CN101717599A - Liquid photosensitive solder resist ink and preparation method thereof - Google Patents
Liquid photosensitive solder resist ink and preparation method thereof Download PDFInfo
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- CN101717599A CN101717599A CN 200910312355 CN200910312355A CN101717599A CN 101717599 A CN101717599 A CN 101717599A CN 200910312355 CN200910312355 CN 200910312355 CN 200910312355 A CN200910312355 A CN 200910312355A CN 101717599 A CN101717599 A CN 101717599A
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Abstract
The invention discloses liquid photosensitive solder resist ink, which comprises the components of a photosensitive resin, an acrylic monomer, a thermosetting resin, a pigment, a filler, a photoinitiator, accessories and a solvent, and is characterized by comprising the components in the following parts by weight: the photosensitive resin 20-80, the acrylic monomer 1-30, the thermosetting resin 5-30, the pigment 0.5-3, the filter 10-40, the photoinitiator 1-10, the accessories 0.1-5 and the solvent 10-30. The liquid photosensitive solder resist ink prepared in the invention has excellent heat resistance and flexibility. The liquid photosensitive solder resist ink has the advantages of simple process, reasonable formula and excellent performance.
Description
Technical field
The present invention relates to a kind of wiring board printing ink, proposed a series of new liquid photosensitive welding resistance printing ink that are used on the PCB, welding resistance printing ink the invention still further relates to liquid photosensitive welding resistance printing ink and preparation method thereof at the solder mask that the PCB surface forms.
Background technology
Along with the continuous propelling and the development of hyundai electronics industry, and the printed board welding resistance printing ink of China starts from the end of the seventies in last century, mainly is thermofixation welding resistance printing ink that kind, begins to change over to from import homemade, the heat curing-type legend ink also occurs simultaneously.Be subjected to down afterwards technogenic influence and the UV type occurred, but be subjected to having influence on of precision and develop into liquid photosensitive welding resistance printing ink at last, existing photocuring has the printing ink of thermofixation again, its photosensitive resin mainly is to obtain with anhydride reaction after novolac epoxy resin and the unsaturated carboxylic acid reaction again, because of its resin contains acidic group, so can develop with buck, excellent heat resistance behind this ink solidification, but because the curing post shrinkage is bigger, the easy embrittlement of solder mask, condemnation factor is higher in production technique.In order to change the photosensitive resin fragility problem of using novolac epoxy resin, begin to adopt bisphenol A type epoxy resin or bisphenol f type epoxy resin or methylol bisphenol A type epoxy resin to come to substitute novolac epoxy resin or part alternate product fully again and synthesize photosensitive resin, this is obtaining very big improvement aspect curing post shrinkage really, but regrettably the thermotolerance of the dihydroxyphenyl propane of dihydroxyphenyl propane or Bisphenol F and modification thereof or bisphenol F epoxy resin always is difficult to satisfy user's requirement a little, especially the execution of the plumbous order of limit, the dihydroxyphenyl propane of dihydroxyphenyl propane or Bisphenol F and modification thereof or bisphenol F epoxy resin be under fire just more of welding resistance at the weldering pure tin or when changing tin, novolac epoxy resin also show at the weldering pure tin or when changing tin unable to do what one wishes, cause condemnation factor to raise.Its function: (one) welding the time rises and to stop lead or conductor, as bridge joint or tin sticky effect between the pad etc.; (2) anticorrosion loss, effects such as protection against the tide and mildew-resistant; (3) anti-damage, attractive in appearance, the beautiful decoration function etc. of scraping of protection PCB appearance.It is related to reliability and long-life problem of PCB work.Particularly the power PC B of high-density, fine wire and micro-holes structure will have high performance welding resistance printing ink just can meet the demands.Therefore, its quality situation not only is related to the extrernal resistance problem of PCB finished product, and cohesive force, thermotolerance and the anti-chemical etc. that directly have influence on operability, reliability and the durability issues of PCB product, particularly welding resistance printing ink and plate face circle become important.
