CN110597015A - Development-resistant photosensitive solder resist material and preparation method thereof - Google Patents
Development-resistant photosensitive solder resist material and preparation method thereof Download PDFInfo
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- CN110597015A CN110597015A CN201910840187.9A CN201910840187A CN110597015A CN 110597015 A CN110597015 A CN 110597015A CN 201910840187 A CN201910840187 A CN 201910840187A CN 110597015 A CN110597015 A CN 110597015A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/101—Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
Abstract
The invention discloses a development-resistant photosensitive solder resist material which comprises the following components in parts by weight: 30-45 parts of photosensitive resin, 5-10 parts of polyester resin, 4-10 parts of acrylic monomer, 12-20 parts of epoxy resin, 20-35 parts of filler, 3-6 parts of photoinitiator and 5-15 parts of solvent, wherein the photosensitive resin is obtained by polymerizing acrylic acid and o-cresol formaldehyde epoxy resin, and reacting the obtained reaction product with anhydride and glycidyl methacrylate in sequence. The development-resistant photosensitive solder resist material prepared by the invention has the advantages of development resistance, high temperature resistance, acid and alkali resistance, hot oil resistance, high adhesion, high hardness and the like; the solder mask obtained by coating has excellent insulativity, acid and alkali resistance and high hardness; the photosensitive solder resist material has a higher ultraviolet light absorption effect, and the development resolution is finer.
Description
Technical Field
The invention belongs to the technical field of solder resist ink of printed circuit boards, and particularly relates to a development-resistant photosensitive solder resist material and a preparation method thereof.
Background
Printed Circuit Boards (PCBs) are one of the important components of the electronics industry, as long as the electronic components of the integrated circuits require the use of a printed circuit board. When the circuit board is manufactured, only a part of welding pads need to be welded in many times, so that the welding pads and circuits which do not need to be welded need to be covered by the solder mask, the solder mask mainly has the functions of preventing bridging between a lead and the welding pads and also has the functions of corrosion resistance, moisture resistance, mildew resistance and the like, and therefore the advantages and the disadvantages of the solder mask relate to the reliability and the service life of the PCB.
The solder mask is mainly formed by coating a liquid photosensitive solder mask material on the surface of a flexible Printed Circuit Board (PCB), sequentially carrying out a series of processes of primary curing, exposure, development, post-curing and the like, and finally forming a polymer coating on the surface of the printed circuit board, namely the photosensitive solder mask material is a main material for forming the solder mask. The development resistance of the solder resist refers to the degree to which the exposed solder resist is resistant to over-development, that is, the degree to which the development time can be exceeded. The developability and the developing resistance of the solder mask directly affect the quality of the produced PCB, poor development brings difficulty to etching, so that the defects of no plating or poor bonding force of a plating layer are generated, the defects of solder mask falling, plating penetration and the like are generated during over development, and the developing resistance reflects the latitude of a developing process. Therefore, in order to ensure the development resistance of the solder resist and to make it function sufficiently, a higher demand is also placed on the development resistance of the photosensitive solder resist material.
At present, when some circuit board factories manufacture high-precision circuit boards, photosensitive solder mask ink is required to have very high photosensitive resolution and developing resistance, and the traditional solder mask material is difficult to meet the requirements.
Disclosure of Invention
The invention aims to provide a photosensitive solder resist material which has excellent developing resistance, high temperature resistance, acid and alkali resistance, hot oil resistance, high adhesion, high hardness and good insulating property, and a preparation method of the photosensitive solder resist material.
The technical scheme adopted by the invention is as follows: a development-resistant photosensitive solder resist material comprises the following components in parts by weight:
the photosensitive resin is prepared by polymerizing acrylic acid and o-cresol formaldehyde epoxy resin, and reacting the obtained reaction product with anhydride and glycidyl methacrylate in sequence to obtain carboxyl and unsaturated groups on side chains.
Preferably, the development-resistant photosensitive solder resist material further comprises 1-4 parts of pigment and 1-5 parts of auxiliary agent by weight.
