CN106785802A - A kind of compression bonding method of the highly dense connector of welding-free type - Google Patents
A kind of compression bonding method of the highly dense connector of welding-free type Download PDFInfo
- Publication number
- CN106785802A CN106785802A CN201611251365.7A CN201611251365A CN106785802A CN 106785802 A CN106785802 A CN 106785802A CN 201611251365 A CN201611251365 A CN 201611251365A CN 106785802 A CN106785802 A CN 106785802A
- Authority
- CN
- China
- Prior art keywords
- connector
- circuit board
- welding
- printed circuit
- bonding method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
- H01R43/24—Assembling by moulding on contact members
Abstract
The invention discloses the compression bonding method of the highly dense connector of welding-free type, it is critical only that the design of frock clamp, the frock clamp includes tank (6), dip mold (5) and top die (2), these frock clamps are applied in the crimping of connector the compression bonding method for forming a kind of highly dense connector of welding-free type again, the highly dense connector of welding-free type can quickly and accurately be crimped, and run a crimping process can complete the crimping of the highly dense connector of multiple welding-free types.
Description
Technical field
The present invention relates to the assembling process technique field of circuit board, and in particular to a kind of crimping of the highly dense connector of welding-free type
Method.
Background technology
At present, the highly dense connector of welding-free type is to be crimped the pin of connector by forcing press with the connection of printed circuit board
Into the hole of printed circuit board, forming interference fit makes it closely connect, the work welded again after crimping before eliminating
Sequence, saves labour and raw material, improves efficiency, while decrease welding process high temperature being rushed to printed circuit board
Hit, improve product quality.Too small yet with the aperture on printed circuit board to be crimped, the pin number of connector is inclined
Many, density is bigger than normal, and in crimping, dip mold will become with one or more pin that printed circuit board somewhat has deviation, connector
Shape, causes connector and printed circuit board to be damaged, while the contraposition of dip mold and printed circuit board also increases to crimping process
Time cost.Therefore, how on the premise of it both can guarantee that crimp quality, moreover it is possible to which improve production efficiency just seems particularly heavy
Will.
The content of the invention
In view of this, the invention provides a kind of compression bonding method of the highly dense connector of welding-free type, can quickly and accurately press
Connecing the highly dense connector of welding-free type, and run a crimping process can complete the crimping of the highly dense connector of multiple welding-free types.
The present invention is achieved through the following technical solutions：
A kind of compression bonding method of the highly dense connector of welding-free type, the method is based on a kind of including tank, dip mold and top die
Frock clamp implement, the compression bonding method comprises the following steps：
Step 1) frock clamp manufactures and designs, and the frock clamp includes tank, dip mold and top die, the tank
Interior cavity volume is identical with the appearance and size of the appearance and size of dip mold and printed circuit board to be crimped, and is set on the dip mold
The lower surface for having multiple holes consistent with the hole heart position in hole to be crimped on printed circuit board and quantity, the top die sets many
The individual contiguous block being connected with connector；
Step 1) by step 1) in tank lie in a horizontal plane on the platform of press-connection machine, by step 1) in dip mold be put into
In the inner volume of tank, then printed circuit board to be crimped is placed on dip mold；
Step 2) will treat that the pin of crimp connector inserts the hole to be crimped of corresponding printed circuit board, then by step 1) in
Top die the top surface for treating crimp connector is placed on by contiguous block；
Step 3) tank that will assemble pushes to the underface of press-connection machine head；
Step 4) start press-connection machine, pressure head is moved downward and presses down on top die so that the pin press-in print of connector
In the hole of circuit board processed, forming interference fit makes its tight connection, that is, complete the connection of connector and printed circuit board.
Cavity volume in the tank is identical with the appearance and size of the appearance and size of dip mold and printed circuit board to be crimped,
Multiple holes consistent with the hole heart position in hole to be crimped on printed circuit board and quantity, the upper pressure are provided with the dip mold
The lower surface of mould sets multiple contiguous blocks being connected with connector.
In above-mentioned compression bonding method, in order that printed circuit board and dip mold can realize accurate contraposition, it is necessary to ensure to hold
Cavity volume in groove is identical with the appearance and size of the appearance and size of dip mold and printed circuit board to be crimped, and is set on dip mold
It is equipped with multiple holes consistent with the hole heart position in hole to be crimped on printed circuit board and quantity.
