CN106785802B - A kind of compression bonding method of the highly dense connector of welding-free type - Google Patents
A kind of compression bonding method of the highly dense connector of welding-free type Download PDFInfo
- Publication number
- CN106785802B CN106785802B CN201611251365.7A CN201611251365A CN106785802B CN 106785802 B CN106785802 B CN 106785802B CN 201611251365 A CN201611251365 A CN 201611251365A CN 106785802 B CN106785802 B CN 106785802B
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- connector
- circuit board
- printed circuit
- tank
- welding
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
- H01R43/24—Assembling by moulding on contact members
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- Manufacturing Of Electrical Connectors (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
Abstract
The invention discloses the compression bonding methods of the highly dense connector of welding-free type, key is the design of frock clamp, the frock clamp includes tank (6), lower die (5) and upper die (2), these frock clamps are applied to the compression bonding method that a kind of highly dense connector of welding-free type is formed in the crimping of connector again, the highly dense connector of welding-free type can be quickly and accurately crimped, and run a crimping process to complete the crimping of the highly dense connector of multiple welding-free types.
Description
Technical field
The present invention relates to the assembling process technique fields of circuit board, and in particular to a kind of crimping of the highly dense connector of welding-free type
Method.
Background technique
Currently, the highly dense connector of welding-free type is to be crimped the pin of connector by press machine with the connection of printed circuit board
Into the hole of printed circuit board, forming interference fit connects it closely, the work that crimping is welded again later before eliminating
Sequence saves labour and raw material, improves efficiency, while decreasing welding process high temperature and rushing to printed circuit board
It hits, improves product quality.However since the aperture on printed circuit board to be crimped is too small, the pin number of connector is inclined
More, density is bigger than normal, and in crimping, lower die and printed circuit board slightly have deviation, one or more pin of connector will become
Shape causes connector and printed circuit board to be damaged, while the contraposition of lower die and printed circuit board also gives crimping process to increase
Time cost.Therefore, how under the premise of both can guarantee crimp quality, moreover it is possible to which improving production efficiency just seems especially heavy
It wants.
Summary of the invention
In view of this, can quickly and accurately be pressed the present invention provides a kind of compression bonding method of the highly dense connector of welding-free type
The highly dense connector of welding-free type is connect, and run a crimping process to complete the crimping of the highly dense connector of multiple welding-free types.
The present invention is achieved through the following technical solutions:
A kind of compression bonding method of the highly dense connector of welding-free type, this method are based on a kind of including tank, lower die and upper die
Frock clamp implement, which includes the following steps:
The design and manufacture of step 1) frock clamp, the frock clamp include tank, lower die and upper die, the tank
Interior cavity is identical with the outer dimension of lower die and the outer dimension of printed circuit board to be crimped, and is arranged on the lower die
Have multiple with the hole heart position in hole to be crimped on printed circuit board and the consistent hole of quantity, the lower surface setting of the upper die is more
A link block being connect with connector；
Step 1) lies in a horizontal plane in the tank in step 1) on the platform of press-connection machine, and the lower die in step 1) is put into
In the inner volume of tank, then printed circuit board to be crimped is placed on lower die；
Step 2) by the pin to crimp connector be inserted into corresponding printed circuit board wait crimp in hole, then will be in step 1)
Upper die the top surface to crimp connector is placed on by link block；
Assembled tank is pushed to the underface of press-connection machine head by step 3)；
Step 4) starts press-connection machine, and pressure head, which moves downward, presses down on upper die, so that the pin of connector is pressed into print
In the hole of circuit board processed, forming interference fit connects it closely, that is, completes the connection of connector and printed circuit board.
Cavity in the tank is identical with the outer dimension of lower die and the outer dimension of printed circuit board to be crimped,
It is provided on the lower die multiple with the hole heart position in hole to be crimped on printed circuit board and the consistent hole of quantity, the upper pressure
Multiple link blocks connecting with connector are arranged in the lower surface of mould.
