CN104320928B - Hole plugging method of different resistance welding colors of circuit board - Google Patents
Hole plugging method of different resistance welding colors of circuit board Download PDFInfo
- Publication number
- CN104320928B CN104320928B CN201410538651.6A CN201410538651A CN104320928B CN 104320928 B CN104320928 B CN 104320928B CN 201410538651 A CN201410538651 A CN 201410538651A CN 104320928 B CN104320928 B CN 104320928B
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- Prior art keywords
- oil
- circuit board
- green
- plugging
- solder mask
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Printing Methods (AREA)
Abstract
The invention discloses a hole plugging method of a different resistance welding colors of circuit board. The hole plugging method comprises the following steps of step A, performing hole plugging through the green hole plugging ink from the bottom surface of the circuit board; step B, performing the first oil printing and namely printing the bottom surface through the green matte oil and printing the top surface through the white oil; step C, performing the first prebaking; step D, performing the secondary oil printing and namely printing the bottom surface through the green matte oil and printing the top surface through the white oil again; step E, performing the secondary prebaking; step F, performing exposure and development; step G, performing curing and six-segment baking; step H, performing surface treatment of lead-free solder coating. According to the hole plugging method of the different resistance welding colors of circuit board, the twice surface oil printing is adopted and accordingly the customer requirements for the oil thickness are met, the white oil surface is free of hole plugging green oil color, and the curing stage is changed into 6 segments from 5 segments and the matte hole plugging oil, the white oil, the green oil and the lead-free solder coating are combined and accordingly the binding force of the ink is large and the oil-off condition of the hole plugging position is improved.
Description
Technical field
The present invention relates to printed circuit board (PCB), especially the circuit board method for plugging of different solder mask colors.
Background technology
Existing circuit board, the welding resistance oil on its surface is all only a kind of color, or just only printing white, or just only
Print green or other colors.The requirement of client now is improved constantly, and from outward appearance and process requirements, needs to develop new product, system
Make that there are two kinds of solder mask colors（Simultaneously green dumb paint/mono- face white oil）Consent circuit board, and be surface-treated be lead-free tin spray.
Because circuit board two sides solder mask is inconsistent and characteristic of ink itself, plate face is always occurred during prior art consent
Not enough, there is aperture and falls oil with rabbet ink adhesion in dumb light solder mask, after solidification the problems such as exposure oil.Using white oil consent,
Green dumb paint is poor with the adhesion of white consent oil, and in lead-free tin spray, oily problem occurs in jack position Jing after high temperature impact.
Filling holes with resin can solve this problem, but cost increases, and client does not receive.Therefore, researcher is badly in need of by adjusting parameter and is changed
Change silk-screen step reaches and is solved to get rid of oil after matte surface plug cock hole site spray tin with green rabbet ink, and white oil face has green oil ghost image to ask
Topic.
The content of the invention
To solve above-mentioned technical problem, it is an object of the invention to provide oil, white oil face are not fallen without green oil ghost image in a kind of aperture
With different solder mask colors circuit board method for plugging.
The technical solution used in the present invention is：
A kind of circuit board method for plugging of different solder mask colors, comprises the following steps：
A, from the one side of printed circuit board (PCB) with green rabbet ink consent；
B, a stamp-pad ink, i.e., it is another with white oil printed circuit board (PCB) with consent place face described in green dumb paint printing A
Face；
It is C, once pre-baked；
D, secondary stamp-pad ink, i.e., again with green dumb paint printing consent place face, with white oil printed circuit board (PCB) another side；
It is E, secondary pre-baked；
F, exposure and development；
G, solidification, six sections of bakings；
The surface treatment of H, lead-free tin spray.
Wherein, cure parameter is in step G:50 degree of 30 min of * 60min+60 degree *+75 spend * 60 min+85
Degree degree * 30 min+160 of * 30 min+110 spend * 120 min.
Step H should be carried out after the completion of G in 2 hours.
