CN106398393A - Thermally curable white solder-resist material and preparation method thereof - Google Patents
Thermally curable white solder-resist material and preparation method thereof Download PDFInfo
- Publication number
- CN106398393A CN106398393A CN201610795161.3A CN201610795161A CN106398393A CN 106398393 A CN106398393 A CN 106398393A CN 201610795161 A CN201610795161 A CN 201610795161A CN 106398393 A CN106398393 A CN 106398393A
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- China
- Prior art keywords
- heat cure
- parts
- white solder
- resist material
- solder resist
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/106—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
- C09D11/107—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds from unsaturated acids or derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
- C09D11/037—Printing inks characterised by features other than the chemical nature of the binder characterised by the pigment
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/102—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/106—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
- C09D11/108—Hydrocarbon resins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
Abstract
The invention discloses a thermally curable white solder-resist material. The material is prepared from the following raw materials in parts by weight: 10-30 parts of thermosetting resin, 10-30 parts of epoxy resin, 30-55 parts of titanium dioxide, 1-8 parts of auxiliary agent, 10-25 parts of solvent, 0.1-1.5 parts of anti-sagging auxiliary agent, and 1-20 parts of filler. According to the technical scheme of the invention, the thermally curable white solder-resist material has the advantages of high-temperature yellowing resistance, reflectivity, short operation process and low price, thus meeting the requirements of low-end market in terms of performance.
Description
Technical field
The invention belongs to functional material field is and in particular to a kind of heat cure white solder resist material, a kind of heat cure is white
The preparation method of color solder mask and the method that this heat cure white solder mask is printed in PCB.
Background technology
Soldering-resistance layer is the permanent resist being coated in printing board surface, and it selectively protects printing board surface, prevents
It is short-circuited between wire and pad during welding component, bridge.Additionally, it also has moistureproof, mould proof, Defend salt fog effect.Cause
This, the quality of welding resistance film quality not only affects the outward appearance of printed board, and can affect the service life of printed board.Electric with printing
The development of road plate, curtain coating (or silk screen printing) liquid photosensitive solder resist material (Liquid Photoimageable Ink, contracting
It is written as LPI) become the predominant methods that printed board soldering-resistance layer is processed.Liquid photosensitive solder resist material, mainly with photocuring and thermosetting
The resin changed is main body, cooperation photosensitizer, thermal curing agents, filler, colorant and various auxiliary agent composition.It is applied by curtain or silk-screen
Method is coated on the substrate after etching, through the series of process process such as preliminary drying, exposure, development, solidify afterwards, is finally printing
Plate surface forms a kind of polymer coating of crosslinking curing.Its function is：(1) wire or conductor, such as pad are stoped from when welding
Deng between bridge joint or tin sticky effect；(2) anti-corrosion loss, the effect such as moistureproof and mould proof；(3) protection PCB appearance prevents scraping damage,
Play attractive in appearance, beautiful decoration function etc..It is related to the reliability of PCB work and long-life problem.Particularly high density, essence
Thin wire and the high performance PCB of small pore structure, will have high performance solder resist material could meet requirement.Therefore, its quality feelings
Condition is related to extrernal resistance problem, availability, reliability and the durability issues of PCB finished product, particularly solder resist material and plate face circle
Cohesive force, thermostability and chemical resistance etc. become important parameter.
It is necessary to reach that adhesive force is strong, hardness is high, solvent resistant, acid and alkali-resistance, heat resistant oils etc. require after soldering-resistance layer machines.
Because technical process is complex, therefore not only select solder resist material extremely important, and strict technology control in process of production
System is more to ensure that the key point of soldering-resistance layer quality.
Content of the invention
It is an object of the present invention to overcoming above-mentioned prior art defect, provide a kind of heat cure white solder resist material,
The resisting high-temperature yellowing of low-end market, reflectance can be met in aspect of performance, operating process is short, and price is low.
A kind of heat cure white solder resist material, is made up of the raw material of following parts by weight：Thermosetting resin 10-30 part, epoxy
Resin 10-30 part, titanium dioxide 30-55 part, auxiliary agent 1-8 part, solvent 10-25 part, resist sagging auxiliary agent 0.1-1.5 part, filler 1-20
Part.
