CN106873309A - A kind of Positive photosensitive water solubility dry film solder mask and purposes - Google Patents
A kind of Positive photosensitive water solubility dry film solder mask and purposes Download PDFInfo
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- CN106873309A CN106873309A CN201710098304.XA CN201710098304A CN106873309A CN 106873309 A CN106873309 A CN 106873309A CN 201710098304 A CN201710098304 A CN 201710098304A CN 106873309 A CN106873309 A CN 106873309A
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/008—Azides
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- Spectroscopy & Molecular Physics (AREA)
- Materials For Photolithography (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The invention discloses a kind of Positive photosensitive water solubility dry film solder mask and purposes, the photosensitive water-soluble dry film solder mask is main by alkali soluble resins, light-sensitive compound, sensitivity enhancer, plasticizer, hot setting adhesive, thermosetting adhesive catalyst, low boiling point solvent, high boiling solvent and remaining additive composition.Dry film solder mask of the invention can replace photosensitive dry film; have both the effect of pattern transfer and welding resistance simultaneously; the dry film possesses good pliability simultaneously, by a pad pasting, three exposures; and heat cure; all flows of the image transfer, welding resistance and line terminal protection of wiring board are completed, and remains part dry film to be covered on line map, play resistant to elevated temperatures effect when protection circuit is not scratched or welds; letter saves Making programme, saves financial cost.
Description
Technical field
The present invention relates to a kind of Positive photosensitive water solubility dry film solder mask and purposes.
Background technology
Since dry film photoresist was developed from 1958, just it has been widely used in modern electronics industry technical field, it is special
It is not in printed circuit board field.According to final use, dry film can be divided into three kinds：Against corrosion or anti-plate dry film, welding resistance is done
Film and advanced photosensitive insulating materials.
At present, in the market has emerged the photosensitive dry film and dry film solder mask of a collection of excellent performance, patent
CN101111803A discloses a kind of positive dry film photoresist, its invention photosensitive resist agent have resolution ratio higher with
And adhesion, pattern transfer instrument can be work perfectly well as and be applied to pcb board making field, but the positive dry film lacks high temperature resistant
Property and good pliability, it is impossible to used as cover layer.Patent CN105388703A discloses a kind of sense of polyimide type
Light cover layer, the cover layer has certain resistance to elevated temperatures, but the photosensitive cover layer is entered by the conductor circuit with FPC
After row vacuum pressing-combining, it is exposed development and then obtains fine insulation cover layer, for protection circuit.But the process is not related to
And to the process for utilizing invented photosensitive dry film to prepare PCB circuits.Therefore, it will be seen that being prepared in printed circuit board
In, the against corrosion or anti-plate dry film as image transfer and the dry film solder mask as covering are independently present.
Thus had in high-density circuit board manufacturing process by pad pasting, exposure image transfer, development, plating or
Etching obtains corresponding high-density line, and then, coats solder mask or patch dry film solder mask, protection circuit during for welding
Etc. multinomial operation, whole process can be related to pad pasting twice, not only consume human cost, also consume material resources cost, while increase
The complexity of process, it is uneconomical.
The content of the invention
The purpose of the present invention is to solve the shortcomings of the prior art, there is provided a kind of Positive photosensitive water solubility dry film solder mask and its
Application method.Positive photosensitive water solubility dry film solder mask of the invention has good resolution ratio, adhesion, pliability and resistance to height
Warm nature, cannot be only used for the making of High density of PCB plate, and can be shielded as welding resistance cover layer simultaneously, prevent circuit from scraping
Short-circuit between conductors is led when wound or welding.
The purpose of the present invention is achieved through the following technical solutions：A kind of Positive photosensitive water solubility dry film solder mask, it by
40-80 weight portions alkali soluble resins, 20-40 weight portions light-sensitive compound, 2-8 weight portions sensitivity enhancer, 0.5-2 weight portions
Saturation ethyoxyl (methoxyl group) urethane acrylate class plasticizer, 2-12 weight portions hot setting adhesive, 0.4-1.2 weight portions
Thermosetting adhesive catalyst, 30-120 weight portions high boiling solvent, 150-400 weight portions low boiling point solvent composition.
