CN106398386A - Solder resist ink for LED (Light Emitting Diode) exposure machine and preparation method thereof - Google Patents
Solder resist ink for LED (Light Emitting Diode) exposure machine and preparation method thereof Download PDFInfo
- Publication number
- CN106398386A CN106398386A CN201610795120.4A CN201610795120A CN106398386A CN 106398386 A CN106398386 A CN 106398386A CN 201610795120 A CN201610795120 A CN 201610795120A CN 106398386 A CN106398386 A CN 106398386A
- Authority
- CN
- China
- Prior art keywords
- exposure machine
- parts
- solder mask
- led exposure
- pcb
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/101—Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/102—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/106—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
- C09D11/107—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds from unsaturated acids or derivatives thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
Abstract
The invention relates to the field of ink, in particular to solder resist ink for an LED (Light Emitting Diode) exposure machine and a preparation method thereof. The ink mainly comprises the components in parts by weight: 35-50 parts of photosensitive material, 4-10 parts of acrylic monomer 1, 1-8 parts of acrylic monomer 2, 4-8 parts of epoxy resin, 1-4 parts of pigment, 20-35 parts of a filler, 6-10 parts of a photoinitiator, 1-5 parts of an adjuvant and 5-15 parts of solvent. The preparation method comprises the following steps: uniformly dispersing the raw materials, then grinding the dispersed raw materials, and filtering to obtain an ink finished product. The ink finished product is especially suitable for the LED exposure machine. The solder resist ink for the LED exposure machine has the advantages of high temperature resistance, acid and alkali resistance, hot-oil resistance and high adhesive force.
Description
Technical field
The invention belongs to ink area is and in particular to a kind of LED exposure machine solder mask and preparation method thereof.
Background technology
Exposure machine is the requisite equipment of modern manufacturing printing board PCB, in printed circuit board manufacturing process,
One of crucial operation is exactly to transfer to negative map picture on coating foil base material.When solder mask figure shifts, traditional exposure
Ray machine available machine time and time of exposure are all long, and it is big to consume energy, and LED exposure machine can solve these problems, but
The light source unicity of LED exposure machine is larger, in order to meet the job requirement of LED exposure machine, needs to develop and a meet LED and expose
The ink that ray machine uses.
Content of the invention
For prior art exist problem, it is an object of the invention to provide a kind of LED exposure machine solder mask and its
Preparation method.
To achieve these goals, the technical solution used in the present invention is as follows：
A kind of LED exposure machine solder mask, described LED exposure machine solder mask is included by weight as the following group
Point：
35～50 parts of photosensitive resin
1 4～10 parts of acrylic monomerss
2 1～8 parts of acrylic monomerss
4～8 parts of epoxy resin
1～4 part of pigment
20～35 parts of filler
6～10 parts of light trigger
1～5 part of auxiliary agent
5～15 parts of solvent
Preferably, described photosensitive resin is prepared from by following steps：By 280～320 parts of solvents, 280～320 parts of rings
Oxygen tree fat, 100～120 parts of acrylic acid, 0.05～0.2 part of hydroquinone are added in reactor, are heated to 100～110 DEG C, so
Add catalyst afterwards, react 8～12 hours, be eventually adding 60～100 parts of anhydride, then react 3～5 hours, finally obtain acid number
For 50mgKOH/g to 65mgKOH/g, solid content is the photosensitive resin of 55-65%.
Preferably, catalyst is amines catalyst or phosphor catalyst.
Preferably, described acrylic monomerss 1 be hydroxyethyl methylacrylate, Bis(pentaerythritol) five/six acrylate and
One or more of trimethylolpropane trimethacrylate.
Preferably, the acrylate photoactive that described acrylic monomerss 2 are 7～9 for degree of functionality.
Preferably, described epoxy resin is in bisphenol A epoxide resin, novolac epoxy resin and o-cresol epoxy resin
One or more；Epoxy resin wherein in LED exposure machine solder mask can with for preparing the epoxy resin of photosensitive resin
With identical it is also possible to different.
