CN106952829A - A kind of integrated antenna package Trim Molding mould - Google Patents
A kind of integrated antenna package Trim Molding mould Download PDFInfo
- Publication number
- CN106952829A CN106952829A CN201710134759.2A CN201710134759A CN106952829A CN 106952829 A CN106952829 A CN 106952829A CN 201710134759 A CN201710134759 A CN 201710134759A CN 106952829 A CN106952829 A CN 106952829A
- Authority
- CN
- China
- Prior art keywords
- forming
- antenna package
- integrated antenna
- roller
- die
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000465 moulding Methods 0.000 title claims abstract description 12
- 238000007493 shaping process Methods 0.000 claims description 6
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 claims description 4
- 235000010724 Wisteria floribunda Nutrition 0.000 claims description 4
- 239000000956 alloy Substances 0.000 claims description 4
- 229910045601 alloy Inorganic materials 0.000 claims description 4
- 229910000423 chromium oxide Inorganic materials 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 238000000034 method Methods 0.000 abstract description 3
- 238000003754 machining Methods 0.000 abstract description 2
- 238000012423 maintenance Methods 0.000 abstract description 2
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 238000005520 cutting process Methods 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4885—Wire-like parts or pins
- H01L21/4896—Mechanical treatment, e.g. cutting, bending
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Details Of Aerials (AREA)
Abstract
Field is manufactured the present invention relates to semiconductor integrated circuit, a kind of integrated antenna package Trim Molding mould is particularly related to, is made up of female die for forming, upper holder block, forming terrace die, rotating shaft, roller, roller sliding block, stage clip and little spring；Described female die for forming, which is placed on the base plate of forcing press, to be used to place plastic-sealed body；Described forming terrace die is movably connected on the cope plate of forcing press by rotating shaft and roller, and laterally disposed little spring is provided with the lower end of forming terrace die；The upper end of described roller sliding block is connected by stage clip with cope plate, and its lower end is flexibly connected with described little spring.The present invention pushed by forming terrace die realized with female die for forming it is once-forming to the terminal pin of plastic-sealed body, machining accuracy of the present invention is high, and long lifespan is easy to maintenance, the integrated antenna package Trim Molding technique of various models is widely used in, is adapted to promote the use of in integrated antenna package enterprise.
Description
Technical field
Field is manufactured the present invention relates to semiconductor integrated circuit, a kind of integrated antenna package Trim Molding mould is particularly related to.
Background technology
With developing rapidly for domestic electronics industry, integrated antenna package production scale constantly expands, encapsulation technology from
DIP, SOP, TSOP, TQFP to BGA continuous improvement, automatic rib cutting formation system change in the past many secondary mould single process
State, improve product quality and production efficiency, alleviate the labor intensity of operating personnel, make integrated circuit tendon-cut and shaping
Mould turns into the core technology of automatic rib cutting formation system, and Rib-cutting die is that shaping dies is equipped as critical process.But
With the raising of the integrated function of integrated circuit, the increase of product terminal pin quantity, this brings tired to conventional rib cutting formation
It is difficult.
The content of the invention
The purpose of the present invention is exactly one for overcoming the low shortcoming of rib cutting shaping dies short life, precision in the prior art and providing
What it is kind with high life and precision is once shapable integrated antenna package Trim Molding mould.
In order to solve the above technical problems, the present invention is adopted the following technical scheme that：
A kind of integrated antenna package Trim Molding mould, by female die for forming, upper holder block, forming terrace die, rotating shaft, roller, roller sliding block,
Stage clip and little spring are constituted；Described female die for forming, which is placed on the base plate of forcing press, to be used to place plastic-sealed body；Described shaping is convex
Mould is movably connected on the cope plate of forcing press by rotating shaft and roller, and laterally disposed small bullet is provided with the lower end of forming terrace die
Spring；The upper end of described roller sliding block is connected by stage clip with cope plate, and its lower end is flexibly connected with described little spring.
Preferably, the material of described female die for forming and forming terrace die uses Japanese fuji hard alloy F10, and its hardness is
60-62HRC。
Preferably, the symmetry of described female die for forming is ± 0.003mm, and its surface is coated with chromium oxide.
Compared with prior art, beneficial effects of the present invention are：
The present invention pushed by forming terrace die coordinate with female die for forming realize it is once-forming to the terminal pin of plastic-sealed body, the present invention into
Pattern has machining accuracy high, and long lifespan is easy to maintenance, is widely used in the integrated antenna package Trim Molding work of various models
Skill, is adapted to promote the use of in integrated antenna package enterprise.
Brief description of the drawings
Fig. 1 is schematic structural view of the invention；
Fig. 2 is mplifying structure schematic diagram at B of the present invention.
Embodiment
Referring to shown in accompanying drawing 1-2, a kind of integrated antenna package Trim Molding mould is convex by female die for forming 1, upper holder block 3, shaping
Mould 4, rotating shaft 5, roller 6, roller sliding block 7, stage clip 8 and little spring 9 are constituted；Described female die for forming 1 is placed in the base plate of forcing press
It is upper to be used to place plastic-sealed body 2；Described forming terrace die 4 is movably connected in the cope plate 10 of forcing press by rotating shaft 5 and roller 6
On, it is provided with laterally disposed little spring 9 in the lower end of forming terrace die 4；The upper end of described roller sliding block 7 by stage clip 8 with it is upper
Template 10 is connected, and its lower end is flexibly connected with described little spring 9.
Preferably, the material of described female die for forming 1 and forming terrace die 4 uses Japanese fuji hard alloy F10, its hardness
For 60-62HRC.
Preferably, the symmetry of described female die for forming 1 is ± 0.003mm, and its surface is coated with chromium oxide.
