CN206323664U - A kind of compression bonding apparatus of the highly dense connector of welding-free type - Google Patents
A kind of compression bonding apparatus of the highly dense connector of welding-free type Download PDFInfo
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- CN206323664U CN206323664U CN201621467009.4U CN201621467009U CN206323664U CN 206323664 U CN206323664 U CN 206323664U CN 201621467009 U CN201621467009 U CN 201621467009U CN 206323664 U CN206323664 U CN 206323664U
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Abstract
The utility model is related to a kind of compression bonding apparatus of the highly dense connector of welding-free type, crimping for connector and printed circuit board, including press-connection machine 1, top die 2, connector 3, printed circuit board 4, dip mold 5 and tank 6, the utility model provides a kind of compression bonding apparatus of the highly dense connector of welding-free type, quickly and accurately the pin of connector can be pressed into the hole of pcb board, whole device is simple in construction easy to operate, efficiency high, it is adaptable to the crimping of batch connector.
Description
Technical field
The utility model is related to circuit board assembly equipment technical field, and in particular to a kind of pressure of the highly dense connector of welding-free type
Connection device, for highly dense connector to be pressed into printed circuit board.
Background technology
Connector is typically the extruding force of application press-connection machine generation when being connected with printed circuit board (abbreviation pcb board) will be even
The pin for connecing device is pressed into the hole on pcb board, and forming interference fit is closely joined together it.In the crimping used at present
Although most of in equipment all eliminate the process welded after extruding, labour and raw material are saved, efficiency is improved；And
Impact of the welding process high temperature to pcb board is reduced, product quality is improved, but still suffer from the deficiency of following aspect：
1st, due to there are many apertures on pcb board to be crimped, the pin number of welding-free type connector is also many and close
Degree is big, and the contraposition in so hole on the hole and pcb board in crimping on dip mold is required very strictly, slightly deviation connector
Pin will deform, and the contraposition holding time of dip mold and pcb board is long, has had a strong impact on production efficiency.
2nd, the through slot in existing crimping apparatus on dip mold reduces the support force to pcb board so that crimping connection
There is small deformation around hole after device on pcb board.
3rd, top die can only once be crimped to a connector in existing crimping apparatus, when on same pcb board
When needing to crimp multiple connectors, the existing obvious inefficiency of top die can not meet production.
Utility model content
In order to solve the above technical problems, the utility model provides a kind of compression bonding apparatus of the highly dense connector of welding-free type, energy
Enough that quickly and accurately the pin of connector is pressed into the hole of pcb board, whole device is simple in construction easy to operate, efficiency high, is applicable
In the crimping of batch connector.
The utility model solves the technical scheme that its technical problem used：
A kind of compression bonding apparatus of the highly dense connector of welding-free type, for crimp connector and printed circuit board, including press-connection machine,
It is characterized in that：Also include the tank being arranged on the platform of press-connection machine, being internally provided with for the tank is printed for placing
Hole heart position and the quantity one in multiple holes to be crimped with printed circuit board are provided with the dip mold of circuit board, the dip mold
Cavity volume and the appearance and size of dip mold and the appearance and size of printed circuit board in the hole of cause, the tank is identical, described to push
The top of mould is provided with the top die for inserting the pin of connector in corresponding printed circuit plate hole, and the lower surface of the top die is set
Multiple contiguous blocks being connected with connector are put, the top die is vertically set on the underface of pressure welding pressure head.
Preferably, the two side and two ends of the tank are respectively arranged with baffle plate, the length of the baffle plate is less than baffle plate
The side wall or the length of end at place.
Preferably, the bottom surface of the tank is additionally provided with multiple grooves, the groove is arc or rectangle, the tank
It is to be made by aluminum alloy materials, aluminum alloy materials and groove cause tank lighter in weight, is easy to manually carry out push-and-pull.
Preferably, be additionally provided with the dip mold with installed in the corresponding circular hole of printed circuit board lower surface device and
Square opening, can avoid the printed circuit board BOT faces good component of welding equipment, the material of the dip mold is preferably FR4.
Preferably, the thickness and the thickness sum of dip mold of the highest point height than printed circuit board for holding groove sidewall
Big 2mm.
Preferably, the big 0.3mm in aperture in the hole to be crimped on boring ratio printed circuit board on the dip mold, not only rises
To the effect of guided connector, the supporting role to compression printed circuit board is also improved.
The appearance and size of the top die can be designed according to the spacing of connector and the upper surface shape of connector, described
The electrolysis of top die is less than 2/3rds of crimping compressing head junction, and a top die can crimp several connectors simultaneously,
The material of the top die is preferably stainless steel.
