CN207705156U - A kind of semiconductor components and devices cutting, mechanism for testing - Google Patents
A kind of semiconductor components and devices cutting, mechanism for testing Download PDFInfo
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- CN207705156U CN207705156U CN201721713035.5U CN201721713035U CN207705156U CN 207705156 U CN207705156 U CN 207705156U CN 201721713035 U CN201721713035 U CN 201721713035U CN 207705156 U CN207705156 U CN 207705156U
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Abstract
The utility model discloses a kind of semiconductor components and devices cutting, mechanism for testing, it is related to semiconductor components and devices technical field, a kind of semiconductor components and devices cutting, mechanism for testing, including holder and track, the branch is provided with an inclined side, the top of holder is equipped with horizontal plane, and track is arranged on the inclined side of holder, further include setting feeding unit material in the horizontal plane and setting it is in orbit be arranged in order, cutting unit, test cell, separation unit and splicing unit.The utility model has the beneficial effects that, increase by one of test cell and separation unit after cutting unit, testing integrated automation after realization cutting, the such product of relevant enterprise is not tested or taken a sample test and is compared, the reliability of product quality can be increased, the such product manual test of relevant enterprise is compared, efficiency greatly improves, and saves the cost of company.
Description
Technical field
The utility model is related to semiconductor components and devices technical field, especially a kind of semiconductor components and devices cutting, test machine
Structure.
Background technology
Semiconductor portions component needs to prescind extra pin, convenient for making client use.Existing procedure is typically all
After the completion of test, then cutting, not re-test (also due to pin not so good test after prescinding), direct goods dispatch after cutting.But by
All it is metal in cutter and pin, mechanical stress is had during cutting, inside chip is caused to damage, quality is caused hidden
Suffer from.
There is corresponding cutter now according to the demand of each producer, but does not test or take out after most of cuttings
It surveys, minority can be surveyed manually hand, and speed is slow, and efficiency is very low.
Utility model content
The purpose of this utility model is that one of repetition measurement work(is increased after corner cut on the basis of existing automatic pin cutter
Can, the semiconductor components and devices that may be damaged when cutting test is picked out, a kind of semiconductor components and devices cutting is devised, surveys
Test-run a machine structure.
Realize that above-mentioned purpose the technical solution of the utility model is, a kind of semiconductor components and devices cutting, mechanism for testing, including
Holder and track, the branch are provided with an inclined side, and the top of holder is equipped with horizontal plane, and the inclined side in holder is arranged in track
On face, further include setting feeding unit material in the horizontal plane and setting it is in orbit be arranged in order, cutting unit, test it is single
Member, separation unit and splicing unit.
Further, the feeding unit material includes the positioning body I, mobile cylinder I, rotation of pending fixed component holding box
The box chamber I of rotating motor I and storage holding box, the positioning body I include two vertical openings concave plate staggered relatively, mobile cylinder
I is arranged between two notch plates, and the junction of horizontal plane and inclined side in holder is arranged in electric rotating machine I, and box chamber I is located at branch
In the groove of frame horizontal plane, positioning body I, electric rotating machine I and box chamber I are successively set on the telescopic end of mobile cylinder I.
Further, the cutting unit includes cutting fixed plate, cuts cylinder, connecting plate, cutter and backing plate, described to cut
It cuts fixed plate to be arranged on the inclined side of holder, cutting fixed plate is equipped with cutting cylinder, cuts top and the connection of cylinder
One end of plate is connected, and the other end of connecting plate is connect with the cutter that vertical tilt side moves back and forth, and is set below the cutting edge of cutter
There are backing plate, cutter to be arranged with parallel track.
Further, the test cell includes testing fixed plate, tested cylinder, briquetting, locating piece and testing piece, described
Test fixed plate is arranged on the inclined side of holder, and test fixed plate is equipped with tested cylinder, and the telescopic end of tested cylinder connects
Briquetting is connect, the side of tested cylinder is equipped with locating piece, and the one-to-one test of two rows for stretching to track side is equipped in locating piece
Piece, upper row's testing piece are located at the lower section of locating piece.