Preferably, the preparation method of the photosensitive resin comprises the following steps: according to the weight portion, 10-15 portions of acrylic acid, 40-45 portions of o-cresol formaldehyde epoxy resin, 35-45 portions of solvent, 0.2-0.8 portion of catalyst and 0.2-0.6 portion of hydroquinone are heated to 100-110 ℃ for reaction for 8-12 hours, then 6-8 portions of anhydride are added for reaction for 4-6 hours at 100-108 ℃, and then 1-4 portions of glycidyl methacrylate are added for continuous reaction for 4-6 hours, thus obtaining the photosensitive resin with the acid value of 25-35mgKOH/g and the solid content of 55-65 percent.
More preferably, the preparation method of the photosensitive resin is as follows: according to parts by weight, in a reaction vessel, heating 10-15 parts of acrylic acid, 40-45 parts of o-cresol formaldehyde epoxy resin, 35-45 parts of solvent, 0.2-0.8 part of catalyst and 0.2-0.6 part of hydroquinone to 100 ℃ for reaction for 8-12 hours, then adding 6-8 parts of anhydride for reaction at 105 ℃ for 4-6 hours, and then adding 1-4 parts of glycidyl methacrylate for reaction at 105 ℃ for 4-6 hours to obtain the photosensitive resin with the acid value of 25-35mgKOH/g and the solid content of about 60 percent.
Preferably, the anhydride commonly used in the preparation of the photosensitive resin is tetrahydrophthalic anhydride. Preferably, the solvent is DBE, a solvent of Shandong Yuanli science and technology, Inc., and the catalyst is triphenylphosphine, a catalyst of Zhuhai city, Miyuan chemical technology, Inc.
The PCB photosensitive ink has weak alkali (1% sodium carbonate aqueous solution), and in the developing process, the reaction is slow, the developing time is long and the development is resistant due to the low acid value.
Preferably, the polyester resin is a carboxyl group-containing polyester resin having an acid value of 25 to 35 mgKOH/g.
Preferably, the acrylic monomer is selected from one or more of trimethylolpropane triacrylate, di-pentaerythritol hexaacrylate and ethoxylated trimethylolpropane triacrylate.
Preferably, the epoxy resin is selected from o-cresol formaldehyde epoxy resin or bisphenol A phenol formaldehyde epoxy resin. The addition of epoxy resin can increase the crosslink density of the product.
Preferably, the filler is selected from one or more of barium sulfate, talcum powder and silicon dioxide.
Preferably, the photoinitiator is selected from one or more of 2-methyl-1- (4-methylthiophenyl) -2-morpholine-1-one, 2-isopropyl thioxanthone, 2, 4-diethyl thioxanthone, 2,4, 6-trimethylbenzoyl-diphenylphosphine oxide and bis-2, 6-difluoro-3-pyrrolylphenyltitanocene.
Preferably, the solvent is selected from one or more of ketone solvents, ester solvents, ether solvents and petroleum solvents.
The solvent is one or more of ketones, esters, ethers and petroleum, the commonly used ketone solvents comprise acetone, methyl ethyl ketone and cyclohexanone, the commonly used ester solvents comprise ethylene glycol monoethyl ether acetate, ethylene glycol monobutyl ether acetate, diethylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether acetate, diethylene glycol monobutyl ether acetate, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, propylene glycol monobutyl ether acetate and the like, and the commonly used ether solvents comprise ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monobutyl ether, diethylene glycol monomethyl ether, diethylene glycol monobutyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol monobutyl ether, dipropylene glycol monomethyl ether, dipropylene glycol monoethyl ether, dipropylene glycol monobutyl ether and the like; the petroleum solvent is naphtha.
Preferably, the auxiliary agent is selected from one or more of a leveling agent, a defoaming agent and a dispersing agent. The leveling agent, the defoaming agent and the dispersing agent can be added according to the actual needs by the skilled person.
The defoaming agent can be selected from organosilicon defoaming agent, organic fluorine defoaming agent and acrylic defoaming agent.
The leveling agent can be selected from organosilicon leveling agent, polyurethane leveling agent, etc.
The dispersant may be propylene glycol methyl ether, dipropylene glycol methyl ether, etc.
Preferably, the pigment is selected from organic pigments or inorganic pigments. The skilled person can choose to add organic or inorganic pigments according to the actual needs.
The invention also provides a preparation method of the development-resistant photosensitive solder resist material, which comprises the following steps:
1) mixing photosensitive resin, polyester resin, acrylic monomer, epoxy resin, photoinitiator, auxiliary agent, solvent, pigment and filler;
2) grinding to obtain the development-resistant photosensitive solder resist material.
