CN110804339A - Matte solder resist ink and preparation method thereof - Google Patents
Matte solder resist ink and preparation method thereof Download PDFInfo
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- CN110804339A CN110804339A CN201911353568.0A CN201911353568A CN110804339A CN 110804339 A CN110804339 A CN 110804339A CN 201911353568 A CN201911353568 A CN 201911353568A CN 110804339 A CN110804339 A CN 110804339A
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- solder resist
- resist ink
- matte
- matte solder
- acrylic acid
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/101—Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
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- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
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Abstract
The invention particularly relates to matte solder resist ink and a preparation method thereof. The matte solder resist ink comprises the following components in percentage by weight: 10% -15% of acrylic acid copolymerized resin; 25% -30% of acrylic acid high photosensitive resin; 5% -8% of a photoinitiator; 30-40% of filler; 7.5 to 17 percent of color paste; 0.1 to 5 percent of auxiliary agent. The extinction property of the acrylic acid copolymerization resin is utilized to replace the existing silicon dioxide extinction powder, the acrylic acid high-photosensitive resin has good photosensitive performance, and the obtained matte solder resist ink realizes good extinction effect and curing effect. The preparation method is simple, the raw materials are low in cost, the requirement on production conditions is low, and large-scale production can be realized.
Description
Technical Field
The invention particularly relates to matte solder resist ink and a preparation method thereof.
Background
The matte solder resist ink is solder resist ink which can achieve a non-bright surface effect relative to a flat surface effect. Matte solder resist ink is widely used for Light Emitting Diode (LED) color screens and Printed Circuit Boards (PCBs) of electronic products, but due to the traditional manufacturing process, the glossiness of different batches of the matte ink, even the same batch, is inconsistent, so that the reflectivity on the PCBs is different. In order to solve the problem of reflectivity difference, a reflecting cover needs to be added on the LED lamp bead, and the cost of the reflecting cover is close to the cost of the lamp bead, so that the production cost is greatly increased.
With the continuous change of market demand of digital products, many large-scale digital product enterprises such as apples, millets and the like set up to use matte ink, and the demand of the matte ink is increased rapidly. The existing product mainly adopts silicon dioxide matting powder for matting, and because the silicon dioxide matting powder has a large specific surface area and cannot be completely dispersed in the production process, the glossiness of the same batch of printing ink is inconsistent, the contact of the produced printing ink is higher than that of the common printing ink, the surface of the printing ink is uneven after silk-screen printing, and the matting effect is seriously influenced. The existing products, such as matte black ink, use a large amount of white carbon black as the colorant of the ink, but because the light absorption effect of the white carbon black and the extinction effect of the silicon dioxide extinction powder cause the bottom layer ink of the PCB board to be not completely solidified when being solidified by ultraviolet light, so that the phenomena of cavities, falling off and the like of solder bridges easily occur in the production process, the PCB board is scrapped due to the falling off of the ink in the chemical engineering, and the requirements of digital products for 2mil solder bridges cannot be met and the first pass percent cannot be ensured.
Therefore, it is required to develop a matte solder resist ink which can secure a matting effect as well as a curing effect.
Disclosure of Invention
Aiming at the defects of the prior art, the invention aims to provide a matte solder resist ink and a preparation method thereof. The extinction property of the acrylic acid copolymerization resin is utilized to replace the existing silicon dioxide extinction powder, the acrylic acid high-photosensitive resin has good photosensitive performance, and the obtained matte solder resist ink realizes good extinction effect and curing effect. The preparation method is simple, the raw materials are low in cost, the requirement on production conditions is low, and large-scale production can be realized.
The invention adopts the following technical scheme.
The matte solder resist ink comprises the following components in percentage by weight:
preferably, the acrylic copolymer resin is selected from Allnex- (ACA) Z320 resin of xylonite.
Preferably, the acrylic high photosensitive resin is prepared by the following method:
(1) uniformly mixing a photoinitiator GR-FMT 784, a photoinitiator UV-907, south Asia 704H epoxy resin and dipropylene glycol methyl ether according to the weight ratio of 1:5:12-14:30, and reacting at the temperature of 100 ℃ and 120 ℃ for 4-5 hours to obtain a mixture;
(2) under the action of protective gas, according to the percentage of the mass of the mixture, 2 to 4 percent of acrylic acid is added to react at 90 to 95 ℃, and when the acid value is 22 to 24 percent, 0.4 to 0.5 percent of p-hydroxyanisole is added to react at 110 ℃; when the acid value is 2.0-2.4, 0.4-0.6% of p-hydroxyanisole, 3-6% of tetramethylbenzene and 3-6% of dipropylene glycol methyl ether are added for reaction at the temperature of 93-96 ℃; when the acid value is 50-55, the acrylic high photosensitive resin is obtained.
Preferably, the photoinitiator is one or both of a photoinitiator DETX or a photoinitiator ITX.