Further, the separation unit includes sorting cylinder, transport chamber, positioning cylinder, sliding rail and substandard products box, described point
It selects cylinder to be arranged on the inclined side of holder, sorts the telescopic end connection transportation chamber of cylinder, the side of transport chamber is equipped with and rail
The top surface of the corresponding straight slot in road, transport chamber is equipped with positioning cylinder, and the lower section of transport chamber is equipped with sliding rail, and substandard products box is arranged in holder
Downside in the groove of inclined side and positioned at transport chamber.
Further, the splicing unit includes holding qualified component positioning body II, concave plate II, II and of mobile cylinder
Storage Box, the interior concave plate II staggered relatively including two vertical openings of the positioning body II, mobile cylinder II are arranged in two concaves
Between plate II, Storage Box is arranged in the groove in riding face, and positioning body II and Storage Box are successively set on mobile cylinder II
Telescopic end.
Further, the feeding unit material, cutting unit, test cell, separation unit and splicing unit it is adjacent between
Track be equipped with positioning pin, the bottom end of positioning pin be arranged it is adjacent in the bracket gas cylinder of internal stent.
Using a kind of semiconductor components and devices cutting of the technical solution of the utility model making, mechanism for testing, beneficial to effect
Fruit is：Increase by one of test cell and separation unit after cutting unit, testing integrated automation after cutting is realized, for phase
The such product of pass enterprise, which is not tested or taken a sample test, to be compared, and can increase the reliability of product quality, for the such product of relevant enterprise
Manual test is compared, and efficiency greatly improves, and saves the cost of company.
Description of the drawings
Fig. 1 is the application semiconductor components and devices cutting, the dimensional structure diagram of mechanism for testing；
Fig. 2 is the structural schematic diagram of the application feeding unit material；
Fig. 3 is the structural schematic diagram of the application cutting unit；
Fig. 4 is the structural schematic diagram of the application test cell；
Fig. 5 is the structural schematic diagram of the application separation unit；
Fig. 6 is the structural schematic diagram of the application splicing unit.
In above each figure, 1, holder；11, inclined side；12, horizontal plane；2, track；
3, feeding unit material；31, positioning body I；32, mobile cylinder I；33, electric rotating machine I；34, box chamber I；
4, cutting unit；41, fixed plate is cut；42, cylinder is cut；43, connecting plate；44, cutter；45, backing plate；
5, test cell；51, fixed plate is tested；52, tested cylinder；53, briquetting；54, locating piece；55, testing piece；
6, separation unit；61, cylinder is sorted；62, transport chamber；63, positioning cylinder；64, sliding rail；65, substandard products box；
7, splicing unit；71, positioning body II；72, concave plate II；73, mobile cylinder II；74, Storage Box.
Specific implementation mode
Further to illustrate that the utility model is to reach the technological means and effect that predetermined purpose of utility model is taken,
Below in conjunction with attached drawing and preferred embodiment, to foundation specific embodiment of the present utility model, structure, feature and its effect, in detail
Carefully it is described as follows：
A kind of semiconductor components and devices cutting, mechanism for testing, as shown in Figure 1, including holder 1 and track 2, holder 1 is equipped with
One inclined side 11, track 2 are arranged on the inclined side 11 of holder 1, and the top of holder 1 is equipped with horizontal plane 12, horizontal plane 12
It is equipped with feeding unit material 3, setting cutting unit 4, test cell 5, separation unit 6 and splicing unit are arranged in order on track 2
7。
With reference to figure 2, feeding unit material 3 includes the positioning body I 31, mobile cylinder I 32, rotation of pending fixed component holding box
The box chamber I 34 of rotating motor I 33 and storage holding box, positioning body I 31 include two vertical openings concave plate staggered relatively, mobile gas
Cylinder I 32 is arranged between two notch plates, and electric rotating machine I 33 is arranged in the junction of the horizontal plane 12 and inclined side 11 of holder 1,
Box chamber I 34 is located in the groove of 1 horizontal plane 12 of holder, and positioning body I 31, electric rotating machine I 33 and box chamber I 34 are successively set on movement
The telescopic end of cylinder I 32.Holding box is placed in positioning body I 31, is then moved into rotation using mobile cylinder I 32
Place, is then rotated with electric rotating machine I 33 to track, and using the effect of gravity, fixation component in holding box is from rail
It slips down in road 2, then rotates holding box to horizontal plane, then when next holding box comes this position, push it to box
In chamber I 34.