Summary of the invention
The objective of the invention is provides a kind of both thermotolerance and endurances in order to guarantee printing ink for the deficiency that solves above-mentioned technology, again for guarantee solder mask solidify after embrittlement not, liquid photosensitive welding resistance printing ink of excellent flexibility and preparation method thereof is arranged again.
In order to achieve the above object, a kind of liquid photosensitive welding resistance printing ink that the present invention is designed, its component comprises: photosensitive resin, Acrylic Acid Monomer, heat reactive resin, pigment, filler, light trigger, auxiliary agent and solvent, it is characterized in that in weight part, the ratio of each component is: 20 parts～80 parts of photosensitive resins, Acrylic Acid Monomer is 1 part-30 parts, 5 parts～30 parts of heat reactive resins, 0.5 part～3 parts of pigment, 10 parts～40 parts of fillers, 1 part～10 parts of light triggers, 0.1 part～5 parts of auxiliary agents, 10 parts～30 parts of solvents; Described photosensitive resin is to adopt organic silicon modified phenolic Resins, epoxy and the reaction of undersaturated monocarboxylic acid, its reactant again with anhydride reaction, thereby on side chain, obtain the photosensitive resin of carboxyl and unsaturated group, but obtain the photosensitive resin of solid polymerization of light and buck reaction thus.This photosensitive resin preferred proportion is 30 parts～60 parts.
Described light trigger is to select different light triggers according to different pigment; comprise the 2-methylanthraquinone 2-ethyl-anthraquinone; 2-tertiary butyl anthraquinone; 1-chloroanthraquinone; 2; 4-dimethyl thioxanthone; 2; the 4-diethyl thioxanthone; 2; 4-di-isopropyl thioxanthone; the methyl phenyl ketone dimethyl ketal; benzyl dimethyl ketal; the 2-methylanthraquinone 2-ethyl-anthraquinone; 2-tertiary butyl anthraquinone; 1-chloroanthraquinone; the 2-isopropyl thioxanthone; 2; 4; 6-methyl benzoyl-diphenyl phosphine oxide; 2-methyl isophthalic acid-(4-methylthio group phenyl)-2-morpholinyl acetone; 2; the 4-diethyl thioxanthone; 1-hydroxy-cyclohexyl-phenyl ketone; 2-hydroxy-2-methyl-1-phenyl-acetone; 4-benzoyl-4 '-the methyldiphenyl thioether; benzoin dimethylether; (dimethylamino)-ethyl benzoate; two 2; 6-two fluoro-3-pyrroles phenyl two luxuriant titaniums; to (N; the N dimethylamine base) the different monooctyl ester of phenylformic acid; 4-phenyl benzophenone (PBZ); 2-benzoyl methyl benzoate; 2-phenyl benzyl-2-dimethyl amine-1-(4-morpholine benzyl phenyl) butanone; oxoethanoic acid salt mixture; two (2; 4; the 6-trimethylbenzoyl)-light triggers commonly used such as phenyl phosphine oxide, but be not limited to above-mentioned light trigger.Preferred proportion is 2 parts～10 parts.
Heat reactive resin comprises modifying epoxy resin by organosilicon (665 resins that Shanghai Resin Factory produces), bisphenol A epoxide resin, hydrogenated bisphenol A epoxy resin, bisphenol F epoxy resin, dihydroxyphenyl propane D Resins, epoxy, bisphenol-s epoxy resin, bisphenol-s epoxy resin, phenol formaldehyde (PF) Resins, epoxy, ortho-cresol formaldehyde Resins, epoxy, resorcinol type epoxy, tetraphenolic ethane tetraglycidel ether epoxy resin, triphenol methylmethane triglycidyl ether Resins, epoxy, Phloroglucinol monomethyl ether triglycidyl ether Resins, epoxy, the mixed with resin of one or more in the trimesic acid triglycidyl ether forms.
Described stopping composition comprises mineral fillers such as barium sulfate, talcum powder, silicon-dioxide, kaolin powder, calcium hydroxide, magnesium hydroxide, lime carbonate, ground barium sulfate, montmorillonite, can select one or more to mix.Preferred proportion is 10 parts～35 parts.