In above-mentioned compression bonding method, in order to make printed circuit board and lower die can be realized accurate contraposition, it is necessary to guarantee to hold
Cavity in slot is identical with the outer dimension of lower die and the outer dimension of printed circuit board to be crimped, and sets on lower die
It is equipped with multiple with the hole heart position in hole to be crimped on printed circuit board and the consistent hole of quantity.
Further, the two sidewalls and both ends of tank are respectively arranged with baffle, the gear in the step 1)~step 3)
The length of plate is less than the side wall where baffle or the length of end, the sum of the thickness of the baffle and tank side wall compare printed circuit
Lower die and printed circuit board both can be fixed on appearance by the sum of the thickness of the thickness of plate and lower die big 2mm, such design
In slot, disassembly also can be convenient.
Further, multiple grooves are additionally provided in the bottom surface of the tank, the groove is arc or rectangle, such
Design can mitigate the weight of tank, facilitate and pushed and pulled.
Further, the aperture in the hole to be crimped on the boring ratio printed circuit board in the step 1) on lower die is big
0.3mm, in order to increase lower die to the support force of printed circuit board, be additionally provided with and be mounted on print on the lower die
The corresponding circular hole of circuit board lower surface processed device and square hole can be avoided in the mounted first device in the face printed circuit board BOT
Part.
Further: the step 1)~step 4) is completed in the environment of antistatic.
The beneficial effects of the present invention are:
Crucial place of the invention is that corresponding according to the shape of printed circuit board to be crimped and the Position Design in hole
Lower die and tank, then lower die and printed circuit board are put into tank, automatic accurate contraposition may be implemented, eliminate people
The process that work is aligned, has saved the time；Simultaneously by the outer dimension of upper die according to the spacing of connector and connector
Upper surface shape specifically designs, and allows a upper die to crimp multiple connectors simultaneously, substantially increases crimping efficiency.
Detailed description of the invention
Fig. 1 is state diagram of the present invention when crimping work.
Fig. 2 is the structural schematic diagram of tank of the present invention.
Fig. 3 is the structural schematic diagram of lower die of the present invention.
Fig. 4 is the structural schematic diagram of upper die of the present invention.
Fig. 5 is control principle schematic diagram of the invention.
It is as shown in the figure: 1. press-connection machines, 2. upper dies, 2.1 link blocks, 3. connectors, 4. printed circuit boards, 5. lower dies,
5.1 holes, 5.2 circular holes, 5.3 square holes, 6. tanks, 6.1 baffles, 6.2 grooves, 81. mechanical pressure head stroke controlling units, 82. pressures
Power sensing unit, 83. pressure judging units.
Specific embodiment
In order to make the objectives, technical solutions, and advantages of the present invention clearer, right with reference to the accompanying drawings and embodiments
The present invention is described further, it should be appreciated that the specific embodiment that this place is described is only used to explain the present invention, not
For limiting the present invention.
As shown in Figs 1-4, the compression bonding method of the highly dense connector of a kind of welding-free type, this method be based on it is a kind of include tank 6, under
The frock clamp of pressing mold 5 and upper die 2 is implemented, it is characterised in that: the compression bonding method includes the following steps:
The design and manufacture of step 1) frock clamp, the frock clamp include tank 6, lower die 5 and upper die 2,
Step 1) lies in a horizontal plane in the tank 6 in step 1) on the platform of press-connection machine 1, by the lower die 5 in step 1)
It is put into the inner volume of tank 6, then printed circuit board 4 to be crimped is placed on lower die 5；
Step 2) by the pin to crimp connector 3 be inserted into corresponding printed circuit board 4 wait crimp in hole, then by step 1)
In upper die 2 top surface to crimp connector 3 is placed on by link block 2.1；
Assembled tank 6 is pushed to the underface of 1 head of press-connection machine by step 3)；
Step 4) starts press-connection machine 1, and pressure head, which moves downward, presses down on upper die 2, so that the pin of connector 3 is pressed into
In the hole of printed circuit board 4, forming interference fit connects it closely, that is, completes the connection of connector 3 and printed circuit board 4.
