CN100482752C - Light sensitive anti-solder ink composition, application and circuit board containing the same - Google Patents
Light sensitive anti-solder ink composition, application and circuit board containing the same Download PDFInfo
- Publication number
- CN100482752C CN100482752C CN 200810004765 CN200810004765A CN100482752C CN 100482752 C CN100482752 C CN 100482752C CN 200810004765 CN200810004765 CN 200810004765 CN 200810004765 A CN200810004765 A CN 200810004765A CN 100482752 C CN100482752 C CN 100482752C
- Authority
- CN
- China
- Prior art keywords
- ink composite
- composite according
- photoresist
- anhydride
- methyl
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Abstract
The invention relates to a photographic solder mask composite and the application thereof. The solder mask composite is suitable for anti-seal printing of ordinary circuit boards and heavily coated circuit boards; the composite mainly contains: (A) photographic resin, (B) ultraviolet light photopolymerization evocating agent, (C) visible light photopolymerization evocating agent, (D) fluidifying agent and (E) thermocuring components.
Description
Technical field
The present invention relates to a kind of new ink composite, in particular to a kind of new light sensitive anti-solder ink composition.The invention still further relates to the application of this ink composite and contain the wiring board of this ink composite.
Background technology
In printed-wiring board (PWB), electronic component is mounted thereto to be pre-formed on the welding zone of printed wiring base material of conducting channel pattern, covers and all circuit regions outside the welding zone all are used as the welding resistance etchant resist of permanent protective membrane.Like this, when being welded to electronic component on the printed-wiring board (PWB), just can avoid scolder to be bonded on the zone that need not to be covered, and the conductor that prevents the forming circuit pattern is because of directly being exposed in the air oxidation or corroding because of moisture by scolder.
In recent years, along with the development of electronic product, require on the printed-wiring board (PWB) used thickness under the increasing situation greater than the Copper Foil of 50 μ m.Along with the increase of copper thickness, the thickness of corresponding welding resistance etchant resist also needs to increase, in the hope of playing a good protection.
At present, using more in the welding resistance etchant resist is light sensitive anti-solder ink.The using method of light sensitive anti-solder ink is generally, at first will be coated with rete under lower temperature prebake conditions so that solvent evaporates, utilize UV-irradiation to make its Procuring again, then by developing with rare alkaline aqueous solution, form corrosion-resisting pattern, carry out elevated temperature heat afterwards to filming and solidify, finally form the welding resistance etchant resist.But when coating is thicker, the coating bottom completely solidified because ultraviolet ray can not penetrate coating fully, base coat can be softened when therefore elevated temperature heat was solidified, and then cause that coating sends out wrinkle, thereby influence the performances such as outward appearance, thermotolerance, hardness and electrical insulating property of the final welding resistance etchant resist that forms greatly, also directly have influence on the integral product performance of final wiring board.
Solidify the corrugated problem for solving the light sensitive anti-solder ink thick coating, can adopt the method that progressively heats up in the hot setting stage.Shrink big problem though this method has solved when thick coating solidifies, efficient is lower, and the performances such as thermotolerance, hardness and electrical insulating property of the welding resistance etchant resist that forms all descend to some extent.
Therefore, need provide a kind of common printed wiring board that both had been suitable for, also be suitable for the printed-wiring board (PWB) light sensitive anti-solder ink that use, new of welding resistance etchant resist coating thicker (〉=50 μ m) simultaneously.
Summary of the invention
The object of the present invention is to provide a kind of light sensitive anti-solder ink composition, said composition contains (A) photoresist, (B) UV-light Photoepolymerizationinitiater initiater, (C) visible light Photoepolymerizationinitiater initiater, (D) thinner and (E) Thermocurable composition.
The present invention also provides the application of described ink composite aspect the wiring board printing.
In addition, the invention provides the wiring board that uses described ink composite.
Embodiment
Light sensitive anti-solder ink composition provided by the invention contains (A) photoresist, (B) UV-light Photoepolymerizationinitiater initiater, (C) visible light Photoepolymerizationinitiater initiater, (D) thinner and (E) Thermocurable composition.
Term implication used herein is as follows:
" (methyl) vinylformic acid " mean vinylformic acid, methacrylic acid with and composition thereof general name, other represents that similarly implication is similar.
" saturated or undersaturated multi-anhydride " means saturated multi-anhydride and two kinds of situations of undersaturated multi-anhydride, and other represents that similarly implication is similar.
