CN102883544B - Prevent via hole from falling the method for oil during wiring board lead-free tin spray - Google Patents
Prevent via hole from falling the method for oil during wiring board lead-free tin spray Download PDFInfo
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- CN102883544B CN102883544B CN201110195672.9A CN201110195672A CN102883544B CN 102883544 B CN102883544 B CN 102883544B CN 201110195672 A CN201110195672 A CN 201110195672A CN 102883544 B CN102883544 B CN 102883544B
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- wiring board
- brown
- via hole
- free tin
- lead
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Abstract
Prevent via hole from falling the method for oil when the invention discloses a kind of wiring board lead-free tin spray, comprise step: etching, microetch brown, volcanic ash nog plate, plugging green oil, welding resistance and lead-free tin spray.The present invention, by increasing microetch brown operation after the etching, carries out micro-alligatoring to increase the adhesive force of consent green oil and hole wall to hole wall, thus reaches and prevent follow-up lead-free tin spray process Yin Gaowen and cause via hole to fall oily object.Compared with prior art, the invention solves the problem that plugging green oil via hole in lead-free tin spray process falls oil, and technique is simple, effectively improves the quality of product.
Description
Technical field:
The present invention relates to wiring board manufacturing technology, what be specifically related to is that a kind of employing during lead-free tin spray process making wiring board prevents via hole from falling the method for oil, mainly for the pcb board of ball grid array structure (BGA).
Background technology:
Wiring board is in manufacturing process, need to carry out the techniques such as gold-plated, turmeric, and wiring board is carrying out in above-mentioned processing procedure, its temperature needs to control within 100 DEG C, to make wiring board when plugging green oil, ink can bear its temperature range and can not with hole wall cut open from, therefore now there will not be via hole fall oil phenomenon.
Along with the fast development of electronic product, user has higher requirement to the wiring board making electronic product, and the pcb board of ball grid array structure (BGA) is owing to having that package area is few, function is large, number of pins is many, Yi Shangxi, reliability are high, good electrical property and the feature such as holistic cost is low, become the direction that each manufacturer's pcb board is manufactured gradually.
But, for ball grid array structure (BGA) wiring board of lead-free tin spray process, due to the instantaneous temperature of lead-free tin spray process very high (250 ~ 280 DEG C), rabbet ink is caused to be difficult to bear high temperature, thus expand, and after plating, pcb board, due to hole wall smoother, easily causes rabbet ink and hole wall to peel off, thus generation via hole falls oily phenomenon, has a strong impact on the quality of product.
Summary of the invention:
In view of above problem, the object of the present invention is to provide during a kind of wiring board lead-free tin spray and prevent via hole from falling the method for oil, make wiring board to solve lead-free tin spray process, when carrying out plugging green oil, cause via hole to fall the problem of oil because temperature is too high.
For achieving the above object, the present invention is mainly by the following technical solutions:
Prevent via hole from falling a method for oil during wiring board lead-free tin spray, comprise step:
B, the process of microetch brown is carried out to wiring board, make the via hole hole wall of wiring board and plate face form rough surface, and on above-mentioned rough surface, form one deck brown film.
Wherein comprise step before step B:
A, etch processes is carried out to wiring board, logicalnot circuit part on wiring board is removed.
Wherein comprise step after step B:
C, nog plate process is carried out to wiring board, the brown film being positioned at wiring board plate face is ground off.
Wherein with the speed of 1.8m/min, nog plate is carried out to wiring board by volcanic ash Plate grinder.
Wherein step B comprises:
The speed of 3m/min is kept to carry out brown process to wiring board by brown machine.
Wherein comprise after step C:
D, plugging green oil process is carried out to wiring board via hole.
Wherein comprise after step D:
E, welding resistance process is carried out to wiring board, make PCB surface form one deck ink protective layer, carry out baking sheet process afterwards.
Wherein carry out baking sheet process to wiring board in step e to comprise:
First by being heated to 75 DEG C of maintenances 120 minutes after wiring board welding resistance, being then warmed up to 85 DEG C of maintenances 30 minutes, being warmed up to 100 DEG C of maintenances 20 minutes afterwards, being then warmed up to 120 DEG C of maintenances 20 minutes, being finally warmed up to 155 DEG C of maintenances 70 minutes, complete wiring board baking sheet.
Wherein comprise after step e:
F, lead-free tin spray process is carried out to wiring board, make wiring board copper wire surface form one deck tin protective layer.
Wherein step F comprises:
At 155 DEG C of temperature, keep baking 30 minutes, continue afterwards to carry out lead-free tin spray process once to wiring board in 4 seconds at temperature 264 DEG C.
The present invention, by carrying out the process of microetch brown after to circuit board etching, can make the via hole hole wall of wiring board and plate face form rough surface by the effect of microetch and brown liquid medicine, form one deck brown film afterwards on formed above-mentioned rough surface.