Wherein, saturation ethyoxyl (methoxyl group) the urethane acrylate class plasticizer has following structure：
Wherein, R1It is H or-CH3, R2、R3It is separately-CH3Or straight chained alkyl, n1It is 1-9 integers, n2For 1-12 is whole
Number.
Further, the preferred novolac resin of the alkali soluble resins, the weight that the novolac resin is based on GPC is equal
Molecular weight is about 2000-30000.
Further, the preferred cresol novolac resin of the novolac resin, wherein ,/weight of p-Cresol content
Amount mixed proportion is 6:4-9.
Further, the preferred azido compound base sensitizer of substituted anthraquinone two of described light-sensitive compound.
Further, the sensitivity enhancer can be less than 1000 comprising about 2-7 phenolic hydroxyl weight average molecular weight
Polyhydroxy benzophenone class compound.
Further, the heat cure of following functional group is selected from the hot setting adhesive structure comprising one or more
Bonding group：Epoxide group, oxetane groups, cyclic ether groups, cyclic thioether group.
Further, the thermosetting adhesive catalyst is by imdazole derivatives, amines, hydrazine compound, phosphine compound
In one or more by it is any proportioning mixing composition.
Further, the high boiling solvent and low boiling point solvent, boiling point difference are not less than 30 DEG C, preferably not less than 50
℃.High boiling solvent boiling point is not less than 100 DEG C, selected from toluene, butyl acetate, cyclopentanone, ethylene glycol monomethyl ether, dimethylbenzene,
Cyclohexanone, ethylene glycol, carbiphene, ethylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether acetate, propane diols
Single monoethyl ether acetate；Low boiling point solvent boiling point is not higher than 100 DEG C, selected from acetone, methyl alcohol, ethyl acetate, methyl ethyl ketone,
Benzene, isopropanol.
Further, also including 08-1.6 weight portion additives；Institute's additive is by dyestuff, pigment, photic colour coupler, stabilization
Constituted by any proportioning mixing for one or more in agent, levelling agent, spices, antioxidant.
A kind of above-mentioned Positive photosensitive water solubility dry film solder mask is simultaneously as the image transfer tool and welding resistance cover layer of pcb board
Purposes, it is specific as follows：
(1) pad pasting：Positive photosensitive water solubility dry film solder mask is entirely affixed on pcb board by hot-rolling.
(2) expose for the first time：The first film is placed on pcb board after pad pasting, Positive photosensitive water solubility welding resistance is done
Film carries out first time exposure, realizes the first film picture transferance.
(3) develop, wash, dry：Pcb board after exposure in developing in the aqueous sodium carbonate of 1~2wt%, exposure
Partly because producing carboxyl and being dissolved in alkalescent developer solution, unexposed part retains, and circuit is obtained after washing drying
Figure.
(4) etch：Pcb board after step 3 development is by after the etching of chromic acid/sulfuric acid etching solution, washing drying obtains required
Line pattern；The Positive photosensitive water solubility dry film solder mask of unexposed portion is now covered on PCB line maps.
(5) expose for second：On the basis of line map obtained by step 4, using the second film, by the second film
Image exposure, it is to avoid secondary pad pasting, realizes the second film picture transferance.
(6) develop, wash, dry：Second expose after pcb board in developing in the aqueous sodium carbonate of 1~2wt%,
Develop soldering opening, and unexposed portion is remained on line map.
(7) third time exposes.Pcb board after developing through step 6 exposes under being placed directly within ultraviolet, makes unexposed positivity
Photosensitive water-soluble dry film solder mask produces carboxyl after being irradiated through ultraviolet.
(8) heat cure：Pcb board after step 7 exposure is in solidifying 2-10min, Positive photosensitive water under 160 DEG C of -170 DEG C of high temperature
The carboxyl crosslinking that hot setting adhesive and step 7 in dissolubility dry film solder mask are produced, generates the resistant to elevated temperatures structure of alkali resistance, finally
Welding resistance cover layer is formed, plays a part of protection circuit.
