CN112002647A - Automatic pin cutting and testing integrated machine for semiconductor electronic device and application thereof - Google Patents
Automatic pin cutting and testing integrated machine for semiconductor electronic device and application thereof Download PDFInfo
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- CN112002647A CN112002647A CN202011168631.6A CN202011168631A CN112002647A CN 112002647 A CN112002647 A CN 112002647A CN 202011168631 A CN202011168631 A CN 202011168631A CN 112002647 A CN112002647 A CN 112002647A
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- 238000012360 testing method Methods 0.000 title claims abstract description 102
- 238000005520 cutting process Methods 0.000 title claims abstract description 66
- 239000004065 semiconductor Substances 0.000 title claims abstract description 58
- 230000007246 mechanism Effects 0.000 claims abstract description 108
- 239000000463 material Substances 0.000 claims abstract description 36
- 238000007599 discharging Methods 0.000 claims abstract description 34
- 230000007306 turnover Effects 0.000 claims abstract description 15
- 238000007664 blowing Methods 0.000 claims abstract description 8
- 238000009826 distribution Methods 0.000 claims abstract description 7
- 230000009471 action Effects 0.000 claims description 11
- 230000000903 blocking effect Effects 0.000 claims description 11
- 230000001360 synchronised effect Effects 0.000 claims description 4
- 238000012546 transfer Methods 0.000 claims description 4
- 238000011144 upstream manufacturing Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 10
- 238000000034 method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000001133 acceleration Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 210000004556 brain Anatomy 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4885—Wire-like parts or pins
- H01L21/4896—Mechanical treatment, e.g. cutting, bending
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/14—Measuring as part of the manufacturing process for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
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Abstract
The invention provides an automatic pin cutting and testing integrated machine for a semiconductor electronic device and application thereof. The all-in-one machine comprises a main body frame, and an automatic feeding bin, a turnover mechanism, a discharging straight rail mechanism, a foot cutting mechanism, a testing mechanism, a material distributing mechanism and a sorting box which are arranged on the main body frame, wherein the automatic feeding bin can sense whether a product exists in the bin or not and push out the product under certain conditions; the turnover mechanism can move the pushed product to the discharging straight rail mechanism; the straight rail of the discharging straight rail mechanism is provided with an axial sliding chute and an accelerating air blowing hole; the foot cutting mechanism can cut feet of the product; the testing mechanism is positioned at the downstream of the foot cutting mechanism and can test and judge the product; the material distribution mechanism can put products into different sub-boxes of the classification box according to the test judgment result. Including applications in semiconductor electronic device corner dicing and/or testing. The invention can obviously reduce the production cost and improve the production efficiency and the production quality; the pin cutting precision can reach +/-0.1 mm, and the precision is high.
Description
Technical Field
The invention relates to the field of processing of semiconductor electronic devices, in particular to an automatic pin cutting and testing integrated machine of a semiconductor electronic device and application thereof.
Background
The existing manual pin cutting machine for semiconductor electronic devices can only produce about 1000 products in one hour, and needs to go through a plurality of links such as pin cutting, selecting, manual pipe penetrating, manual selecting, DC conventional parameter testing and the like, and because of the need of manual operation, the problems of low efficiency, low cutting precision and the like exist, for example, the error is often about 0.5mm, the pin lengths of the products cannot be consistent, and the situations of different lengths can occur. And the product pin length required by customers is usually controlled within 0.2mm, which is difficult to meet the requirements of customers. In addition, in the existing process, after the pins are manually cut, the DC conventional parameters are tested after the pins are manually inserted, so that the production operation is very inconvenient and high in cost, the product quality cannot be effectively guaranteed, and in addition, if the electrostatic protection is not well done in the process, the product is easily caused to be soft and invalid, so that the quality hidden danger is caused.
Disclosure of Invention
In view of the deficiencies in the prior art, it is an object of the present invention to address one or more of the problems in the prior art as set forth above. For example, it is an object of the present invention to improve the quality and efficiency of the pin cutting of semiconductor electronic devices.
In order to achieve the above object, the present invention provides an automatic pin cutting and testing all-in-one machine for semiconductor electronic devices.