More specifically, the preparation method of the development-resistant photosensitive solder resist material comprises the following steps:
1) weighing photosensitive resin, polyester resin, acrylic monomer, epoxy resin, photoinitiator, auxiliary agent, solvent, pigment and filler according to parts by weight;
2) placing the components weighed in the step 1) into a dispersion machine for high-speed uniform dispersion;
3) grinding the components uniformly dispersed in the step 2) on a three-roller machine until the fineness is less than 20 mu m to obtain a coarse product of the development-resistant photosensitive solder resist material;
4) filtering the coarse product of the development-resistant photosensitive solder mask material obtained in the step 3) to remove mechanical impurities and coarse particles, and obtaining the development-resistant photosensitive solder mask material.
The invention also provides a method for printing the development-resistant photosensitive solder mask material on the PCB to form the solder mask, which comprises the following steps
1) Printing: diluting the development-resistant photosensitive solder resist material, and printing the diluted development-resistant photosensitive solder resist material on the surface of the PCB;
2) primary curing: drying the PCB printed in the step 1) to obtain a primary cured PCB;
3) exposure: cooling the PCB primarily cured in the step 2) into a dry film, and exposing to obtain an exposed PCB;
4) and (3) developing: developing the PCB exposed in the step 3) to obtain a developed PCB;
5) post-curing: and (4) curing the PCB developed in the step 4) to form the solder mask.
More specifically, the method for printing the development-resistant photosensitive solder mask material on the PCB to form the solder mask comprises the following steps:
1) printing: diluting the development-resistant photosensitive solder resist material to the viscosity of 150-200dPa.s by using dibasic acid ester, and printing the material on the surface of the PCB by adopting a screen printing or roll coating mode;
2) primary curing: putting the PCB printed in the step 1) into an oven, and drying for 40-55min at 70-75 ℃ to obtain a primary cured PCB;
3) exposure: cooling the PCB primarily cured in the step 2) into a dry film, covering a mask, and performing contact exposure under the light of an ultraviolet lamp to obtain an exposed PCB;
4) and (3) developing: using 0.9-1.2% Na2CO3Developing the PCB exposed in the step 3) for 90-120s by using the solution, and washing by using water to obtain a developed PCB;
5) post-curing: curing the PCB developed in the step 4) at the temperature of 145-155 ℃ for 45-65min to form the solder mask.
The traditional photosensitive solder resist material is in an exposure development stage, the development time is 45-60 seconds, and the resolution is made to be 75-80 microns. The photosensitive solder resist material can be developed for 90-120 seconds, and the resolution is 50-55 microns.
The invention has the beneficial effects that: (1) the development-resistant photosensitive solder resist material prepared by the invention has the advantages of development resistance, high temperature resistance, acid and alkali resistance, hot oil resistance, high adhesion, high hardness and the like; (2) the solder mask obtained by coating has excellent insulativity, acid and alkali resistance and high hardness; (3) the photosensitive solder resist material has a higher ultraviolet light absorption effect, and the development resolution is finer.
Detailed Description
Example 1
A development-resistant photosensitive solder resist material includes the components in parts by weight shown in Table 1.
The preparation method of the photosensitive resin comprises the following steps: according to parts by weight, in a reaction vessel, heating 10 parts of acrylic acid, 45 parts of o-cresol formaldehyde epoxy resin, 35 parts of solvent, 0.3 part of catalyst and 0.3 part of hydroquinone to 100 ℃ for reaction at 110 ℃ for 8-12 hours, then adding 8 parts of anhydride for reaction at 105 ℃ for 4-6 hours, and then adding 1.6 parts of glycidyl methacrylate for reaction at 105 ℃ for 4-6 hours. The photosensitive resin with the acid value of 30-35mgKOH/g and the solid content of about 62 percent is obtained.
A preparation method of a development-resistant photosensitive solder resist material comprises the following steps:
1) weighing photosensitive resin, polyester resin, acrylic monomer, epoxy resin, photoinitiator, auxiliary agent, solvent, pigment and filler according to parts by weight;
2) placing the components weighed in the step 1) into a dispersion machine for high-speed uniform dispersion;
3) grinding the components uniformly dispersed in the step 2) on a three-roller machine until the fineness is less than 20 mu m to obtain a coarse product of the development-resistant photosensitive solder resist material;
4) filtering the coarse product of the development-resistant photosensitive solder mask material obtained in the step 3) to remove mechanical impurities and coarse particles, and obtaining the development-resistant photosensitive solder mask material.