In a kind of embodiment preferred, described photoresist (A) is for containing the photoresist of carboxyl and at least two ethylene type unsaturated link(age)s simultaneously in the molecule, and it can be synthetic by following any method:
(1) multi-functional epoxy compounds (a) and the unsaturated monocarboxylic (b) that has two above epoxy group(ing) in the molecule carries out esterification, and the carboxylate that obtains reacts with saturated or undersaturated multi-anhydride (c) again;
(2) (methyl) vinylformic acid and other comonomer (d) reaction with ethylene type unsaturated link(age) form multipolymer, partly react with (methyl) glycidyl acrylate again;
(3) (methyl) glycidyl acrylate and other multipolymer and unsaturated monocarboxylic (b) with comonomer (d) of ethylene type unsaturated link(age) react, and the resultant that obtains reacts with saturated or undersaturated multi-anhydride (c) again;
(4) contain two hydroxyls at least in the multi-functional epoxy compounds (a), unsaturated monocarboxylic (b) that has two above epoxy group(ing) in the molecule and the molecule and have can with compound (e) reaction of other group of epoxy reaction, generate intermediate (I), described intermediate reacts with saturated or undersaturated multi-anhydride (c) again;
(5) unsaturated multi-anhydride forms multipolymer with the aromatic hydrocarbons reaction with vinyl, again with hydroxyalkyl (methyl) acrylate reactions; Or
(6) the described intermediate of method (4) (I) again with saturated or undersaturated multi-anhydride (c) and monoisocyanates (f) reaction that contains unsaturated group.
The example of spendable epoxy compounds (a) comprising in aforesaid method (1) and (4): the solvable fusible Resins, epoxy of bisphenol A type epoxy resin, bisphenol-A epoxy resin, bisphenol f type epoxy resin, bisphenol-s epoxy resin, solvable fusible novolac epoxy, the solvable Resins, epoxy of cresols, dihydroxyphenyl propane, united phenol-type epoxy resin, di-toluene phenol-type epoxy resin, triphenol methylmethane type Resins, epoxy and N-Racemic glycidol type Resins, epoxy.Above-mentioned epoxy compounds can use separately also and can two or more mixing use.Wherein, the solvable fusible Resins, epoxy of the solvable fusible novolac epoxy in these epoxy compoundss, the solvable Resins, epoxy of cresols, dihydroxyphenyl propane is because of it can obtain having preferred use of welding resistance etchant resist of performances such as good scolding tin thermotolerance and reagent resistance.
The example of spendable unsaturated monocarboxylic (b) comprising in aforesaid method (1), (3) and (4): vinylformic acid, acrylic acid dipolymer, methacrylic acid, β-styrene acrylic, β-furfuryl group vinylformic acid, butenoic acid, alpha-cyano styracin, styracin, and contain the reactant of (methyl) esters of acrylic acid of a hydroxyl or the reactant half ester class of saturated or unsaturated dibasic acid and unsaturated single Racemic glycidol compound in saturated or unsaturated dicarboxylic acid anhydride and the molecule.Consider light solidified, preferred use acrylic or methacrylic acid in these unsaturated monocarboxylics.
The example of spendable saturated or undersaturated multi-anhydride (c) comprising in aforesaid method (1), (3), (4) and (6): dibasic acid anhydrides such as maleic anhydride, succinyl oxide, itaconic anhydride, Tetra hydro Phthalic anhydride, Tetra Hydro Phthalic Anhydride, hexahydrophthalic anhydride, methylhexahydrophthalic anhydride, Jia Qiao-Nei-Tetra Hydro Phthalic Anhydride, methyl first bridge-Nei-Tetra Hydro Phthalic Anhydride, methyl tetrahydrophthalic anhydride; Aromatic series polybasic acid anhydrides such as trimellitic acid 1,2-anhydride, pyromellitic dianhydride, benzophenone tetracarboxylic acid dicarboxylic anhydride; And 5-(2,5-dioxy tetrahydrofuran base)-3-methyl-3-tetrahydrobenzene-1,2-dicarboxylic anhydride, and similar polybasic acid anhydride derivative.These saturated or undersaturated multi-anhydrides can use in independent or two or more mixing.Consider the characteristic of cured coating film, preferably use Tetra Hydro Phthalic Anhydride, hexahydrophthalic anhydride and succinyl oxide.
Preferred described multi-anhydride (c) consumption is that to make the solids component acid value of resultant of reaction be the consumption of 50-150mgKOH/g.When the not enough 50mgKOH/g of the acid value of photoresist, alkali dissolution is not good enough, the development difficulty in dilute alkaline aqueous solution described later of filming of the composition that obtains, and when acid value surpasses 150mgKOH/g, performances such as anti-dominance, alkali resistance and the electrical characteristic of photocuring film reduce, sometimes even can not be used as the welding resistance etchant resist.
Spendable other the example of the comonomer with ethylene type unsaturated link(age) (d) comprising in aforesaid method (2) and (3): vinylbenzene, chloro-styrene, alpha-methyl styrene; Acrylate or methacrylic ester by methyl, ethyl, propyl group, sec.-propyl, normal-butyl, isobutyl-, the tertiary butyl, amino, 2-ethylhexyl, octyl group, caprinoyl, nonyl, decyl, dodecyl, hexadecyl, octadecyl, cyclohexyl, isobornyl, methoxy ethyl, butoxyethyl group, 2-hydroxyethyl, 2-hydroxypropyl and the replacement of 3-chloro-2-hydroxypropyl; The mono acrylic ester of the mono acrylic ester of polyoxyethylene glycol or monomethacrylates or polypropylene glycol or monomethacrylates; Vinyl acetate, vinyl butyrate or vinyl benzoate; Acrylamide, Methacrylamide, N-hydroxymethyl acrylamide, N-methoxymethyl acrylamide, N-ethoxyl methyl acrylamide, N-butoxymethyl acrylamide, vinyl cyanide or maleic anhydride etc.These comonomers (d) can use separately also and can two or more mixing use.