The all-in-one machine may include: the automatic feeding device comprises a main body frame, and an automatic feeding bin, a turnover mechanism, a discharging straight rail mechanism, a foot cutting mechanism, a testing mechanism, a material distributing mechanism and a sorting box which are arranged on the main body frame, wherein the main body frame comprises a base and an inclined panel fixed on the base; the automatic feeding bin is positioned at the upper end of the inclined panel and can sense whether the semiconductor electronic device exists in the bin or not and push the semiconductor electronic device out of the bin under certain conditions; the turnover mechanism can receive the semiconductor electronic devices pushed out by the automatic feeding bin and can transfer the semiconductor electronic devices to the discharging straight rail mechanism; the material discharging straight rail mechanism comprises a straight rail, the straight rail is positioned on the inclined panel and is provided with an axial sliding chute and an accelerating air blowing hole communicated with the axial sliding chute, the semiconductor electronic device transferred by the turnover mechanism can be placed in the axial sliding chute, and the pin of the placed semiconductor electronic device is outward and exposed; the pin cutting mechanism comprises an upper cutter, a lower cutter and a power cylinder, wherein the upper cutter and the lower cutter are respectively positioned at the upper side and the lower side of the pin of the semiconductor electronic device exposed from the axial chute, the edges of the upper cutter and the lower cutter face each other, and the power cylinder can enable the upper cutter and the lower cutter to be close to each other so as to cut off part of the pin of the semiconductor electronic device; the testing mechanism comprises a plurality of testing stations positioned at the downstream of the pin cutting mechanism, and the semiconductor electronic devices processed by the pin cutting mechanism can be tested and judged on the testing stations; the sorting box is positioned at the downstream of the testing mechanism and comprises a plurality of sub-boxes, and each sub-box can contain semiconductor electronic devices with the same judgment result; the material distribution mechanism can put the tested semiconductor electronic devices into different sub-boxes of the classification box according to the test result of the test mechanism.
In an exemplary embodiment of the invention, the pin cutting mechanism may further include a self-lubricating guide sleeve, a self-lubricating guide sleeve column, a fixing plate, and a connecting member, wherein one end of the connecting member is connected to the output end of the power cylinder, and the other end is connected to the fixing plate; the fixing plate is also respectively fixedly connected with the self-lubricating guide sleeve and the upper cutter; the self-lubricating guide sleeve is sleeved on the self-lubricating guide sleeve column and can move along the self-lubricating guide sleeve column; the lower end of the self-lubricating guide sleeve column is fixed on the inclined panel, and the upper end of the self-lubricating guide sleeve column is fixedly connected with the power cylinder.
In an exemplary embodiment of the present invention, the self-lubricating guide sleeve may include a plurality of sub-guide sleeve columns, the number of the sub-guide sleeve columns is the same as that of the sub-guide sleeve columns, and the sub-guide sleeve columns correspond to the sub-guide sleeve columns one by one, and each sub-guide sleeve is sleeved on the corresponding sub-guide sleeve column.
In an exemplary embodiment of the invention, the number of the test stations is 1 to 5, such as 2, 3, 4, etc. Different types of parameter testing can be performed at each test station.
In an exemplary embodiment of the present invention, a test host may be disposed on the test station.
In an exemplary embodiment of the invention, the all-in-one machine may further include a plurality of discharging mechanisms, the number of the discharging mechanisms is the same as the number of the test stations, and the discharging mechanisms correspond to the test stations one by one, each discharging mechanism is located upstream of the corresponding test station and is capable of intercepting or releasing the semiconductor electronic devices to enter the corresponding test station in the axial chute.
In an exemplary embodiment of the invention, the all-in-one machine further comprises a plurality of discharging mechanisms, the number of the discharging mechanisms is the same as that of the testing stations, the discharging mechanisms correspond to the testing stations one by one, and each discharging mechanism is located at the upstream of the corresponding testing station and can perform material distribution action.
In an exemplary embodiment of the invention, the inclined panel is parallel to the horizontal plane or has a set angle with the horizontal plane.