The method for printing the development-resistant photosensitive solder mask material on the PCB to form the solder mask comprises the following steps:
1) printing: diluting the development-resistant photosensitive solder resist material to the viscosity of 150-200dPa.s by using dibasic acid ester, and printing the material on the surface of the PCB by adopting a screen printing or roll coating mode;
2) primary curing: putting the PCB printed in the step 1) into an oven, and drying for 40-55min at 70-75 ℃ to obtain a primary cured PCB;
3) exposure: cooling the PCB primarily cured in the step 2) into a dry film, covering a mask, and performing contact exposure under the light of an ultraviolet lamp to obtain an exposed PCB;
4) and (3) developing: using 0.9-1.2% Na2CO3Developing the exposed flexible Printed Circuit Board (PCB) in the step 3) for 90-120s by using the solution, and washing by using water to obtain a developed PCB;
5) post-curing: curing the PCB developed in the step 4) at the temperature of 145-155 ℃ for 45-65min to form the solder mask.
Example 2
A development-resistant photosensitive solder resist material includes the components in parts by weight shown in Table 1.
The preparation method of the photosensitive resin comprises the following steps: according to parts by weight, in a reaction vessel, heating 12 parts of acrylic acid, 42 parts of o-cresol formaldehyde epoxy resin, 39 parts of solvent, 0.2 part of catalyst and 0.3 part of hydroquinone to 100 ℃ for reaction for 8-12 hours, then adding 8 parts of anhydride for reaction at 105 ℃ for 4-6 hours, and then adding 2.5 parts of glycidyl methacrylate for reaction at 105 ℃ for 4-6 hours. The photosensitive resin with the acid value of 30-35mgKOH/g and the solid content of 65 percent is obtained.
The process for preparing the development-resistant photosensitive solder resist material was the same as in example 1.
The method of forming the solder resist by printing the development-resistant photosensitive solder resist material on the PCB is the same as that of example 1.
Example 3
A development-resistant photosensitive solder resist material includes the components in parts by weight shown in Table 1.
The preparation method of the photosensitive resin comprises the following steps: according to parts by weight, in a reaction vessel, heating 15 parts of acrylic acid, 40 parts of o-cresol formaldehyde epoxy resin, 40 parts of solvent, 0.2 part of catalyst and 0.3 part of hydroquinone to 100 ℃ for reaction at 110 ℃ for 8-12 hours, then adding 7 parts of anhydride for reaction at 105 ℃ for 4-6 hours, and then adding 1.5 parts of glycidyl methacrylate for reaction at 105 ℃ for 4-6 hours. The photosensitive resin with the acid value of 30-35mgKOH/g and the solid content of 60 percent is obtained.
The process for preparing the development-resistant photosensitive solder resist material was the same as in example 1.
The method of forming the solder resist by printing the violet-development-resistant photosensitive solder resist material on the PCB is the same as that of example 1.
Example 4
A development-resistant photosensitive solder resist material includes the components in parts by weight shown in Table 1.
The preparation method of the photosensitive resin comprises the following steps: according to the weight portion, 11 portions of acrylic acid, 45 portions of o-cresol formaldehyde epoxy resin, 38 portions of solvent, 0.2 portion of catalyst and 0.3 portion of hydroquinone are heated to 100 ℃ and 110 ℃ for reaction for 8 to 12 hours, then 8 portions of anhydride are added for reaction at 105 ℃ for 4 to 6 hours, and then 3.5 portions of glycidyl methacrylate are added for reaction at 105 ℃ for 4 to 6 hours. The photosensitive resin with the acid value of 30-35mgKOH/g and the solid content of 65 percent is obtained.
The process for preparing the development-resistant photosensitive solder resist material was the same as in example 1.
The method of forming the solder resist by printing the development-resistant photosensitive solder resist material on the PCB is the same as that of example 1.
Example 5
A development-resistant photosensitive solder resist material includes the components in parts by weight shown in Table 1.