With reference to figure 3, cutting unit 4 includes cutting fixed plate 41, cuts cylinder 42, connecting plate 43, cutter 44 and backing plate 45,
Cutting fixed plate 41 is arranged on the inclined side 11 of holder 1, and cutting fixed plate 41 is equipped with cutting cylinder 42, cuts cylinder 42
Top be connected with one end of connecting plate 43, the other end of connecting plate 43 connects with the cutter 44 that vertical tilt side 11 moves back and forth
It connects, backing plate 45 is equipped with below the cutting edge of cutter 44, cutter 44 is arranged in parallel with track 2.Come first device when from 4 upstream of cutting unit
When part, the pin of component is cut away in the interaction of cutter 44 and backing plate 45.
With reference to figure 4, test cell 5 includes test fixed plate 51, tested cylinder 52, briquetting 53, locating piece 54 and testing piece
55, test fixed plate 51 is arranged on the inclined side 11 of holder 1, and test fixed plate 51 is equipped with tested cylinder 52, tests gas
The telescopic end of cylinder 52 connects briquetting 53, and the side of tested cylinder 52 is equipped with locating piece 54, is equipped in locating piece 54 and stretches to track one
The one-to-one testing piece 55 of two rows of side, upper row's testing piece 55 are located at the lower section of locating piece 54.It is swum across when from test cell 5
When carrying out component, briquetting 53 is pressed down against upper row's testing piece 55 on locating piece 54, upper row's testing piece 55 and lower row's testing piece 55
It is harmonious, to being detected at the pin of component,.
With reference to figure 5, separation unit 6 includes sorting cylinder 61, transport chamber 62, positioning cylinder 63, sliding rail 64 and substandard products box 65,
Sorting cylinder 61 is arranged on the inclined side 11 of holder 1, sorts the telescopic end connection transportation chamber 62 of cylinder 61, transport chamber 62
Side is equipped with straight slot corresponding with track 2, and the top surface of transport chamber 62 is equipped with positioning cylinder 63, and the lower section of transport chamber 62, which is equipped with, to be slided
Rail 64, substandard products box 65 are arranged in the groove of 1 inclined side 11 of holder and positioned at the downsides of transport chamber 62.When from separation unit 6
Upstream come underproof component when, positioning cylinder 63 blocks the straight slot of transport chamber 62, sorting cylinder 61 move transport chamber
62 at substandard products box 65, and since the transport chamber 62 is inclined, therefore substandard products component is under gravity, is slipped to substandard products box
In 65.
As shown in fig. 6, splicing unit 7 includes holding qualified component positioning body II 71, concave plate II 72, mobile cylinder II
73 and Storage Box 74, it is arranged including two vertical openings concave plate II 72 staggered relatively, mobile cylinder II 73 in positioning body II 71
Between two concave plates II 72, Storage Box 74 is arranged in the groove of 1 inclined surface of holder, and positioning body II 71 and Storage Box 74 are successively
Telescopic end in mobile cylinder II 73 is set.Storage Box is placed in two concave plates II 72, when Storage Box fills with, utilizes shifting
Cylinder II 73 of taking offence pushes it in Storage Box 74, which is similar to feeding unit material 3.
