CN107603329A - A kind of liquid development photosensitive solder resist ink and preparation method thereof - Google Patents
A kind of liquid development photosensitive solder resist ink and preparation method thereof Download PDFInfo
- Publication number
- CN107603329A CN107603329A CN201710840841.7A CN201710840841A CN107603329A CN 107603329 A CN107603329 A CN 107603329A CN 201710840841 A CN201710840841 A CN 201710840841A CN 107603329 A CN107603329 A CN 107603329A
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- China
- Prior art keywords
- solder resist
- resist ink
- block
- liquid development
- photosensitive solder
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Abstract
Develop photosensitive solder resist ink the invention discloses a kind of liquid, include the components of following parts by weight：Photosensitive resin 45 65, activated monomer 10 20, light trigger 28, colorant 15, filler 12 18, defoamer 12, solvent 10 15, described photosensitive resin includes amphipathic nature block polymer, bisphenol A type epoxy resin, organic silicon acrylic ester, and the mass ratio of three is 1：（0.8‑1.5）：（0.1‑0.5）.
Description
Technical field
The present invention relates to solder mask technical field, more particularly to a kind of liquid development photosensitive solder resist ink and its preparation side
Method.
Background technology
Welding resistance is the particularly important procedure of PCB manufacturing process, and its main function is that solder mask is passed through into silk
The mode of print is covered on the line pattern etched, the position that need not enter units welding is all covered, to prevent
In element welding process because of upper tin and caused by electrical communication the problem of forming short circuit.With the further densifications of PCB and nothing
The appearance of lead welding procedure, a large amount of of higher requirement, especially flexible PCB are it is also proposed for the performance of solder mask
Use.Solder mask plays moistureproof, anti-pollution, anticorrosion in the solder mask that circuit board surface is formed and prevents welding from causing splicing
Deng effect, this requires solder mask to have excellent heat resistance, chemical resistance, pliability.Traditional epoxies soldering-resistance layer solidification
Higher fragility is shown afterwards, it is impossible to suitable for flexible board.
The content of the invention
The defects of present invention is in order to make up prior art, there is provided a kind of liquid development photosensitive solder resist ink and its preparation side
Method.
The present invention is achieved by the following technical solutions：
A kind of liquid development photosensitive solder resist ink, include the component of following parts by weight：Photosensitive resin 45-65, activated monomer 10-
20th, light trigger 2-8, colorant 1-5, filler 12-18, defoamer 1-2, solvent 10-15, described photosensitive resin include amphipathic
Block copolymer, bisphenol A type epoxy resin, organic silicon acrylic ester, the mass ratio of three is 1：（0.8-1.5）：（0.1-
0.5）.
Described activated monomer is acrylic monomers.
Described light trigger is TMDPO, 2- hydroxy-2-methyl -1- phenyl
It is acetone, double（2,4,6- trimethylbenzoyls）Phenyl phosphine oxide, 1- hydroxy cyclohexyl phenylketones and 2,4,6- trimethylbenzene first
One kind in acyl group ethoxyl phenenyl phosphine oxide.
Described colorant is according to 1 by pigment and fluorocarbon surfactant：（0.01-0.1）Weight than it is blended, grind
Grind, be scattered obtained.
Described filler is mesoporous silicon oxide.
Described amphipathic nature block polymer is poly-（Isoprene-block-oxirane）Block copolymer, gather（Ethene
Propylene-block-oxirane）Block copolymer, gather（Butadiene-block-oxirane）Block copolymer, gather（Isoprene-
Block-oxirane）One kind in block copolymer.
A kind of preparation method of described liquid development photosensitive solder resist ink, is comprised the following steps that：By photosensitive resin, activity
Monomer and light trigger feed intake in passage, are stirred with high speed dispersor under 500-600r/min rotating speeds to after 65-80 DEG C,
Stop stirring, add filler, colorant, solvent, defoamer, open stirring, mixing speed 300-500r/min, be stirred
Resulting material is ground to fineness less than 5 μm with 260 or 405 type three-roll grinders after even, finally uses the screen pack of 325-600 mesh again
Filtering, produce described liquid development photosensitive solder resist ink.
