CN202387845U - Flattening die for flattened patch plastic encapsulated diode production - Google Patents
Flattening die for flattened patch plastic encapsulated diode production Download PDFInfo
- Publication number
- CN202387845U CN202387845U CN201120523371XU CN201120523371U CN202387845U CN 202387845 U CN202387845 U CN 202387845U CN 201120523371X U CN201120523371X U CN 201120523371XU CN 201120523371 U CN201120523371 U CN 201120523371U CN 202387845 U CN202387845 U CN 202387845U
- Authority
- CN
- China
- Prior art keywords
- die
- flattening
- punch
- position block
- block
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The utility model discloses a flattening die used for flattened patch plastic encapsulated diode production. The flattening die comprises an upper die plate and a lower die plate; a male die seat is mounted below the upper die plate; a male die carrier is mounted below the male die seat; a male die groove is formed on the lower surface of the male die carrier; a male die is mounted in the male die groove; a female die seat is mounted above the lower die plate; a female die carrier is mounted above the female die seat; a female die groove is formed on the upper surface of the female die carrier; and a female die corresponding to the male die in position is mounted in the female die groove. The flattening to lead wire at two ends of a diode can be finished through the match between the male die and the female die, so that the production requirement of the flattened patch plastic encapsulated diode is met under the premise that the special patch plastic encapsulated diode production line is not used. The flattening die has the advantages of simple structure, convenience in operation and low cost.
Description
Technical field
The utility model relates to a kind of mould that flattening type paster plastic package diode is produced that is used for, and relates in particular to a kind of simple, practical flattening mould that is used for the production of flattening type paster plastic package diode.
Background technology
Needs along with the production of miniaturization of electronic products, automation; Demand to the paster plastic package diode increases year by year; Because paster plastic package diode production line is different fully with conventional axial plastic package diode apparatus for production line; Realize the updating and upgrading of a product, have only and heavily drop into another paster plastic package diode production line, need substantial contribution (production line about 2,000,000) and time.This has not only hindered enterprise provides a large amount of paster plastic package diodes, can not satisfy the demand of society, and needs waste enterprise's substantial contribution and time.In the production of paster plastic package diode; Be flattening wherein to diode two ends lead-in wire with the maximum one procedure of conventional axial plastic package diode production difference; This is a unexistent operation during the conventional axial plastic package diode is produced; So, also be not used in the flattening mould that flattening type paster plastic package diode is produced in the market.
Summary of the invention
The purpose of the utility model just is to provide in order to address the above problem a kind of simple, practical flattening mould that flattening type paster plastic package diode is produced that is used for.
The utility model is realized above-mentioned purpose through following technical scheme:
The utility model comprises cope match-plate pattern and lower bolster, and the below of said cope match-plate pattern is equipped with convex mould base, and the below of said convex mould base is equipped with the punch frame, and the lower surface of said punch frame is provided with the punch groove, in the said punch groove punch is installed; The top of said lower bolster is equipped with die socket, and the top of said die socket is equipped with the die frame, and the upper surface of said die frame is provided with the die groove, is equipped with in the said die groove and the corresponding die in the position of said punch.
The utility model utilizes the flattening operation that can accomplish punch and cooperating of die diode two ends lead-in wire, thereby under the prerequisite of not using special-purpose paster plastic package diode production line, has satisfied the production needs of flattening type paster plastic package diode.
Particularly, said punch is fixed through the punch screw on the said punch recess sidewall, and said die is fixed through the die screw on the said die recess sidewall.This structure makes the installation and removal of punch and die very simple, helps changing fast punch and die.
As optimal selection, said punch and said die are sintered carbide die.Can reach more than 10000 times its service life.
Further; Position near said die one side on the said die socket is provided with the slide block that is used for fixing diode; Said slide block is connected with the take-up housing of its below; Said take-up housing is provided with the block that is fixedly connected with said lower bolster away from a side of said die, between said take-up housing and the said block spring is installed, and the axial direction of said spring is vertical with the axial direction of said die.Press in the process of die at punch; Punch has a thrust to the diode that is positioned at die next door, above-mentioned slide mechanism is set after, this thrust can be dissolved moving for slide block; Thereby avoided this thrust that diode is caused damage, improved product percent of pass.
Further, the upper fixed of said lower bolster is equipped with preceding lower position block, and said block is said preceding lower position block; The below of said cope match-plate pattern is installed with and the said preceding corresponding preceding upper limit position block of lower position block; The top of said lower bolster also is installed with the back lower position block, and the below of said cope match-plate pattern also is installed with and the corresponding back upper limit position block of said back lower position block.Said mechanism can be assisted punch and the common flattening operation of accomplishing diode lead of die, makes its action more accurate.