Preferably, described light trigger is 2- methyl isophthalic acid-(4- methyl mercapto phenyl) -2- morpholine -1- acetone, 2- phenyl
Benzyl -2- dimethyl amine -1- (4- morpholine benzyl phenyl) butanone, 2- isopropyl thioxanthone, 2,4,6- trimethylbenzoyl-hexichol
Double (2,4,6- trimethylbenzoyl) phosphine oxide of base phosphine oxide, phenyl, the fluoro- 3- pyrroles's phenyl titanocenes of double 2,6- bis- and 2,4-
One or more of diethyl thioxanthone；
Preferably, described filler is one or more of barium sulfate, silicon dioxide and Pulvis Talci.
Preferably, described auxiliary agent is the levelling agent containing organosilicon radical and defoamer.
Preferably, described solvent is one or more of ether solvent or esters solvent, and conventional ether solvent has
Glycol monoethyl ether, ethylene glycol monoethyl ether, ethylene glycol monobutyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol
Monobutyl ether, propylene glycol monomethyl ether, dihydroxypropane single-ether, propylene glycol monobutyl ether, dipropylene glycol monomethyl ether, DPE,
Dipropylene glycol mono-n-butyl Ether etc., conventional esters solvent has ethylene glycol monoethylether acetate, ethylene glycol monomethyl ether acetate, diethyl two
Alcohol methyl ether acetate, diethylene glycol monoethyl ether acetic acid esters, butyl carbitol acetate, propylene glycol methyl ether acetate,
Propylene glycol monoethyl ether acetate, propylene glycol monobutyl ether acetass etc..Solvent wherein in LED exposure machine solder mask be used for
Prepare photosensitive resin solvent can identical it is also possible to different.
Preferably, described anhydride is THPA.
Present invention also offers a kind of preparation method of above-mentioned LED exposure machine solder mask, comprise the following steps：To feel
Photopolymer resin, acrylic monomerss 1, acrylic monomerss 2, epoxy resin, light trigger, auxiliary agent, solvent, pigment and filler are by weight
Weigh, with rate of dispersion 600～1000r/min on dispersion machine, disperse 50～70 minutes, after being uniformly dispersed, on three-roller
It is ground to fineness and is less than 20 μm, refilter removing mechanical admixture and coarse grain, finished product.
Present invention also offers a kind of method that above-mentioned LED exposure machine solder mask is printed on PCB, walk including following
Suddenly：
(1) print：Solder mask dibasic ester is diluted to viscosity 150～200dPa.s, then adopts silk-screen or rolling
Painting formula is printed on soft board PCB surface；
(2) just solidify：The PCB printing in step (1) is put into baking oven, it is dried 40 at 72～75 DEG C of temperature～
55min, obtains the PCB just solidifying；
(3) expose：Using LED exposure machine, the PCB in step (2) is exposed 5～10 seconds, so that film is reached at short notice
The light sensitivitys needing；
(4) develop：The Na being 0.9～1.2% with concentration2CO3PCB in step (3) is developed 45～80 seconds by aqueous solution,
Then rinsed with water, obtain the PCB developing；
(5) solidify afterwards：45～65min will be solidified through the PCB that step (4) are processed at 145～155 DEG C, form welding resistance
Film.
Beneficial effects of the present invention：
(1) to have high temperature resistant, acid and alkali-resistance, heat resistant oils, adhesive force height etc. excellent for the LED exposure machine solder mask of the present invention
Point；
(2) meet environmental requirement, abnormal smells from the patient is low.
Specific embodiment
In order to preferably explain the present invention, enumerate following table specific embodiment and be described further.Optimize from each embodiment
Preferred plan.
Embodiment 1～8
A kind of LED exposure machine solder mask, including the component of weight portion as shown in table 1.
The preparation method of photosensitive resin is：By weight, by 300 parts of solvents, 300 parts of epoxy resin, 110 parts of propylene
Acid, 0.1 part of hydroquinone are added in reactor, are heated to 105 DEG C, are subsequently adding catalyst Bian amine, react 10 hours, finally
Add 60 parts of THPAs, then react 4 hours, finally obtaining acid number is 50mgKOH/g, and solid content is 60% photosensitive resin.
A kind of preparation method of LED exposure machine solder mask, comprises the following steps：
(1) weigh photosensitive resin, acrylic monomerss 1, acrylic monomerss 2, epoxy resin, light trigger by weight, help
Agent, solvent, pigment and filler；
(2) by each component weighing in step (1) on dispersion machine with rate of dispersion 600r/min, disperse 50 minutes；
(3) fineness will be ground on the finely dispersed each group of step (2) is placed in three-roller and be less than 20 μm, be hindered
Solder paste ink crude product；
(4) the solder mask crude product obtaining in step (3) is refiltered removing mechanical admixture and coarse grain, make finished product
LED exposure machine solder mask.