Preferably, the filler is one or both of precipitated barium sulfate or talc.
Preferably, the color paste is one or more of black color paste, red color paste, yellow color paste and blue color paste. According to the invention, the matte solder resist ink with different colors can be prepared by mixing different color pastes according to production requirements.
Preferably, the auxiliary agent is a leveling agent.
Further preferably, the leveling agent is SN-3056 from Shanghai deep bamboo chemical science and technology Limited.
The preparation method of the matte solder resist ink comprises the following steps: and uniformly mixing the acrylic acid copolymer resin, the acrylic acid high photosensitive resin, the photoinitiator, the filler, the color paste and the auxiliary agent to obtain the matte solder resist ink.
The invention has the advantages of
(1) The extinction property of the acrylic acid copolymerization resin is used for replacing the existing silicon dioxide extinction powder, so that the material has a good extinction effect, and the problem of inconsistent glossiness caused by incomplete dispersion of silicon dioxide in production is solved.
(2) The photoinitiator is added in the synthetic process of the acrylic high-photosensitive resin, so that the photosensitive effect of the resin is improved, and the photosensitive performance of the resin is ensured by processing through the process; different color pastes are mixed to generate color, the problem that the mutual superposition of light absorption and light blocking caused by the use of white carbon black in black ink is solved, and the obtained matte solder resist ink can be effectively cured.
(3) The preparation method is simple, the raw materials are low in cost, the requirement on production conditions is low, and large-scale production can be realized.
Drawings
FIG. 1 is a side etching image of the solder bridge of the matte solder resist ink of the present invention.
FIG. 2 is a solder mask bridge undercut image of a conventional matte solder mask ink (RS-2000AG BKM).
Detailed Description
The present invention will be described in detail below with reference to specific embodiments.
Example 1
The acrylic acid high photosensitive resin is prepared by the following method:
(1) uniformly mixing a photoinitiator GR-FMT 784, a photoinitiator UV-907, south Asia 704H epoxy resin and dipropylene glycol methyl ether according to the weight ratio of 1:5:12:30, and reacting at 100 ℃ for 4 hours to obtain a mixture;
(2) adding 3% acrylic acid under the action of protective gas, reacting at 95 deg.C, adding 0.5% p-hydroxyanisole when acid value is 22-24, and reacting at 110 deg.C; when the acid value is 2.0-2.4, adding 0.5% of hydroxyanisole, 5% of tetramethylbenzene and 5% of dipropylene glycol methyl ether, and reacting at 96 ℃; when the acid value is 50-55, the acrylic high photosensitive resin is obtained.
Example 2
A black matte solder resist ink comprises the following components in percentage by weight:
the preparation method of the matte solder resist ink comprises the following steps: the preparation method comprises the following steps of uniformly mixing Allnex- (ACA) Z320 resin, acrylic acid high photosensitive resin, a photoinitiator DETX, precipitated barium sulfate, talcum powder, black paste, red paste, yellow paste, blue paste and SN-3056 to obtain the matte solder resist ink.
Example 3
A red matte solder resist ink comprises the following components in percentage by weight:
the preparation method of the matte solder resist ink comprises the following steps: and uniformly mixing the Allnex- (ACA) Z320 resin, the acrylic acid high photosensitive resin, the photoinitiator DETX, the precipitated barium sulfate, the talcum powder, the red paste and the SN-3056 to obtain the matte solder resist ink.
Example 4
A green matte solder resist ink comprises the following components in percentage by weight:
the preparation method of the matte solder resist ink comprises the following steps: the preparation method comprises the steps of uniformly mixing Allnex- (ACA) Z320 resin, acrylic acid high photosensitive resin, a photoinitiator ITX, precipitated barium sulfate, talcum powder, yellow slurry, blue slurry and SN-3056 to obtain the matte solder resist ink.
Examples of the experiments
The performance of the matte solder resist inks of examples 2-4 of the present invention were compared with that of the conventional matte solder resist ink RS-2000AG BKM. Wherein, the glossiness standard is as follows: the fluctuation of the upper limit and the lower limit of the same batch is plus or minus 1, the test angle is 60 degrees, and the results are shown in Table 1.
TABLE 1
As can be seen from Table 1, the matte solder resist ink provided by the invention has a significantly smaller change range in glossiness, which shows that the matte effect of the matte solder resist ink provided by the invention is more stable than RS-2000AG BKM and the display effect is better. The matte solder resist ink has good bridge protection performance, and shows that the bottom layer ink is completely cured during ultraviolet curing, so that the phenomena of solder bridge isolation cavities, falling off and the like in the production process are effectively avoided.
As can be seen from FIGS. 1 and 2, the solder resist bridge undercut of the matte solder resist ink of the invention is 0.41mil to 0.88mil, which is lower than 2.3mil of RS-2000AG BKM, and the bridge protection performance is poorer when the undercut is larger, which also shows that the matte solder resist ink of the invention has good bridge protection performance.