The beneficial effects of the invention are as follows：The present invention is in view of the shortcomings of the prior art, there is provided a kind of pliability is good and resistance to
The Positive photosensitive dry film against corrosion of 160-170 DEG C of high temperature, protection circuit is solved while as image transfer tool as cover layer
Problem, it is to avoid the process of secondary pad pasting.I.e. by a situation for pad pasting, secondary image transfer, development, etching, exposure, heat
Solidification obtains ideal line figure, and remains part dry film and be covered on line map, play protection circuit be not scratched or
Resistant to elevated temperatures effect during welding, letter saves Making programme, saves financial cost.
Specific embodiment
The invention provides a kind of Positive photosensitive water solubility dry film solder mask, it is by 40-80 weight portions alkali soluble resins, 20-
40 weight portion light-sensitive compounds, 2-8 weight portions sensitivity enhancer, 0.5-2 weight portion saturation ethyoxyl (methoxyl group) polyurethane
Esters of acrylic acid plasticizer, 2-12 weight portions hot setting adhesive, 0.4-1.2 weight portion thermosetting adhesives catalyst, 30-120
Weight portion high boiling solvent, 150-400 weight portions low boiling point solvent and other additives composition.
Wherein, saturation ethyoxyl (methoxyl group) urethane acrylate class plasticizer is with following structure：
Wherein, R1It is H or-CH3, R2、R3For-CH3Or straight chained alkyl, n1Represent 1-9 integers, n2Represent 1-12 whole
Number.The compound of the structure has greatly improved to lifting dry film pliability.
The alkali soluble resins includes but is not limited to novolac resin, preferably cresol novolac resin, in the middle of it/
The Mixing ratio by weight example of p-Cresol content is 4:6 to 6:4 scope, the difference of mixed proportion influences whether photosensitive speed and film
Residual rate.Novolac resin is preferably but not limited to the weight average molecular weight about 2000-30000 based on GPC.
Described light-sensitive compound is preferred but is not restricted to the azido compound base sensitizer of substituted anthraquinone two.
The sensitivity enhancer can be the polyhydroxy two less than 1000 comprising about 2-7 phenolic hydroxyl weight average molecular weight
Benzophenone class compound.
The thermosetting adhesive group of following functional group is selected from the hot setting adhesive structure comprising one or more：
Epoxide group, oxetane groups, cyclic ether groups, cyclic thioether group.Thermosetting adhesive catalyst can be following
One or more but do not limit：Imdazole derivatives, amines such as benzyl dimethylamine, hydrazine compound such as adipyl dihydrazide, phosphine
Compound such as triphenylphosphine etc..
The high boiling solvent and low boiling point solvent boiling point difference are not less than 30 DEG C, optimal to be not less than 50 DEG C.It is wherein high
Boiling point solvent boiling point is not less than 100 DEG C, selected from toluene, butyl acetate, cyclopentanone, ethylene glycol monomethyl ether, dimethylbenzene, hexamethylene
Ketone, ethylene glycol, carbiphene, ethylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether acetate, propane diols list second
Base ether acetic acid ester, mainly plays increase dry film flexible；Low boiling point solvent boiling point be less than 100 DEG C, selected from acetone, methyl alcohol,
Ethyl acetate, methyl ethyl ketone, benzene and isopropanol, mainly play a part of uniformly to mix photosensitive composition.
The additive is by the one kind in dyestuff, pigment, photic colour coupler, stabilizer, levelling agent, spices, antioxidant etc.
Or many compositions.
Positive photosensitive water solubility dry film solder mask of the present invention can be covered as the image transfer tool and welding resistance of pcb board simultaneously
Film, specific operation process is as follows：
(1) pad pasting：Positive photosensitive water solubility dry film solder mask is entirely affixed on pcb board by hot-rolling.
(2) expose for the first time：The first film is placed on pcb board after pad pasting, Positive photosensitive water solubility welding resistance is done
Film carries out first time exposure, realizes the first film picture transferance.