The beneficial effects of the utility model are：
1st, the utility model compared with prior art, adds pocket structure, by dip mold and printed circuit board from lower past
On be placed on inside tank, and make the inner side spacing of tank and the appearance and size one of dip mold and printed circuit board to be crimped
Cause, the hole consistent with quantity with the hole heart position of printed circuit plate hole is set on dip mold, it is ensured that dip mold and printing electricity
The accurate contraposition of road plate, so as to eliminate the artificial process aligned, substantially reduces time cost.
2nd, by the appearance and size of top die according to the spacing of connector and the upper surface shape of connector come specific design, make
Multiple connectors can be crimped simultaneously by obtaining a top die, improve crimping efficiency.
The 3rd, corresponding with being arranged on printed circuit board lower surface device circular hole and square opening are set on dip mold, can be very
The printed circuit board BOT faces good component of welding equipment is avoided well；Set corresponding with printed circuit board crimping hole on dip mold
Hole can improve the supporting role to compression printed circuit board.
Brief description of the drawings
Fig. 1 is overall structure diagram of the present utility model.
Fig. 2 is pocket structure schematic diagram of the present utility model.
Fig. 3 is top die structural representation of the present utility model.
Fig. 4 is dip mold structural representation of the present utility model.
Shown in figure：1- press-connection machines, 2- top dies, 3- connectors, 4- printed circuit boards, 5- dip molds, 6- tanks, 7- gears
Plate, 8- contiguous blocks, 9- grooves, 10- holes, 11- circular holes, 12- square openings.
Embodiment
In order that the purpose of this utility model, technical scheme and advantage are more clearly understood, below in conjunction with the accompanying drawings and implement
Example is described in further detail to the utility model, it will be appreciated that specific embodiment described herein is used only for explaining this
Utility model, is not used to limit the utility model.
As Figure 1-4, a kind of compression bonding apparatus of the highly dense connector of welding-free type, the pressure for connector and printed circuit board
Connect, including press-connection machine 1, top die 2, connector 3, printed circuit board 4, dip mold 5 and tank 6, in two symmetrical sides of tank 6
On be respectively arranged with baffle plate 7, the length of the baffle plate 7 is less than the side wall where baffle plate 7 or the length of end, in the tank 6
The dip mold 5 being internally provided with for placing printed circuit board 4, be provided with the dip mold 5 multiple with printed circuit board 4
On hole to be crimped the hole heart position hole 10 consistent with quantity, cavity volume, the appearance and size and print of dip mold 5 in the tank 6
The appearance and size of circuit board 4 processed is identical, and the top of the dip mold 5 is provided with inserts corresponding printed circuit by the pin of connector 3
Top die 2 in the hole of plate 4, the lower surface of the top die 2 sets multiple contiguous blocks 8 being connected with connector 3, the top die
2 are vertically set on the underface of the pressure head of press-connection machine 1.
Preferably, as shown in Fig. 2 the bottom surface of the tank 6 is additionally provided with multiple grooves 9, present embodiment further groove 9 is
Arc, the tank 6 is made by aluminum alloy materials, and aluminum alloy materials and groove 9 cause tank lighter in weight, are easy to people
Work carries out push-and-pull.
Preferably, as shown in figure 4, being additionally provided with the dip mold 5 with being arranged on printed circuit board lower surface device pair
The circular hole 11 and square opening 12 answered, can avoid the printed circuit board BOT faces good component of welding equipment, the material of the dip mold 5
It is of fine quality to elect FR4 as.
Preferably, the side wall of tank 6 highest point height than printed circuit board 4 thickness and dip mold 5 thickness it
With big 2mm.
Preferably, the hole 10 on the dip mold 5 than the hole to be crimped on printed circuit board the big 0.3mm in aperture, not only
Play a part of guided connector 3, also improve the supporting role to compression printed circuit board 4.
Preferably, the appearance and size of the top die 2 can be according to the spacing and the upper surface shape of connector of connector
Design, the electrolysis of the top die is less than 2/3rds of crimping compressing head junction, and a top die 2 can in present embodiment
To crimp 3 connectors 3 simultaneously, the material of the top die 2 is preferably stainless steel.
A kind of crimping course of work of the compression bonding apparatus of the highly dense connector of welding-free type of the utility model is：Tank 6 is placed on
On the platform of press-connection machine 1, the inside of tank 6 is sequentially placed dip mold 5 and printed circuit board 4, the pin of connector 3 from the bottom up
In the hole 10 for inserting printed circuit board 4, top die 2 is arranged on the upper surface of connector 3, and tank 6 is pushed into the pressure head of press-connection machine 1
Underface, then start press-connection machine 1, the pressure head of press-connection machine 1, which is moved downward, to be crimped, the pin of connector 3 be pressed into and printed
In the hole of circuit board 4 processed, forming interference fit is closely joined together it, that is, completes once to crimp, because top die 2 can be with
Connect multiple connectors 3 simultaneously, can be same model can also be different model connector, therefore once crimping process can be with
Crimp multiple connectors.