The method that above-mentioned LED exposure machine solder mask is printed on PCB, comprises the following steps：
(1) print：Solder mask dibasic ester is diluted to viscosity 150～200dPa.s, then adopts silk-screen or rolling
Painting formula is printed on soft board PCB surface；
(2) just solidify：The PCB printing in step (1) is put into baking oven, at 72 DEG C of temperature, 40min is dried, obtain just
The PCB of solidification；
(3) expose：Using LED exposure machine, the soft board PCB in step (2) is exposed 5～10 seconds；
(4) develop：The Na being 0.9～1.2% with concentration2CO3Aqueous solution will be through the PCB development 45～80 of step (3)
Second, then rinsed with water, obtain the PCB developing；
(5) solidify afterwards：45～65min will be solidified through the PCB that step (4) develop at 150 DEG C, form soldering-resistance layer.
The method preparing LED exposure machine welding resistance soft board ink is same as Example 1.
By LED exposure machine welding resistance soft board ink be printed on PCB formed soldering-resistance layer method identical with embodiment 1.
Embodiment 9
A kind of LED exposure machine solder mask, including the component of weight portion as shown in table 1.
The preparation method of the wherein photosensitive resin of employing is：By weight, by 300 parts of solvents, 280 parts of epoxy resin,
110 parts of acrylic acid, 0.1 part of hydroquinone are added in reactor, are heated to 105 DEG C, are subsequently adding catalyst Bian amine, react 10
Hour, it is eventually adding 100 parts of THPAs, then reacts 4 hours, finally obtaining acid number is 55mgKOH/g, and solid content is 62%
Photosensitive resin.
The method preparing LED exposure machine solder mask is same as Example 1.
By LED exposure machine solder mask be printed on PCB formed soldering-resistance layer method identical with embodiment 1.
Embodiment 10
A kind of LED exposure machine solder mask, including the component of weight portion as shown in table 1.
The preparation method of the wherein photosensitive resin of employing is：By weight, by 300 parts of solvents, 320 parts of epoxy resin,
110 parts of acrylic acid, 0.1 part of hydroquinone are added in reactor, are heated to 105 DEG C, are subsequently adding catalyst Bian amine, react 10
Hour, it is eventually adding 60 parts of THPAs, then reacts 4 hours, finally obtaining acid number is 55mgKOH/g, and solid content is 62%
Photosensitive resin.
The method preparing LED exposure machine solder mask is same as Example 1.
By LED exposure machine solder mask be printed on PCB formed soldering-resistance layer method identical with embodiment 1.
Comparative example 1
A kind of LED exposure machine solder mask, including the component of weight portion as shown in table 1.
The preparation method of photosensitive resin is：By weight, by 300 parts of solvents, 300 parts of epoxy resin, 110 parts of propylene
Acid, 0.1 part of hydroquinone are added in reactor, are heated to 105 DEG C, are subsequently adding catalyst Bian amine, react 10 hours, finally
Add 60 parts of THPAs, then react 4 hours, finally obtaining acid number is 50mgKOH/g, and solid content is 60% photosensitive resin.
The method preparing LED exposure machine solder mask is same as Example 1.
By LED exposure machine solder mask be printed on PCB formed soldering-resistance layer method identical with embodiment 1.
Table 1 embodiment 1～10 and the formula of comparative example 1
The performance of table 2 various embodiments of the present invention product
Wherein, pencil hardness is pressed《Paint and varnish pencil method measures hardness of paint film》GB/T6739-2006 detects；Temperature tolerance
Detection be the model of coating solder mask is carried out 10 seconds by GB/T4677-2002 regulation, the test of three soldering resistances can bear
Temperature data.
As can be seen from Table 2, the performance with ultraviolet light polymerization liquid photosensitive welding resistance soft board ink of present invention preparation has
The advantages of good temperature tolerance, resistance to acids and bases, adhesive force are high, hardness is big.Compared with comparative example 1, embodiments of the invention 1～10
Hardness, tack, temperature tolerance, acid resistance, the performance such as alkali resistance all high than comparative example 1.