In an exemplary embodiment of the invention, the test station is capable of DC parametric testing.
In an exemplary embodiment of the invention, the determining includes determining as pass or fail.
In an exemplary embodiment of the invention, the material separating mechanism may include a sorting shuttle block, a stepping motor and a stepping motor timing belt, wherein the sorting shuttle block is connected with the stepping motor through the stepping motor timing belt.
In an exemplary embodiment of the invention, the integrated machine may further comprise a material blocking mechanism used in cooperation with the shuttle block.
In an exemplary embodiment of the invention, the all-in-one machine may further include a PLC program control module, for example, a PLC program control cabinet, which can issue control commands to the respective components.
In an exemplary embodiment of the invention, the kiosk may further include an electrical control and PLC program control cabinet.
The invention further provides application of the automatic pin cutting and testing integrated machine for the semiconductor electronic device. Including applications in the dicing and/or testing of semiconductor electronic devices.
Compared with the prior art, the beneficial effects of the invention can include: the links of manual contact with products can be reduced, so that the quality is better guaranteed; the production cost can be obviously reduced, and the production efficiency is obviously improved; the foot cutting precision can reach the high standard requirement of a client, for example, 7.2mm +/-0.2 mm.
Drawings
The above and other objects and features of the present invention will become more apparent from the following description taken in conjunction with the accompanying drawings, in which:
FIG. 1 is a schematic structural diagram of an automatic pin cutting and testing all-in-one machine for semiconductor electronic devices according to the present invention;
fig. 2 is a schematic partial structure diagram of the automatic pin cutting and testing all-in-one machine for semiconductor electronic devices of the invention.
Description of the main reference numerals:
10-main body frame, 11-inclined panel, 12-base; 20-an automatic feeding bin; 30-a turnover mechanism; 40-a material discharging straight rail mechanism, 41-an axial sliding chute and 42-an accelerating air blowing hole; 50-a foot cutting mechanism, 51-a power cylinder, 51a first action air inlet, 51 b-a second action air inlet, 52-a connecting piece, 53-a fixing plate, 54-a self-lubricating guide sleeve, 55-a self-lubricating guide sleeve column, 56-an upper cutter and 57-a lower cutter; 60-a testing mechanism, 61-a first testing station, 62-a second testing station, 61 a-a first discharging mechanism and 62 a-a second discharging mechanism; 70-material separating mechanism, 71-sorting shuttle block, 72-stepping motor, 73-stepping motor synchronous belt, 74-material blocking mechanism, 80-sorting box, 90-electric control and PLC program control cabinet, 100-touch screen.
Detailed Description
Hereinafter, the semiconductor electronic device automatic pin cutting and testing all-in-one machine and the application thereof of the present invention will be described in detail with reference to the accompanying drawings and the exemplary embodiments.
The invention provides an automatic pin cutting and testing integrated machine for a semiconductor electronic device.
Fig. 1 shows a schematic structural diagram of an automatic pin cutting and testing all-in-one machine for semiconductor electronic devices of the invention. Fig. 2 is a schematic view of a partial structure of the semiconductor electronic device automatic pin cutting and testing all-in-one machine of the invention, which mainly shows components of an automatic feeding bin, a turnover mechanism, a discharging straight rail mechanism, a pin cutting mechanism, a testing mechanism, a material distributing mechanism and the like of the all-in-one machine.
In an exemplary embodiment of the present invention, as shown in fig. 1, the all-in-one machine may include: the automatic feeding device comprises a main body frame 10, an automatic feeding bin 20, a turnover mechanism 30, a discharging straight rail mechanism 40, a foot cutting mechanism 50, a testing mechanism 60, a material distributing mechanism 70, a sorting box 80, an electric control and PLC program control cabinet 90 and a touch screen 100.
The main body frame 10 may be used as a support frame for other components, which may be located on a work table. As shown in fig. 1, the main body frame may include a tilt panel 11 and a base 12, which may be fixedly coupled. The inclined panel 11 may form an angle with the horizontal plane, which may be determined according to practical situations. Of course, the present invention is not limited thereto, and the inclined panel 11 may be parallel to the horizontal plane.