(3) develop, wash, dry：Pcb board after exposure in developing in the aqueous sodium carbonate of 1~2wt%, exposure
Partly because producing carboxyl and being dissolved in alkalescent developer solution, unexposed part retains, and circuit is obtained after washing drying
Figure.
(4) etch：Pcb board after step 3 development is by after the etching of chromic acid/sulfuric acid etching solution, washing drying obtains required
Line pattern；The Positive photosensitive water solubility dry film solder mask of unexposed portion is now covered on PCB line maps.
(5) expose for second：On the basis of line map obtained by step 4, using the second film, by the second film
Image exposure, it is to avoid secondary pad pasting, realizes the second film picture transferance.
(6) develop, wash, dry：Second expose after pcb board in developing in the aqueous sodium carbonate of 1~2wt%,
Develop soldering opening, and unexposed portion is remained on line map.
(7) third time exposes.Pcb board after developing through step 6 exposes under being placed directly within ultraviolet, makes unexposed positivity
Photosensitive water-soluble dry film solder mask produces carboxyl after being irradiated through ultraviolet.
(8) heat cure：Pcb board after step 7 exposure is in solidifying 2-10min, Positive photosensitive water under 160 DEG C of -170 DEG C of high temperature
The carboxyl crosslinking that hot setting adhesive and step 7 in dissolubility dry film solder mask are produced, generates the resistant to elevated temperatures structure of alkali resistance, finally
Welding resistance cover layer is formed, plays a part of protection circuit.
According to the present invention, the image transfer tool that Positive photosensitive dry film against corrosion both can regard pcb board can also be used as resistance
Weldering cover layer is realized by such mode：Diazido light-sensitive compound first in the photosensitive resist agent composition exists
Dissolving of the methyl novolac resin in aqueous slkali can be suppressed when unexposed, reduce its it is unexposed when solubility, and work as
When having ultraviolet light, the compound is converted to be dissolved in the carboxylic acid of alkaline solution, so photosensitive compared to non-exposed
Dry film against corrosion, shows solubility and increased 1000 to 1500 times or so.Photosensitive resist dry film first as image transfer tool,
Image 1 is transferred on dry film by film 1, after exposure, the part of exposure is removed by developer solution, unexposed portion image
Retain, then etch the line map 1 of film 1；Then, on the basis of the pattern for retaining, using film 2, it is exposed
Development, it would be desirable to which the solder joint of welding develops out；Finally by whole plate in being exposed under uviol lamp, dry film is allowed to produce carboxyl after high temperature
There is heat cross-linking in lower and thermal curing agents, the welding resistance cover layer of high temperature resistant and resistance to weak base is formed, while playing welding resistance and protective wire
The effect on road.
With reference to embodiment, the invention will be further described.The following is the example for illustrating embodiments of the present invention
Son, but the invention is not restricted to these embodiments.
Mixed proportion according to table 1 below mixes each component in proportion, is stirred well to and is completely dissolved, and entered vacuum and takes out
Filter, removes insoluble matter, and photosensitive polymer combination solution using bar coater is uniformly coated on as support
The pet film surface of 18 μ m-thicks, dries 2 minutes in 90 DEG C of air dry oven, then takes out,
Form thick about 35 μm photosensitive dry film.Then its surface laminating as protective layer 22 μ m-thicks polyethylene film.
Table 1
Note：YDCN-500-80P is commercial compound, the production of Kukdo Chemical Co., Ltd.s.
Embodiment 1-6 and the sample production method of comparative example 1, the evaluation method of sample and evaluation result are carried out below
Illustrate.
【Sample production method】
The copper foil surface that reverse side has polyimide film is processed by shot blasting, is washed, dried.Then rolled at 105 DEG C
Under roll temperature, while peel off the diaphragm on photosensitive polymer combination surface, while with hot roll lamination machine by Positive photosensitive tree
Oil/fat composition is attached to by Surface Machining and is preheating on 60 DEG C of copper-clad laminate.Stress control is in 0.3Mpa, pad pasting speed
It is 1.5 ms/min.Thus obtain deposition have be formed with the substrate of Copper Foil dry film photoresist layer image-forming component.