Claims (8)
1. The matte solder resist ink is characterized by comprising the following components in percentage by weight:
2. matte solder resist ink according to claim 1, characterized in that said acrylic copolymeric resin is selected from Allnex- (ACA) Z320 resins of jacobol.
3. The matte solder resist ink according to claim 1, wherein the acrylic high photosensitive resin is prepared by the following method:
(1) uniformly mixing a photoinitiator GR-FMT 784, a photoinitiator UV-907, south Asia 704H epoxy resin and dipropylene glycol methyl ether according to the weight ratio of 1:5:12-14:30, and reacting at the temperature of 100 ℃ and 120 ℃ for 4-5 hours to obtain a mixture;
(2) under the action of protective gas, according to the percentage of the mass of the mixture, 2 to 4 percent of acrylic acid is added to react at 90 to 95 ℃, and when the acid value is 22 to 24 percent, 0.4 to 0.5 percent of p-hydroxyanisole is added to react at 110 ℃; when the acid value is 2.0-2.4, 0.4-0.6% of p-hydroxyanisole, 3-6% of tetramethylbenzene and 3-6% of dipropylene glycol methyl ether are added for reaction at the temperature of 93-96 ℃; when the acid value is 50-55, the acrylic high photosensitive resin is obtained.
4. Matte solder resist ink according to claim 1, characterized in that the photoinitiator is one or both of the photoinitiators DETX or ITX.
5. The matte solder resist ink according to claim 1, wherein the filler is one or both of precipitated barium sulfate or talc.
6. The matte solder resist ink according to claim 1, wherein the color paste is one or more of black color paste, red color paste, yellow color paste and blue color paste.
7. Matte solder resist ink according to claim 1, characterized in that the auxiliary agent is a leveling agent.
8. The method for preparing the matte solder resist ink according to any one of claims 1 to 7, which is characterized by comprising the following steps: and uniformly mixing the acrylic acid copolymer resin, the acrylic acid high photosensitive resin, the photoinitiator, the filler, the color paste and the auxiliary agent to obtain the matte solder resist ink.
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| CN201911353568.0A CN110804339A (en) | 2019-12-25 | 2019-12-25 | Matte solder resist ink and preparation method thereof |
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| CN201911353568.0A CN110804339A (en) | 2019-12-25 | 2019-12-25 | Matte solder resist ink and preparation method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112280400A (en) * | 2020-10-29 | 2021-01-29 | 广州市帝天印刷材料有限公司 | Anti-precipitation UV (ultraviolet) coating matt oil and preparation method and application thereof |
| CN112852215A (en) * | 2021-01-12 | 2021-05-28 | 惠州市艾比森光电有限公司 | Printing ink for PCB (printed circuit board) of LED display screen, preparation method of LED display module using printing ink and LED display screen |
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| JP2011006505A (en) * | 2009-06-23 | 2011-01-13 | Toyobo Co Ltd | Organic lusterless material |
| CN103265845A (en) * | 2013-06-17 | 2013-08-28 | 张宇 | UV (ultraviolet) curing light guiding ink and preparation method thereof |
| CN106398386A (en) * | 2016-08-31 | 2017-02-15 | 江门市阪桥电子材料有限公司 | Solder resist ink for LED (Light Emitting Diode) exposure machine and preparation method thereof |
| CN109897448A (en) * | 2019-03-06 | 2019-06-18 | 江苏艾森半导体材料股份有限公司 | The dumb light solder mask of low inorganic constituents |
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2019
- 2019-12-25 CN CN201911353568.0A patent/CN110804339A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011006505A (en) * | 2009-06-23 | 2011-01-13 | Toyobo Co Ltd | Organic lusterless material |
| CN103265845A (en) * | 2013-06-17 | 2013-08-28 | 张宇 | UV (ultraviolet) curing light guiding ink and preparation method thereof |
| CN106398386A (en) * | 2016-08-31 | 2017-02-15 | 江门市阪桥电子材料有限公司 | Solder resist ink for LED (Light Emitting Diode) exposure machine and preparation method thereof |
| CN109897448A (en) * | 2019-03-06 | 2019-06-18 | 江苏艾森半导体材料股份有限公司 | The dumb light solder mask of low inorganic constituents |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112280400A (en) * | 2020-10-29 | 2021-01-29 | 广州市帝天印刷材料有限公司 | Anti-precipitation UV (ultraviolet) coating matt oil and preparation method and application thereof |
| CN112852215A (en) * | 2021-01-12 | 2021-05-28 | 惠州市艾比森光电有限公司 | Printing ink for PCB (printed circuit board) of LED display screen, preparation method of LED display module using printing ink and LED display screen |
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Application publication date: 20200218 |