The example of spendable compound (e) comprising in aforesaid method (4) and (6): dimethylol propionic acid, dihydroxymethyl acetate, dimethylolpropionic acid, dihydroxymethyl valeric acid, dihydroxymethyl caproic acid etc. contain polyhydric monocarboxylic acid; And dialkanol amine such as diethanolamine, diisopropanolamine (DIPA).These compounds (e) can use separately also and can two or more mixing use.
In the described method (4), epoxy group(ing) 1 molar equivalent of relative epoxy compounds (a), the total amount of unsaturated monocarboxylic (b) and compound (e) is preferably about 0.8-1.3 molar equivalent, is preferably about 0.9-1.1 molar equivalent especially.Wherein the molar equivalent of compound (e) accounts for (b) and (e) 5-50% of total amount, especially preferably accounts for 10-30%.For the reaction of described intermediate (I) and multi-anhydride (c), with respect to the hydroxyl in the intermediate (I), the reaction of the multi-anhydride (c) of the hydroxyl of preferred 1 molar equivalent and 0.1-0.9 molar equivalent.
The example of spendable unsaturated monoisocyanates (f) comprising in the aforesaid method (4): have (methyl) acrylic acid or the like of a hydroxyl in methylacryoyloxyethyl isocyanic ester or organic diisocyanate and the molecule, react the product that obtains with about equimolar ratio.These unsaturated monoisocyanates (f) can use separately also and can two or more mixing use.
Photoresist in the ink composite of the present invention (A) is not limited to above-described material, so long as have carboxyl and at least two ethylene type unsaturated link(age)s and solids component acid value in the molecule is the photosensitive resin of 50-150mgKOH/g, can use in the present invention.Above-mentioned substance also can mix use.
Above-mentioned photoresist (A) is owing to have a plurality of free carboxyls on the side chain of polymkeric substance, can carry out the video picture of dilute alkaline aqueous solution so contain the composition of this photoresist, by said composition is exposed, is developed, and heat filming, can obtain the good welding resistance etchant resists of various characteristics such as thermotolerance, solvent resistance, acid resistance, adaptation, electrical characteristic, hardness.
The present invention is to described UV-light Photoepolymerizationinitiater initiater (B) and without particular limitation, for example: benzoin, benzoin and benzoin alkyl oxides such as benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether; Methyl phenyl ketone, 2,2-dimethoxy-2-phenyl methyl phenyl ketone, 2,2-diethoxy-2-phenyl methyl phenyl ketone, 1, acetophenones such as 1-dichloroacetophenone; 2-methyl isophthalic acid-[4-(methyl sulfo-) phenyl]-2-morpholinyl acetone-1,2-benzyl-2-dimethyl amido-1-(4-morpholinyl phenyl)-butane-1-ketone, N, amido acetophenones such as N-dimethyl amine benzoylformaldoxime; Anthraquinone classes such as 2-methylanthraquinone, 2-ethyl-anthraquinone, 2-tertiary butyl anthraquinone, 1-chloroanthraquinone; 2,4-dimethyl thioxanthone, 2,4-diethyl thioxanthone, 2-clopenthixal ketone, 2, thioxanthene ketones such as 4-di-isopropyl thioxanthone; Ketal classes such as methyl phenyl ketone dimethyl ketal, benzyl dimethyl ketal; Organo-peroxides such as benzoyl peroxide, dicumyl peroxide base; 2,4, mercaptan compounds such as 5-three aromatic base imidazoles diploids, hibon, 2-sulfenyl benzoglyoxaline, 2-sulfenyl benzoxazole, 2-sulfurio benzo thiazole; 2,4, Organohalogen compounds such as 6-three-s-triazine, tribromo-ethanol, trisbromomethyl phenyl ketone; Benzophenone, 4,4 '-Benzophenones or thioxanthene ketones such as two diethyl amido benzophenone; 2,4,6-trimethylbenzoyl diphenylphosphine oxide compound etc. all can be used for the present invention.More than cited UV-light light trigger can use separately also and can two or more mixing use.Also can add N, N-dimethyl amido M-nitro benzoic acid ethyl ester, N, the light-initiated auxiliary agents of tertiary amines such as N-dimethyl amido M-nitro benzoic acid isopentyl ester, amyl group-4-dimethyl amido benzoic ether, triethylamine, trolamine.
Ink composite of the present invention, in described photoresist (A) 100 weight parts, described uv photopolymerization initiator (B) preferably uses the 1-30 weight part, more preferably uses the 1-20 weight part.
Visible light Photoepolymerizationinitiater initiater (C) for example can use among the present invention, two [2,6-two fluoro-3-(1H-pyrryl-1) phenyl] titanium luxuriant (Irgacure784), two (pentafluorophenyl group) titanium are luxuriant, in the initiator system one or more of anthraquinone/tertiary amine light initiation system, camphorquinone (claiming camphane spinach ketone CQ again)/tertiary amine light initiation system, 3-ketone group tonka bean camphor/tertiary amine light initiation system or vat dyes/help.
