CN204857681U - Quick packaging hardware based on RFID - Google Patents
Quick packaging hardware based on RFID Download PDFInfo
- Publication number
- CN204857681U CN204857681U CN201520612522.7U CN201520612522U CN204857681U CN 204857681 U CN204857681 U CN 204857681U CN 201520612522 U CN201520612522 U CN 201520612522U CN 204857681 U CN204857681 U CN 204857681U
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- slide glass
- encapsulation
- standing groove
- equipment
- bracket
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Abstract
The utility model discloses a quick packaging hardware based on RFID, including slide glass pre treatment device, encapsulate the processing equipment, tailor equipment and check out test set, slide glass pre treatment device's discharge gate is connected with the encapsulation processing equipment, the discharge gate that encapsulates the processing equipment is connected with the equipment of tailorring, the discharge gate of equipment tailor is connected with the check out test set, the encapsulation processing equipment including encapsulation bracket (1) and hot packaging hardware, the encapsulation bracket set up in hot packaging hardware's below, encapsulation bracket (1) on be provided with the basic standing groove of a plurality of cards (2), the bottom of the basic standing groove of card (2) be provided with a plurality of chip groove (3). The utility model provides a quick packaging hardware based on RFID has improved production efficiency, has practiced thrift the cost to the quality of the finished product smart card that can guarantee to obtain, in the basic basic standing groove of putting on the encapsulation bracket of card of card, it is more stable, with hot packaging hardware no -float.
Description
Technical field
The utility model relates to RFID smart card field, relates to a kind of fast packing device based on RFID specifically.
Background technology
Along with the development of society and the progress of scientific level, smart card has become a requisite part in people's life, and people are more and more higher to the performance of smart card, quality requirement, and the package system of smart card also needs to improve fast.
The encapsulation process of smart card is generally first the chip on double carrier band is obtained through die-cut the chip needed, and then by the chip package that obtains on the draw-in groove of card base.
But existing Intelligent card package system, and Ka Ji and chip have the size determined, and some smart cards (as IC-card, fiscard, mass transit card), owing to needing certain size, a card base only need encapsulation chip; But also have some smart cards (as SIM card), if each card base only encapsulates an intelligent card chip, unnecessary waste can be caused; And conventional package system can only encapsulate a sheet smart card, and production efficiency is low, and cost is high at every turn.
Although have developed the system that some can encapsulate multiple intelligent card chip on a card base now, after encapsulating, there is no supporting cutting and checkout equipment, the finished product smart card quality produced can be caused to there will be some problems.
Utility model content
The purpose of this utility model is to overcome the deficiencies in the prior art, provides a kind of fast packing device based on RFID, can encapsulate simultaneously, often open on card base and can encapsulate multiple chip, improve production efficiency, saved cost at multiple Zhang Kaji; Be provided with supporting cutting and checkout equipment, the quality of the finished product smart card obtained can be ensured; Encapsulation bracket is provided with card base standing groove, is provided with chip groove bottom card base standing groove, Ka Ji and chip are placed on encapsulation bracket more stable, coordinate better with heat-seal device.
The purpose of this utility model is achieved through the following technical solutions: a kind of fast packing device based on RFID, comprises slide glass pre-processing device, encapsulation process equipment, cutting equipment and checkout equipment; The discharging opening of described slide glass pre-processing device and encapsulation process equipment connection, the discharging opening of encapsulation process equipment and cutting equipment connection, the discharging opening of cutting equipment is connected with checkout equipment; Described encapsulation process equipment comprises encapsulation bracket and heat-seal device, and described encapsulation bracket is arranged at the below of heat-seal device, described encapsulation bracket is provided with multiple card base standing groove, and the bottom of described card base standing groove is provided with multiple chip groove.
Described slide glass pre-processing device comprises glue sticking device and slide glass blanking units, and the discharging opening of described glue sticking device is connected with slide glass blanking units.
Described encapsulation process equipment also comprises slide glass grabbing device, and described slide glass grabbing device is provided with sucker, and slide glass grabbing device is used for slide glass pre-processing device to process the slide glass obtained and puts into chip groove bottom card base standing groove.
The number of the card base standing groove that described encapsulation bracket is arranged is three.
Chip groove number bottom described card base standing groove is nine.
Described checkout equipment comprises appearance detection apparatus and quality detection device.
The beneficial effects of the utility model are: (1) can encapsulate at multiple Zhang Kaji simultaneously, often opens on card base and can encapsulate multiple chip, improve production efficiency, saved cost.
(2) be provided with supporting cutting and checkout equipment in system, the quality of the finished product smart card obtained can be ensured.
(3) encapsulate on bracket and be provided with card base standing groove, be provided with chip groove bottom card base standing groove, Ka Ji and chip are placed on encapsulation bracket more stable, coordinate better with heat-seal device.
Accompanying drawing explanation
Fig. 1 is theory diagram of the present utility model;
Fig. 2 is the structural representation of encapsulation bracket;
In figure, 1-encapsulates bracket, 2-card base standing groove, 3-chip groove.
Embodiment
Below in conjunction with accompanying drawing, the technical solution of the utility model is described in further detail, but protection range of the present utility model is not limited to the following stated.