Solvent is ketone, ester class or one or more compositions such as ethers and petroleum-type, and ethers has ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monobutyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, propylene glycol monomethyl ether, dihydroxypropane single-ether, propylene glycol monobutyl ether, dipropylene glycol monomethyl ether, dipropylene glycol list ether, dipropylene glycol monobutyl ether etc.; The ester class has ester classes such as ethylene glycol monoethyl ether acetate, ethylene glycol monomethyl ether acetate, diethylene glycol monomethyl ether acetic ester, diethylene glycol monoethyl ether acetic ester, butyl carbitol acetate, propylene glycol methyl ether acetate, propylene glycol monoethyl ether acetate, propylene glycol monobutyl ether acetic ester, dipropylene glycol monomethyl ether acetic ester, dipropylene glycol monoethyl ether acetate, dipropylene glycol monobutyl ether acetic ester, and petroleum-type has petroleum naphtha etc.Solvent based can be used in independent or two or more mixing.
Acrylic Acid Monomer is: the lauric acid acrylate, simple function group reaction monomers such as iso-bornyl acrylate, 1, the 6-hexanediyl ester, propylene glycol diacrylate, bifunctional reaction monomers such as neopentylglycol diacrylate, three (2-hydroxyethyl) isocyanuric acid triacrylate, Viscoat 295, pentaerythritol triacrylate, the glycerol propoxylate triacrylate, the trimethylol propane trimethyl triacrylate, the ethoxyquin tetramethylol methane tetraacrylate, two trimethylolpropane tetra-acrylate, the third oxidation tetramethylol methane tetraacrylate, polyfunctional group reaction monomers such as dipentaerythritol acrylate, be made up of one or more materials wherein, content can account for 1 part～30 parts in 100 parts printing ink are total.
Also include the defoamer below 10 parts, described defoamer is organosilicon or organic fluorine and acrylic acid or the like defoamer.
Pigment is that actual needs is selected, and available organic or inorganic pigment does not have restriction especially.
Other auxiliary agent: add according to actual needs as flow agent etc.
The preparation method of a kind of above-mentioned liquid photosensitive welding resistance printing ink provided by the invention, it is characterized in that the proportioning weighing of photosensitive resin, Acrylic Acid Monomer, heat reactive resin, light trigger, auxiliary agent, solvent, pigment and filler by the component weight part, after high speed dispersion on the dispersion machine is even, on three-roller, be ground to fineness less than 15 μ m, remove mechanical impurity and coarse grain by filter plant again, make finished product printing ink, then packing.
Described photosensitive resin is to adopt organic silicon modified phenolic Resins, epoxy and unsaturated monocarboxylic acid reaction, its reactant again with anhydride reaction, thereby on side chain, obtain the photosensitive resin of carboxyl and unsaturated group; Its production method is with 220 parts of organic silicon modified phenolic Resins, epoxy and unsaturated monocarboxylic acid 219.4-230 part in the reaction vessel, be heated to 70 ℃ of dissolvings, wait to dissolve to finish and add 88 parts of methacrylic acids, N, 1.5 parts of N-dimethylbenzyl ammonia, 100 parts of toluene, 1 part of the vitriol oil, be heated to 90 ℃～110 ℃ reactions about 10 hours, reflux dewatering, redistillation adds acid anhydrides 80.5-125 part after removing toluene, be heated to 100 ℃～120 ℃, reacted 8 hours, obtaining acid number is 50mgKOH/g to 70mgKOH/g, and solid content is 64% photosensitive resin.At this, described unsaturated monocarboxylic acid can be Acrylic Acid Monomer, methacrylic acid, Ba Dousuan etc., and preferred Acrylic Acid Monomer, unsaturated monocarboxylic acid can use separately or mix more than 2 kinds and 2 kinds and use.Described acid anhydrides can be Tetra Hydro Phthalic Anhydride, methyl tetrahydrochysene phthalate anhydride, hexahydrobenzene dicarboxylic anhydride, maleic anhydride, trimellitic acid 1,2-anhydride, phthalate anhydride, succinyl oxide etc., preferred as requested Tetra Hydro Phthalic Anhydride.