Two [2,6-two fluoro-3-(1H-pyrryl-1) phenyl] titanium is luxuriant
Two (pentafluorophenyl group) titanium is luxuriant
Camphorquinone
Ink composite of the present invention, in described photoresist (A) 100 weight parts, described visible light polymerization starter (C) preferably uses the 0.001-2 weight part, more preferably uses the 0.005-1.5 weight part.
Thinner among the present invention (D) can be organic solvent, for example: ethers such as ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monobutyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, propylene glycol monomethyl ether, dihydroxypropane single-ether, propylene glycol monobutyl ether, dipropylene glycol monomethyl ether, dipropylene glycol list ether, dipropylene glycol monobutyl ether; Ester classes such as vinyl acetic monomer, N-BUTYL ACETATE, ethylene glycol monoethyl ether acetate, ethylene glycol monomethyl ether acetate, diethylene glycol monomethyl ether acetic ester, diethylene glycol ether acetate alone, diethylene glycol monobutyl ether acetic ester, propylene glycol monomethyl ether acetate, dihydroxypropane single-ether acetic ester, propylene glycol monobutyl ether acetic ester, dipropylene glycol monomethyl ether acetate, dipropylene glycol list ethyl ether acetate ester, dipropylene glycol monobutyl ether acetate ester; Ketones solvent in addition commonly used is as butanone, pimelinketone, isophorone; Aromatic solvent is as toluene, dimethylbenzene, durene; And the oil series solvent, as petroleum naphtha, oxidation petroleum naphtha, solvent naphtha etc.These solvents can use in independent or two or more mixing.
According to ink composite of the present invention, in described photoresist (A) 100 weight parts, the preferred consumption of above-mentioned organic solvent is the 30-300 weight part, and preferred consumption is the 30-100 weight part.
Thinner among the present invention (D) also can be photopolymerization monomer, for example: (methyl) Hydroxyethyl acrylate, (methyl) esters of acrylic acid that contains hydroxyl of tetramethylolmethane three (methyl) acrylate, Dipentaerythritol five (methyl) acrylate etc.; (methyl) methyl acrylate, (methyl) ethyl propenoate, (methyl) butyl acrylate, simple function (methyl) esters of acrylic acids such as (methyl) lauryl acrylate; 1, two (methyl) acrylate, two of 6-hexylene glycol contract/two (methyl) acrylate, two of tripropylene glycol contract/difunctionality (methyl) esters of acrylic acids such as two (methyl) acrylate of triethylene Glycol, two (methyl) acrylate of ethoxyquin dihydroxyphenyl propane, two (methyl) acrylate of neopentyl glycol diethoxy/propoxy-; Multifunctional (methyl) esters of acrylic acids such as trimethylolpropane tris (methyl) acrylate, tetramethylolmethane four (methyl) acrylate, Dipentaerythritol six (methyl) acrylate; And ethoxylation polyfunctional acrylic ester and propoxylation polyfunctional acrylic ester etc.Above-mentioned substance can use in independent or two or more mixing.
According to ink composite of the present invention, in described photoresist (A) 100 weight parts, the preferred consumption of above-mentioned photopolymerization monomer is below 50 weight parts, and preferred consumption is below 30 weight parts.
Among the present invention, described thinner (D) can use photopolymerization monomer or organic solvent separately, also can use this two classes material simultaneously.
Thermocurable composition of the present invention (E) is included in the epoxy compounds that has plural epoxy group(ing) in the molecule.What such compound was commonly used has: the solvable fusible Resins, epoxy of bisphenol A type epoxy resin, bisphenol-A epoxy resin, bisphenol f type epoxy resin, bisphenol-s epoxy resin, solvable fusible novolac epoxy, the solvable Resins, epoxy of cresols, dihydroxyphenyl propane, united phenol-type epoxy resin, di-toluene phenol-type epoxy resin, triphenol methylmethane type Resins, epoxy, N-Racemic glycidol type Resins, epoxy, three-glycidyl amine compound, 2 dimer diglycidylether, aliphatic epoxy resin, xylene Resins, epoxy.These Resins, epoxy can use separately also and can two or more mixing use.
According to ink composite of the present invention, in described photoresist (A) 100 weight parts, the preferred consumption of described Thermocurable composition (E) is the 5-100 weight part, and preferred consumption is the 5-50 weight part.
Described photoresist (A) is formed two liquid status for the host of principal constituent and Thermocurable composition (E) for the solidifying agent of principal constituent, in use both is mixed.
Also can comprise in the auxiliary agents such as epoxy resin cure promotor, mineral filler, tinting pigment, defoamer one or more in the ink composite of the present invention.
Wherein said epoxy resin cure promotor can be: imidazoles, glyoxal ethyline, 2-ethyl imidazol(e), 2-ethyl-4-methylimidazole, 2-phenylimidazole, 4-phenylimidazole, 1-cyano ethyl-2-phenylimidazole, 1-(2-cyano ethyl)-imdazole derivatives such as 2-ethyl-4-methylimidazole; Dicyano diamide, phenyl dimethyl amine, 4-(dimethylamino)-N, amine compound such as N-dimethyl benzyl amine; Hydrazide kind compounds such as adipic dihydrazide, sebacoyl hydrazine; Phosphorus compounds such as triphenyl phosphorus etc.Epoxy resin cure promotor is not defined in the above compound especially, so long as the epoxy resin cure catalyzer, or promote the material of epoxy group(ing) and carboxyl reaction all to can be used for the present invention.Above-mentioned substance can use in independent or two or more mixing, and by described photoresist (A) 100 weight parts, preferred consumption is the 0.1-20 weight part.
