CN201608203U

CN201608203U - Jig and equipment for packaging LED modules by adopting glue dotting

Info

Publication number: CN201608203U
Application number: CN2010201235938U
Authority: CN
Inventors: 黄少忠
Original assignee: SHENZHEN GENTA LED COMPONENTS CO Ltd
Current assignee: SHENZHEN GENTA LED COMPONENTS CO Ltd
Priority date: 2010-03-04
Filing date: 2010-03-04
Publication date: 2010-10-13
Anticipated expiration: 2020-03-04

Abstract

The embodiment of the utility model relates to a jig for packaging LED modules by adopting glue dotting, comprising a press plate and a base movably connected with the press plate, wherein a plurality of through holes for matching with a hot-pressing die to carry out hot-pressing riveting on LED module assemblies are arranged on the base. The embodiment of the utility model also provides equipment for packaging the LED modules by adopting glue dotting. By adopting the jig and the equipment in the embodiment of the utility model, the LED module assemblies packaged by using a glue dotting method can be subjected to hot-pressing riveting, and the cooled LED module assemblies are fastened and sealed into a whole to meet the requirements of a glue-dotting packaging process, thereby having no need of adopting a glue-poured type LED module packaging method; and therefore, the utility model saves a great amount of glue bodies and greatly reduces the packaging cost of the LED modules.

Description

The tool and the equipment that are used for the encapsulation of LED module point glue

Technical field

The utility model relates to the LED field, relates in particular to a kind of tool of the LED of being used for module point glue encapsulation and is used for the equipment that LED module point glue encapsulates.

Background technology

At present, the application of LED integrated form encapsulation module on various display message boards or display screen more and more widely, its advantage is that production technology is simple and efficient is high.Yet, adopt the LED module method for packing of rubber filling type, it carries out LED die set fit sealing needs a large amount of colloids, cost is higher, especially at the white LED lamp product of lighting use, its required colloid need add expensive phosphor material powder, and this makes the colloid cost significantly improve, thereby has significantly improved LED module packaging cost.

The utility model content

The utility model embodiment technical problem to be solved is, a kind of tool that is used to place the LED die set is provided, and a kind of equipment that is used for the encapsulation of LED module point glue, it is mainly to carrying out the hot pressing riveted between each the LED die set that uses the dispensing method encapsulation, cooling back LED die set fit sealing becomes an integral body, satisfy the requirement of some glue packaging technology, thereby do not need to adopt the LED module method for packing of rubber filling type, save a large amount of colloids, significantly reduced LED module packaging cost.

For solving the problems of the technologies described above, the utility model embodiment adopts following technical scheme: a kind of tool of the LED of being used for module point glue encapsulation, comprise pressing plate, and the base that flexibly connects with described pressing plate, wherein, described base is provided with and is used to cooperate hot-die the LED die set to be carried out some perforation of hot pressing riveted.

A kind of equipment that is used for the encapsulation of LED module point glue, comprise first power set, second power set, the hot-die that links to each other with described second power set, and be arranged between described first power set and described second power set, be used to the tool that cooperates described first power set that the LED die set that is positioned over is wherein locked, wherein, described tool comprises: the pressing plate that links to each other with described first power set; With the base that described pressing plate flexibly connects, described base is provided with and is used to cooperate described hot-die described LED die set to be carried out some perforation of hot pressing riveted.

The beneficial effect of the utility model embodiment is: by a kind of tool and equipment of the LED of being used for module point glue encapsulation are provided, wherein tool comprises pressing plate, and the base that flexibly connects with described pressing plate, and described base is provided with and is used to cooperate hot-die the LED die set to be carried out some perforation of hot pressing riveted, like this, can be to carrying out the hot pressing riveted between each the LED die set that uses the dispensing method encapsulation, cooling back LED die set fit sealing becomes an integral body, satisfy the requirement of some glue packaging technology, thereby do not need to adopt the LED module method for packing of rubber filling type, save a large amount of colloids, significantly reduced LED module packaging cost.

Below in conjunction with accompanying drawing the utility model embodiment is described in further detail.

Description of drawings

Fig. 1 is the schematic perspective view of the equipment that is used for the encapsulation of LED module point glue of the utility model embodiment; Fig. 2 be the utility model embodiment based on a kind of LED die set schematic diagram; Fig. 3 is the part schematic diagram of the equipment that is used for the encapsulation of LED module point glue of the utility model embodiment; Fig. 4 is another part schematic diagram of the equipment that is used for the encapsulation of LED module point glue of the utility model embodiment.