The outer dimension of cavity and lower die 5 in the tank 6 and the outer dimension phase of printed circuit board 4 to be crimped
Together, be provided on the lower die 5 it is multiple with the hole heart position in hole to be crimped on printed circuit board 4 and the consistent hole 5.1 of quantity,
Multiple link blocks 2.1 connecting with connector 3 are arranged in the lower surface of the upper die 2.
The two sidewalls and both ends of tank 6 are respectively arranged with baffle 6.1, the baffle in above-mentioned steps step 1)~step 3)
6.1 length is less than the side wall at 6.1 place of baffle or the length of end, and the sum of baffle 6.1 and the thickness of 6 side wall of tank are than printing
The big 2mm of the sum of the thickness of the thickness of circuit board 4 and lower die 5, so that lower die 5 and printed circuit board 4 are capable of fixing in tank 6
In.
Hole 5.1 in the step 1) on lower die 5 is 0.3mm bigger than the aperture in the hole to be crimped on printed circuit board 4, no
Only play the role of guided connector, also improves the supporting role to compression printed circuit board.
The bottom surface of tank 6 in the step 1)~step 3) is additionally provided with multiple grooves 6.2, and the groove 6.2 is arc
Shape or rectangle, groove 6.2 design the weight so that entire tank 6, facilitate and carry out push-and-pull tank 6.
Circular hole corresponding with 4 lower surface device of printed circuit board is mounted on is additionally provided in the step 1) on lower die 5
5.2 and square hole 5.3, the 4 already installed component in lower section of printed circuit can be effectively avoided,
The step 1)~step 4) is completed in the environment of antistatic.
The outer dimension of the upper die 2 can be designed according to the spacing of connector and the upper surface shape of connector, institute
The electrolysis for stating upper die is less than 2/3rds of crimping compressing head junction, sets the link block 2.1 of upper die 2 in the present embodiment
3 are counted into, then can crimp 3 connectors simultaneously, the material of the upper die is preferably stainless steel.
A kind of crimped status of the highly dense connector of welding-free type of the present invention is as shown in Figure 1, again as shown in figure 5, this hair
Bright control system 8 is mechanical pressure head control system, including mechanical pressure head stroke controlling unit 81, pressure sensitive unit 82 and
Pressure judging unit 83, wherein the setting of pressure sensitive unit 82 is in crimping compressing head.The first of mechanical pressure head is set first
When height coordinate and terminal height coordinate, threshold value is set by the maximum, force born to the more pins of crimp connector, by the threshold value
It is stored in pressure judging unit 83；Make the highly dense connector of the printed board, welding-free type and upper lower die peripheral frame positioning and clamping and pushes away
It is put into immediately below mechanical pressure head, when the mechanical pressure head stroke controlling unit 81 issues control signal to action execution unit, drive
Motivation tool pressure head starts downward crimping operation stroke to the initial height coordinate set, makes the feeling of stress being arranged in pressure head
It answers unit 82 to carry out pressure sensitive test to the lower surface of pressure head, and sends induction test data to pressure judging unit 83,
By being compared analysis with the preset threshold being pre-stored in pressure judging unit 83, judge in stroke range until terminal height
The pressure head pressure of degree coordinate compression bonding apparatus is less than maximum value, then issues and judges to mechanical pressure head stroke controlling unit 81
Signal, mechanical pressure head stroke controlling unit 81 interrupt downward displacement commands after receiving the judgement signal, start up-on command, drive
Motivation tool pressure head uplink makes pressure head leave upper die, completes crimping work.It is controlled in this compression bonding method by using mechanical pressure head
System keeps crimping work more accurate, and improves work efficiency, and is suitable for industrial production application.
The part not illustrated in specification is the prior art or common knowledge.The present embodiment is merely to illustrate the invention,
Rather than limit the scope of the invention, the modifications such as equivalent replacement that those skilled in the art make the present invention are considered
It falls into invention claims institute protection scope.