In order to improve characteristics such as hardness, thermotolerance, the present invention can cooperate mineral filler commonly used as required, for example: barium sulfate, barium titanate, calcium dioxide, talcum powder, gas-phase silica, silicon-dioxide, clay, magnesiumcarbonate, lime carbonate, aluminum oxide, mica powder, kaolin etc.
Described mineral filler is by described photoresist (A) 100 weight parts, and preferred consumption is below 300 weight parts.
Ink composite of the present invention has no particular limits tinting pigment, can be tinting pigment commonly used such as phthalocyanine green, phthalocyanine blue, Viola crystallina, titanium dioxide, carbon black as required.
Ink composite of the present invention also can comprise auxiliary agents such as heat polymerization inhibitors, thixotroping tackifier, dispersion agent, flow agent and defoamer as required.
Ink composite of the present invention can be used for printed circuit board.
In addition, the present invention also provides the wiring board that uses described ink composite.
If no special instructions, alleged umber all is a weight part among the present invention.
Should be understood that, for those of ordinary skills, can be according to the above description for change of the present invention or conversion, and all these changes or conversion all should belong to the protection domain of claim.
By following examples can the present invention is further illustrated.
Embodiment
Synthesis example 1
Photoresist A1's is synthetic
In reactor, add 200 gram bisphenol A type epoxy resin (E20 resins, epoxy equivalent (weight) 500) (production of Wuxi resin processing plant), 200 gram ethylene glycol ether acetates, 28.8 gram vinylformic acid, 0.5 gram Resorcinol and 2 gram N, N-dimethylbenzyl ammonia, and, measure its acid number less than 5 90-95 ℃ thermotonus 20 hours.Add 82 gram Tetra hydro Phthalic anhydrides again, in 90 ℃ thermotonuses 6 hours, obtaining acid number was 61, and solid content is 63% lurid resin liquid A1.
Synthesis example 2
Photoresist A2's is synthetic
Be that the ratio of 1:1:2 adds methyl methacrylate, butyl methacrylate and vinylformic acid according to mol ratio in reactor, solvent uses carbitol acetate, and catalyzer uses Diisopropyl azodicarboxylate (AIBN), stirs 4 hours at 80 ℃, obtains resin solution.
Cool off this resin solution, use toluhydroquinone as stopper, tetrabutyl phosphonium bromide phosphorus is as catalyzer, under 90-105 ℃ of condition, carry out addition reaction with (methyl) glycidyl acrylate, wherein said resin carboxyl is 5:1 with the mol ratio of (methyl) glycidyl acrylate, reaction was carried out 16 hours, after the cooling resultant resin liquid A2 was taken out.
In the Resin A 2 that obtains, nonvolatile component is 65%, and the acid value of solids component is 120mgKOH/g, M
wBe about 15000.
Embodiment 1-6 and comparative example 1-6
Above-mentioned synthesis example 1 and 2 resin liquid that obtain are mixed with other preparation by the prescription in the table 1.Elder generation's high speed dispersion 10 minutes disperses to obtain granularity less than 20 microns anti-solder ink with three-roll grinder then.
Application Example
For the present invention and printing ink of the prior art are compared, print general thickness anti-solder ink coating wiring board (thickness is less than 50 μ m after the ink lay prebake) and thick coating anti-solder ink wiring board (thickness is greater than 50 μ m after the ink lay prebake) in the following method respectively, measure preliminary drying drying property, photosensitivity, development, sticking power and the model outward appearance of each printing ink, and the result is listed in table 2 and the table 3 respectively.
1. preliminary drying drying property
With stencil ink printing has been made on the wiring board of condactive pattern at the cleaning exsiccant, in 75 ℃ baking oven, take out cool after predrying 20 minutes to room temperature, cover the exposure egative film, in exposure machine, vacuumize, take out the impression of checking printing ink and the complexity that egative film takes off.
Evaluation method: ink film does not have impression fully, and egative film easily takes off to excellent; Ink film has slight impression, and egative film takes off easily and ink film is not stained with egative film for good; Ink film has obvious impression, and egative film is difficult to take off and ink film is not stained with during egative film is; Ink film is stained with egative film for poor.
2. development
With stencil printing ink is coated on the cleaning exsiccant wiring board substrate, makes test sample plate, 6 on each routine model is put into 75 ℃ of constant temperature ovens and is toasted, and takes out one from baking oven, carries out development operation then in per 20 minutes.Development conditions is: 1%Na
2CO
3The aqueous solution, 30 ℃ of liquid temperature, spray pressure 1kg/cm
2
Evaluation method: preliminary drying can develop totally in 40 minutes, can not develop clean for poor in 60 minutes; Preliminary drying can develop totally in 60 minutes, can not develop in 80 minutes totally to be; Preliminary drying can develop totally in 80 minutes, can not develop clean for good in 100 minutes; It is excellent that preliminary drying 100 minutes and longer time can develop totally.