Soldering-resistance layer obtained by embodiment 1～10 and comparative example 1 is carried out following performance.
Tack：According to the test method of JISDO202, cured film cutting is that 1mm × 1mm is grid-like, is carried out with 3M gummed paper
Disbonded test.
Soldering resistance：According to the test method of JJSC6481, scaling powder is soaked to test piece, enters in 288 DEG C of solder furnace
Three wickings of row 10 seconds, observe model.
Electroless gold plating patience：
Carry out peel test with 3M adhesive tape after turmeric.
Acid resistance is tested：In 10vol%H2SO4Soak 20 minutes under room temperature.
Alkali resistance is tested：Soak 20 minutes under 10wt%NaOH room temperature.
Insulating properties is tested：Take the circuit board that IPC specifies, the cured film as described in the method for front, test electrical insulating property；Wherein,
Humidified condition is：85 DEG C of temperature, humidity 85%RH, 500 hours applied voltages 100V, condition determination is：Minute 60 seconds, applies
Making alive 500V.
Claims (9)
1. a kind of LED exposure machine solder mask is it is characterised in that include following raw material by weight：
2. LED exposure machine solder mask according to claim 1 is it is characterised in that described photosensitive resin is by as follows
Step is prepared from：By 280～320 parts of solvents, 280～320 parts of epoxy resin, 100～120 parts of acrylic acid, 0.05～0.2 part
Hydroquinone is added in reactor, is heated to 100～110 DEG C, is subsequently adding catalyst, reacts 8～12 hours, is eventually adding
60～100 parts of anhydride, then react 3～5 hours, finally obtaining acid number is 50mgKOH/g to 65mgKOH/g, solid content is 55～
65% photosensitive resin.
3. LED exposure machine solder mask according to claim 1 is it is characterised in that described acrylic monomerss 1 are first
One or more of base 2-(Acryloyloxy)ethanol, Bis(pentaerythritol) five/six acrylate, trimethylolpropane trimethacrylate.
4. LED exposure machine solder mask according to claim 1 is it is characterised in that described acrylic monomerss 2 are official
Energy degree is 7～9 acrylate.
5. LED exposure machine solder mask according to claim 1 is it is characterised in that described acrylic monomerss 1 and third
The weight of acrylic monomer 2 is than for 1:2～3:1.
6. LED exposure machine solder mask according to claim 1 is it is characterised in that described epoxy resin is bisphenol-A
One or more of epoxy resin, novolac epoxy resin and o-cresol epoxy resin.
7. LED exposure machine solder mask according to claim 1 is it is characterised in that described light trigger is 2- first
Base -1- (4- methyl mercapto phenyl) -2- morpholine -1- acetone, 2- phenyl benzyl -2- dimethyl amine -1- (4- morpholine benzyl phenyl) butanone, 2-
Isopropyl thioxanthone, 2,4,6- trimethylbenzoy-dipheny phosphine oxide, phenyl are double (2,4,6- trimethylbenzoyl)
One or more of phosphine oxide, the fluoro- 3- pyrroles's phenyl titanocenes of double 2,6- bis- and 2,4- diethyl thioxanthone.
8. a kind of preparation method of the LED exposure machine solder mask according to any one of claim 1～7, its feature
It is, by photosensitive resin, acrylic monomerss 1, acrylic monomerss 2, epoxy resin, light trigger, auxiliary agent, solvent, pigment and fill out
Material weighs by weight, with rate of dispersion 600～1000r/min on dispersion machine, disperses 50～70 minutes, after being uniformly dispersed,
Fineness is ground on three-roller and is less than 20 μm, refilter removing mechanical admixture and coarse grain, make finished product.
9. the method that the LED exposure machine solder mask according to any one of claim 1～7 is printed in PCB, its feature
It is, comprise the following steps：
(1) print：Solder mask dibasic ester is diluted to viscosity 150～200dPa.s, then adopts silk-screen or rollon
It is printed on soft board PCB surface；
(2) just solidify：The PCB printing in step (1) is put in baking oven, at 72～75 DEG C of temperature, 40～55min is dried,
Obtain the PCB just solidifying；
(3) expose：Using LED exposure machine, the PCB in step (2) is exposed 5～10 seconds；
(4) develop：The Na being 0.9～1.2% with concentration2CO3PCB in step (3) is developed 45～80 seconds by aqueous solution, then
Rinsed with water；
(5) solidify afterwards：45～65min will be solidified through the PCB that step (4) are processed at 145～155 DEG C, form soldering-resistance layer.