By the resulting a kind of liquid photosensitive welding resistance printing ink of preparation method of the present invention, during use, use silk screen printing on the PCB version in liquid photosensitive welding resistance printing ink of the present invention, drying is 10 minutes～15 minutes under 80 ℃～90 ℃, taking out a little, cooling promptly forms dry film, cover mask, 1%～2% Na is used in contact exposure under ultraviolet lamp then
2CO
3The aqueous solution developed 30 seconds～60 seconds, water flushing back without the part of illumination by flush away, the part of photocuring is then stayed on the substrate and is formed figure, formed the good soldering-resistance layer of anti-weldering property in 30 minutes～40 minutes in 140 ℃ of following after fixing then, therefore, technology of the present invention is simple, prescription is reasonable, excellent property.
With a kind of modified epoxy provided by the invention is the photosensitive resin starting raw material, to be the resulting liquid photosensitive welding resistance of main raw material(s) printing ink thus, it is first photocuring, back thermofixation, its existing good thermotolerance, excellent flexibility is arranged again, solved with the novolac epoxy resin be starting raw material photosensitive resin fragility and be the thermotolerance and the insufficient problem of endurance of initial starting material synthetic photosensitive resin with bisphenol A type epoxy resin or bisphenol f type epoxy resin or methylol bisphenol A type epoxy resin.
Embodiment
For better understanding the present invention, the present invention will be further described below in conjunction with embodiment.
At first specify the preparation of the homemade photosensitive resin of the present invention with example:
Embodiment 1:
The photosensitive resin that present embodiment is described, its preparation method is: adding organic silicon modified phenolic Resins, epoxy 220g and diethylene glycol ether acetate alone 230g are heated to 70 ℃ of dissolvings in reaction vessel, wait to dissolve to finish and add methacrylic acid 88g, N, N-dimethylbenzyl ammonia 1.5g, toluene 100g, vitriol oil 1g is heated to 90～110 ℃ of reactions about 10 hours, reflux dewatering, adding Tetra Hydro Phthalic Anhydride 125g was heated to 100～120 ℃ after toluene was removed in redistillation, obtaining acid number is 70mgKOH/g, and solid content is 64% photosensitive resin (1).
Embodiment 2:
The photosensitive resin that present embodiment is described, its preparation method is: adding organic silicon modified phenolic Resins, epoxy 220g and diethylene glycol ether acetate alone 231.5g are heated to 70 ℃ of dissolvings in reaction vessel, wait to dissolve to finish and add methacrylic acid 88g, N, N-dimethylbenzyl ammonia 1.5g, toluene 100g, vitriol oil 1g is heated to 90～110 ℃ of reactions about 10 hours, reflux dewatering, adding Tetra Hydro Phthalic Anhydride 102g was heated to 100～120 ℃ after toluene was removed in redistillation, obtaining acid number is 60mgKOH/g, and solid content is 64% photosensitive resin (2).
Embodiment 3:
The photosensitive resin that present embodiment is described, its preparation method is: adding organic silicon modified phenolic Resins, epoxy 220g and diethylene glycol ether acetate alone 219.4g are heated to 70 ℃ of dissolvings in reaction vessel, wait to dissolve to finish and add methacrylic acid 88g, N, N-dimethylbenzyl ammonia 1.5g, toluene 100g, vitriol oil 1g is heated to 90～110 ℃ of reactions about 10 hours, reflux dewatering, adding Tetra Hydro Phthalic Anhydride 80.5g was heated to 100～120 ℃ after toluene was removed in redistillation, obtaining acid number is 50mgKOH/g, and solid content is 64% photosensitive resin (3).