【Exposure】
It is exposed using ultrahigh pressure mercury lamp.
【Development】
By the sample after above-mentioned exposure, with 30 DEG C, mass concentration is that 1% aqueous sodium carbonate is developed, development pressure
Power is 1.5bar, and developing time is 1.5 times of most short developing time.
【Etching】
Using the method for chromic acid/sulfuric acid chemical etching, wherein sulfuric acid 80gL-1, chromic acid 240gL-1, sodium sulphate
40.5g·L-1.Pcb board after above-mentioned development is dried etches 30min in etching solution, takes out washing drying.
【Evaluation method】
【Film speed is evaluated】
Determined using on the basis of 21 lattice exposure guide rules of Stouffer Graphic Arts equipment companies.Regulation exposure energy
The photosensitive lattice number measured to substrate development is 7 lattice, and required exposure energy is lower, illustrates that the film speed of photosensitive dry film is faster,
Sensitivity is higher.
【Resolution ratio is evaluated】
Exposed using the photomask of Line/Space=10/10-100/100 μm of the wiring pattern for waiting the line widths such as line-spacing
After photodevelopment, observed with light microscope, it is good with side pattern, develop completely clearly minimum feature as evaluation.
【Heat resistance】
Resist patterns is placed on 150 DEG C of hot plate, and after carrying out the heating of 2 minutes, is entered with light microscope
Row observation, is evaluated as follows with the state of corrosion-resisting pattern：Change in the shape and surface of Resist patterns is relative to the figure
When the thickness of case is not more than 3%, it is evaluated as " good "；It is evaluated as " general " when the scope of change is 3% to 5%；Change is big
It is evaluated as when 10% " poor ".
【Pliability】
Under 4kg pressure, 120 DEG C of hot-rollings and 2.0m/min transmission speeds, by above-mentioned photosensitive dry film be fitted in 18um or
On the thick two-sided soft copper plate of person 12um copper, exposure shows that 7 lattice are defined by the photosensitive chi of 21 ranks.Observation is repeatedly rubbed using 2mm poles
Film surface fracture situation, by soft board doubling 3 times if substantially without breakage, breakage at observation folding line.And use following pattern table
Show breakage：◎ represents that pole rubs rear substantially without breakage, intact at 3 folding lines of doubling；△ represents that pole occurs after rubbing
It is damaged at breakage, and doubling folding line.The evaluation result of embodiment 1-4 and comparative example 1-3 is as shown in table 2 below：
Table 2
As shown in upper table 2, embodiment 1-6 and compare 1 evaluation result and show, the photosensitive resist dry film that the present invention is implemented
With preferable resolution ratio, heat resistance and pliability also serve as welding resistance cover layer simultaneously as image transfer tool.
Compared with Example 1 compared with the consumption of the middle cresol novolac resin of embodiment 2 has exceeded preferred scope, institute
Accelerated with film speed；The consumption of the middle cresol novolac resin of embodiment 3 is less than given preferred scope, so exposing
Slow, this can increase the cost of factory's actual production, reduce efficiency.
Compared with Example 1 compared with the sensitivity enhancer in embodiment 4 is less than given preferred scope, so its point
Resolution has declined, and other performances are held essentially constant.
Compared with Example 1 compared with, be not added with embodiment 5 ethyoxyl (methoxyl group) polyurethane saturation acrylate plasticising
Agent, this directly affects the pliability of photosensitive water-soluble dry film solder mask, cause the dry film test when deteriorated flexibility while using
When easily there are the operations such as film broken phenomena impair etching plating.
Compared with Example 1 compared with being not added with thermosetting adhesive catalyst in embodiment 6 so that the speed of heat cure declines,
Need to extend thermal curing time to 3 it is more than hour while heat resistance when can also influence the dry film as welding resistance cover layer.