Above-mentioned each operating process is operated using controller, to provide optimal solution speed, in addition, in feed material list
Member 3, cutting unit 4, test cell 5, separation unit 6 and splicing unit 7 it is adjacent between track 2 be equipped with positioning pin, this is fixed
The bottom end of position pin is adjacent with the holder being arranged inside holder 1.It can be ensureing during carrying out different units operation, no
Omit the processes such as cutting, detection, sorting and the splicing of any component.
Semiconductor components and devices slides into track by feeding unit material, slides into cutting unit through track, cuts after foot again by track
Slide into test cell.Briquetting makes upper and lower testing piece clamp 4 pins of component, starts to survey downwardly against 4 built-in testing piece above
Examination.It tests semiconductor components and devices and slides into separation unit.When semiconductor components and devices enters separation unit, if semiconductor element device
Part is non-defective unit, sorts cylinder and positioning cylinder is failure to actuate, semiconductor components and devices is slided to through track in splicing unit directly down；
If semiconductor components and devices is defective products, positioning cylinder acts first, blocks semiconductor components and devices, then sorts cylinder movement,
Transport chamber is pushed forward at substandard products box, defective semiconductor's component is put into substandard products box by positioning cylinder reoperation, sorts gas
Cylinder reoperation transports transport chamber to original place back, waits for that next semiconductor components and devices reoperates.
The utility model is described above with reference to further embodiment, but the scope of protection of the utility model is simultaneously
It is not limited to this, in the case where not departing from the scope of the utility model, various improvement can be carried out to it and can be used etc.
It imitates object and replaces component therein, as long as structural conflict is not present, items technical characteristic mentioned in the various embodiments can be with
Any way combines, and any reference signs in the claims should not be construed as limiting the involved claims, nothing
By from the point of view of which point, the present embodiments are to be considered as illustrative and not restrictive.Therefore, any to fall into right
All technical solutions in the range of it is required that are within the protection scope of the present utility model.
Claims (7)
1. a kind of semiconductor components and devices cutting, mechanism for testing, including holder (1) and track (2), the holder (1) are inclined equipped with one
The top of prism (11), holder (1) is equipped with horizontal plane (12), and track (2) is arranged on the inclined side (11) of holder (1),
It is characterized in that, further including the feeding unit material (3) being arranged on horizontal plane (12) and setting being arranged in order on track (2)
Cutting unit (4), test cell (5), separation unit (6) and splicing unit (7).
2. a kind of semiconductor components and devices cutting according to claim 1, mechanism for testing, which is characterized in that the feed material list
First (3) include the positioning body I (31) of pending fixed component holding box, mobile cylinder I (32), electric rotating machine I (33) and deposit
The box chamber I (34) of holding box is put, the positioning body I (31) includes two vertical openings concave plate staggered relatively, mobile cylinder I
(32) it is arranged between two notch plates, horizontal plane (12) and inclined side (11) in holder (1) is arranged in electric rotating machine I (33)
Junction, box chamber I (34) are located in the groove of holder (1) horizontal plane (12), positioning body I (31), electric rotating machine I (33) and box chamber
I (34) are successively set on the telescopic end of mobile cylinder I (32).
3. a kind of semiconductor components and devices cutting according to claim 1, mechanism for testing, which is characterized in that the cutting list
First (4) include cutting fixed plate (41), cutting cylinder (42), connecting plate (43), cutter (44) and backing plate (45), and the cutting is solid
Fixed board (41) is arranged on the inclined side (11) of holder (1), and cutting fixed plate (41) is equipped with cutting cylinder (42), cuts gas
The top of cylinder (42) is connected with one end of connecting plate (43), and the other end of connecting plate (43) is back and forth moved with vertical tilt side (11)
The cutting edge lower section of dynamic cutter (44) connection, cutter (44) is equipped with backing plate (45), and cutter (44) is arranged in parallel with track (2).