The beneficial effect of the utility model is:
The utility model utilizes the flattening operation that can accomplish punch and cooperating of die diode two ends lead-in wire; Thereby under the prerequisite of not using special-purpose paster plastic package diode production line, satisfied the production needs of flattening type paster plastic package diode, had advantage simple in structure, easy to operate, that cost is low.
Description of drawings
Accompanying drawing is the structural representation of the utility model.
The specific embodiment
Below in conjunction with accompanying drawing the utility model is described further:
Shown in accompanying drawing; The utility model comprises cope match-plate pattern 1 and lower bolster 8, and the below of cope match-plate pattern 1 is equipped with convex mould base 2, and the below of convex mould base 2 is equipped with punch frame 5; The lower surface of punch frame 5 is provided with punch groove (unmarked among the figure), in the said punch groove punch 6 is installed; The top of lower bolster 8 is equipped with die socket 9, die socket 9 the top die frame 18 is installed, the upper surface of die frame 18 is provided with die groove (unmarked among the figure), is equipped with in the said die groove and the corresponding die 14 in the position of punch 6; Punch 6 is sintered carbide die with die 14, can reach its service life more than 10000 times; Punch 6 is fixing through the punch screw on the said punch recess sidewall 7; Die 14 is fixing through the die screw on the said die recess sidewall 17; This structure makes the installation and removal of punch 6 and die 14 very simple, helps changing fast punch 6 and die 14.
Shown in accompanying drawing, the upper fixed of lower bolster 8 is equipped with preceding lower position block 11; The below of cope match-plate pattern 1 is installed with the preceding upper limit position block 3 corresponding with preceding lower position block 11; The top of lower bolster 8 also is installed with back lower position block 10, and the below of cope match-plate pattern 1 also is installed with the back upper limit position block 4 corresponding with back lower position block 10.Said mechanism can be assisted punch 6 and the die 14 common flattening operations of accomplishing diode lead, makes its action more accurate.19 is guide shaft and guide pin bushing among the figure, is used to convex mould base 2 guiding.
Shown in accompanying drawing; Position near die 14 1 sides on the die socket 9 is provided with the slide block 15 that is used for fixing diode; Slide block 15 is connected with the take-up housing 12 of its below, between take-up housing 12 and the preceding lower position block 11 spring 13 is installed, and the axial direction of spring 13 is vertical with the axial direction of die 14.Press in the process of die 14 at punch 6; The diode that 6 pairs of punch are positioned at die 14 next doors has a thrust, above-mentioned slide mechanism is set after, this thrust can be dissolved moving for slide block 15; Thereby avoided this thrust that diode is caused damage, improved product percent of pass.
Shown in accompanying drawing, the workflow of the utility model is following: will treat that the diode 16 in the diode assembly of plastic packaging is placed on the die frame 18, fixes the lead-in wire of diode 16 first ends through the fixture on the slide block 15; Hydraulic press (not shown, be commonly used mold mechanism) matched moulds then crimps onto 0.18-0.22mm with the lead-in wire of diode 16 second ends; After the hydraulic press die sinking,, be placed in again on the die frame 18 behind rotation 180 degree, accomplish the flattening of diode 16 first ends lead-in wire behind the hydraulic press matched moulds plastic package diode 16 taking-ups, behind the taking-up diode assembly, whole flattening flow process end.
Claims (6)
1. one kind is used for the flattening mould that flattening type paster plastic package diode is produced; It is characterized in that: comprise cope match-plate pattern and lower bolster; The below of said cope match-plate pattern is equipped with convex mould base; The below of said convex mould base is equipped with the punch frame, and the lower surface of said punch frame is provided with the punch groove, in the said punch groove punch is installed; The top of said lower bolster is equipped with die socket, and the top of said die socket is equipped with the die frame, and the upper surface of said die frame is provided with the die groove, is equipped with in the said die groove and the corresponding die in the position of said punch.
2. the flattening mould that is used for the production of flattening type paster plastic package diode according to claim 1; It is characterized in that: said punch is fixed through the punch screw on the said punch recess sidewall, and said die is fixed through the die screw on the said die recess sidewall.
3. the flattening mould that is used for the production of flattening type paster plastic package diode according to claim 1 and 2, it is characterized in that: said punch and said die are sintered carbide die.
4. the flattening mould that is used for the production of flattening type paster plastic package diode according to claim 1; It is characterized in that: the position near said die one side on the said die socket is provided with the slide block that is used for fixing diode; Said slide block is connected with the take-up housing of its below; Said take-up housing is provided with the block that is fixedly connected with said lower bolster away from a side of said die; Between said take-up housing and the said block spring is installed, the axial direction of said spring is vertical with the axial direction of said die.