As shown in fig. 1, the upper end of the inclined panel 11 may have a horizontal section on which the automatic feed bin 20 may be disposed. The automatic feeding bin 20 may be provided with a sensor, and after the classified product (i.e., semiconductor electronic device) is put into the automatic feeding bin 20, the sensor senses the material, and the product can be automatically pushed out to the next station link.
As shown in fig. 1, the turnover mechanism 30 can receive the products from the automatic feeding bin 20 and transfer the products to the next station, i.e., the discharging straight rail mechanism. The canting mechanism 30 may be a tube-clamping canting mechanism.
The discharge straight rail mechanism 40 shown in fig. 1 may include a straight rail, which may be disposed on the inclined panel 11. As shown in fig. 2, the straight rail is further provided with an axial sliding slot 41 and an accelerating air blowing hole 42. The axial sliding groove 41 is opened along the axial direction of the straight rail, the notch of the sliding groove faces outwards, and the direction of the notch can be parallel to the plate surface of the inclined panel 11 shown in fig. 1. The turnover mechanism 30 can transfer the product into the axial chute 41, i.e. a plurality of products can be placed in the axial chute 41, with the legs of the products facing outwards and exposed from the axial chute. The acceleration air blowing holes 42 are communicated with the axial sliding chute 41, and air can be blown into the axial sliding chute 41 through the acceleration air blowing holes 42 so as to enable products to move downstream.
The foot cutting mechanism 50 shown in fig. 1 may include a power cylinder 51, a connecting member 52, a fixing plate 53, a self-lubricating guide bush 54, a self-lubricating guide bush column 55, an upper cutter 56 and a lower cutter 57 as shown in fig. 2. Wherein the output end of the power cylinder 51 may be connected with one end of the connecting member 52. The other end of the connector 52 may be connected with a fixing plate 53. The fixing plate 53 is also fixedly connected with the self-lubricating guide sleeve 54. The upper and lower ends of the self-lubricating guide sleeve column 55 can be respectively fixedly connected with the power cylinder 51 and the inclined panel 11. The self-lubricating guide sleeve 54 is sleeved on the self-lubricating guide sleeve column 55 and slides on the self-lubricating guide sleeve column under the driving of the fixing plate 53. The upper cutter 56 may be fixed to the fixing plate 53, and the lower cutter 57 may be fixed to the straight rail or the inclined panel 11. The upper cutter 56 and the lower cutter 57 are respectively positioned at the upper and lower sides of the pin of the product exposed from the axial chute 41, and the edges of the two are opposite to each other, and the power cylinder 51 can make the upper cutter approach to the lower cutter to cut off a part of the pin of the semiconductor electronic device.
The testing mechanism 60 shown in fig. 1 may include a number of testing stations, e.g., 2, 4, 5, etc., located downstream of the foot cutting mechanism, e.g., a first testing station 61 and a second testing station 62 as shown in fig. 2. At the test station, the product processed by the cutting foot mechanism 50 can be tested and determined. The tests performed by the first or second test station include DC parametric tests, and the other test station is capable of performing additional parameters, such as dynamic ac parameters RG, etc., which are tested to first differentiate the product's quality and second to make the product perform better in the application circuit. The DC parameters may include MOS transistor color temperature: a starting voltage VTH, a drain-source breakdown voltage BVDSS, a transconductance GMP, an on-resistance RON and the like. The determination may include product pass or fail, e.g., product OK, NG. The decision may also differentiate products according to different performance parameters of the products, for example, according to different test structures, further sub-categorizing OK and/or NG products.
The distribution mechanism 70 shown in fig. 1 is capable of placing the tested products into different sub-boxes of the sorting box 80 according to the determination result of the testing mechanism 60.
As shown in fig. 1, the sorting bin 80 is located downstream of the testing mechanism 60. The sorting bin 80 may comprise a plurality of sub-bins, each capable of holding a product having the same determination. The classification box 80 may be a BIN classification box, which can distinguish parameters of different properties of the product according to the needs of the customer.