Embodiment

As shown in Figure 1, the utility model embodiment provides a kind of equipment of the LED of being used for module point glue encapsulation, comprising the first Pneumatic pressure power device 1 is arranged, the second Pneumatic pressure power device 2, the hot-die 3 that links to each other with the second Pneumatic pressure power device 2, and the tool 4 that is arranged at the utility model embodiment between the first Pneumatic pressure power device 1 and the second Pneumatic pressure power device 2, the LED die set that tool 4 is used for cooperating 1 pair in the first Pneumatic pressure power device to be positioned over tool 4 is locked, one comprises as shown in Figure 2 plastic face mask 5 and circuit board 6 the LED die set, and plastic face mask 5 one sides are provided with rivet-like plastic cylinder 7, it passes the perforate 8 on the circuit board 6, perforate 8 sizes and the rivet-like plastic cylinder 7 of one circuit board 6 are complementary, be beneficial to finish follow-up hot pressing riveted, tool 4 includes pressing plate 9 as shown in Figure 3, and base as shown in Figure 4 10, pressing plate 9 links to each other with the first Pneumatic pressure power device 1, and base 10 is provided with and is used to cooperate 3 pairs of LED die sets of hot-die to carry out some perforation 11 of hot pressing riveted, wherein, the size of perforation 11 is greater than the size that is used for the rivet-like plastic cylinder 7 of hot pressing riveted on its corresponding plastic face mask 5, like this perforation 11 can be when placing the LED die set its rivet-like plastic cylinder 7 of empty avoiding, hot-die 3 comprises constant temperature heating device 12, and the pressing die head 13 that links to each other with constant temperature heating device 12, pressing die head 13 is provided with some heat conductive rods, each heat conductive rod is corresponding with corresponding perforation 11 respectively, for accurate location, can also offer the location notch that is used to locate the LED die set on the base 10; (plastic face mask 5 is last when plastic face mask 5 and circuit board 6 are chimeric, circuit board 6 is following, and the rivet-like plastic cylinder 7 on the plastic face mask 5 passes the perforation 11 on perforate 8 corresponding tool 4 bases 10 on the circuit board 6) after put into tool 4, and start the first Pneumatic pressure power device 1 plastic face mask 5 and circuit board 6 are locked downwards, plastic face mask 5 and circuit board 6 are closely cooperated, simultaneously, the pressing die head 13 that has been heated to the hot-die 3 of colloidal sol (plastics) temperature relies on the impetus of the second Pneumatic pressure power device 2, the perforation 11 that is upward through on tool 4 bases 10 is pressed onto the rivet-like plastic cylinder 7 that needs riveted, thereby plastic face mask 5 and circuit board 6 be fit sealing be combined into an integral body, one finished the action of the second Pneumatic pressure power device 2 in moment, and one will be delayed time to the plastic cool curing time of rivet-like plastic cylinder 7 and (can assemble delayer the locking time of the first Pneumatic pressure power device 1, its delay adjustments is pressed the actual needs adjustment), treat to unclamp tool 4 behind the LED die set cooling curing, take out the LED die set, at this moment, the assembly of two dissimilar material properties (plastic face mask 5 and circuit board 6) becomes an overall structure and can satisfy the requirement of some glue packaging technologies after the hot pressing riveted is handled, certainly, tool 4 is not in contact with one another with hot-die 3, like this, the high temperature on the hot-die 3 can not pass on the tool 4.

As a kind of execution mode, the above-mentioned first Pneumatic pressure power device 1, the second Pneumatic pressure power device 2 all can be substituted by other power set, as motor power device or hydraulic power unit.

As a kind of execution mode, above-mentioned LED die set can comprise other shapes beyond the derivet shape plastic cylinder, the hot pressing riveted parts of material.

Adopt the equipment that is used for the encapsulation of LED module point glue of the utility model embodiment, the upper, middle and lower structure of having utilized the first Pneumatic pressure power device 1, the second Pneumatic pressure power device 2 and tool 4 to form dexterously, use simple Pneumatic pressure power device and constant temperature heating device, with sequences such as locking, hot pressing and riveteds, LED die set fit sealing with two dissimilar material properties, action is simple, quick, and easy operating.

The above is an embodiment of the present utility model; should be pointed out that for those skilled in the art, under the prerequisite that does not break away from the utility model principle; can also make some improvements and modifications, these improvements and modifications also are considered as protection range of the present utility model.

Claims

1. a tool that is used for LED module point glue encapsulation is characterized in that, comprises pressing plate, and the base that flexibly connects with described pressing plate, and wherein, described base is provided with and is used to cooperate hot-die the LED die set to be carried out some perforation of hot pressing riveted.

2. tool as claimed in claim 1 is characterized in that, the size of described perforation is greater than the size that is used for the rivet-like plastic cylinder of hot pressing riveted on the described LED die set corresponding with it.

3. one kind is used for the equipment that LED module point glue encapsulates, it is characterized in that, comprise first power set, second power set, the hot-die that links to each other with described second power set, and be arranged between described first power set and described second power set, be used to the tool that cooperates described first power set that the LED die set that is positioned over is wherein locked, wherein, described tool comprises:

The pressing plate that links to each other with described first power set;

With the base that described pressing plate flexibly connects, described base is provided with and is used to cooperate described hot-die described LED die set to be carried out some perforation of hot pressing riveted.

4. equipment as claimed in claim 3 is characterized in that, the size of described perforation is greater than the size that is used for the rivet-like plastic cylinder of hot pressing riveted on the described LED die set corresponding with it.

5. equipment as claimed in claim 3 is characterized in that described hot-die comprises constant temperature heating device, and the pressing die head that links to each other with described constant temperature heating device.

6. equipment as claimed in claim 3 is characterized in that, offers the location notch that is used to locate described LED die set on the described base.

7. as each described equipment in the claim 3 to 6, it is characterized in that described first power set, described second power set are the Pneumatic pressure power device.