Further, the step 1)~step 3) in tank two side and two ends be respectively arranged with baffle plate, the gear
The length of plate compares printed circuit less than the side wall or the length of end where baffle plate, the baffle plate with the thickness sum for holding groove sidewall
Dip mold and printed circuit board can be both fixed on appearance by the big 2mm of the thickness sum of thickness and dip mold of plate, such design
In groove, it is also possible to convenient dismounting.
Further, multiple grooves are additionally provided with the bottom surface of the tank, the groove is arc or rectangle, such
Design can mitigate the weight of tank, conveniently carry out push-and-pull.
Further, the step 1) in hole to be crimped on boring ratio printed circuit board on dip mold aperture it is big
0.3mm, in order to increase support force of the dip mold to printed circuit board, be additionally provided with the dip mold with installed in print
The corresponding circular hole of circuit board lower surface device processed and square opening, can avoid in the mounted first device in printed circuit board BOT faces
Part.
Further,：The step 1)~step 4) it is to be completed in the environment of antistatic.
The beneficial effects of the invention are as follows：
Crucial part of the invention is that corresponding according to the shape of printed circuit board to be crimped and the Position Design in hole
Dip mold and tank, then dip mold and printed circuit board are put into tank can realize automatic accurate contraposition, eliminate people
The process that work is aligned, has saved the time；Simultaneously by the appearance and size of top die according to the spacing of connector and connector
Upper surface shape carrys out specific design so that a top die can simultaneously crimp multiple connectors, substantially increase crimping efficiency.
Brief description of the drawings
Fig. 1 is state diagram of the present invention when work is crimped.
Fig. 2 is the structural representation of tank of the present invention.
Fig. 3 is the structural representation of dip mold of the present invention.
Fig. 4 is the structural representation of top die of the present invention.
Fig. 5 is control principle schematic diagram of the invention.
Shown in figure：1. press-connection machine, 2. top die, 2.1 contiguous blocks, 3. connector, 4. printed circuit board, 5. dip mold,
5.1 holes, 5.2 circular holes, 5.3 square openings, 6. tank, 6.1 baffle plates, 6.2 grooves, 81. mechanical pressure head stroke controlling units, 82. pressures
Power sensing unit, 83. pressure judging units.
Specific embodiment
In order to make the purpose , technical scheme and advantage of the present invention be clearer, below in conjunction with the accompanying drawings and embodiment pair
The present invention is described further, it should be appreciated that this place describe specific embodiment be only used to explain the present invention, not
For limiting the present invention.
As Figure 1-4, the compression bonding method of the highly dense connector of a kind of welding-free type, the method be based on it is a kind of include tank 6, under
The frock clamp of pressing mold 5 and top die 2 is implemented, it is characterised in that：The compression bonding method comprises the following steps：
Step 1) frock clamp manufactures and designs, and the frock clamp includes tank 6, dip mold 5 and top die 2,
Step 1) by step 1) in tank 6 lie in a horizontal plane on the platform of press-connection machine 1, by step 1) in dip mold 5
It is put into the inner volume of tank 6, then printed circuit board 4 to be crimped is placed on dip mold 5；
Step 2) will treat that the pin of crimp connector 3 inserts the hole to be crimped of corresponding printed circuit board 4, then by step 1)
In top die 2 top surface for treating crimp connector 3 is placed on by contiguous block 2.1；
Step 3) tank 6 that will assemble pushes to the underface of the head of press-connection machine 1；
Step 4) start press-connection machine 1, pressure head is moved downward and presses down on top die 2 so that the pin press-in of connector 3
In the hole of printed circuit board 4, forming interference fit makes its tight connection, that is, complete the connection of connector 3 and printed circuit board 4.
The appearance and size of cavity volume and dip mold 5 in the tank 6 and the appearance and size phase of printed circuit board 4 to be crimped
Together, multiple holes 5.1 consistent with the hole heart position in hole to be crimped on printed circuit board 4 and quantity are provided with the dip mold 5,
The lower surface of the top die 2 sets multiple contiguous blocks 2.1 being connected with connector 3.