Embodiment 4:
The liquid photosensitive welding resistance printing ink that present embodiment is described, take off and state component by weight ratio, get 55 parts of the homemade photosensitive resins of embodiment 1 method, 40 parts of triphenol methylmethane triglycidyl ether Resins, epoxy, 20 parts in barium sulfate, dark green 1 part of phthalein, 0.5 part of Dyhard RU 100,10 parts of dipentaerythritol six acrylate, 0.5 part of auxiliary agent, 6.5 parts of ethylene glycol monoethyl ether acetates, above-mentioned substance is uniformly dispersed under high speed dispersor, on three-roller, be ground to fineness≤15 μ m then, adjust viscosity to 65ps with 6 parts of ethylene glycol monoethyl ether acetates at last, promptly get novel photosensitive resin liquid photosensitive welding resistance printing ink of the present invention.The performance test results is as follows:
Preliminary drying (75 ℃): 40 minutes
Exposure: 350mJ/cm
2
Levels of exposure: 9 grades
Develop: 1%Na
2CO
3The aqueous solution develops, 60s
After fixing (140 ℃): 35 minutes
Sticking power: one-level
Hardness: 6H
Welding resistance performance: 288 ℃, 10s, four times
Embodiment 5:
The liquid photosensitive welding resistance printing ink that present embodiment is described, take off and state component by weight ratio, get 65 parts of embodiment 2 homemade photosensitive resins, 10 parts of triphenol methylmethane triglycidyl ether Resins, epoxy, 35 parts in barium sulfate, dark green 1.5 parts of phthalein, 0.8 part of Dyhard RU 100,15 parts of dipentaerythritol six acrylate, 0.5 part of auxiliary agent, 10 parts of ethylene glycol monoethyl ether acetates, above-mentioned substance is uniformly dispersed under high speed dispersor, on three-roller, be ground to fineness≤15 μ m then, adjust viscosity to 60ps with 8 parts of ethylene glycol monoethyl ether acetates at last, promptly get novel photosensitive resin liquid photosensitive welding resistance printing ink of the present invention.The performance test results is as follows:
Preliminary drying (75 ℃): 40 minutes
Exposure: 350mJ/cm
2
Levels of exposure: 8 grades
Develop: 1%Na
2CO
3The aqueous solution develops, 50s
After fixing (140 ℃): 35 minutes
Sticking power: one-level
Hardness: 5H
Welding resistance performance: 288 ℃, 10s, four times
Embodiment 6:
The liquid photosensitive welding resistance printing ink that present embodiment is described, take off and state component by weight ratio, get 58 parts of embodiment 3 homemade photosensitive resins, 15 parts of triphenol methylmethane triglycidyl ether Resins, epoxy, 38 parts in barium sulfate, dark green 1 part of phthalein, 0.5 part of Dyhard RU 100,15 parts of dipentaerythritol six acrylate, 0.5 part of auxiliary agent, 10 parts of ethylene glycol monoethyl ether acetates, above-mentioned substance is uniformly dispersed under high speed dispersor, on three-roller, be ground to fineness≤15 μ m then, adjust viscosity to 60ps with 10 parts of ethylene glycol monoethyl ether acetates at last, promptly get novel photosensitive resin liquid photosensitive welding resistance printing ink of the present invention.The performance test results is as follows:
Preliminary drying (75 ℃): 40 minutes
Exposure: 350mJ/cm
2
Levels of exposure: 8 grades
Develop: 1%Na
2CO
3The aqueous solution develops, 55s
After fixing (140 ℃): 35 minutes
Sticking power: one-level
Hardness: 5H
Welding resistance performance: 288 ℃, 10s, four times
Claims (10)
1. liquid photosensitive welding resistance printing ink, its component comprises: photosensitive resin, Acrylic Acid Monomer, heat reactive resin, pigment, filler, light trigger, auxiliary agent and solvent, it is characterized in that the ratio of each component is in weight part: 20 parts～80 parts of photosensitive resins, Acrylic Acid Monomer are 1 part 30 parts, 5 parts～30 parts of heat reactive resins, 0.5 part～3 parts of pigment, 10 parts～40 parts of fillers, 1 part～10 parts of light triggers, 0.1 part～5 parts of auxiliary agents, 10 parts～30 parts of solvents; Described photosensitive resin is to adopt organic silicon modified phenolic Resins, epoxy and the reaction of undersaturated monocarboxylic acid, its reactant again with anhydride reaction, thereby on side chain, obtain the photosensitive resin of carboxyl and unsaturated group.