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107177231A (en) * | 2017-06-02 | 2017-09-19 | 湖南松井新材料有限公司 | Photosensitive-ink and its preparation method and application |
| CN107203095A (en) * | 2017-07-19 | 2017-09-26 | 江苏广信感光新材料股份有限公司 | A kind of solvable photosensitive composite of white alkali and preparation method and application |
| CN108359312A (en) * | 2018-03-12 | 2018-08-03 | 江门市阪桥电子材料有限公司 | A kind of high temperature resistant type UV-LED inkjet printings welding resistance ink and its preparation method and application |
| CN109799677A (en) * | 2018-12-28 | 2019-05-24 | 江门市阪桥电子材料有限公司 | A kind of photosensitive solder resist material and preparation method thereof without TGIC |
| CN110527407A (en) * | 2019-08-08 | 2019-12-03 | 江西阪桥感光科技有限公司 | A kind of low-halogen low sulphur photosensitive solder resist material and preparation method thereof |
| CN110540771A (en) * | 2019-09-06 | 2019-12-06 | 江门市阪桥电子材料有限公司 | Photosensitive solder resist material with short exposure time and preparation method thereof |
| CN110597015A (en) * | 2019-09-06 | 2019-12-20 | 江门市阪桥电子材料有限公司 | Development-resistant photosensitive solder resist material and preparation method thereof |
| CN110615865A (en) * | 2019-11-05 | 2019-12-27 | 江苏睿浦树脂科技有限公司 | Resin for high-temperature-resistant low-yellowing solder-resistant UV (ultraviolet) ink and preparation method thereof |
| CN110804339A (en) * | 2019-12-25 | 2020-02-18 | 江门市阪桥电子材料有限公司 | Matte solder resist ink and preparation method thereof |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107177231A (en) * | 2017-06-02 | 2017-09-19 | 湖南松井新材料有限公司 | Photosensitive-ink and its preparation method and application |
| CN107203095A (en) * | 2017-07-19 | 2017-09-26 | 江苏广信感光新材料股份有限公司 | A kind of solvable photosensitive composite of white alkali and preparation method and application |
| CN107203095B (en) * | 2017-07-19 | 2020-08-18 | 江苏广信感光新材料股份有限公司 | White alkali-soluble photosensitive composition and preparation method and application thereof |
| CN108359312A (en) * | 2018-03-12 | 2018-08-03 | 江门市阪桥电子材料有限公司 | A kind of high temperature resistant type UV-LED inkjet printings welding resistance ink and its preparation method and application |
| CN109799677A (en) * | 2018-12-28 | 2019-05-24 | 江门市阪桥电子材料有限公司 | A kind of photosensitive solder resist material and preparation method thereof without TGIC |
| CN110527407A (en) * | 2019-08-08 | 2019-12-03 | 江西阪桥感光科技有限公司 | A kind of low-halogen low sulphur photosensitive solder resist material and preparation method thereof |
| CN110540771A (en) * | 2019-09-06 | 2019-12-06 | 江门市阪桥电子材料有限公司 | Photosensitive solder resist material with short exposure time and preparation method thereof |
| CN110597015A (en) * | 2019-09-06 | 2019-12-20 | 江门市阪桥电子材料有限公司 | Development-resistant photosensitive solder resist material and preparation method thereof |
| CN110615865A (en) * | 2019-11-05 | 2019-12-27 | 江苏睿浦树脂科技有限公司 | Resin for high-temperature-resistant low-yellowing solder-resistant UV (ultraviolet) ink and preparation method thereof |
| CN110804339A (en) * | 2019-12-25 | 2020-02-18 | 江门市阪桥电子材料有限公司 | Matte solder resist ink and preparation method thereof |
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Denomination of invention: Soldering resistance ink for LED exposure machine and its preparation method Effective date of registration: 20221214 Granted publication date: 20190910 Pledgee: Guangdong Development Bank Co.,Ltd. Jiangmen branch Pledgor: JIANGMEN ABQ ELECTRONIC MATERIAL Co.,Ltd. Registration number: Y2022980027316 |