As shown in fig. 1, an electrical control and PLC program control cabinet 90 may be located on the base 12. The electrical control and PLC program control cabinet 90 is the brain of the entire device, from which all mechanical actions can be initiated; meanwhile, the electrical control and PLC program control cabinet 90 may also communicate with a peripheral test host (i.e., a test host corresponding to the test station) to classify the tested products.
As shown in fig. 1, the touch screen 100 may be located on the inclined panel 11. The position of the touch screen 100 on the inclined panel 11 should be a position easy to operate. The touch screen 100 can be connected to the electrical control and PLC program control cabinet 90, and various control parameters of the device can be adjusted through the touch screen.
In the present embodiment, as shown in fig. 2, a first operation intake port 51a and a second operation intake port 51b may be opened in the power cylinder 51.
In the present embodiment, the number of the self-lubricating guide sleeve columns may be 1 or more, for example, 2, 3, 4, etc. The number of the self-lubricating guide sleeves is the same as that of the self-lubricating guide sleeve columns, the self-lubricating guide sleeves correspond to the self-lubricating guide sleeve columns one by one, and each self-lubricating guide sleeve is sleeved on the corresponding self-lubricating guide sleeve column.
Correspondingly, a plurality of through holes can be formed in the fixing plate, the number of the through holes is the same as that of the self-lubricating guide sleeves, the through holes correspond to the self-lubricating guide sleeves one by one, and each self-lubricating guide sleeve is fixed in the corresponding through hole.
In this embodiment, a sensor can be arranged on the pin cutting station to sense whether materials exist.
In this embodiment, as shown in fig. 2, the all-in-one machine further includes a first material discharging mechanism 61a and a second material discharging mechanism 62a respectively located at the front ends of the first testing station and the second testing station, and both of them may include stepping material discharging cylinders, and can perform material separating operation. The first discharging mechanism 61a is matched with the first testing station 61 for use; a second drop out mechanism 62a is used in conjunction with the second test station 62.
In the present embodiment, as shown in fig. 2, the feed mechanism may include a sorting shuttle block 71, a stepping motor 72, and a stepping motor timing belt 73. The sorting shuttle block 71 can be connected with the stepping motor 72 through a stepping motor synchronous belt 73, and the sorting shuttle block 71 can sort tested and judged products.
In this embodiment, as shown in fig. 2, the integrated machine may further include a material blocking mechanism 74. The sorting shuttle 71 cooperates with the material blocking mechanism 74 to place the tested products OK and NG into different sub-boxes of the sorting box 80. The material blocking mechanism 74 is mainly controlled by an electric control and a PLC program in the PLC program control cabinet 90 to control the action of the cylinder, so as to realize the actions of material blocking and discharging of the product. The power source for the material blocking mechanism 74 may be a material blocking cylinder.
In this embodiment, the kiosk is adaptable TO TO series products, such as TO-220F tubular products.
The invention may be a mold structure design. The invention mainly ensures the accuracy of the length of the cutting foot from the structural design of two mechanisms: firstly, a product plastic package body (namely a product) is fixed by utilizing a straight rail inner groove (namely an axial sliding groove 41) as shown in figure 2, so that the product plastic package body cannot move up and down, and the function of ensuring the pin cutting precision is achieved; secondly, the fixed plate 53, the self-lubricating guide sleeve 54, the self-lubricating guide sleeve column 55, the upper cutter 56 and the lower cutter 57 are positioned as shown in figure 2, and the upper cutter and the lower cutter are positioned in a double mode, so that the product cannot move up and down and left and right, and the precision of the foot cutting size of the product is greatly improved. The foot cutting size precision of the invention can reach plus or minus 0.1mm, which is higher than plus or minus 0.2mm given by customers.
The working process of the invention can be as follows: when a product enters a pin cutting station, a sensor detects the existence of materials and transmits signals to a PLC (programmable logic controller (PLC) program in a PLC program control cabinet 90), the PLC sends an action instruction again, a material blocking cylinder acts to block the product at the moment, the pin cutting station performs a cutter action after receiving the signals, the product enters a testing station after the pin cutting is completed, a testing host performs parameter testing on the product, the testing host sends a classification signal to the PLC after the testing is completed, the PLC receives the classification signal and then sends an instruction to a classification shuttle block, the classification shuttle block performs classification action through the classification signal instruction given by the PLC, the product is placed in a designated bin, and the classification action is completed.