3. photosensitivity
With stencil printing ink is coated on the cleaning exsiccant wiring board substrate, 6 of each example coating sample boards place 75 ℃ of constant temperature ovens to toast, predrying 30 minutes, be placed on the ink film with 21 rank exposure guide rules and expose, develop then (by the condition in above-mentioned 2. developments).Estimate as investigating object with the residual ink film 9 lattice required exposure energy of exposure guide rule.
Evaluation method:
Residual 9 lattice of exposure back development ink film need luminous energy less than 500mJ/cm
2For excellent;
Residual 9 lattice of exposure back development ink film need luminous energy more than or equal to 500mJ/cm
2And less than 600mJ/cm
2For very;
Residual 9 lattice of exposure back development ink film need luminous energy more than or equal to 600mJ/cm
2And less than 700mJ/cm
2For in;
Residual 9 lattice of exposure back development ink film need luminous energy more than or equal to 700mJ/cm
2For poor.
4. sticking power
With stencil printing ink is coated on the cleaning exsiccant wiring board substrate, make model, model is placed 75 ℃ of constant temperature oven bakings 30 minutes, expose with residual 9 lattice of ink film institute energy requirement, develop then (by the condition in the development 2), again model is placed 150 ℃ baking oven to toast 1 hour, make test sample plate.Adopt a stroke lattice adhesive tape method that model sticking power is tested.
Appraisal procedure: do not come off fully for excellent, drawing a ruling limit has and comes off on a small quantity for very, has more than 1 lattice to come off for poor.
5. model outward appearance
The making of test sample plate is identical with the making of model in the test of sticking power.
Testing method: visual observation test sample plate outward appearance.
Appraisal procedure: test plate surface smooth smooth be excellent, air spots is sent out wrinkle for poor.
Table 2 general thickness coating test case
Table 3 thick coating test case
From the result of table 2 and table 3 as seen, in the embodiment of the invention owing to used the visible light Photoepolymerizationinitiater initiater, the anti-solder ink that obtains is in the thick coating wiring board is printed, every performances such as preliminary drying drying property, development, photosensitivity, sticking power and model outward appearance are excellent, compare with the printing ink that does not use the visible light Photoepolymerizationinitiater initiater in the comparative example, improving significantly aspect sticking power and the model outward appearance.Therefore, composition of the present invention not only is fit to the anti-welding printing of general high precision wiring board, also is fit to thick coating (〉=50 μ m) the anti-welding printing of wiring board.
Claims (16)
1. ink composite contains (A) photoresist, (B) UV-light Photoepolymerizationinitiater initiater, (C) visible light Photoepolymerizationinitiater initiater, (D) thinner and (E) Thermocurable composition.
2. ink composite according to claim 1, wherein said photoresist (A) is for containing the photoresist of carboxyl and at least two ethylene type unsaturated link(age)s simultaneously in the molecule.
3. ink composite according to claim 1, wherein said visible light Photoepolymerizationinitiater initiater (C) contains two [2,6-two fluoro-3-(1H-pyrryl-1) phenyl], and titanium luxuriant, two (pentafluorophenyl group) titanium is luxuriant, in anthraquinone/tertiary amine light initiation system, camphorquinone/tertiary amine light initiation system or the 3-ketone group tonka bean camphor/tertiary amine light initiation system one or more.
4. ink composite according to claim 1, wherein said thinner (D) are one or more in organic solvent and/or the photopolymerization monomer.
5. ink composite according to claim 1, wherein said Thermocurable composition (E) is for containing the epoxy compounds of two above epoxy group(ing) in the molecule.
6. ink composite according to claim 2, wherein said photoresist (A) is synthetic by following any method:
(1) multi-functional epoxy compounds (a) and the unsaturated monocarboxylic (b) that has two above epoxy group(ing) in the molecule carries out esterification, and the carboxylate that obtains reacts with saturated or undersaturated multi-anhydride (c) again;
(2) (methyl) vinylformic acid and other comonomer (d) reaction with ethylene type unsaturated link(age) form multipolymer, partly react with (methyl) glycidyl acrylate again;
(3) (methyl) glycidyl acrylate and other multipolymer and unsaturated monocarboxylic (b) with comonomer (d) of ethylene type unsaturated link(age) react, and the resultant that obtains reacts with saturated or undersaturated multi-anhydride (c) again;
(4) contain two hydroxyls at least in the multi-functional epoxy compounds (a), unsaturated monocarboxylic (b) that has two above epoxy group(ing) in the molecule and the molecule and have can with compound (e) reaction of other group of epoxy reaction, generate intermediate (I), described intermediate reacts with saturated or undersaturated multi-anhydride (c) again;
(5) unsaturated multi-anhydride forms multipolymer with the aromatic hydrocarbons reaction with vinyl, again with hydroxyalkyl (methyl) acrylate reactions; Or
(6) the described intermediate of method (4) (I) again with saturated or undersaturated multi-anhydride (c) and monoisocyanates (f) reaction that contains unsaturated group.