The compression bonding apparatus for the highly dense connector of a kind of welding-free type that the utility model is provided, by by dip mold and printed circuit
Plate is arranged inside tank, and makes the inner side spacing of tank and the appearance and size one of dip mold and printed circuit board to be crimped
Cause, the hole consistent with quantity with the hole heart position of printed circuit plate hole is set on dip mold, it is ensured that dip mold and printing electricity
The accurate contraposition of road plate, so as to eliminate the artificial process aligned, substantially reduces time cost；In addition, one pushes
Mould can meet the crimping of all highly dense connectors of welding-free type in printed board；Top die is placed directly on the highly dense connector of welding-free type
On, convenient contraposition, and a top die can crimp the highly dense connector of several welding-free types simultaneously, substantially increase efficiency.
The part not illustrated in specification is prior art or common knowledge.It is new that the present embodiment is merely to illustrate the practicality
Type, rather than limit scope of the present utility model, equivalent replacement that those skilled in the art are done for the utility model etc.
Modification is deemed to fall within the utility model right claim institute protection domain.
Claims (6)
1. a kind of compression bonding apparatus of the highly dense connector of welding-free type, for crimp connector and printed circuit board, including press-connection machine
(1), it is characterised in that：Also include being arranged on tank (6) on the platform of press-connection machine (1), tank (6) are internally provided with
It is provided with dip mold (5) for placing printed circuit board (4), the dip mold (5) multiple with being treated on printed circuit board (4)
Crimp the appearance and size of cavity volume in the hole heart position hole (10) consistent with quantity in hole, the tank (6) and dip mold (5) with
The appearance and size of printed circuit board (4) is identical, and the top of the dip mold (5) is provided with inserts corresponding by the pin of connector (3)
Top die (2) in printed circuit board (4) hole, the lower surface of the top die (2) sets multiple companies being connected with connector (3)
Block (8) is connect, the top die (2) is vertically set on the underface of press-connection machine (1) pressure head.
2. a kind of compression bonding apparatus of the highly dense connector of welding-free type according to claim 1, it is characterised in that：The tank
(6) two side and two ends is respectively arranged with baffle plate (7), and the length of the baffle plate (7) is less than the side wall where baffle plate (7) or end
The length in portion.
3. a kind of compression bonding apparatus of the highly dense connector of welding-free type according to claim 1, it is characterised in that：The tank
(6) bottom surface is additionally provided with multiple grooves (9), and the groove (9) is arc or rectangle.
4. a kind of compression bonding apparatus of the highly dense connector of welding-free type according to claim 1, it is characterised in that：The dip mold
(5) circular hole (11) corresponding with being arranged on printed circuit board (4) lower surface device and square opening (12) are additionally provided with.
5. a kind of compression bonding apparatus of the highly dense connector of welding-free type according to claim 2, it is characterised in that：The baffle plate
(7) the thickness sum with tank (6) side wall is than the thickness of printed circuit board (4) and the big 2mm of thickness sum of dip mold (5).
6. a kind of compression bonding apparatus of the highly dense connector of welding-free type according to claim 1, it is characterised in that：The dip mold
(5) aperture big 0.3mm of the hole (10) than the hole to be crimped on printed circuit board (4) on.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621467009.4U CN206323664U (en) | 2016-12-29 | 2016-12-29 | A kind of compression bonding apparatus of the highly dense connector of welding-free type |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621467009.4U CN206323664U (en) | 2016-12-29 | 2016-12-29 | A kind of compression bonding apparatus of the highly dense connector of welding-free type |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206323664U true CN206323664U (en) | 2017-07-11 |
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ID=59261995
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621467009.4U Active CN206323664U (en) | 2016-12-29 | 2016-12-29 | A kind of compression bonding apparatus of the highly dense connector of welding-free type |
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| CN (1) | CN206323664U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110366325A (en) * | 2019-07-26 | 2019-10-22 | 天津津航计算技术研究所 | A kind of compression bonding apparatus and method for pcb board connector |
-
2016
- 2016-12-29 CN CN201621467009.4U patent/CN206323664U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110366325A (en) * | 2019-07-26 | 2019-10-22 | 天津津航计算技术研究所 | A kind of compression bonding apparatus and method for pcb board connector |
| CN110366325B (en) * | 2019-07-26 | 2021-11-16 | 天津津航计算技术研究所 | Crimping device and method for PCB (printed circuit board) connector |
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