Above-mentioned steps step 1)~step 3) in tank 6 two side and two ends be respectively arranged with baffle plate 6.1, the baffle plate
6.1 length is printed less than the side wall or the length of end where baffle plate 6.1, baffle plate 6.1 with the thickness sum ratio of the side wall of tank 6
The big 2mm of the thickness sum of thickness and dip mold 5 of circuit board 4 so that dip mold 5 and printed circuit board 4 can be fixed on tank 6
In.
The step 1) in aperture big 0.3mm of the hole 5.1 than the hole to be crimped on printed circuit board 4 on dip mold 5, no
Only play a part of guided connector, also improve the supporting role to compression printed circuit board.
The step 1)~step 3) in the bottom surface of tank 6 be additionally provided with multiple grooves 6.2, the groove 6.2 is arc
Shape or rectangle, the design of groove 6.2 cause the weight of whole tank 6, conveniently carry out push-and-pull tank 6.
The step 1) in be additionally provided with dip mold 5 with installed in the corresponding circular hole of the lower surface device of printed circuit board 4
5.2 and square opening 5.3, the already installed component in the lower section of printed circuit 4 can be effectively avoided,
The step 1)~step 4) it is to be completed in the environment of antistatic.
The appearance and size of the top die 2 can be according to the upper surface shape design of the spacing of connector and connector, institute
The electrolysis of top die are stated less than 2/3rds of crimping compressing head junction, the contiguous block 2.1 of top die 2 is set in the present embodiment
3 are counted into, then can simultaneously crimp 3 connectors, the material of the top die is preferably stainless steel.
A kind of crimped status of the highly dense connector of welding-free type of the present invention are as shown in figure 1, again as shown in figure 5, this hair
Bright control system 8 is mechanical pressure head control system, including mechanical pressure head stroke controlling unit 81, pressure sensitive unit 82 and
Pressure judging unit 83, wherein, the pressure sensitive unit 82 is arranged in crimping compressing head.The first of mechanical pressure head is set first
When height coordinate and terminal height coordinate, will treat that the maximum, force that many pins of crimp connector bear is set to threshold value, by the threshold value
It is stored in pressure judging unit 83；Make the highly dense connector of the printed board, welding-free type and upper dip mold peripheral frame positioning and clamping and push away
It is put into immediately below mechanical pressure head, when the mechanical pressure head stroke controlling unit 81 sends control signal to action execution unit, drives
Motivation tool pressure head starts downward crimping operation stroke to the initial height coordinate for setting, and makes to be arranged on the feeling of stress in pressure head
Answering unit 82 carries out pressure sensitive test to the lower surface of pressure head, and sends sensing test data to pressure judging unit 83,
By being compared analysis with the predetermined threshold value being pre-stored in pressure judging unit 83, judge in stroke range until terminal is high
The pressure head pressure of coordinate compression bonding apparatus is spent not less than maximum, then sends judgement to mechanical pressure head stroke controlling unit 81
Signal, mechanical pressure head stroke controlling unit 81 interrupts downward displacement commands after receiving the judgement signal, starts up-on command, drives
Motivation tool pressure head is up, pressure head is left top die, completes crimping work.Controlled by using mechanical pressure head in this compression bonding method
System makes crimping work more accurate, and improves operating efficiency, it is adaptable to industrial production application.
The part not illustrated in specification is prior art or common knowledge.The present embodiment is merely to illustrate the invention,
Rather than the scope of the present invention is limited, those skilled in the art are considered for modifications such as equivalent replacements for being made of the invention
Fall into invention claims institute protection domain.
Claims (8)
1. the compression bonding method of the highly dense connector of a kind of welding-free type, the method be based on it is a kind of include tank (6), dip mold (5) and on
The frock clamp of pressing mold (2) is implemented, it is characterised in that：The compression bonding method comprises the following steps：
1) tank (6) is lain in a horizontal plane on the platform of press-connection machine (1), dip mold (5) is put into the inner volume of tank (6)
In, then printed circuit board (4) to be crimped is placed on dip mold (5)；
2) in treating that the pin of crimp connector (3) inserts the hole to be crimped of corresponding printed circuit board (4), then by step 1) in
Top die (2) is placed on the top surface for treating crimp connector (3) by contiguous block (2.1)；
3) tank (6) that will be assembled pushes to the underface of press-connection machine (1) head；
4) press-connection machine (1) is started, pressure head is moved downward and presses down on top die (2) so that the pin press-in print of connector (3)
In the hole of circuit board (4) processed, forming interference fit makes its tight connection, that is, complete the company of connector (3) and printed circuit board (4)
Connect.