With silk screen printing process stamp-pad ink in step A, model F21 of green rabbet ink.
A stamp-pad ink adopts 51T half tones with secondary stamp-pad ink in D in step B.
Model PSR-4000MH of the green dumb paint, white oil model WST-H98.
Once pre-baked parameter is 70 degree of * in step C（15-20 min）.
Secondary pre-baked parameter is 73 degree of * 35 min in step E.
Exposure parameter is in step F：White oil face exposure guide rule 9-10 lattice, the lattice of green oil face 13, developing powder 1.8-2.0m/
min。
Beneficial effects of the present invention：
1）Change silk-screen step, adjust rabbet ink viscosity, solving white oil face with secondary stamp-pad ink there are green oil ghost problems；
2）Using the consent oil matched with two sides face oil, cure parameter is adjusted, be changed to 6 sections by 5 sections, control welding resistance oil solidification
Afterwards to the time of lead-free tin spray, make ink adhesion higher, improve consent position and fall oil.
Description of the drawings
The specific embodiment of the present invention is described further below in conjunction with the accompanying drawings.
Fig. 1 is the circuit board method for plugging flow chart of difference solder mask colors of the invention.
Specific embodiment
As shown in figure 1, the circuit board method for plugging of a kind of different solder mask colors for the present invention, it is intended to solve prior art
Oil is fallen in aperture, and there is green oil ghost image in white oil face, the problems such as product appearance is not good；
The circuit board method for plugging of the present invention, comprises the following steps：
, from bottom consents (using F21 green rabbet inks), the two sides color of this plate is a face white oil, simultaneously for A, silk-screen
Green oil, and rationally to control consent oil color（Green）Therefore must be in green oil face consent and consent severity control is being more than
80%, the control of rabbet ink viscosity exists（300dps-350dps）, it is ensured that white oil face does not have aberration while hole is yellow for consent position.
B, a stamp-pad ink, that is, adopt 51T half tones with green dumb paint（MH）Printing bottom faces, with white oil（WST）Printing
Top faces, it is ensured that white oil face does not have hole yellow and aberration, because white oil mobility is strong, needs to keep flat after the completion of silk-screen.Park 15min-
It is pre-baked after 2h, prevent plate face bubble；
C, once pre-baked 70 degree of *（15-20 min）, slightly dry, prevent stamp-pad ink flowing in B, it is ensured that two sides ink is in silk
Not sticky net version when printing second；
D, secondary stamp-pad ink, i.e., adopt again 51T half tones with green dumb paint（MH）Printing bottom faces, with white oil（WST）
Printing top faces, keep flat on request, park 15min-2h；
E, secondary pre-baked 73 degree of * 35 min, prevent stamp-pad ink in D from flowing away, and are easy to curing molding, precuring to ensure white oil face,
Exposure film is not glued in green oil face；
F, exposure, development, because the photobehavior of white oil and green oil is different, production exposure energy white oil face 9-10 lattice,
The lattice of green oil face 13, it is ensured that the photocuring in green oil face is completed to get rid of oil after blowout prevention tin, is needed every white between the film during contraposition production
Paper, prevents ink from not drying and cross pollution, developing powder 1.8-2.0m/ min, and oil is not got rid of in control consent position；
G, solidification, six sections are toasted, and cure parameter is:50 degree of degree * 30 min+75 of * 60 min+60 spend * 60 min+85
Degree degree * 30 min+160 of * 30 min+110 spend * 120 min, space bay are needed during solidification, it is ensured that hot gas flowing in oven
It is smooth to be allowed to completion of cure, improve spray tin and get rid of oily phenomenon；
The surface treatment of H, lead-free tin spray.Lead-free tin spray is carried out oily the solidification in 2 hours of welding resistance is completed.Print in 2 hours
Plate is not also cooled down completely, in order to avoid lead-free tin spray instantaneous high-temperature causes welding resistance oil cracking, is dropped.