4. a kind of semiconductor components and devices cutting according to claim 1, mechanism for testing, which is characterized in that the test is single
First (5) include test fixed plate (51), tested cylinder (52), briquetting (53), locating piece (54) and testing piece (55), the test
Fixed plate (51) is arranged on the inclined side (11) of holder (1), and test fixed plate (51) is equipped with tested cylinder (52), test
The side of the telescopic end connection briquetting (53) of cylinder (52), tested cylinder (52) is equipped with locating piece (54), is set in locating piece (54)
There are the one-to-one testing piece (55) of the two rows for stretching to track side, upper row's testing piece (55) to be located at the lower section of locating piece (54).
5. a kind of semiconductor components and devices cutting according to claim 1, mechanism for testing, which is characterized in that the sorting is single
First (6) include sorting cylinder (61), transport chamber (62), positioning cylinder (63), sliding rail (64) and substandard products box (65), the sorting gas
Cylinder (61) is arranged on the inclined side (11) of holder (1), the telescopic end connection transportation chamber (62) of sorting cylinder (61), transport chamber
(62) side is equipped with straight slot corresponding with track (2), and the top surface of transport chamber (62) is equipped with positioning cylinder (63), transport chamber
(62) lower section is equipped with sliding rail (64), and substandard products box (65) is arranged in the groove of holder (1) inclined side (11) and positioned at transport
The downside of chamber (62).
6. a kind of semiconductor components and devices cutting according to claim 1, mechanism for testing, which is characterized in that the splicing list
First (7) include holding qualified component positioning body II (71), concave plate II (72), mobile cylinder II (73) and Storage Box (74),
It is arranged two including the concave plate II (72) that two vertical openings are staggered relatively, mobile cylinder II (73) in the positioning body II (71)
Between concave plate II (72), Storage Box (74) is arranged in the groove of holder (1) inclined surface, positioning body II (71) and Storage Box
(74) it is successively set on the telescopic end of mobile cylinder II (73).
7. a kind of semiconductor components and devices cutting according to claim 1, mechanism for testing, which is characterized in that the feed material list
First (3), cutting unit (4), test cell (5), separation unit (6) and splicing unit (7) it is adjacent between track (2) be equipped with
The bottom end of positioning pin, positioning pin is adjacent in the internal bracket gas cylinder of holder (1) with setting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721713035.5U CN207705156U (en) | 2017-12-11 | 2017-12-11 | A kind of semiconductor components and devices cutting, mechanism for testing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721713035.5U CN207705156U (en) | 2017-12-11 | 2017-12-11 | A kind of semiconductor components and devices cutting, mechanism for testing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207705156U true CN207705156U (en) | 2018-08-07 |
Family
ID=63025669
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721713035.5U Active CN207705156U (en) | 2017-12-11 | 2017-12-11 | A kind of semiconductor components and devices cutting, mechanism for testing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207705156U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112002647A (en) * | 2020-10-28 | 2020-11-27 | 四川立泰电子有限公司 | Automatic pin cutting and testing integrated machine for semiconductor electronic device and application thereof |
-
2017
- 2017-12-11 CN CN201721713035.5U patent/CN207705156U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112002647A (en) * | 2020-10-28 | 2020-11-27 | 四川立泰电子有限公司 | Automatic pin cutting and testing integrated machine for semiconductor electronic device and application thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200131 Address after: 256300 221 the Yellow River Road, Tian Zhen Street, Gaoqing County, Zibo, Shandong Patentee after: Shandong Bao Cheng Electronics Co., Ltd. Address before: 266000. 100 meters South Road, three Yang Qing Road, Jiangshan Town, Qingdao City, Shandong, Laixi Patentee before: QINGDAO HAIZHI SEMICONDUCTOR CO., LTD. |
|
| TR01 | Transfer of patent right |