5. the flattening mould that is used for the production of flattening type paster plastic package diode according to claim 4, it is characterized in that: the upper fixed of said lower bolster is equipped with preceding lower position block, and said block is said preceding lower position block; The below of said cope match-plate pattern is installed with and the said preceding corresponding preceding upper limit position block of lower position block; The top of said lower bolster also is installed with the back lower position block, and the below of said cope match-plate pattern also is installed with and the corresponding back upper limit position block of said back lower position block.
6. the flattening mould that is used for the production of flattening type paster plastic package diode according to claim 1; It is characterized in that: the upper fixed of said lower bolster is equipped with preceding lower position block, and the below of said cope match-plate pattern is installed with and the said preceding corresponding preceding upper limit position block of lower position block; The top of said lower bolster also is installed with the back lower position block, and the below of said cope match-plate pattern also is installed with and the corresponding back upper limit position block of said back lower position block.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120523371XU CN202387845U (en) | 2011-12-14 | 2011-12-14 | Flattening die for flattened patch plastic encapsulated diode production |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120523371XU CN202387845U (en) | 2011-12-14 | 2011-12-14 | Flattening die for flattened patch plastic encapsulated diode production |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202387845U true CN202387845U (en) | 2012-08-22 |
Family
ID=46662797
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201120523371XU Expired - Fee Related CN202387845U (en) | 2011-12-14 | 2011-12-14 | Flattening die for flattened patch plastic encapsulated diode production |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202387845U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106952829A (en) * | 2017-03-08 | 2017-07-14 | 安徽国晶微电子有限公司 | A kind of integrated antenna package Trim Molding mould |
| CN107159822A (en) * | 2017-05-23 | 2017-09-15 | 苏州木山云智能科技有限公司 | A kind of fine rule stretches machine drawing copper cash indenter device |
-
2011
- 2011-12-14 CN CN201120523371XU patent/CN202387845U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106952829A (en) * | 2017-03-08 | 2017-07-14 | 安徽国晶微电子有限公司 | A kind of integrated antenna package Trim Molding mould |
| CN107159822A (en) * | 2017-05-23 | 2017-09-15 | 苏州木山云智能科技有限公司 | A kind of fine rule stretches machine drawing copper cash indenter device |
| CN107159822B (en) * | 2017-05-23 | 2019-12-10 | 南京万和消防科技有限公司 | Copper wire pressure head device for fine wire drawing machine |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN202239190U (en) | A curved pipe hole-punching device | |
| CN205414112U (en) | Continuous stamping die of production shell fragment terminal | |
| CN204262173U (en) | A kind of continuous stamping die manufacturing automobile fog light movable contact spring | |
| CN104438833B (en) | A kind of continuous stamping die manufacturing threading device talk bonder terminal | |
| CN203426279U (en) | Continuous stamping die for manufacturing backboard communication connector terminal | |
| CN104384352B (en) | A kind of manufacture can the continuous stamping die of threading device antenna terminal | |
| CN205008490U (en) | A progressive stamping die for processing seven grades of stator core | |
| CN203578515U (en) | Novel die set with fine blanking and cold extruding functions | |
| CN202387845U (en) | Flattening die for flattened patch plastic encapsulated diode production | |
| CN103203413A (en) | Outer ring continuous stamping die | |
| CN205414148U (en) | Make continuous stamping die of high -speed transmission backplate communication connector terminal | |
| CN201511079U (en) | Stamping die for processing clutch diaphragm spring | |
| CN204234579U (en) | A kind of continuous stamping die of manufacturing intelligence threading device structure part | |
| CN205032569U (en) | Make continuous stamping die of backplate communication connector shielding piece | |
| CN204974926U (en) | Corner cut one shot forming mould that punches | |
| CN210358842U (en) | Front door mounting metal support die and front door mounting metal support thereof | |
| CN102909272A (en) | Flange drawing die | |
| CN203418030U (en) | Intra-die feeding device | |
| CN202779436U (en) | Packing box iron sheet composite mould of embossing, wire-leading, corner-cutting and punching | |
| CN205414111U (en) | Make continuous stamping die of high electric current transmission connector hardware product | |
| CN101733329A (en) | Novel quick-installation and multi-utilization mold base | |
| CN202316780U (en) | Mold structure for punching and molding head part of worm of spiral clamping hoop | |
| CN202239335U (en) | In-mold automatic feeding mechanism for punching | |
| CN202290987U (en) | Worm transmission type hose hoop shell processing device | |
| CN202137247U (en) | Chamfering mould |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120822 Termination date: 20151214 |
|
| EXPY | Termination of patent right or utility model |