After plugging green oil and welding resistance process are carried out to via hole on wiring board, need to carry out baking sheet to wiring board, make the green oil on wiring board in via hole, on surface of circuit board solder mask layer solidification, simultaneously due to the green oil temperature influence in via hole in the curing process, produce adhewsive action between the rough surface of meeting and via hole hole wall, ensure that it does not come off, and at follow-up lead-free tin spray process, even if keep 264 DEG C of temperature, via hole is also there will not be to fall the phenomenon of oil.
Accompanying drawing illustrates:
Fig. 1 is process chart of the present invention.
Embodiment:
Core concept of the present invention is: the present invention is by carrying out the process of microetch brown to wiring board, rough surface is formed to make via hole hole wall, be formed in the via hole of rough surface carry out plugging green oil at this afterwards, then baking sheet process is carried out, the rough surface of the green oil in via hole and hole wall is formed adhere to, and when follow-up lead-free tin spray process, ensure that the too high green oil that can not cause of its temperature produces expansion and departs from hole wall, produce oily phenomenon.
For setting forth thought of the present invention and object, below in conjunction with the drawings and specific embodiments, the present invention is described further.
Shown in Figure 1, Fig. 1 is process chart of the present invention.Prevent via hole from falling the method for oil when the invention provides a kind of wiring board lead-free tin spray, it mainly comprises step:
A, etch processes is carried out to wiring board, logicalnot circuit part on wiring board is removed.
Wherein, described step etching is exactly utilize chemical reaction that the removing of wiring board logicalnot circuit part is formed the process of line pattern, is undertaken, carry out etching inspection after etching by normal process parameter.
B, the process of microetch brown is carried out to wiring board, make the via hole hole wall of wiring board and plate face form rough surface, and on above-mentioned rough surface, form one deck brown film.
Wherein first microetch is carried out to wiring board in step B, the effect of microetch makes to form rough surface in the plate face of wiring board and wiring board via hole, carry out brown process more afterwards, need in brown process to use brown machine to keep the speed of 3m/min to plate, and be located in brown process chemical liquids and carry out, and brown process chemical liquids also can form rough surface to via hole hole wall and plate face, and via hole hole wall after brown process and plate face can form one deck brown film, this brown film does not affect follow-up technique.
C, nog plate process is carried out to wiring board, the brown film being positioned at wiring board plate face is ground off.
The effect of wherein said step volcanic ash nog plate is ground off by copper face brown film mechanically, avoids copper face color be brown and cause ink for screen printing to darken, and not overpickling during nog plate, nog plate speed is 1.8m/min.
D, plugging green oil process is carried out to wiring board via hole.
What wherein said plugging green oil adopted is aluminium flake jack process, and the time of staying of plate from brown to consent controlled in 24 hours.
E, welding resistance process is carried out to wiring board, make PCB surface form one deck ink protective layer, carry out baking sheet process afterwards.
The object of wherein carrying out baking sheet process to wiring board in step e plays insulation, effect anti-oxidation and attractive in appearance.
First by being heated to 75 DEG C of maintenances 120 minutes after wiring board welding resistance, being then warmed up to 85 DEG C of maintenances 30 minutes, being warmed up to 100 DEG C of maintenances 20 minutes afterwards, being then warmed up to 120 DEG C of maintenances 20 minutes, being finally warmed up to 155 DEG C of maintenances 70 minutes, complete wiring board baking sheet.
F, lead-free tin spray process is carried out to wiring board, make wiring board copper wire surface form one deck tin protective layer.
Wherein step F comprises:
At 155 DEG C of temperature, keep baking 30 minutes, continue afterwards to carry out lead-free tin spray process once to wiring board in 4 seconds at temperature 264 DEG C.
And keep at 155 DEG C of temperature baking within 30 minutes, be after former welding resistance baking sheet add the process of copying, then must complete in 2 hours for lead-free tin spray process.
The present invention, by increasing microetch brown operation after the etching, carries out micro-alligatoring to increase the adhesive force of consent green oil and hole wall to hole wall, thus reaches and prevent follow-up lead-free tin spray process Yin Gaowen and cause via hole to fall oily object.Compared with prior art, the invention solves the problem that plugging green oil via hole in lead-free tin spray process falls oil, and technique is simple, effectively improves the quality of product.
More than that the method preventing via hole from falling oil during a kind of wiring board lead-free tin spray provided by the present invention is described in detail, apply specific case herein to set forth structural principle of the present invention and execution mode, above embodiment just understands method of the present invention and core concept thereof for helping; Meanwhile, for one of ordinary skill in the art, according to thought of the present invention, all will change in specific embodiments and applications, in sum, this description should not be construed as limitation of the present invention.