7. ink composite according to claim 6, wherein said epoxy compounds (a) is a novolac epoxy.
8. ink composite according to claim 6, wherein said compound (e) is for containing the monocarboxylic acid or the dialkanol amine of two above hydroxyls in the molecule.
9. ink composite according to claim 6, in the wherein said synthetic method (4), epoxy group(ing) 1 molar equivalent of relative epoxy compounds (a), the total amount of unsaturated monocarboxylic (b) and compound (e) is the 0.8-1.3 molar equivalent, wherein the molar equivalent proportion of compound (e) is 5-50%, and the hydroxyl in the relative intermediate (I), multi-anhydride (c) reaction of the hydroxyl of 1 molar equivalent and 0.1-0.9 molar equivalent.
10. ink composite according to claim 6, wherein said photoresist (A) are the photosensitive resin of solids component acid value between 50-150mgKOH/g.
11. according to each described ink composite among the claim 1-10, wherein the adding proportion of each component is, by described photoresist (A) 100 weight parts, organic solvent 30-300 weight part and/or below photopolymerization monomer 50 weight parts in described UV-light Photoepolymerizationinitiater initiater (B) the 1-30 weight part, described visible light polymerization starter (C) 0.001-2 weight part, described thinner (D), and described Thermocurable composition (E) 5-100 weight part.
12. ink composite according to claim 11, wherein by described photoresist (A) 100 weight parts, described UV-light Photoepolymerizationinitiater initiater (B) is the 1-20 weight part.
13. ink composite according to claim 11, wherein by described photoresist (A) 100 weight parts, described visible light polymerization starter (C) is the 0.005-1.5 weight part.
14. ink composite according to claim 11, wherein by described photoresist (A) 100 weight parts, organic solvent is that 30-100 weight part and/or photopolymerization monomer are below 30 weight parts in the described thinner (D).
15. ink composite according to claim 11, wherein by described photoresist (A) 100 weight parts, described Thermocurable composition (E) is the 5-50 weight part.
16. the purposes of each described ink composite aspect printed circuit board among the claim 1-15.
17. a wiring board contains the welding resistance etchant resist that each described ink composite is printed among the useful claim 1-15.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200810004765 CN100482752C (en) | 2008-01-30 | 2008-01-30 | Light sensitive anti-solder ink composition, application and circuit board containing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200810004765 CN100482752C (en) | 2008-01-30 | 2008-01-30 | Light sensitive anti-solder ink composition, application and circuit board containing the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101220225A CN101220225A (en) | 2008-07-16 |
| CN100482752C true CN100482752C (en) | 2009-04-29 |
Family
ID=39630314
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200810004765 Active CN100482752C (en) | 2008-01-30 | 2008-01-30 | Light sensitive anti-solder ink composition, application and circuit board containing the same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100482752C (en) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102244988A (en) * | 2011-05-10 | 2011-11-16 | 惠州中京电子科技股份有限公司 | Manufacturing process of PCB (Printed Circuit Board) |
| JP5315441B1 (en) * | 2012-03-30 | 2013-10-16 | 太陽インキ製造株式会社 | Photocurable resin composition, dry film, cured product and printed wiring board |
| CN103045014B (en) * | 2013-01-25 | 2015-01-14 | 深圳市万佳原丝印器材有限公司 | Naturally dried photosensitive acid-corrosion-resistant electroplating printing ink and preparation method thereof |
| CN103969947B (en) * | 2013-01-31 | 2016-05-04 | 太阳油墨（苏州）有限公司 | Alkali development-type photosensitive resin composition, its dry film and solidfied material thereof and use it and the printed circuit board (PCB) that forms |
| JP6259240B2 (en) * | 2013-09-30 | 2018-01-10 | 昭和電工株式会社 | Photosensitive resin manufacturing method and color filter manufacturing method |
| CN104974596A (en) * | 2015-07-02 | 2015-10-14 | 深圳市容大感光科技股份有限公司 | Photosensitive solder-resist printing ink composition and circuit board including cured film of same |
| CN107502040A (en) * | 2016-06-14 | 2017-12-22 | 中国科学院化学研究所 | A kind of visible-light curing solvent-free type environment-friendly ink composite |
| CN106189725A (en) * | 2016-07-28 | 2016-12-07 | 上海维凯光电新材料有限公司 | Photosensitive layout coating composition and its production and use |
| CN107216776B (en) * | 2017-06-02 | 2019-11-22 | 上海维凯光电新材料有限公司 | A kind of photo-thermal dual curable composition of insulating coating and its application |
| CN107619624B (en) * | 2017-10-09 | 2018-07-13 | 广东高仕电研科技有限公司 | A kind of UV solidification solder mask and preparation method thereof |
| CN108003271B (en) * | 2017-12-25 | 2020-06-16 | 广东三求光固材料股份有限公司 | Alkali-soluble electroplating-resistant photosensitive resin and preparation method and application thereof |