As described above, the circuit board method for plugging of the present invention is viscous by adopting quadric surface mimeograph brush and controlling consent oil
Degree, in addition to ensureing oily thickness and meeting customer requirement, the problems such as can also cause white oil face not have consent green oil color and yellow hole；Solidification
Stage is changed to 6 sections by 5 sections, and combines using dumb light consent oil/white oil/green oil, lead-free tin spray, makes ink adhesion higher, changes
Fall oil in kind consent position.
The preferred embodiments of the present invention are the foregoing is only, the present invention is not limited to above-mentioned embodiment, as long as with
Essentially identical means realize that the technical scheme of the object of the invention is belonged within protection scope of the present invention.
Claims (8)
1. the circuit board method for plugging of different solder mask colors, it is characterised in that comprise the following steps：
A, from the one side of printed circuit board (PCB) with green rabbet ink consent；
B, a stamp-pad ink, i.e., with consent place face in green dumb paint printing A, with white oil printed circuit board (PCB) another side；
It is C, once pre-baked；
D, secondary stamp-pad ink, i.e., again with green dumb paint printing consent place face, with white oil printed circuit board (PCB) another side；
It is E, secondary pre-baked；
F, exposure and development；
G solidifies, six sections of bakings；
The surface treatment of H, lead-free tin spray.
2. the circuit board method for plugging of different solder mask colors according to claim 1, it is characterised in that:In step G
Cure parameter is:50 degrees Celsius of min+110 of * 60min+60 degree Celsius * 30min+75 degree Celsius * 60min+85 degree Celsius * 30
Degree Celsius+160 degree Celsius of * 120 min of * 30 min.
3. the circuit board method for plugging of different solder mask colors according to claim 1, it is characterised in that：Step H should
Carry out in 2 hours after the completion of G.
4. the circuit board method for plugging of different solder mask colors according to claim 1, it is characterised in that:In step B
Stamp-pad ink adopts 51T half tones with secondary stamp-pad ink in D.
5. the circuit board method for plugging of different solder mask colors according to claim 1, it is characterised in that:The green dumb light
Model PSR-4000MH of oil, white oil model WST-H98.
6. the circuit board method for plugging of different solder mask colors according to claim 1, it is characterised in that:In step C
Once pre-baked parameter is 70 degrees Celsius of *（15-20min）, slightly dry.
7. the circuit board method for plugging of different solder mask colors according to claim 1, it is characterised in that:In step E
Secondary pre-baked parameter is 73 degree Celsius of * 35 min.
8. the circuit board method for plugging of different solder mask colors according to claim 1, it is characterised in that:In step F
Exposure parameter is：White oil face exposure guide rule 9-10 lattice, the lattice of green oil face 13, developing powder 1.8-2.0m/min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410538651.6A CN104320928B (en) | 2014-10-13 | 2014-10-13 | Hole plugging method of different resistance welding colors of circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410538651.6A CN104320928B (en) | 2014-10-13 | 2014-10-13 | Hole plugging method of different resistance welding colors of circuit board |
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| Publication Number | Publication Date |
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| CN104320928A CN104320928A (en) | 2015-01-28 |
| CN104320928B true CN104320928B (en) | 2017-05-10 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410538651.6A Active CN104320928B (en) | 2014-10-13 | 2014-10-13 | Hole plugging method of different resistance welding colors of circuit board |