Preferably, described thermosetting resin is prepared by following methods：In reaction vessel, by methyl styrene 90-110 part,
Methyl methacrylate 90-110 part, styrene 90-110 part, acrylic acid 90-110 part are dissolved in solvent 90-110 part, then plus
Enter azo-bis-isobutyl cyanide 3-5 part, after being heated to 85-90 DEG C of reaction 6-10 hour, add hydroquinone 0.2-0.6 part.
Preferably, the acid number of described thermosetting resin is 130-160mgKOH/g, and solid content is 75-80%.
Preferably, described epoxy resin be bisphenol A epoxide resin, novolac epoxy resin, any in cresol epoxy resin
A kind of.
Preferably, described solvent is ether solvent or esters solvent.
As ether solvent, propylene glycol monomethyl ether, propandiol butyl ether, ethylene glycol, butyl glycol ether etc. can be enumerated.
As esters solvent, ethyl acetate, butyl acetate, isopropyl acetate etc. can be enumerated.
Preferably, described resist sagging auxiliary agent is bentonite or aerosil.
Preferably, described filler is barium sulfate or Pulvis Talci.
Further object is that providing a kind of preparation method of heat cure white solder mask.
A kind of preparation method of heat cure white solder mask, by the described raw material of described heat cure white solder resist material
Obtain after mixing, dispersion, grinding and filtration by weight.
Preferably, said method is：By thermosetting resin, epoxy resin, titanium dioxide, auxiliary agent, solvent and filler by weight
Weigh, after dispersion machine is uniformly dispersed at a high speed, fineness is ground on three-roller and is less than 20 μm, refilter removing mechanical admixture
And coarse grain, make finished product ink.
The present invention also provides a kind of method that described heat cure white solder mask is printed in PCB, walks including following
Suddenly：
(1) described heat cure white solder mask dibasic ester is diluted to viscosity 50-250dPa.s, republishes
PCB surface；
(2) PCB printing is dried 6-30min.
Preferably, the printing process of step (1) is silk-screen or roller coating.
Preferably, step (2) is：The PCB printing is put into baking oven or continuous tunnel furnace, 6-30min is dried.
The present invention compared with prior art, has the advantages that：
The heat cure white solder resist material of the present invention can meet the resisting high-temperature yellowing of low-end market in aspect of performance, instead
Penetrate rate, operating process is short, and price is low.
Specific embodiment
To further illustrate the present invention below by specific embodiment, following examples are the specific embodiment party of the present invention
Formula, but embodiments of the present invention are not limited by following embodiments.
Embodiment 1
A kind of heat cure white solder resist material, is made up of the raw material of following parts by weight：10 parts of thermosetting resin, bisphenol-A ring
30 parts of oxygen tree fat, 55 parts of titanium dioxide, 4 parts of auxiliary agent, 25 parts of ether solvent, 0.1 part of bentonite, 20 parts of Pulvis Talci.
Described thermosetting resin is prepared by following methods：In reaction vessel, by 90 parts of methyl styrene, methyl methacrylate
100 parts of ester, 100 parts of styrene, 110 parts of acrylic acid dissolve in 110 parts of ether solvent, add 5 parts of azo-bis-isobutyl cyanide, plus
After heat to 85 DEG C is reacted 10 hours, add 0.2 part of hydroquinone.
Embodiment 2
A kind of heat cure white solder resist material, is made up of the raw material of following parts by weight：20 parts of thermosetting resin, cresol epoxy
20 parts of resin, 30 parts of titanium dioxide, 1 part of auxiliary agent, 10 parts of esters solvent, 0.8 part of bentonite, 10 parts of barium sulfate.
Described thermosetting resin is prepared by following methods：In reaction vessel, by 100 parts of methyl styrene, methacrylic acid
90 parts of methyl ester, 110 parts of styrene, 90 parts of acrylic acid dissolve in 100 parts of esters solvent, add 3 parts of azo-bis-isobutyl cyanide, plus
After heat to 88 DEG C is reacted 8 hours, add 0.4 part of hydroquinone.
Embodiment 3
A kind of heat cure white solder resist material, is made up of the raw material of following parts by weight：30 parts of thermosetting resin, epoxy novolac
10 parts of resin, 40 parts of titanium dioxide, 8 parts of auxiliary agent, 15 parts of esters solvent, 1.5 parts of aerosil, 1 part of barium sulfate.