| CN109970953B (en) * | 2017-12-27 | 2021-04-09 | 太阳油墨（苏州）有限公司 | Curable resin composition, dry film, cured product, and printed wiring board |
| CN109021672B (en) * | 2018-06-27 | 2021-08-24 | 安徽金龙浩光电科技有限公司 | Protective printing ink for 3D LOGO etching of mobile phone |
| CN108864818B (en) * | 2018-06-27 | 2021-08-24 | 安徽金龙浩光电科技有限公司 | Protective printing ink containing silicon dioxide for 3D LOGO etching of mobile phone |
| CN110615865A (en) * | 2019-11-05 | 2019-12-27 | 江苏睿浦树脂科技有限公司 | Resin for high-temperature-resistant low-yellowing solder-resistant UV (ultraviolet) ink and preparation method thereof |
| CN111585092B (en) * | 2020-04-07 | 2023-09-26 | 潮州三环（集团）股份有限公司 | Wiring terminal |
| CN113604103A (en) * | 2021-08-09 | 2021-11-05 | 江西超洋科技有限公司 | High-light-sensitivity solder resist ink special for PCB and preparation method thereof |
| CN114058212A (en) * | 2021-11-18 | 2022-02-18 | 惠州市艾比森光电有限公司 | Black matte ink, PCB and preparation method thereof |
| CN115806754A (en) * | 2022-12-07 | 2023-03-17 | 连州市祥丰化工有限公司 | Photosensitive imaging developing-formed conductive ink, preparation method thereof and circuit board |
-
2008
- 2008-01-30 CN CN 200810004765 patent/CN100482752C/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN101220225A (en) | 2008-07-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN100482752C (en) | Light sensitive anti-solder ink composition, application and circuit board containing the same | |
| DE60103529T2 (en) | CURING COMPOSITION THAT IS CURED BY LIGHT AND HEAT, A LIGHT-SENSITIVE DRYER MANUFACTURED FROM THIS PRODUCT, AND METHOD FOR FORMING A PATTERN THEREFOR | |
| CN101233452B (en) | Photosensitive resin composition and cured article thereof | |
| CN101542392B (en) | Photocurable resin composition, dry film, cured product, and printed wiring board | |
| CN103998986B (en) | The manufacture method of dry film, laminate structure, printed circuit board (PCB) and laminate structure | |
| CN102944977B (en) | Photosensitive solder resist composite, application thereof and printed circuit board (PCB) containing same | |
| TW562834B (en) | Ultraviolet-curable resin composition and photosolder resist ink containing the composition | |
| CN104974594A (en) | Printing ink composition with water-soluble solvent, application of printing ink composition, and printed circuit board | |
| CN100469843C (en) | Liquid photosensitive ink and applied in printing circuit board | |
| CN105086604A (en) | Printing ink composition, application thereof and printed circuit board | |
| JP5027458B2 (en) | Photo-curable and thermosetting one-component solder resist composition and printed wiring board using the same | |
| TW201035680A (en) | Photosensitive resin composition | |
| JP3673321B2 (en) | Photosensitive resin composition capable of alkali development | |
| CN104974596A (en) | Photosensitive solder-resist printing ink composition and circuit board including cured film of same | |
| CN104610804A (en) | Photoreception solder resistance compound, application thereof and PCB (Printed Circuit Board) comprising compound | |
| CN101675113A (en) | Resin composition, dry film, and fabrications of the same | |
| CN107801316A (en) | The manufacture method of printed circuit board (PCB) and printed circuit board (PCB) | |
| CN1800979B (en) | Solder resist composition of light-curing single liquid style and printing circuit board use same | |
| CN105778726A (en) | Coating composition and application thereof and substrate including film layer formed by coating composition | |
| CN105086605B (en) | A kind of photocuring heat-curing composition ink, purposes and the wiring board containing it | |
| CN1262576C (en) | Resin composition | |
| JP4844002B2 (en) | Acid pendant type epoxy acrylate resin composition | |
| CN105733352A (en) | Photosensitive solder resist ink composition and circuit board | |
| US20020120031A1 (en) | Photothermosetting component | |
| CN109388020A (en) | Photosensitive polymer combination, dry film, solidfied material and printed circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee |
Owner name: SHENZHEN RONGDA PHOTOSENSITIVE SCIENCE AND TECHNOL Free format text: FORMER NAME: RONGDA ELECTRONIC MATERIAL CO., LTD., SHENZHEN |
|
| CP01 | Change in the name or title of a patent holder |
Address after: 518103, Xintian Industrial Zone, Fuyong Town, Guangdong, Shenzhen, 27 Patentee after: Shenzhen Rongda Photosensitive Science & Technology Co., Ltd. Address before: 518103, Xintian Industrial Zone, Fuyong Town, Guangdong, Shenzhen, 27 Patentee before: Rongda Electronic Material Co., Ltd., Shenzhen |
|
| C56 | Change in the name or address of the patentee | ||
| CP02 | Change in the address of a patent holder |
Address after: Baoan District Fuyong Fuyong street Shenzhen city Guangdong province 518103 Lake Lixin first Science Park Research Building No. 1-3 building Patentee after: Shenzhen Rongda Photosensitive Science & Technology Co., Ltd. Address before: 518103, Xintian Industrial Zone, Fuyong Town, Guangdong, Shenzhen, 27 Patentee before: Shenzhen Rongda Photosensitive Science & Technology Co., Ltd. |