Claims (6)
1. a kind of compression bonding method of the highly dense connector of welding-free type, this method be based on it is a kind of include tank (6), lower die (5) and on
The frock clamp of pressing mold (2) is implemented, it is characterised in that: the compression bonding method includes the following steps:
1) tank (6) is lain in a horizontal plane on the platform of press-connection machine (1), lower die (5) is put into the inner volume of tank (6)
In, then printed circuit board (4) to be crimped is placed on lower die (5)；
2) by the corresponding printed circuit board (4) of the insertion of the pin to crimp connector (3) wait crimp in hole, then will be in step 1)
Upper die (2) is placed on the top surface to crimp connector (3) by link block (2.1)；
3) assembled tank (6) is pushed to the underface of press-connection machine (1) head；
4) start press-connection machine (1), pressure head, which moves downward, presses down on upper die (2), so that the pin of connector (3) is pressed into print
In the hole of circuit board (4) processed, forming interference fit connects it closely, that is, completes the company of connector (3) and printed circuit board (4)
It connects；
Wherein, the outer dimension and printed circuit board to be crimped (4) of the cavity in the tank (6) and lower die (5) is outer
Shape size is identical, is provided on the lower die (5) multiple with the hole heart position in hole to be crimped on printed circuit board (4) and quantity
Consistent hole (5.1), multiple link blocks (2.1) connecting with connector (3) are arranged in the lower surface of the upper die (2), described
The bottom surface of tank (6) is additionally provided with multiple grooves (6.2), and the groove (6.2) is arc or rectangle.
2. a kind of compression bonding method of the highly dense connector of welding-free type according to claim 1, it is characterised in that: the tank
(6) two sidewalls and both ends are respectively arranged with baffle (6.1), and the length of the baffle (6.1) is less than the side where baffle (6.1)
The length of wall or end.
3. a kind of compression bonding method of the highly dense connector of welding-free type according to claim 2, it is characterised in that: the baffle
(6.1) with the sum of the thickness of tank (6) side wall than the big 2mm of the sum of the thickness of printed circuit board (4) and the thickness of lower die (5).
4. a kind of compression bonding method of the highly dense connector of welding-free type according to claim 1, it is characterised in that: the step 1)
Hole (5.1) on middle lower die (5) is 0.3mm bigger than the aperture in the hole to be crimped on printed circuit board (4).
5. a kind of compression bonding method of the highly dense connector of welding-free type according to claim 1, it is characterised in that: the step 1)
Circular hole (5.2) corresponding with printed circuit board (4) lower surface device is mounted on and square hole are additionally provided on middle lower die (5)
(5.3)。
6. a kind of compression bonding method of the highly dense connector of welding-free type according to claim 1, it is characterised in that: the step 1)
~step 4) is completed in the environment of antistatic.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611251365.7A CN106785802B (en) | 2016-12-29 | 2016-12-29 | A kind of compression bonding method of the highly dense connector of welding-free type |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611251365.7A CN106785802B (en) | 2016-12-29 | 2016-12-29 | A kind of compression bonding method of the highly dense connector of welding-free type |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106785802A CN106785802A (en) | 2017-05-31 |
| CN106785802B true CN106785802B (en) | 2019-03-29 |
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ID=58929413