Operation principle is that the cope plate 10 of forcing press is descending, drives the upper holder block 3 being attached thereto to move down and push down and is placed on
Plastic-sealed body 2 on female die for forming 1, cope plate 10 is continued traveling downwardly, and roller sliding block 7 presses to roller 6, and roller 6 drives forming terrace die 4,
Forming terrace die 4 is set to be rotated around rotating shaft 5, the terminal pin and female die for forming 1 for clamping plastic-sealed body 2 make part forming.To ensure processing
Precision, described female die for forming 1 and the material of forming terrace die 4 use Japanese fuji hard alloy F10, and its hardness is 60-
62HRC, and the symmetry of female die for forming 1 is set to ± 0.003mm.To ensure the service life of the present invention, in female die for forming table
Face coats chromium oxide layer.
Claims (3)
1. a kind of integrated antenna package Trim Molding mould, it is characterised in that：By female die for forming（1）, upper holder block（3）, forming terrace die
（4）, rotating shaft（5）, roller（6）, roller sliding block（7）, stage clip（8）And little spring（9）Constitute；Described female die for forming（1）It is placed in
It is used to place plastic-sealed body on the base plate of forcing press（2）；Described forming terrace die（4）Pass through rotating shaft（5）And roller（6）It is flexibly connected
In the cope plate of forcing press（10）On, in forming terrace die（4）Lower end be provided with laterally disposed little spring（9）；Described roller
Sliding block（7）Upper end pass through stage clip（8）With cope plate（10）Connection, its lower end and described little spring（9）It is flexibly connected.
2. a kind of integrated antenna package Trim Molding mould according to claim 1, it is characterised in that：Described female die for forming
（1）And forming terrace die（4）Material use Japanese fuji hard alloy F10, its hardness be 60-62HRC.
3. a kind of integrated antenna package Trim Molding mould according to claim 1 or 2, it is characterised in that：Described shaping
Cavity plate（1）Symmetry be ± 0.003mm, its surface is coated with chromium oxide.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710134759.2A CN106952829A (en) | 2017-03-08 | 2017-03-08 | A kind of integrated antenna package Trim Molding mould |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710134759.2A CN106952829A (en) | 2017-03-08 | 2017-03-08 | A kind of integrated antenna package Trim Molding mould |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106952829A true CN106952829A (en) | 2017-07-14 |
Family
ID=59467893
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710134759.2A Pending CN106952829A (en) | 2017-03-08 | 2017-03-08 | A kind of integrated antenna package Trim Molding mould |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106952829A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109047582A (en) * | 2018-07-23 | 2018-12-21 | 江苏宝浦莱半导体有限公司 | A kind of Trim Molding machine and its application method for packaging semiconductor |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05152483A (en) * | 1991-11-28 | 1993-06-18 | Yamada Seisakusho Co Ltd | Lead bender for ic products |
| JPH1056119A (en) * | 1996-08-09 | 1998-02-24 | Apic Yamada Kk | Lead forming device for semiconductor device |
| CN101090092A (en) * | 2006-06-17 | 2007-12-19 | 铜陵三佳科技股份有限公司 | Separation method for surface adhesive integrated circuit product and its mould |
| CN201247766Y (en) * | 2008-09-04 | 2009-05-27 | 浙江华越芯装电子股份有限公司 | Device for pressed molding integrated circuit |
| CN102013401A (en) * | 2009-02-27 | 2011-04-13 | 伟仕高(肇庆)半导体有限公司 | Non-destructive arc moulding mechanism for integrated circuit pin, and method thereof |
| CN202387845U (en) * | 2011-12-14 | 2012-08-22 | 成都中科精密模具有限公司 | Flattening die for flattened patch plastic encapsulated diode production |
| CN103579040A (en) * | 2013-10-30 | 2014-02-12 | 山东泰吉星电子科技有限公司 | No-damage chip molding and packaging process |
| CN206516611U (en) * | 2017-03-08 | 2017-09-22 | 安徽国晶微电子有限公司 | A kind of integrated antenna package Trim Molding mould |
-
2017
- 2017-03-08 CN CN201710134759.2A patent/CN106952829A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05152483A (en) * | 1991-11-28 | 1993-06-18 | Yamada Seisakusho Co Ltd | Lead bender for ic products |
| JPH1056119A (en) * | 1996-08-09 | 1998-02-24 | Apic Yamada Kk | Lead forming device for semiconductor device |
| CN101090092A (en) * | 2006-06-17 | 2007-12-19 | 铜陵三佳科技股份有限公司 | Separation method for surface adhesive integrated circuit product and its mould |
| CN201247766Y (en) * | 2008-09-04 | 2009-05-27 | 浙江华越芯装电子股份有限公司 | Device for pressed molding integrated circuit |
| CN102013401A (en) * | 2009-02-27 | 2011-04-13 | 伟仕高(肇庆)半导体有限公司 | Non-destructive arc moulding mechanism for integrated circuit pin, and method thereof |
| CN202387845U (en) * | 2011-12-14 | 2012-08-22 | 成都中科精密模具有限公司 | Flattening die for flattened patch plastic encapsulated diode production |
| CN103579040A (en) * | 2013-10-30 | 2014-02-12 | 山东泰吉星电子科技有限公司 | No-damage chip molding and packaging process |
| CN206516611U (en) * | 2017-03-08 | 2017-09-22 | 安徽国晶微电子有限公司 | A kind of integrated antenna package Trim Molding mould |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109047582A (en) * | 2018-07-23 | 2018-12-21 | 江苏宝浦莱半导体有限公司 | A kind of Trim Molding machine and its application method for packaging semiconductor |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170714 |