Compared with Example 1 compared with, comparative example 1 is not added with hot setting adhesive, thermosetting adhesive catalyst and plasticizer,
The carboxyl for causing the dry film photoresist to be produced after re-expose cannot form cross-linked structure and show very poor with thermal curing agents
Heat resistance.Meanwhile, plasticizer is not added with formula to be caused
The present invention need to only paste a film, three exposures, and heat cure in printed circuit board or manufacture lead frame process
The process of image transfer can be completed, while playing a part of welding resistance covering, and circuit surface is covered in always as terminal guarantor
Shield.The present invention is intended to provide a kind of Positive photosensitive water solubility dry film solder mask, with preferable resolution ratio, pliability and high temperature resistant
Property and image transfer and welding resistance covering effect can be simultaneously completed in the case of a pad pasting, letter saved Making programme, saves
About financial cost.
Therefore, photosensitive water-soluble dry film solder mask of the present invention possesses preferable resolution ratio and elching resistant energy,
The instrument that can be shifted as image in practical application, while also possess preferable heat resistance and pliability, can be as welding resistance
Cover layer, serves and covers, and protection circuit is not scratched.Just because of it has appeal advantage, only can paste once when in use
Film come complete image transfer and covering process, letter save Making programme, save labour and financial cost, can extensive use
In printed circuit board, lead frame etc. is manufactured, the manufacture of semiconductor packing, the field such as Precision Machining of metal.
Claims (10)
1. a kind of Positive photosensitive water solubility dry film solder mask, it is characterised in that it is by 40-80 weight portions alkali soluble resins, 20-40 weights
Amount part light-sensitive compound, 2-8 weight portions sensitivity enhancer, 0.5-2 weight portion saturation ethyoxyl (methoxyl group) polyurethane propylene
Acid ester type plasticizer, 2-12 weight portions hot setting adhesive, 0.4-1.2 weight portion thermosetting adhesives catalyst, 30-120 weight
The compositions such as part high boiling solvent, 150-400 weight portion low boiling point solvents.
Wherein, saturation ethyoxyl (methoxyl group) the urethane acrylate class plasticizer has following structure：
Wherein, R1It is H or-CH3, R2、R3It is separately-CH3Or straight chained alkyl, n1It is 1-9 integers, n2It is 1-12 integers.
2. according to claim 1 Positive photosensitive water solubility dry film solder mask, it is characterised in that the preferred phenol of alkali soluble resins
Novolac resin, the weight average molecular weight that the novolac resin is based on GPC is about 2000-30000.
3. according to claim 2 Positive photosensitive water solubility dry film solder mask, it is characterised in that the novolac resin is preferred
Cresol novolac resin, wherein ,/Mixing ratio by weight of p-Cresol content example about 6:4-9.
4. according to claim 1 Positive photosensitive water solubility dry film solder mask, it is characterised in that described light-sensitive compound is preferred
The azido compound base sensitizer of substituted anthraquinone two.
5. Positive photosensitive water solubility dry film solder mask according to claim 1, it is characterised in that the sensitivity enhancer can be with
It is the polyhydroxy benzophenone class compound comprising about 2-7 phenolic hydroxyl weight average molecular weight less than 1000.
6. according to claim 1 Positive photosensitive water solubility dry film solder mask, it is characterised in that the hot setting adhesive structure
In comprising one or more be selected from following functional group thermosetting adhesive group：Epoxide group, oxetane groups, ring-type
Ether group, cyclic thioether group.
7. according to claim 1 Positive photosensitive water solubility dry film solder mask, it is characterised in that the thermosetting adhesive catalyst
It is made up of by the mixing of any proportioning one or more in imdazole derivatives, amines, hydrazine compound, phosphine compound.