2. liquid photosensitive welding resistance printing ink according to claim 1 is characterised in that described heat reactive resin comprises modifying epoxy resin by organosilicon, bisphenol A epoxide resin, hydrogenated bisphenol A epoxy resin, bisphenol F epoxy resin, dihydroxyphenyl propane D Resins, epoxy, bisphenol-s epoxy resin, bisphenol-s epoxy resin, phenol formaldehyde (PF) Resins, epoxy, ortho-cresol formaldehyde Resins, epoxy, resorcinol type epoxy, tetraphenolic ethane tetraglycidel ether epoxy resin, triphenol methylmethane triglycidyl ether Resins, epoxy, Phloroglucinol monomethyl ether triglycidyl ether Resins, epoxy, the mixed with resin of one or more in the trimesic acid triglycidyl ether forms.
3. liquid photosensitive welding resistance printing ink according to claim 1, it is characterized in that described filler is mineral filler, one or more that comprise barium sulfate, talcum powder, silicon-dioxide, kaolin powder, calcium hydroxide, magnesium hydroxide, lime carbonate, ground barium sulfate, montmorillonite mix.
4. liquid photosensitive welding resistance printing ink according to claim 1, it is characterized in that described Acrylic Acid Monomer is the lauric acid acrylate, simple function group reaction monomers such as iso-bornyl acrylate, 1, the 6-hexanediyl ester, propylene glycol diacrylate, bifunctional reaction monomers such as neopentylglycol diacrylate, three (2-hydroxyethyl) isocyanuric acid triacrylate, Viscoat 295, pentaerythritol triacrylate, the glycerol propoxylate triacrylate, the trimethylol propane trimethyl triacrylate, the ethoxyquin tetramethylol methane tetraacrylate, two trimethylolpropane tetra-acrylate, the third oxidation tetramethylol methane tetraacrylate, polyfunctional group reaction monomers such as dipentaerythritol acrylate, be made up of one or more materials wherein, content can account for 1 part～30 parts in 100 parts printing ink are total.
5. liquid photosensitive welding resistance printing ink as claimed in claim 1 is characterized in that also including the defoamer below 10 parts, and described defoamer is organosilicon or organic fluorine and acrylic acid or the like defoamer composition.
6. preparation method who requires described liquid photosensitive welding resistance printing ink according to aforesaid right, it is characterized in that the proportioning weighing of photosensitive resin, heat reactive resin, light trigger, auxiliary agent, solvent, pigment and filler by the component weight part, after high speed dispersion on the dispersion machine is even, on three-roller, be ground to fineness less than 15 μ m, remove mechanical impurity and coarse grain by filter plant again, make finished product printing ink, then packing.
7. the preparation method of a kind of liquid photosensitive welding resistance printing ink according to claim 6, it is characterized in that described photosensitive resin is to adopt organic silicon modified phenolic Resins, epoxy and unsaturated monocarboxylic acid reaction, its reactant again with anhydride reaction, thereby on side chain, obtain the photosensitive resin of carboxyl and unsaturated group; Its production method is in the reaction vessel organic silicon modified phenolic Resins, epoxy to be dissolved in 219.4-230 part solvent for 220 parts, be heated to 70 ℃ of dissolvings, wait to dissolve to finish and add 88 parts of unsaturated monocarboxylic acid methacrylic acids, N, 1.5 parts of N-dimethylbenzyl ammonia, 100 parts of toluene, 1 part of the vitriol oil, be heated to 90 ℃～110 ℃ reactions about 10 hours, reflux dewatering, redistillation adds acid anhydrides 80.5-125 part after removing toluene, be heated to 100 ℃～120 ℃, reacted 8 hours, obtaining acid number is 50mgKOH/g to 70mgKOH/g, and solid content is 64% photosensitive resin.