2. the compression bonding method of the highly dense connector of a kind of welding-free type according to claim 1, it is characterised in that：The tank
(6) cavity volume in is identical with the appearance and size of the appearance and size of dip mold (5) and printed circuit board (4) to be crimped, it is described under
Multiple holes (5.1) consistent with the hole heart position in hole to be crimped on printed circuit board (4) and quantity, institute are provided with pressing mold (5)
The lower surface for stating top die (2) sets multiple contiguous blocks (2.1) being connected with connector (3).
3. the compression bonding method of the highly dense connector of a kind of welding-free type according to claim 1, it is characterised in that：The step 1)
~step 3) in tank (6) two side and two ends be respectively arranged with baffle plate (6.1), the length of the baffle plate (6.1) is less than gear
The length of side wall or end where plate (6.1).
4. the compression bonding method of the highly dense connector of a kind of welding-free type according to claim 2, it is characterised in that：The baffle plate
(6.1) with the thickness sum of tank (6) side wall than the thickness of printed circuit board (4) and the big 2mm of thickness sum of dip mold (5).
5. the compression bonding method of the highly dense connector of a kind of welding-free type according to claim 1, it is characterised in that：The step 1)
Aperture big 0.3mm of the hole (5.1) than the hole to be crimped on printed circuit board (4) on middle dip mold (5).
6. the compression bonding method of the highly dense connector of a kind of welding-free type according to claim 1, it is characterised in that：The step 1)
~step 3) in the bottom surface of tank (6) be additionally provided with multiple grooves (6.2), the groove (6.2) is arc or rectangle.
7. the compression bonding method of the highly dense connector of a kind of welding-free type according to claim 1, it is characterised in that：The step 1)
Be additionally provided with middle dip mold (5) with installed in the corresponding circular hole (5.2) of printed circuit board (4) lower surface device and square opening
(5.3)。
8. the compression bonding method of the highly dense connector of a kind of welding-free type according to claim 1, it is characterised in that：The step 1)
~step 4) it is to be completed in the environment of antistatic.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611251365.7A CN106785802B (en) | 2016-12-29 | 2016-12-29 | A kind of compression bonding method of the highly dense connector of welding-free type |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611251365.7A CN106785802B (en) | 2016-12-29 | 2016-12-29 | A kind of compression bonding method of the highly dense connector of welding-free type |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106785802A true CN106785802A (en) | 2017-05-31 |
| CN106785802B CN106785802B (en) | 2019-03-29 |
Family
ID=58929413
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611251365.7A Active CN106785802B (en) | 2016-12-29 | 2016-12-29 | A kind of compression bonding method of the highly dense connector of welding-free type |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107138628A (en) * | 2017-06-09 | 2017-09-08 | 株洲中车时代电气股份有限公司 | A kind of light-guiding pillar compression bonding apparatus and method |
| CN107946860A (en) * | 2017-11-16 | 2018-04-20 | 无锡市同步电子制造有限公司 | Crimp design technology |
| CN111263534A (en) * | 2020-04-10 | 2020-06-09 | 宁波均普智能制造股份有限公司 | Pressure head and press fitting equipment |
| CN111970917A (en) * | 2020-07-30 | 2020-11-20 | 西南电子技术研究所（中国电子科技集团公司第十研究所） | Flat pressing type crimping tool for PCB and connector |
| CN115942620A (en) * | 2023-01-09 | 2023-04-07 | 广州诺顶智能科技有限公司 | Crimping machine control method and system, crimping machine and readable medium |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107138628A (en) * | 2017-06-09 | 2017-09-08 | 株洲中车时代电气股份有限公司 | A kind of light-guiding pillar compression bonding apparatus and method |
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| CN111970917A (en) * | 2020-07-30 | 2020-11-20 | 西南电子技术研究所（中国电子科技集团公司第十研究所） | Flat pressing type crimping tool for PCB and connector |
| CN115942620A (en) * | 2023-01-09 | 2023-04-07 | 广州诺顶智能科技有限公司 | Crimping machine control method and system, crimping machine and readable medium |
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