Solder mask prepared by the present invention is with amphipathic nature block polymer modified bisphenol A type epoxy resin and organosilicon third
Then olefin(e) acid ester compound reacts, the resinite of synthesis has good photonasty and heat concurrently with activated monomer again as photosensitive resin
Curability, amphipathic group therein make itself and mesoporous silicon oxide filler, the pigment through fluorocarbon surfactant modified processing
There is more preferable compatibility and adhesion Deng composition, solve that traditional solder mask fragility is big, has the problems such as aberration, it is final to be made
Ink uniform color it is stable, pliability is good, heat-resisting, antiseptic power is strong, hydrophobic oleophobic, is especially suitable for high performance flexible circuit
Plate.
Embodiment
A kind of liquid development photosensitive solder resist ink, include the component of following parts by weight：Photosensitive resin 45, acrylic monomers
10th, TMDPO 2, colorant 1, mesoporous silicon oxide 12, defoamer 1, solvent 10, it is described
Photosensitive resin include it is poly-（Isoprene block oxirane）Block copolymer, bisphenol A type epoxy resin, acid-organosilicon crylic acid
Ester, the mass ratio of three is 1：0.8：0.1.
A kind of described liquid development photosensitive solder resist ink, described light trigger is 2,4,6 trimethylbenzoyls two
It is phenyl phosphine oxide, 2 hyd roxymethyl phenyl acetone, double（2,4,6 trimethylbenzoyls）Phenyl phosphine oxide, 1 hydroxy-cyclohexyl benzene
Ketone and 2, one kind in 4,6 trimethylbenzoyl ethoxyl phenenyl phosphine oxides.
Described colorant is according to 1 by pigment and fluorocarbon surfactant：（0.01）Weight than it is blended, grinding, point
Dissipate obtained.
A kind of preparation method of described liquid development photosensitive solder resist ink, is comprised the following steps that：By photosensitive resin, activity
Monomer and light trigger feed intake in passage, are stirred with high speed dispersor under 500r/min rotating speeds to after 65 DEG C, stop stirring
Mix, add filler, colorant, solvent, defoamer, open stirring, mixing speed 300r/min, be uniformly mixed rear gains
Material is ground to fineness less than 5 μm with 260 type three-roll grinders, finally produces described liquid with the filter screen filtration of 325 mesh again
Develop photosensitive solder resist ink.
Claims (7)
- The photosensitive solder resist ink 1. a kind of liquid is developed, it is characterised in that include the component of following parts by weight：Photosensitive resin 45-65, Activated monomer 10-20, light trigger 2-8, colorant 1-5, filler 12-18, defoamer 1-2, solvent 10-15, described photosensitive tree Fat includes amphipathic nature block polymer, bisphenol A type epoxy resin, organic silicon acrylic ester, and the mass ratio of three is 1：（0.8- 1.5）：（0.1-0.5）.
- 2. a kind of liquid development photosensitive solder resist ink as claimed in claim 1, it is characterised in that described activated monomer is third Acrylic monomer.
- A kind of 3. liquid development photosensitive solder resist ink as claimed in claim 1, it is characterised in that described light trigger is 2, It is 4,6- trimethyl benzoyl diphenyl base phosphine oxides, 2- hydroxy-2-methyl -1- phenylacetones, double（2,4,6- trimethylbenzoyls Base）Phenyl phosphine oxide, 1- hydroxy cyclohexyl phenylketones and 2, one in 4,6- trimethylbenzoyl ethoxyl phenenyl phosphine oxides Kind.
- 4. a kind of liquid development photosensitive solder resist ink as claimed in claim 1, it is characterised in that described colorant is by pigment With fluorocarbon surfactant according to 1：（0.01-0.1）Weight than blended, grinding, scattered obtained.
- 5. a kind of liquid development photosensitive solder resist ink as claimed in claim 1, it is characterised in that described filler is mesoporous two Silica.