For a better understanding of the above-described exemplary embodiments of the invention, the working principle of the all-in-one machine is further explained below with reference to fig. 1 and 2.
The classified tube-packed products are put into an automatic feeding bin 20 of the all-in-one machine, and after a sensor of the automatic feeding bin 20 senses that the materials are supplied, a product turnover mechanism 30 is automatically pushed out.
The air cylinder of the turnover mechanism 30 starts to act to place the product into the straight rail, and the air blowing hole 42 is accelerated to blow air so that the product can rapidly slide to the foot cutting mechanism 50.
The power cylinder 51 starts to operate, the upper cutter 56 and the lower cutter 57 are used for cutting off the long legs of the product, and the length of the product meets the requirements specified by customers.
After the foot cutting is finished, the first discharging mechanism 61a and the second discharging mechanism 62a perform material distribution, and one product is discharged to the downstream first testing station 61 and the downstream second testing station 62 each time.
The first test station 61 and the second test station 62 perform test determination on the product. Then the sorting shuttle block 71 cooperates with the material blocking device 74 to place the tested products OK and NG into the BIN sorting box 80 respectively, and the work is completed.
The invention also provides an application of the semiconductor electronic device automatic pin cutting and testing all-in-one machine, such as the application in the semiconductor electronic device pin cutting, the application in the semiconductor electronic device testing, and the application in the semiconductor electronic device pin cutting and testing at the same time.
In summary, the semiconductor electronic device automatic pin cutting and testing all-in-one machine and the application thereof of the invention have the advantages that at least one of the following items is included:
(1) the integrated machine does not need manual pin cutting, selection and manual pipe penetration, and the integrated machine starts to test after the pins are directly cut, so that the links of manual contact with products can be reduced, and the quality is ensured.
(2) The integrated machine is designed by a mould structure, the pin cutting precision can reach +/-0.1 mm, and the precision can completely meet the requirements of customers.
(3) The invention can obviously improve the production efficiency, for example, the production efficiency is improved to 5000-6500 products per hour from the previous 1000 products per hour, and the production efficiency is improved by several times.
(4) The invention can save production cost, for example, 4 working procedures of the existing manual pin cutting machine can be simultaneously saved, about 4-5 persons are saved, and labor cost is obviously reduced.
Although the present invention has been described above in connection with exemplary embodiments, it will be apparent to those skilled in the art that various modifications and changes may be made to the exemplary embodiments of the present invention without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (10)
1. The utility model provides an automatic pin test all-in-one of cutting of semiconductor electron device which characterized in that, the all-in-one includes: the automatic feeding device comprises a main body frame, and an automatic feeding bin, a turnover mechanism, a discharging straight rail mechanism, a foot cutting mechanism, a testing mechanism, a material distributing mechanism and a sorting box which are arranged on the main body frame, wherein the main body frame comprises a base and an inclined panel fixed on the base; the automatic feeding bin is positioned at the upper end of the inclined panel and can sense whether the semiconductor electronic device exists in the bin or not and push the semiconductor electronic device out of the bin under certain conditions; the turnover mechanism can receive the semiconductor electronic devices pushed out by the automatic feeding bin and can transfer the semiconductor electronic devices to the discharging straight rail mechanism; the material discharging straight rail mechanism comprises a straight rail, the straight rail is positioned on the inclined panel and is provided with an axial sliding chute and an accelerating air blowing hole communicated with the axial sliding chute, the semiconductor electronic device transferred by the turnover mechanism can be placed in the axial sliding chute, and the pin of the placed semiconductor electronic device is outward and exposed; the pin cutting mechanism comprises an upper cutter, a lower cutter and a power cylinder, wherein the upper cutter and the lower cutter are respectively positioned at the upper side and the lower side of the pin of the semiconductor electronic device exposed from the axial chute, the edges of the upper cutter and the lower cutter face each other, and the power cylinder can enable the upper cutter and the lower cutter to be close to each other so as to cut off part of the pin of the semiconductor electronic device; the testing mechanism comprises a plurality of testing stations positioned at the downstream of the pin cutting mechanism, and the semiconductor electronic devices processed by the pin cutting mechanism can be tested on the testing stations; the sorting box is positioned at the downstream of the testing mechanism and comprises a plurality of sub-boxes, and each sub-box can contain semiconductor electronic devices with the same judgment result; the material distribution mechanism can put the tested semiconductor electronic devices into different sub-boxes of the classification box according to the test result of the test mechanism.