Claims (1)
1. prevent via hole from falling a method for oil during wiring board lead-free tin spray, it is characterized in that comprising step:
A, to utilize chemical reaction by normal process parameter by logicalnot circuit part removing on wiring board to form line pattern;
B, above-mentioned wiring board is placed in brown process chemical liquids, the speed of 3m/min is kept to carry out brown process to wiring board by brown machine, make via hole hole wall that wiring board is formed and plate face form rough surface by brown process chemical liquids, and on above-mentioned rough surface, form one deck brown film;
C, with the speed of 1.8m/min, nog plate process is carried out to wiring board by volcanic ash Plate grinder, the brown film being positioned at wiring board plate face is ground off;
D, employing aluminium flake jack process carry out plugging green oil process to wiring board via hole, and ensure that the time of staying of wiring board from brown to consent controls within 24 hours;
E, welding resistance process is carried out to wiring board, PCB surface is made to form one deck ink protective layer, then by being heated to 75 DEG C of maintenances 120 minutes after wiring board welding resistance, being then warmed up to 85 DEG C of maintenances 30 minutes, being warmed up to 100 DEG C of maintenances 20 minutes afterwards, being then warmed up to 120 DEG C of maintenances 20 minutes, being finally warmed up to 155 DEG C of maintenances 70 minutes, wiring board baking sheet is completed;
F, the wiring board after welding resistance added and copies process, at 155 DEG C of temperature, keep baking 30 minutes, continuing in 2 hours and at temperature 264 DEG C to carry out lead-free tin spray process once to wiring board in 4 seconds afterwards.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110195672.9A CN102883544B (en) | 2011-07-13 | 2011-07-13 | Prevent via hole from falling the method for oil during wiring board lead-free tin spray |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110195672.9A CN102883544B (en) | 2011-07-13 | 2011-07-13 | Prevent via hole from falling the method for oil during wiring board lead-free tin spray |
Publications (2)
| Publication Number | Publication Date |
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| CN102883544A CN102883544A (en) | 2013-01-16 |
| CN102883544B true CN102883544B (en) | 2015-09-16 |
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| CN201110195672.9A Active CN102883544B (en) | 2011-07-13 | 2011-07-13 | Prevent via hole from falling the method for oil during wiring board lead-free tin spray |
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Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104320928B (en) * | 2014-10-13 | 2017-05-10 | 广东依顿电子科技股份有限公司 | Hole plugging method of different resistance welding colors of circuit board |
| CN104955283A (en) * | 2015-06-17 | 2015-09-30 | 安徽达胜电子有限公司 | Circuit board tin spraying process |
| CN105208794B (en) * | 2015-09-02 | 2018-01-23 | 深圳崇达多层线路板有限公司 | A kind of PCB manufacturing method of soft board of lead-free tin spray |
| CN108882547A (en) * | 2018-07-16 | 2018-11-23 | 信丰福昌发电子有限公司 | A kind of technique of wiring board welding resistance pre-treatment |
| CN111405758A (en) * | 2019-01-03 | 2020-07-10 | 鸿富锦精密工业(武汉)有限公司 | Circuit board processing method and circuit board |
| CN111970815B (en) * | 2020-08-17 | 2021-07-27 | Oppo广东移动通信有限公司 | Circuit board, manufacturing method thereof and electronic equipment |
| CN113347804A (en) * | 2021-06-11 | 2021-09-03 | 金禄电子科技股份有限公司 | Circuit board and solder mask method thereof |
| CN113630967A (en) * | 2021-08-05 | 2021-11-09 | 恩达电路(深圳)有限公司 | Production process of black anode aluminum oxide-based circuit board |
| CN115209633B (en) * | 2022-09-14 | 2022-12-09 | 深圳万和兴电子有限公司 | Manufacturing method of single-sided windowing hole plugging of PCB lead-free tin-sprayed plate |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101720167A (en) * | 2009-11-20 | 2010-06-02 | 深圳崇达多层线路板有限公司 | Method for producing circuit board by filling resin in holes on inner core plate |
| CN101765298A (en) * | 2010-01-04 | 2010-06-30 | 深南电路有限公司 | Processing technology of printed circuit board |
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2011
- 2011-07-13 CN CN201110195672.9A patent/CN102883544B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101720167A (en) * | 2009-11-20 | 2010-06-02 | 深圳崇达多层线路板有限公司 | Method for producing circuit board by filling resin in holes on inner core plate |
| CN101765298A (en) * | 2010-01-04 | 2010-06-30 | 深南电路有限公司 | Processing technology of printed circuit board |
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| CN102883544A (en) | 2013-01-16 |
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Inventor after: An Guoyi Inventor after: Deng Siji Inventor after: Ann Yu Leteng are Guoyi Deng Inventor before: He Chun |
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