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611251365.7A Active CN106785802B (en) | 2016-12-29 | 2016-12-29 | A kind of compression bonding method of the highly dense connector of welding-free type |
Country Status (1)
| Country | Link |
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| CN (1) | CN106785802B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111970917A (en) * | 2020-07-30 | 2020-11-20 | 西南电子技术研究所（中国电子科技集团公司第十研究所） | Flat pressing type crimping tool for PCB and connector |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107138628B (en) * | 2017-06-09 | 2019-08-09 | 株洲中车时代电气股份有限公司 | A kind of light-guiding pillar compression bonding apparatus and method |
| CN107946860A (en) * | 2017-11-16 | 2018-04-20 | 无锡市同步电子制造有限公司 | Crimp design technology |
| CN111263534B (en) * | 2020-04-10 | 2020-08-11 | 宁波均普智能制造股份有限公司 | Pressure head and press fitting equipment |
| CN115942620B (en) * | 2023-01-09 | 2023-08-29 | 广州诺顶智能科技有限公司 | Crimping machine control method and system, crimping machine and readable medium |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011086662A (en) * | 2009-10-13 | 2011-04-28 | Nec Corp | Board connecting device |
| CN202103961U (en) * | 2011-07-13 | 2012-01-04 | 国电南瑞科技股份有限公司 | Crimping device of PCB (printed circuit board) connector |
| CN203119273U (en) * | 2013-01-04 | 2013-08-07 | 重庆金龙科技有限公司 | Folding machine for flat cable ends |
| CN203150875U (en) * | 2012-12-22 | 2013-08-21 | 中国船舶重工集团公司第七0九研究所 | Alignment and crimping device for flat cable connectors |
| CN204179465U (en) * | 2014-11-06 | 2015-02-25 | 上海元一电子有限公司 | Terminal crimping connector |
| CN204244576U (en) * | 2014-11-11 | 2015-04-01 | 黄庆 | Automatic pressing device |
| CN205141344U (en) * | 2015-11-24 | 2016-04-06 | 上海无线电设备研究所 | Printing board contact pin crimping device |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BE1011920A3 (en) * | 1998-05-15 | 2000-03-07 | Framatome Connectors Belgium | Method and device for the positioning of a plate with printed circuits in a press. |
| JP3921459B2 (en) * | 2003-07-11 | 2007-05-30 | ソニーケミカル＆インフォメーションデバイス株式会社 | Mounting method and mounting apparatus for electrical parts |
| JP4832107B2 (en) * | 2006-02-23 | 2011-12-07 | ソニーケミカル＆インフォメーションデバイス株式会社 | Implementation method |
| DE102006058731A1 (en) * | 2006-12-13 | 2008-07-17 | Robert Bosch Gmbh | PCB connection |
| CN201267091Y (en) * | 2008-05-28 | 2009-07-01 | 杭州华三通信技术有限公司 | Crimp connection force plug fixture for crimp connection type connector of circuit board and circuit board crimp connection mold |
| TWI338601B (en) * | 2008-11-24 | 2011-03-11 | Inventec Appliances Corp | Automatic assembly fixture |
| CN205793707U (en) * | 2016-06-02 | 2016-12-07 | 上海无线电设备研究所 | A kind of cross joint terminal array installation tool |
-
2016
- 2016-12-29 CN CN201611251365.7A patent/CN106785802B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011086662A (en) * | 2009-10-13 | 2011-04-28 | Nec Corp | Board connecting device |
| CN202103961U (en) * | 2011-07-13 | 2012-01-04 | 国电南瑞科技股份有限公司 | Crimping device of PCB (printed circuit board) connector |
| CN203150875U (en) * | 2012-12-22 | 2013-08-21 | 中国船舶重工集团公司第七0九研究所 | Alignment and crimping device for flat cable connectors |
| CN203119273U (en) * | 2013-01-04 | 2013-08-07 | 重庆金龙科技有限公司 | Folding machine for flat cable ends |
| CN204179465U (en) * | 2014-11-06 | 2015-02-25 | 上海元一电子有限公司 | Terminal crimping connector |
| CN204244576U (en) * | 2014-11-11 | 2015-04-01 | 黄庆 | Automatic pressing device |
| CN205141344U (en) * | 2015-11-24 | 2016-04-06 | 上海无线电设备研究所 | Printing board contact pin crimping device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111970917A (en) * | 2020-07-30 | 2020-11-20 | 西南电子技术研究所（中国电子科技集团公司第十研究所） | Flat pressing type crimping tool for PCB and connector |
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|---|---|
| CN106785802A (en) | 2017-05-31 |
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