2. The automatic pin cutting and testing all-in-one machine for semiconductor electronic devices as claimed in claim 1, wherein the pin cutting mechanism further comprises a self-lubricating guide sleeve, a self-lubricating guide sleeve column, a fixing plate and a connecting piece, wherein one end of the connecting piece is connected with the output end of the power cylinder, and the other end of the connecting piece is connected with the fixing plate; the fixing plate is also respectively fixedly connected with the self-lubricating guide sleeve and the upper cutter;
the self-lubricating guide sleeve is sleeved on the self-lubricating guide sleeve column and can move along the self-lubricating guide sleeve column; the lower end of the self-lubricating guide sleeve column is fixed on the inclined panel, and the upper end of the self-lubricating guide sleeve column is fixedly connected with the power cylinder.
3. The automatic pin cutting and testing all-in-one machine for semiconductor electronic devices as claimed in claim 2, wherein the self-lubricating guide sleeve comprises a plurality of sub guide sleeve columns, the self-lubricating guide sleeve columns comprise a plurality of sub guide sleeve columns, the number of the sub guide sleeve columns is the same as that of the sub guide sleeve columns, the sub guide sleeve columns correspond to the sub guide sleeve columns one by one, and each sub guide sleeve column is sleeved with the corresponding sub guide sleeve column.
4. The automatic pin cutting and testing all-in-one machine for semiconductor electronic devices according to claim 1, further comprising a plurality of discharging mechanisms, wherein the number of the discharging mechanisms is the same as that of the testing stations, the discharging mechanisms correspond to the testing stations one by one, and each discharging mechanism is located at the upstream of the corresponding testing station and can perform material distribution action.
5. The automatic pin cutting and testing all-in-one machine for semiconductor electronic devices as claimed in claim 1, wherein the inclined panel is parallel to a horizontal plane or forms a set included angle with the horizontal plane.
6. The semiconductor electronic device automatic pin cutting and testing all-in-one machine as claimed in claim 1, wherein the testing station is capable of performing DC parametric testing.
7. The automatic pin cutting and testing all-in-one machine for semiconductor electronic devices according to claim 1, wherein the material separating mechanism comprises a sorting shuttle block, a stepping motor and a stepping motor synchronous belt, wherein the sorting shuttle block is connected with the stepping motor through the stepping motor synchronous belt.
8. The semiconductor electronic device automatic pin cutting and testing all-in-one machine as claimed in claim 7, further comprising a material blocking mechanism used with the shuttle block.
9. The semiconductor electronic device automatic pin cutting and testing all-in-one machine as claimed in claim 1, further comprising an electrical control and PLC program control cabinet.
10. Use of the semiconductor electronic device automatic pin cutting and testing all-in-one machine as claimed in any one of claims 1 to 9 in pin cutting and/or testing of semiconductor electronic devices.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011168631.6A CN112002647B (en) | 2020-10-28 | 2020-10-28 | Automatic pin cutting and testing integrated machine for semiconductor electronic device and application thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011168631.6A CN112002647B (en) | 2020-10-28 | 2020-10-28 | Automatic pin cutting and testing integrated machine for semiconductor electronic device and application thereof |
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| CN112002647A true CN112002647A (en) | 2020-11-27 |
| CN112002647B CN112002647B (en) | 2021-01-29 |
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| CN202011168631.6A Active CN112002647B (en) | 2020-10-28 | 2020-10-28 | Automatic pin cutting and testing integrated machine for semiconductor electronic device and application thereof |
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