8. Positive photosensitive water solubility dry film solder mask according to claim 1, it is characterised in that the high boiling solvent and low
Boiling point solvent, boiling point difference is not less than 30 DEG C, preferably not less than 50 DEG C.High boiling solvent boiling point is not less than 100 DEG C, selected from first
Benzene, butyl acetate, cyclopentanone, ethylene glycol monomethyl ether, dimethylbenzene, cyclohexanone, ethylene glycol, carbiphene, ethylene glycol
Single monoethyl ether acetate, diethylene glycol monoethyl ether acetate, propylene glycol monoethyl acetic acid esters；Low boiling point solvent boiling point is not higher than
100 DEG C, selected from acetone, methyl alcohol, ethyl acetate, methyl ethyl ketone, benzene, isopropanol.
9. according to claim 1 Positive photosensitive water solubility dry film solder mask, it is characterised in that also add including 08-1.6 weight portions
Plus agent；Institute's additive is pressed by one or more in dyestuff, pigment, photic colour coupler, stabilizer, levelling agent, spices, antioxidant
Any proportioning mixing composition.
10. Positive photosensitive water solubility dry film solder mask described in a kind of claim 1 is simultaneously as the image transfer tool of pcb board and resistance
Weld the purposes of cover layer, it is characterised in that specific as follows：
(1) pad pasting：Positive photosensitive water solubility dry film solder mask is entirely affixed on pcb board by hot-rolling.
(2) expose for the first time：The first film is placed on pcb board after pad pasting, Positive photosensitive water solubility dry film solder mask is entered
Row exposes for the first time, realizes the first film picture transferance.
(3) develop, wash, dry：Pcb board after exposure is in development, the part of exposure in the aqueous sodium carbonate of 1~2wt%
It is dissolved in alkalescent developer solution because carboxyl is produced, unexposed part retains, line map is obtained after washing drying.
(4) etch：Pcb board after step 3 development is by after the etching of chromic acid/sulfuric acid etching solution, washing drying obtains required circuit
Figure；The Positive photosensitive water solubility dry film solder mask of unexposed portion is now covered on PCB line maps.
(5) expose for second：On the basis of line map obtained by step 4, using the second film, by the second film picture
Exposure, it is to avoid secondary pad pasting, realizes the second film picture transferance.
(6) develop, wash, dry：Pcb board after exposing for second develops in developing in the aqueous sodium carbonate of 1~2wt%
Go out soldering opening, unexposed portion is remained on line map.
(7) third time exposes.Pcb board after developing through step 6 exposes under being placed directly within ultraviolet, makes unexposed Positive photosensitive
Water-soluble dry film solder mask produces carboxyl after being irradiated through ultraviolet.
(8) heat cure：Pcb board after step 7 exposure is water-soluble in 2-10min, Positive photosensitive is solidified under 160 DEG C of -170 DEG C of high temperature
The carboxyl crosslinking that hot setting adhesive and step 7 in dry film solder mask are produced, generates the resistant to elevated temperatures structure of alkali resistance, ultimately forms
Welding resistance cover layer, plays a part of protection circuit.
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108037634A (en) * | 2017-12-27 | 2018-05-15 | 浙江福斯特新材料研究院有限公司 | A kind of laser direct imaging Positive photosensitive water solubility dry film solder mask and purposes |
| CN116144233A (en) * | 2023-01-08 | 2023-05-23 | 珦盛新材料(珠海横琴)股份有限公司 | Photosensitive dry film coating, preparation method thereof and photosensitive dry film |
| CN116156772A (en) * | 2022-12-28 | 2023-05-23 | 南通威斯派尔半导体技术有限公司 | AMB copper-clad ceramic circuit board and preparation method thereof |
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| CN108037634A (en) * | 2017-12-27 | 2018-05-15 | 浙江福斯特新材料研究院有限公司 | A kind of laser direct imaging Positive photosensitive water solubility dry film solder mask and purposes |
| CN116156772A (en) * | 2022-12-28 | 2023-05-23 | 南通威斯派尔半导体技术有限公司 | AMB copper-clad ceramic circuit board and preparation method thereof |
| CN116156772B (en) * | 2022-12-28 | 2024-06-14 | 南通威斯派尔半导体技术有限公司 | AMB copper-clad ceramic circuit board and preparation method thereof |
| CN116144233A (en) * | 2023-01-08 | 2023-05-23 | 珦盛新材料(珠海横琴)股份有限公司 | Photosensitive dry film coating, preparation method thereof and photosensitive dry film |
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