8. the preparation method of a kind of liquid photosensitive welding resistance printing ink according to claim 7, it is characterized in that described unsaturated monocarboxylic acid can be Acrylic Acid Monomer, methacrylic acid, Ba Dousuan etc., preferred Acrylic Acid Monomer, unsaturated monocarboxylic acid can use separately or mix more than 2 kinds and 2 kinds and use.Described acid anhydrides is a Tetra Hydro Phthalic Anhydride, the production method of described photosensitive resin is to add 220 parts of organic silicon modified phenolic Resins, epoxy and the solvent diethylene glycol ether acetate alone is heated to 70 ℃ of dissolvings for 230 parts in reaction vessel, wait to dissolve to finish and add 88 parts of methacrylic acids, N, 1.5 parts of N-dimethylbenzyl ammonia, 100 parts of toluene, the vitriol oil is heated to 90 ℃～110 ℃ reactions about 10 hours for 1 part, reflux dewatering, redistillation adds 125 parts of Tetra Hydro Phthalic Anhydrides after removing toluene, is heated to 100 ℃～120 ℃, reacts 8 hours, obtaining acid number is 70mgKOH/g, and solid content is 64% photosensitive resin.
9. the preparation method of a kind of liquid photosensitive welding resistance printing ink according to claim 7, it is characterized in that described unsaturated monocarboxylic acid can be Acrylic Acid Monomer, methacrylic acid, Ba Dousuan etc., preferred Acrylic Acid Monomer, unsaturated monocarboxylic acid can use separately or mix more than 2 kinds and 2 kinds and use.Described acid anhydrides is a Tetra Hydro Phthalic Anhydride, the production method of described photosensitive resin is to add 220 parts of organic silicon modified phenolic Resins, epoxy and diethylene glycol ether acetate alone is heated to 70 ℃ of dissolvings for 231.5 parts in reaction vessel, wait to dissolve to finish and add 88 parts of methacrylic acids, N, 1.5 parts of N-dimethylbenzyl ammonia, 100 parts of toluene, the vitriol oil is heated to 90 ℃～110 ℃ reactions about 10 hours for 1 part, reflux dewatering, redistillation adds 102 parts of Tetra Hydro Phthalic Anhydrides after removing toluene, is heated to 100 ℃～120 ℃, reacts 8 hours, obtaining acid number is 60mgKOH/g, and solid content is 64% photosensitive resin.
10. the preparation method of a kind of liquid photosensitive welding resistance printing ink according to claim 7, it is characterized in that described unsaturated monocarboxylic acid is Acrylic Acid Monomer, methacrylic acid, Ba Dousuan etc., preferred Acrylic Acid Monomer, unsaturated monocarboxylic acid can use separately or mix more than 2 kinds and 2 kinds and use.Described acid anhydrides is a Tetra Hydro Phthalic Anhydride, the production method of described photosensitive resin is to add 220 parts of organic silicon modified phenolic Resins, epoxy and diethylene glycol ether acetate alone is heated to 70 ℃ of dissolvings for 219.4 parts in reaction vessel, wait to dissolve to finish and add 88 parts of methacrylic acids, N, 1.5 parts of N-dimethylbenzyl ammonia, 100 parts of toluene, the vitriol oil is heated to 90 ℃～110 ℃ reactions about 10 hours for 1 part, reflux dewatering, redistillation adds 80.5 parts of Tetra Hydro Phthalic Anhydrides after removing toluene, is heated to 100 ℃～120 ℃, reacts 8 hours, obtaining acid number is 50mgKOH/g, and solid content is 64% photosensitive resin.
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Owner name: NEWEAST PRINTING INK CO., LTD. Free format text: FORMER NAME: NEW ORIENT INK CO., LTD., TONGXIANG, ZHEJIANG |
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Address after: 314500 No. 2320 Chong Fu Road, Zhejiang, Tongxiang Patentee after: Neweast Printing Ink Co., Ltd. Address before: 314500 No. 2320 Chong Fu Road, Zhejiang, Tongxiang Patentee before: Zhejiang Tongxiang Xindongfang Ink Co., Ltd. |