board (4) lower surface device is mounted on and square hole are additionally provided on middle lower die (5) (5.3)。
6. a kind of compression bonding method of the highly dense connector of welding-free type according to claim 1, it is characterised in that: the step 1) ~step 4) is completed in the environment of antistatic.
CN201611251365.7A 2016-12-29 2016-12-29 A kind of compression bonding method of the highly dense connector of welding-free type Active CN106785802B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201611251365.7A CN106785802B (en) 2016-12-29 2016-12-29 A kind of compression bonding method of the highly dense connector of welding-free type

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201611251365.7A CN106785802B (en) 2016-12-29 2016-12-29 A kind of compression bonding method of the highly dense connector of welding-free type

Publications (2)

Publication Number Publication Date
CN106785802A CN106785802A (en) 2017-05-31
CN106785802B true CN106785802B (en) 2019-03-29

Family

ID=58929413

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201611251365.7A Active CN106785802B (en) 2016-12-29 2016-12-29 A kind of compression bonding method of the highly dense connector of welding-free type

Country Status (1)

Country Link
CN (1) CN106785802B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111970917A (en) * 2020-07-30 2020-11-20 西南电子技术研究所(中国电子科技集团公司第十研究所) Flat pressing type crimping tool for PCB and connector

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107138628B (en) * 2017-06-09 2019-08-09 株洲中车时代电气股份有限公司 A kind of light-guiding pillar compression bonding apparatus and method
CN107946860A (en) * 2017-11-16 2018-04-20 无锡市同步电子制造有限公司 Crimp design technology
CN111263534B (en) * 2020-04-10 2020-08-11 宁波均普智能制造股份有限公司 Pressure head and press fitting equipment

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011086662A (en) * 2009-10-13 2011-04-28 Nec Corp Board connecting device
CN202103961U (en) * 2011-07-13 2012-01-04 国电南瑞科技股份有限公司 Crimping device of PCB (printed circuit board) connector
CN203119273U (en) * 2013-01-04 2013-08-07 重庆金龙科技有限公司 Folding machine for flat cable ends
CN203150875U (en) * 2012-12-22 2013-08-21 中国船舶重工集团公司第七0九研究所 Alignment and crimping device for flat cable connectors
CN204179465U (en) * 2014-11-06 2015-02-25 上海元一电子有限公司 Terminal crimping connector
CN204244576U (en) * 2014-11-11 2015-04-01 黄庆 Automatic pressing device
CN205141344U (en) * 2015-11-24 2016-04-06 上海无线电设备研究所 Printing board contact pin crimping device

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE1011920A3 (en) * 1998-05-15 2000-03-07 Framatome Connectors Belgium Method and device for the positioning of a plate with printed circuits in a press.
JP3921459B2 (en) * 2003-07-11 2007-05-30 ソニーケミカル&インフォメーションデバイス株式会社 Mounting method and mounting apparatus for electrical parts
JP4832107B2 (en) * 2006-02-23 2011-12-07 ソニーケミカル&インフォメーションデバイス株式会社 Implementation method
DE102006058731A1 (en) * 2006-12-13 2008-07-17 Robert Bosch Gmbh PCB connection
CN201267091Y (en) * 2008-05-28 2009-07-01 杭州华三通信技术有限公司 Crimp connection force plug fixture for crimp connection type connector of circuit board and circuit board crimp connection mold
TWI338601B (en) * 2008-11-24 2011-03-11 Inventec Appliances Corp Automatic assembly fixture
CN205793707U (en) * 2016-06-02 2016-12-07 上海无线电设备研究所 A kind of cross joint terminal array installation tool

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011086662A (en) * 2009-10-13 2011-04-28 Nec Corp Board connecting device
CN202103961U (en) * 2011-07-13 2012-01-04 国电南瑞科技股份有限公司 Crimping device of PCB (printed circuit board) connector
CN203150875U (en) * 2012-12-22 2013-08-21 中国船舶重工集团公司第七0九研究所 Alignment and crimping device for flat cable connectors
CN203119273U (en) * 2013-01-04 2013-08-07 重庆金龙科技有限公司 Folding machine for flat cable ends
CN204179465U (en) * 2014-11-06 2015-02-25 上海元一电子有限公司 Terminal crimping connector
CN204244576U (en) * 2014-11-11 2015-04-01 黄庆 Automatic pressing device
CN205141344U (en) * 2015-11-24 2016-04-06 上海无线电设备研究所 Printing board contact pin crimping device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111970917A (en) * 2020-07-30 2020-11-20 西南电子技术研究所(中国电子科技集团公司第十研究所) Flat pressing type crimping tool for PCB and connector

Also Published As

Publication number Publication date
CN106785802A (en) 2017-05-31

Similar Documents

Publication Publication Date Title
JPH09306257A (en) Manufacture of harness, pressure welding machine, connector holding beam, and pressure welding device
CN101274346B (en) Method for producing metallic stamping pieces
CN103949538A (en) Full-automatic punching die and machine integration system
CN206040342U (en) Resistor draw forth foot shaper
CN203778650U (en) Pneumatic rectifier bridge pin molding machine with replaceable dies
KR101134031B1 (en) Drawing mold device
CN206435674U (en) A kind of punch press clamper
CN106734842A (en) A kind of Mobile equipment shell system of processing
CN205236814U (en) Bending die
CN104625687A (en) Control system capable of resolving effective pressing stroke
CN210754725U (en) Reinforcing apparatus of automobile parts mould
CN105013950A (en) Shape pressing die for reinforcing plate of cross beam of electric automobile
CN207057518U (en) A kind of inductance touch-screen pin clamps bender
CN202894027U (en) Punch forming mould for upper reinforcing plate of windscreen wiper
CN105251892A (en) Rear axle square plate blanking-pinching-coining composite die and machining process thereof
CN202570965U (en) Connecting support precision-punching die
CN107335764A (en) A kind of cable connector closing in compressing method and compaction mold
CN205926965U (en) Forging die
CN201552276U (en) Two-station rotary riveting die
KR20120033752A (en) Method for forming a tail gate inner
CN103433387B (en) Stamping hole flanging device
CN104959776B (en) The processing method of six side's blind holes in a kind of large scale
CN202411799U (en) Automatic universal joint assembling equipment of automobile steering system
CN108994181A (en) A kind of sheet metal mould
CN206795183U (en) A kind of inner core press-loading device

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant