CN104465456A - Equipment for switching dual-in-line electronic device to be in SMD package form - Google Patents
Equipment for switching dual-in-line electronic device to be in SMD package form Download PDFInfo
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- CN104465456A CN104465456A CN201410465800.0A CN201410465800A CN104465456A CN 104465456 A CN104465456 A CN 104465456A CN 201410465800 A CN201410465800 A CN 201410465800A CN 104465456 A CN104465456 A CN 104465456A
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- electronic device
- material toggling
- equipment
- dual inline
- type electronic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Containers And Plastic Fillers For Packaging (AREA)
Abstract
The embodiment of the invention discloses equipment for switching a dual-in-line electronic device to be in an SMD package form. The equipment comprises a feeding mechanism, a poking mechanism, a punching mechanism and a tube inlet mechanism. The dual-in-line electronic device in a material tube is fed into the poking mechanism through the feeding mechanism. The poking mechanism pokes the dual-in-line electronic device into the punching mechanism after the punching mechanism completes the punching process. The punching mechanism comprises an upper die and a lower die, and the tube inlet mechanism collects the output device of a forming groove into the tube. By the adoption of the equipment, pins of the dual-in-line packaged electronic device are pre-bent through a pre-bending groove, the dual-in-line electronic device is formed through the forming groove in a punched mode, feeding, poking, punching and air blowing tube entering are automatically completed, manual intervening is avoided as much as possible, production efficiency is obviously improved, the dual-in-line package is switched to be the SMD package, and the equipment has positive significance for forming of a compact PCB structure.
Description
Technical field
The present invention relates to a kind of pin of electronic device former, particularly relate to the equipment that a kind of dual inline type electronic device is posted sheet packaged type.
Background technology
DIP encapsulates (Dual In-line Package), also dual in-line package technology is, it is the simplest packaged type of one, adopt the integrated circuit (IC) chip of dual-in-line form encapsulation, most middle small scale integrated circuit all adopts this packing forms, the cpu chip of DIP encapsulation has two row's pins, need be inserted into there is DIP structure chip carrier socket on, on the chip carrier socket that also directly can be welded in DIP structure or be welded in the welding position of identical welding hole number, be characterized in the piercing welding that can realize pcb board easily, good compatibility is had with mainboard.But because its package area and thickness are all larger, and pin is easily damaged in swapping process, and reliability is poor.This packaged type is due to the impact by technique simultaneously, and pin is generally all no more than 100, and along with the Highgrade integration of CPU inside, the arena of history has been exited in DIP encapsulation very soon.
In order to improve the range of application of DIP packaged chip, paster encapsulation can be converted to DIP encapsulation, make it can be applied to the occasion of little pcb board volume, thus reduce costs, and in prior art, do not have a kind of equipment to change DIP encapsulation efficiently, make DIP package application be defined in original scope.
Summary of the invention
Embodiment of the present invention technical problem to be solved is, provides a kind of dual inline type electronic device to be posted the equipment of sheet packaged type.Can paster be become to encapsulate DIP encapsulation transition efficiently.
In order to solve the problems of the technologies described above, embodiments provide the equipment that a kind of dual inline type electronic device is posted sheet packaged type, comprising feed mechanism, material toggling mechanism, punching mechanism, Ru Guan mechanism;
Dual inline type electronic device in material pipe is delivered in described material toggling mechanism by described feed mechanism;
Described material toggling mechanism described punching mechanism complete stamping procedure after described dual inline type electronic device is dialled in described punching mechanism;
Described punching mechanism comprises patrix and counterdie, described counterdie has the pre-curved groove and forming tank of accepting described material toggling mechanism, described patrix has the pre-bending cutting die and forming knife mold that match with described pre-curved groove and forming tank, carries out pre-bending, molding press cutting respectively to described dual inline type electronic device;
Described Ru Guan mechanism is placed in the outlet of described forming tank, and the output device of described forming tank is collected into pipe.
Further, also comprise the feeding pressure mechanism be arranged on described counterdie, described feeding pressure mechanism has elevating mechanism, and described elevating mechanism has the binder bar that is placed in described pre-curved groove and forming tank.
Further, described elevating mechanism is formed by the vertical guide rail be installed vertically on described counterdie and with the lifting slider that described vertical guide rail is slidably connected, and described binder bar two ends are fixed on described lifting slider.
Further, described material toggling mechanism comprises material toggling frame, the material toggling groove be fixedly installed on described material toggling frame, slide the shifting block that is arranged on described material toggling frame, the pilot hole that the bottom of described material toggling groove is arranged, the head end of described pilot hole is provided with the first sliding-tongue of backgauge, described shifting block has the second sliding-tongue slided on by described pilot hole in described material toggling groove.
Further, described material toggling mechanism also comprises L-shaped binder block, and described binder block one end is fixedly installed on material toggling groove, and the other end is placed in the middle part of described material toggling groove.
Further, described material toggling mechanism also comprises the cylinder be arranged on described material toggling frame side, shifting block described in described air cylinder driven, described second sliding-tongue is come and gone and slides in described pilot hole, carried forward by described dual inline type electronic device.
Further, described feed mechanism comprises material pipe support, slide mechanism, valve, and described valve is coordinated with the material pipe end thereof contacts be set up on described material pipe support by slide mechanism.
Further, described material toggling mechanism one end has the interface installing described material pipe.
Further, described Ru Guan mechanism has the air blowing track accepted with described forming tank, and described air blowing track side is provided with the pore of some connection sources of the gas, is covered with cover plate above described air blowing track, and described air blowing track end connects receives aggregate pipe.
Further, described patrix is provided with induction position-limit mechanism, and described induction position-limit mechanism top is provided with inductive switch, triggers described inductive switch when described patrix and counterdie punching press, makes described feed mechanism toward the feeding of described material toggling mechanism.
Implement the embodiment of the present invention, there is following beneficial effect: the electronic device of dual in-line package is carried out pin pre-bending by pre-curved groove by the present invention, by forming tank punching molding, automatically feeding is completed, material toggling, die-cut, be blown into the operation of pipe, one-step punching can be processed multiple electronic device, avoid artificial intervention as far as possible, significantly improve production efficiency, dual in-line package is converted to the form of paster encapsulation, make the electronic device of dual in-line package can be applied on paster PCT plate, facilitate the structure of compact PCB, there is positive meaning.
Accompanying drawing explanation
Fig. 1 is overall structure schematic diagram of the present invention;
Fig. 2 is the another structural representation of entirety of the present invention;
The structure of Tu3Shi material toggling mechanism, counterdie, enter pipe structural scheme of mechanism;
Fig. 4 is the structural representation of counterdie;
Fig. 5 is the structural representation of patrix;
Fig. 6 is the structural representation of feeding pressure mechanism;
The structural representation of Tu7Shi material toggling mechanism;
The another structural representation of Tu8Shi material toggling mechanism;
Fig. 9 is the structural representation of shifting block;
Figure 10 is the structural representation of feed mechanism;
The structural representation of Figure 11 Shi Ruguan mechanism;
The structural representation of the air blowing track of Figure 12 Shi Ruguan mechanism.
Embodiment
For making the object, technical solutions and advantages of the present invention clearly, below in conjunction with accompanying drawing, the present invention is described in further detail.
With reference to the overall structure schematic diagram of the present invention shown in Fig. 1.
A kind of dual inline type electronic device of the embodiment of the present invention is posted the equipment of sheet packaged type, includes feed mechanism 1, material toggling mechanism 2, punching mechanism 3, Ru Guan mechanism 4.
Feed mechanism 1 for by material pipe 11 in dual inline type electronic device blow in material toggling mechanism 2,
The dual-in-line electronic device that feed mechanism is delivered to by material toggling mechanism 2 after punching mechanism 3 completes stamping procedure is dialled in impact machine mechanism and is processed.
Structure as shown in Fig. 2, Fig. 3, Fig. 4, Fig. 5.
Punching mechanism 3 includes counterdie 31 and the patrix 32 of slip pressing, counterdie has the pre-curved groove 311 and forming tank 312 of accepting the feeding of institute of material toggling mechanism, correspondingly with it on patrix 32 be provided with pre-bending cutting die 321 and forming knife mold 322, when counterdie 31 and patrix 32 punching press are closed, pre-bending cutting die 321 coordinates with pre-curved groove 311 pin of dual inline type electronic device is carried out pre-bending, forming knife mold 322 carries out punching molding with the pin of the dual inline type electronic device of forming tank 312 pairs of pre-bendings, makes the pin of dual inline type electronic device form the form of paster encapsulation.
Feeding pressure mechanism 33 is arranged between counterdie 31 and patrix 32, structural representation as shown in Figure 6, feeding pressure mechanism 33 has elevating mechanism 331 and is installed on the binder bar 332 on elevating mechanism 331, elevating mechanism 331 has and is vertically mounted on vertical guide rail 331a on counterdie 31 and slip and is arranged at lifting slider 331b on vertical guide rail, elevating mechanism 331 is two, binder bar is installed between two lifting slider 331b, fall slide block 331b to be elevated under the driving of cylinder, binder bar 332 is processed with the packing colloid of the electronic device of forming tank 312 is fixing for making to be arranged in pre-curved groove 311, when there are substandard products during staff finds forming knife mold 322 and forming tank 312 and substandard products affect the advance of electronic device, air cylinder driven lifting slider 331b can be made, binder bar 332 is made to rise and take out substandard products.
With reference to the structural representation of the material toggling mechanism shown in Fig. 7, Fig. 8, Fig. 9.
Material toggling mechanism 2 comprises material toggling frame, the material toggling groove 22 be fixedly installed on material toggling frame 21, slide the shifting block 23 that is arranged on material toggling frame 21, pilot hole 221 is provided with on bottom material toggling groove 22, on the head end of pilot hole 221, the first sliding-tongue 222 is provided with bottom material toggling groove 22, shifting block 23 is provided with the second sliding-tongue 231, second sliding-tongue 231 slides and is arranged in pilot hole 221, the one side that the first sliding-tongue 222, second sliding-tongue 231 and the direction of advance of electronic device are catered to is arc sliding surface.
Material toggling frame 21 is provided with slide bar 24, shifting block 23 slides and is arranged on slide bar 24, cylinder 25 on material toggling frame side, cylinder 25, for driving shifting block 23, makes the second sliding-tongue 231 come and go and slides in pilot hole 221, when the second sliding-tongue 231 returns, first sliding-tongue 222 produces backgauge effect, and the second sliding-tongue 231 slips over the bottom of the electronic device in material toggling groove 22, and when the second sliding-tongue 231 is dialled forward, second sliding-tongue 231 back produces backgauge effect, is dialled in forward by electronic device in pre-curved groove 311.
L-shaped binder block 26 is installed above material toggling groove 22, binder block 26 one end be fixed on material toggling groove 22 on, the other end is placed in the middle part of material toggling groove 22, and the electronic device level in material toggling groove is advanced.
More preferably, the length of the length of pilot hole 221 and pre-curved groove 311, forming tank 312 is suitable, and the electronic device pre-curved groove 311 just pushes in forming tank 312 by the electronic device entering pre-curved groove 311 from material toggling groove 22.
With reference to the structural representation of the feed mechanism shown in Figure 10.
Feed mechanism 1 comprises material pipe support 12, slide mechanism 13, valve 14, material pipe support 12 is for setting up material pipe, material toggling mechanism 2 one end has the interface 25 installing described material pipe, material pipe 11 1 end-rack is on material pipe support 11, the other end inserts in interface 25, valve 14 is installed on slide mechanism 13, slide mechanism is under the driving of cylinder, valve is coordinated with the end thereof contacts of material pipe 11, from the head end of material pipe 11, the dual inline type electronic device material pipe 11 is blown, delivered to material toggling mechanism 2.
With reference to the structural representation of the Ru Guan mechanism shown in Figure 11, Figure 12.
Ru Guan mechanism 4 has the air blowing track 41 that forming tank is accepted, air blowing track 41 side is provided with the pore 411 of some connection sources of the gas, cover plate 42 is covered with above air blowing track, air blowing track 41 end connect receive aggregate pipe, under the blowing of gas by forming tank export convert to paster encasing electronic components carry out rewinding enter pipe.
The more important thing is that patrix is provided with induction position-limit mechanism 34, structural representation as shown in Figure 2, Figure 4 shows, answer position-limit mechanism top that inductive switch 341 is installed, trigger described inductive switch 341 when patrix and counterdie punching press, make described feed mechanism toward the feeding of described material toggling mechanism.
The present invention operationally, the dual inline type electronic device in material pipe 11 is made to blow the second sliding-tongue 231 front end to material toggling mechanism 2 by feed mechanism 1, namely above pilot hole 221, come and gone by the second sliding-tongue 231 and run, to dial in the pre-curved groove 311 of counterdie 31 before the dual inline type electronic device of the second sliding-tongue 231 front end, patrix 32 is down die-cut, pre-bending cutting die 321 coordinates with pre-curved groove 311 pin of dual inline type electronic device is carried out pre-bending, trigger the inductive switch 341 of induction position-limit mechanism 34 simultaneously, feed mechanism 1 continues feeding, by material toggling mechanism 2 continue stir, new dual inline type electronic device is sent in pre-curved groove 311, the dual inline type electronic device of pre-curved groove 311 pre-bending is sent in forming tank 312, forming knife mold 322 carries out punching molding with the pin of the dual inline type electronic device of forming tank 312 pairs of pre-bendings, trigger the inductive switch 341 of induction position-limit mechanism 34 simultaneously, feed mechanism 1 continues feeding, by material toggling mechanism 2 continue stir, pre-curved groove 311, forming tank 312 carries out punching molding, the air blowing track 41 that electronic device that paster closes pushes Ru Guan mechanism 4 is converted to simultaneously by punching molding, under the air blowing effect of the pore 411 of air blowing track 41, the electronic device of the paster encapsulation machined completes into pipe.
Above disclosedly be only a kind of preferred embodiment of the present invention, certainly can not limit the interest field of the present invention with this, therefore according to the equivalent variations that the claims in the present invention are done, still belong to the scope that the present invention is contained.
Claims (10)
1. dual inline type electronic device is posted an equipment for sheet packaged type, it is characterized in that, comprises feed mechanism, material toggling mechanism, punching mechanism, Ru Guan mechanism;
Dual inline type electronic device in material pipe is delivered in described material toggling mechanism by described feed mechanism;
Described material toggling mechanism described punching mechanism complete stamping procedure after described dual inline type electronic device is dialled in described punching mechanism;
Described punching mechanism comprises patrix and counterdie, described counterdie has the pre-curved groove and forming tank of accepting described material toggling mechanism, described patrix has the pre-bending cutting die and forming knife mold that match with described pre-curved groove and forming tank, carries out pre-bending, molding press cutting respectively to described dual inline type electronic device;
Described Ru Guan mechanism is placed in the outlet of described forming tank, and the output device of described forming tank is collected into pipe.
2. dual inline type electronic device according to claim 1 is posted the equipment of sheet packaged type, it is characterized in that, also comprise the feeding pressure mechanism be arranged on described counterdie, described feeding pressure mechanism has elevating mechanism, and described elevating mechanism has the binder bar that is placed in described pre-curved groove and forming tank.
3. dual inline type electronic device according to claim 2 is posted the equipment of sheet packaged type, it is characterized in that, described elevating mechanism is formed by the vertical guide rail be installed vertically on described counterdie and with the lifting slider that described vertical guide rail is slidably connected, and described binder bar two ends are fixed on described lifting slider.
4. dual inline type electronic device according to claim 1 and 2 is posted the equipment of sheet packaged type, it is characterized in that, described material toggling mechanism comprises material toggling frame, the material toggling groove be fixedly installed on described material toggling frame, slide the shifting block that is arranged on described material toggling frame, the pilot hole that the bottom of described material toggling groove is arranged, the head end of described pilot hole is provided with the first sliding-tongue of backgauge, described shifting block has the second sliding-tongue slided on by described pilot hole in described material toggling groove.
5. dual inline type electronic device according to claim 4 is posted the equipment of sheet packaged type, it is characterized in that, described material toggling mechanism also comprises L-shaped binder block, and described binder block one end is fixedly installed on material toggling groove, and the other end is placed in the middle part of described material toggling groove.
6. dual inline type electronic device according to claim 5 is posted the equipment of sheet packaged type, it is characterized in that, described material toggling mechanism also comprises the cylinder be arranged on described material toggling frame side, shifting block described in described air cylinder driven, described second sliding-tongue is come and gone to be slided in described pilot hole, is carried forward by described dual inline type electronic device.
7. dual inline type electronic device according to claim 4 is posted the equipment of sheet packaged type, it is characterized in that, described feed mechanism comprises material pipe support, slide mechanism, valve, and described valve is coordinated with the material pipe end thereof contacts be set up on described material pipe support by slide mechanism.
8. dual inline type electronic device according to claim 7 is posted the equipment of sheet packaged type, it is characterized in that, described material toggling mechanism one end has the interface installing described material pipe.
9. dual inline type electronic device according to claim 4 is posted the equipment of sheet packaged type, it is characterized in that, described Ru Guan mechanism has the air blowing track accepted with described forming tank, described air blowing track side is provided with the pore of some connection sources of the gas, be covered with cover plate above described air blowing track, described air blowing track end connects receives aggregate pipe.
10. dual inline type electronic device according to claim 1 is posted the equipment of sheet packaged type, it is characterized in that, described patrix is provided with induction position-limit mechanism, described induction position-limit mechanism top is provided with inductive switch, trigger described inductive switch when described patrix and counterdie punching press, make described feed mechanism toward the feeding of described material toggling mechanism.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410465800.0A CN104465456B (en) | 2014-09-15 | 2014-09-15 | The equipment that a kind of dual inline type electronic device is posted piece packaged type |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410465800.0A CN104465456B (en) | 2014-09-15 | 2014-09-15 | The equipment that a kind of dual inline type electronic device is posted piece packaged type |
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| CN104465456A true CN104465456A (en) | 2015-03-25 |
| CN104465456B CN104465456B (en) | 2017-08-25 |
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| CN201410465800.0A Active CN104465456B (en) | 2014-09-15 | 2014-09-15 | The equipment that a kind of dual inline type electronic device is posted piece packaged type |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112002647A (en) * | 2020-10-28 | 2020-11-27 | 四川立泰电子有限公司 | Automatic pin cutting and testing integrated machine for semiconductor electronic device and application thereof |
| CN116721950A (en) * | 2023-08-09 | 2023-09-08 | 天津安联信科技有限公司 | Semiconductor device encapsulation processingequipment |
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| CN204204810U (en) * | 2014-09-15 | 2015-03-11 | 广东良得光电科技有限公司 | A kind of dual inline type electronic device is posted the equipment of sheet packaged type |
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| US6412522B1 (en) * | 2000-02-08 | 2002-07-02 | Oki Electric Industry Co, Ltd. | Bending die and bending machine using the same |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112002647A (en) * | 2020-10-28 | 2020-11-27 | 四川立泰电子有限公司 | Automatic pin cutting and testing integrated machine for semiconductor electronic device and application thereof |
| CN116721950A (en) * | 2023-08-09 | 2023-09-08 | 天津安联信科技有限公司 | Semiconductor device encapsulation processingequipment |
| CN116721950B (en) * | 2023-08-09 | 2023-10-13 | 天津安联信科技有限公司 | Semiconductor device encapsulation processingequipment |
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| Publication number | Publication date |
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| CN104465456B (en) | 2017-08-25 |
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