Described thermosetting resin is prepared by following methods：In reaction vessel, by 110 parts of methyl styrene, methacrylic acid
110 parts of methyl ester, 90 parts of styrene, 100 parts of acrylic acid dissolve in 90 parts of esters solvent, add 4 parts of azo-bis-isobutyl cyanide, plus
After heat to 90 DEG C is reacted 6 hours, add 0.6 part of hydroquinone.
Embodiment 4
A kind of heat cure white solder resist material, is made up of the raw material of following parts by weight：20 parts of thermosetting resin, bisphenol-A ring
20 parts of oxygen tree fat, 40 parts of titanium dioxide, 4 parts of auxiliary agent, 15 parts of ether solvent, 1.5 parts of aerosil, 10 parts of Pulvis Talci.
Described thermosetting resin is prepared by following methods：In reaction vessel, by 100 parts of methyl styrene, methacrylic acid
100 parts of methyl ester, 100 parts of styrene, 100 parts of acrylic acid dissolve in 100 parts of ether solvent, add 4 parts of azo-bis-isobutyl cyanide,
After being heated to 90 DEG C of reactions 8 hours, add 0.4 part of hydroquinone.
Embodiment 5
A kind of preparation method of heat cure white solder mask, each raw material of embodiment 1 is weighed by weight, in dispersion
After being uniformly dispersed at a high speed on machine, 15 μm of fineness is ground on three-roller, refilters removing mechanical admixture and coarse grain, make finished product
Ink.
Embodiment 6
A kind of preparation method of heat cure white solder mask, each raw material of embodiment 3 is weighed by weight, in dispersion
After being uniformly dispersed at a high speed on machine, 10 μm of fineness is ground on three-roller, refilters removing mechanical admixture and coarse grain, make finished product
Ink.
Embodiment 7
A kind of preparation method of heat cure white solder mask, each raw material of embodiment 4 is weighed by weight, in dispersion
After being uniformly dispersed at a high speed on machine, 18 μm of fineness is ground on three-roller, refilters removing mechanical admixture and coarse grain, make finished product
Ink.
Embodiment 8
A kind of be thermally cured the method that white solder mask is printed in PCB, comprise the following steps：
(1) the heat cure white solder mask dibasic ester of embodiment 5 gained is diluted to viscosity 50dPa.s, then leads to
The mode crossing silk-screen is printed on PCB surface；
(2) PCB printing is put into oven drying 6min, form solder mask.
Embodiment 9
A kind of be thermally cured the method that white solder mask is printed in PCB, comprise the following steps：
(1) the heat cure white solder mask dibasic ester of embodiment 7 gained is diluted to viscosity 250dPa.s, then leads to
The mode crossing roller coating is printed on PCB surface；
(2) PCB printing is put into continuous tunnel furnace and 30min is dried, form solder mask.
After the heat cure white solder resist material of embodiment 4 becomes resistance film, the performance test results are as follows：
Tack：According to the test method of JISDO202, grid-like to cured film cutting 1 × 1, shelled with 3M gummed paper
Separating test, test result is 100/100 nothing and comes off.
Soldering resistance：According to the test method of JJSC6481, scaling powder is soaked to test piece, enters in 288 DEG C of solder furnace
Three wickings of row 10 seconds, observe model：No variable color, cured film no floats, and no peels off, and scolding tin penetrates into etc..
Acid resistance is tested：H2SO4* soak 20 minutes under 10vol% room temperature, no peel off.
Alkali resistance is tested：Soak 20 minutes under NaOH*10wt% room temperature, no peel off.
Insulating properties is tested：
Take the circuit board that IPC specifies, the cured film as described in the method for front, test electrical insulating property.
Humidified condition：85 DEG C of temperature, humidity 85%RH, 500 hours applied voltages 100V；
Condition determination：Minute 60 seconds, applied voltage 500V；
Test result：Insulating resistance value 5 × 10 after humidification8Below no copper migration.
It should be understood that these embodiments are only illustrative of the invention and is not intended to limit the scope of the invention.Reading this
Invention lecture content after, those skilled in the art can with any same or similar means the present invention is made various conversion or
Modification, these equivalent form of values equally fall under the scope of the present invention.