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Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106132111A (en) * | 2016-07-26 | 2016-11-16 | 江门崇达电路技术有限公司 | A kind of manufacture method of the wiring board with different solder mask colors |
| CN106793552A (en) * | 2017-02-10 | 2017-05-31 | 昆山元茂电子科技有限公司 | The soldering-inhibiting method of printed circuit board (PCB) |
| CN107215113A (en) * | 2017-05-16 | 2017-09-29 | 胜宏科技（惠州）股份有限公司 | A kind of preparation method for laser carving bar code word white oil block |
| CN107128091A (en) * | 2017-05-26 | 2017-09-05 | 东莞翔国光电科技有限公司 | One kind improves wet film dirty oil plate and falls oily technique |
| CN107509314B (en) * | 2017-06-30 | 2019-12-20 | 奥士康精密电路（惠州）有限公司 | Manufacturing method of anti-welding white-green double-color LED lamp strip plate |
| CN110831332A (en) * | 2019-10-18 | 2020-02-21 | 江苏博敏电子有限公司 | Method for processing solder mask half plug hole |
| CN110831336B (en) * | 2019-11-11 | 2020-10-27 | 珠海崇达电路技术有限公司 | Resin hole plugging method for large-aperture back drilling hole |
| CN112040665B (en) * | 2020-08-05 | 2024-06-07 | 胜宏科技（惠州）股份有限公司 | Anti-welding method for preventing ink from entering holes |
| CN112118678A (en) * | 2020-08-31 | 2020-12-22 | 珠海智锐科技有限公司 | Manufacturing method of packaging substrate |
| CN113597098A (en) * | 2021-06-02 | 2021-11-02 | 深圳市辉煌线路板有限公司 | Method for improving solder resist bleeding of back drilling hole of printed circuit board |
| CN115209633B (en) * | 2022-09-14 | 2022-12-09 | 深圳万和兴电子有限公司 | Manufacturing method of single-sided windowing hole plugging of PCB lead-free tin-sprayed plate |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102510664A (en) * | 2011-10-18 | 2012-06-20 | 东莞生益电子有限公司 | Method for solving thin oil of circuit of PCB (printed circuit board) |
| CN102523698A (en) * | 2011-12-14 | 2012-06-27 | 景旺电子（深圳）有限公司 | Method for filling through-holes of printed circuit board (PCB) with solder mask ink for double-sided opening |
| CN102724818A (en) * | 2012-06-29 | 2012-10-10 | 奥士康精密电路（惠州）有限公司 | Solder mask green ink plugging method |
| CN102802357A (en) * | 2012-08-10 | 2012-11-28 | 东莞市五株电子科技有限公司 | Method for preventing solder mask of singleside-windowed PCB (Printed Circuit Board) from oil leakage |
| CN102883544A (en) * | 2011-07-13 | 2013-01-16 | 深圳市深联电路有限公司 | Method of preventing via hole from oil dropping in lead-free HASL process of circuit board |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10157064A (en) * | 1996-11-28 | 1998-06-16 | Ibiden Co Ltd | Printing mask and method for solder printing of printed-wiring board using the same |
-
2014
- 2014-10-13 CN CN201410538651.6A patent/CN104320928B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102883544A (en) * | 2011-07-13 | 2013-01-16 | 深圳市深联电路有限公司 | Method of preventing via hole from oil dropping in lead-free HASL process of circuit board |
| CN102510664A (en) * | 2011-10-18 | 2012-06-20 | 东莞生益电子有限公司 | Method for solving thin oil of circuit of PCB (printed circuit board) |
| CN102523698A (en) * | 2011-12-14 | 2012-06-27 | 景旺电子（深圳）有限公司 | Method for filling through-holes of printed circuit board (PCB) with solder mask ink for double-sided opening |
| CN102724818A (en) * | 2012-06-29 | 2012-10-10 | 奥士康精密电路（惠州）有限公司 | Solder mask green ink plugging method |
| CN102802357A (en) * | 2012-08-10 | 2012-11-28 | 东莞市五株电子科技有限公司 | Method for preventing solder mask of singleside-windowed PCB (Printed Circuit Board) from oil leakage |
Non-Patent Citations (3)
| Title |
|---|
| 改善阻焊溢油方法研究;彭春生，刘东，朱拓;《印制电路信息》;20140310(第3期);54-58 * |
| 电路板印刷中阻焊油墨的选用和常见故障的处理;林其水;《印制电路信息》;20091210(第12期);46-66 * |
| 阻焊油墨塞孔纵横谈;陈时发;《第六届全国印制电路学术年会论文汇编》;20001010;60-62 * |
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