- 6. a kind of liquid development photosensitive solder resist ink as claimed in claim 1, it is characterised in that described amphipathic block is total to Polymers is poly-（Isoprene-block-oxirane）Block copolymer, gather（Ethylene, propylene-block-oxirane）Block copolymerization Thing, gather（Butadiene-block-oxirane）Block copolymer, gather（Isoprene-block-oxirane）In block copolymer One kind.
- A kind of 7. preparation method of liquid development photosensitive solder resist ink as described in claim 1-6, it is characterised in that specific step It is rapid as follows：Photosensitive resin, activated monomer and light trigger are fed intake in passage, with high speed dispersor in 500-600r/min Stirred under rotating speed to after 65-80 DEG C, stop stirring, add filler, colorant, solvent, defoamer, opened and stir, mixing speed is 300-500r/min, it is uniformly mixed rear resulting material and is ground to fineness less than 5 μm with 260 or 405 type three-roll grinders, most Use the filter screen filtration of 325-600 mesh again afterwards, produce described liquid development photosensitive solder resist ink.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710840841.7A CN107603329A (en) | 2017-09-18 | 2017-09-18 | A kind of liquid development photosensitive solder resist ink and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710840841.7A CN107603329A (en) | 2017-09-18 | 2017-09-18 | A kind of liquid development photosensitive solder resist ink and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107603329A true CN107603329A (en) | 2018-01-19 |
Family
ID=61060729
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710840841.7A Pending CN107603329A (en) | 2017-09-18 | 2017-09-18 | A kind of liquid development photosensitive solder resist ink and preparation method thereof |
Country Status (1)
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| CN (1) | CN107603329A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113549369A (en) * | 2021-07-05 | 2021-10-26 | 江苏海田电子材料有限公司 | Crack-resistant solder-resist hole plugging ink and preparation method thereof |
| CN116694128A (en) * | 2023-06-28 | 2023-09-05 | 鹤山市炎墨科技有限公司 | Anti-welding ink containing block copolymer and preparation method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003005126A1 (en) * | 2001-07-04 | 2003-01-16 | Showa Denko K.K. | Resist curable resin composition and cured article thereof |
| CN101027358A (en) * | 2004-04-02 | 2007-08-29 | 陶氏环球技术公司 | Amphiphilic block copolymer-toughened thermoset resins |
| CN101717599A (en) * | 2009-12-27 | 2010-06-02 | 浙江桐乡新东方油墨有限公司 | Liquid photosensitive solder resist ink and preparation method thereof |
| CN105418864A (en) * | 2015-12-21 | 2016-03-23 | 海门埃夫科纳化学有限公司 | Amphiphilic block copolymer, preparation method therefor and application of amphiphilic block copolymer |
-
2017
- 2017-09-18 CN CN201710840841.7A patent/CN107603329A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003005126A1 (en) * | 2001-07-04 | 2003-01-16 | Showa Denko K.K. | Resist curable resin composition and cured article thereof |
| CN101027358A (en) * | 2004-04-02 | 2007-08-29 | 陶氏环球技术公司 | Amphiphilic block copolymer-toughened thermoset resins |
| CN101717599A (en) * | 2009-12-27 | 2010-06-02 | 浙江桐乡新东方油墨有限公司 | Liquid photosensitive solder resist ink and preparation method thereof |
| CN105418864A (en) * | 2015-12-21 | 2016-03-23 | 海门埃夫科纳化学有限公司 | Amphiphilic block copolymer, preparation method therefor and application of amphiphilic block copolymer |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113549369A (en) * | 2021-07-05 | 2021-10-26 | 江苏海田电子材料有限公司 | Crack-resistant solder-resist hole plugging ink and preparation method thereof |
| CN116694128A (en) * | 2023-06-28 | 2023-09-05 | 鹤山市炎墨科技有限公司 | Anti-welding ink containing block copolymer and preparation method thereof |
| CN116694128B (en) * | 2023-06-28 | 2023-11-24 | 鹤山市炎墨科技有限公司 | Anti-welding ink containing block copolymer and preparation method thereof |
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| Date | Code | Title | Description |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180119 |
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| RJ01 | Rejection of invention patent application after publication |