As shown in Figure 1, a kind of fast packing device based on RFID, comprises slide glass pre-processing device, encapsulation process equipment, cutting equipment and checkout equipment; The discharging opening of described slide glass pre-processing device and encapsulation process equipment connection, the discharging opening of encapsulation process equipment and cutting equipment connection, the discharging opening of cutting equipment is connected with checkout equipment; Described encapsulation process equipment comprises encapsulation bracket 1 and heat-seal device, described encapsulation bracket is arranged at the below of heat-seal device, described encapsulation bracket 1 is provided with multiple card base standing groove 2, the bottom of described card base standing groove 2 is provided with multiple chip groove 3.
Described slide glass pre-processing device comprises glue sticking device and slide glass blanking units, and the discharging opening of described glue sticking device is connected with slide glass blanking units.
Described encapsulation process equipment also comprises slide glass grabbing device, and described slide glass grabbing device is provided with sucker, and slide glass grabbing device is used for slide glass pre-processing device to process the slide glass obtained and puts into chip groove 3 bottom card base standing groove 2.
The number of the card base standing groove 2 that described encapsulation bracket 1 is arranged is three.
Chip groove 3 number bottom described card base standing groove 2 is nine.
Described checkout equipment comprises appearance detection apparatus and quality detection device.
Carry out in the process encapsulated at use native system, first the slide glass lower surface (glue with high temperature and mode) high temperature adhesives glue being adhered to chip on the double carrier band of standard by glue sticking device is needed, then slide glass blanking units is utilized to be gone out from the double carrier band of standard by the slide glass being loaded with chip, (chip groove is very shallow to utilize slide glass grabbing device the slide glass gone out to be put into chip groove 3, when can not affect encapsulation, slide glass adhesive surface with encapsulate contacting of groove in Ka Ji), the lower surface (be stained with high temperature and glue the one side with glue) of slide glass is upward; Card base is put into card base standing groove 2, the milling in advance of card base is cut out one of encapsulation groove (with the chip groove position consistency in encapsulation bracket 1) and is faced down, then heat-seal device is used to encapsulate chip, (in encapsulation process, the heat produced by heat-seal device makes high temperature glue and glue melts, and the slide glass with chip in the encapsulation groove of card base and chip groove is bonded together); Being sheared encapsulating the packaged smart card obtained by Scissoring device, being detected by appearance detection apparatus and quality detection device again after having sheared, rejecting defective item.
Further, use that native system is the same can encapsulate a card base only needing the smart card of an encapsulation chip (fiscard, IC-card etc.), the chip slot chip slide glass of correspondence being placed on bosom in encapsulation bracket 1 is only needed to put, card base only cuts an encapsulation groove in the milling of position, bosom, encapsulate in a like fashion, need not cutting be carried out, due to encapsulation bracket 1 having multiple card base standing groove 2, also can multiple smart cards of disposable encapsulation.
Claims (6)
1. based on a fast packing device of RFID, it is characterized in that: comprise slide glass pre-processing device, encapsulation process equipment, cutting equipment and checkout equipment; The discharging opening of described slide glass pre-processing device and encapsulation process equipment connection, the discharging opening of encapsulation process equipment and cutting equipment connection, the discharging opening of cutting equipment is connected with checkout equipment; Described encapsulation process equipment comprises encapsulation bracket (1) and heat-seal device, described encapsulation bracket is arranged at the below of heat-seal device, described encapsulation bracket (1) is provided with multiple card base standing groove (2), and the bottom of described card base standing groove (2) is provided with multiple chip groove (3).
2. a kind of fast packing device based on RFID according to claim 1, it is characterized in that: described slide glass pre-processing device comprises glue sticking device and slide glass blanking units, the discharging opening of described glue sticking device is connected with slide glass blanking units.
3. a kind of fast packing device based on RFID according to claim 1, it is characterized in that: described encapsulation process equipment also comprises slide glass grabbing device, described slide glass grabbing device is provided with sucker, and slide glass grabbing device is used for slide glass pre-processing device being processed the chip groove (3) that card base standing groove (2) bottom put into by the slide glass obtained.
4. a kind of fast packing device based on RFID according to claim 1, is characterized in that: the number of the upper card base standing groove (2) arranged of described encapsulation bracket (1) is three.
5. a kind of fast packing device based on RFID according to claim 1, is characterized in that: chip groove (3) number of described card base standing groove (2) bottom is nine.
6. a kind of fast packing device based on RFID according to claim 1, is characterized in that: described checkout equipment comprises appearance detection apparatus and quality detection device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520612522.7U CN204857681U (en) | 2015-08-14 | 2015-08-14 | Quick packaging hardware based on RFID |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520612522.7U CN204857681U (en) | 2015-08-14 | 2015-08-14 | Quick packaging hardware based on RFID |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204857681U true CN204857681U (en) | 2015-12-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520612522.7U Active CN204857681U (en) | 2015-08-14 | 2015-08-14 | Quick packaging hardware based on RFID |
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| Country | Link |
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| CN (1) | CN204857681U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112002647A (en) * | 2020-10-28 | 2020-11-27 | 四川立泰电子有限公司 | Automatic pin cutting and testing integrated machine for semiconductor electronic device and application thereof |
-
2015
- 2015-08-14 CN CN201520612522.7U patent/CN204857681U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112002647A (en) * | 2020-10-28 | 2020-11-27 | 四川立泰电子有限公司 | Automatic pin cutting and testing integrated machine for semiconductor electronic device and application thereof |
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| GR01 | Patent grant |