Claims (10)
1. a kind of heat cure white solder resist material is it is characterised in that be made up of the raw material of following parts by weight：Thermosetting resin 10-30
Part, epoxy resin 10-30 part, titanium dioxide 30-55 part, auxiliary agent 1-8 part, solvent 10-25 part, resist sagging auxiliary agent 0.1-1.5 part, fill out
Material 1-20 part.
2. heat cure white solder resist material according to claim 1 is it is characterised in that described thermosetting resin is by following methods
Preparation：In reaction vessel, by methyl styrene 90-110 part, methyl methacrylate 90-110 part, styrene 90-110 part,
Acrylic acid 90-110 part is dissolved in solvent 90-110 part, adds azo-bis-isobutyl cyanide 3-5 part, is heated to 85-90 DEG C of reaction
After 6-10 hour, add hydroquinone 0.2-0.6 part.
3. heat cure white solder resist material according to claim 2 is it is characterised in that the acid number of described thermosetting resin is
130-160mgKOH/g, solid content is 75-80%.
4. heat cure white solder resist material according to claim 1 is it is characterised in that described epoxy resin is bisphenol-A epoxy
Any one in resin, novolac epoxy resin, cresol epoxy resin.
5. heat cure according to claim 1 and 2 white solder resist material it is characterised in that described solvent be ether solvent or
Esters solvent.
6. heat cure white solder resist material according to claim 1 is it is characterised in that described resist sagging auxiliary agent is bentonite
Or aerosil.
7. heat cure white solder resist material according to claim 1 is it is characterised in that described filler is barium sulfate or Talcum
Powder.
8. a kind of preparation method of heat cure white solder mask is it is characterised in that by the heat cure white described in claim 1
The described raw material of solder resist material obtains after mixing by weight, disperse, grind and filtering.
9. a kind of method that heat cure white solder mask preparing claim 8 methods described is printed in PCB, it is special
Levy and be, comprise the following steps：
(1) described heat cure white solder mask dibasic ester is diluted to viscosity 50-250dPa.s, republishes in PCB table
Face；
(2) PCB printing is dried 6-30min.
10. method according to claim 9 is it is characterised in that the printing process of step (1) is silk-screen or roller coating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610795161.3A CN106398393A (en) | 2016-08-31 | 2016-08-31 | Thermally curable white solder-resist material and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610795161.3A CN106398393A (en) | 2016-08-31 | 2016-08-31 | Thermally curable white solder-resist material and preparation method thereof |
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| Publication Number | Publication Date |
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| CN106398393A true CN106398393A (en) | 2017-02-15 |
Family
ID=58002064
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| CN201610795161.3A Pending CN106398393A (en) | 2016-08-31 | 2016-08-31 | Thermally curable white solder-resist material and preparation method thereof |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108882546A (en) * | 2018-07-13 | 2018-11-23 | 常州澳弘电子有限公司 | A kind of processing technology of the wiring board with extra-strong corrosion resistant |
| CN109828435A (en) * | 2018-12-27 | 2019-05-31 | 江门市阪桥电子材料有限公司 | A kind of non-discolouring photosensitive white solder resist material and preparation method thereof of resistance to turmeric |
| CN113549370A (en) * | 2021-07-02 | 2021-10-26 | 江苏海田电子材料有限公司 | High-photosensitivity imaging solder resist ink and preparation method thereof |
| CN115141511A (en) * | 2022-08-10 | 2022-10-04 | 江西锦荣新材料有限公司 | High-temperature-resistant white ink and LED substrate made of same |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109828435A (en) * | 2018-12-27 | 2019-05-31 | 江门市阪桥电子材料有限公司 | A kind of non-discolouring photosensitive white solder resist material and preparation method thereof of resistance to turmeric |
| CN113549370A (en) * | 2021-07-02 | 2021-10-26 | 江苏海田电子材料有限公司 | High-photosensitivity imaging solder resist ink and preparation method thereof |
| CN115141511A (en) * | 2022-08-10 | 2022-10-04 | 江西锦荣新材料有限公司 | High-temperature-resistant white ink and LED substrate made of same |
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Application publication date: 20170215 |