The preparation method of the photosensitive resin comprises the following steps: according to the weight portion, 15 portions of acrylic acid, 40 portions of o-cresol formaldehyde epoxy resin, 35 portions of solvent, 0.2 portion of catalyst and 0.3 portion of hydroquinone are heated to 100 ℃ and 110 ℃ for reaction for 8 to 12 hours, then 8 portions of anhydride are added for reaction at 105 ℃ for 4 to 6 hours, and then 1.5 portions of glycidyl methacrylate are added for reaction at 105 ℃ for 4 to 6 hours. The photosensitive resin with the acid value of 30-35mgKOH/g and the solid content of about 65 percent is obtained.
The process for preparing the development-resistant photosensitive solder resist material was the same as in example 1.
The method of forming the solder resist by printing the development-resistant photosensitive solder resist material on the PCB is the same as that of example 1.
Comparative example 1
A photosensitive solder resist material comprising the components in parts by weight shown in Table 1.
The preparation method of the photosensitive resin comprises the following steps: heating 8 parts of acrylic acid, 45 parts of o-cresol formaldehyde epoxy resin, 35 parts of solvent, 0.2 part of catalyst and 0.3 part of hydroquinone to 100 ℃ for reaction for 8-12 hours, and then adding 11.5 parts of anhydride for reaction for 4-6 hours at 105 ℃ to obtain the photosensitive resin with the acid value of 55-65mgKOH/g and the solid content of 65%.
The process for preparing the development-resistant photosensitive solder resist material was the same as in example 1.
The method of forming the solder resist by printing the development-resistant photosensitive solder resist material on the PCB is the same as that of example 1.
TABLE 1 parts by weight of the components used in examples 1-5 and comparative example 1
The development-resistant photosensitive solder resist materials prepared in examples 1 to 5 and comparative example 1 were subjected to property measurement, and the results are shown in Table 2.
TABLE 2 measurement results of Properties of development-resistant photosensitive solder resist materials prepared in examples 1 to 5 and comparative example 1
Wherein, the developing conditions are as follows: examples 1 to 5 were a development time of 100 seconds and a development pressure of 1.5 to 2.0kg/cm2Comparative example 1, development time 55 seconds, development pressure 1.5-2.0kg/cm2.
The pencil hardness is detected according to GB/T6739-2006 "paint film hardness determined by colored paint and varnish pencil method"; the temperature resistance test is the temperature data which can be borne by the sample coated with the photosensitive solder resist material according to GB/T4677-2002 for 10 seconds and three times of solder resistance tests.
As can be seen from Table 2, the development-resistant photosensitive solder resist material prepared by the invention has good temperature resistance, acid and alkali resistance, high adhesion and development resistance. Compared with comparative example 1, each of the performances of examples 1 to 5 of the present invention is superior to that of comparative example 1.
The solder resists obtained in examples 1 to 5 and comparative example 1 were subjected to the following property measurement.
Adhesion: according to the test method of JISDO202, the cured film was cut into a 1mm × 1mm square lattice shape, and a peeling test was performed with 3M adhesive tape.
Solder resistance: according to the JJSC6481 test method, the test sample is soaked in the soldering flux, the three times of tin immersion is carried out in a solder furnace at 288 ℃ for 10 seconds, and the sample is observed.
And (3) testing acid resistance: at 10 vol% H2SO4Soaking for 20 minutes at room temperature.
Alkali resistance test: soak in 10 wt% NaOH at room temperature for 20 minutes.
And (3) insulation testing: taking a circuit board specified by IPC, and testing the electrical insulation property according to the cured film described in the method; wherein, the humidifying condition is as follows: the temperature is 85 ℃, the humidity is 85% RH, the voltage is applied for 500 hours at 100V, and the measurement conditions are as follows: the measurement time was 60 seconds, and the voltage was 500V.
The results of the measurement of the solder resist films of examples 1 to 5 and comparative example 1 are shown in the following table 3:
TABLE 3 measurement results of solder resists of examples 1 to 5 and comparative example 1
| Examples 1 to 5 | Comparative example 1 | |
| Resolution of development | Minimum resolution accuracy 50 micron | Minimum accuracy 77 micron |
| Adhesion Property | 100/100 has no shedding | Slight detachment |
| Resistance to soldering tin | No discoloration, no floating of the cured film, no peeling, and solder penetration | Slight detachment |
| Acid resistance test | Without peeling | Slight detachment |
| Alkali resistance test | Without peeling | Slight detachment |
| Insulation test | Insulation resistance value after humidification is 5 multiplied by 108Above no copper migration | Qualified |
As can be seen from Table 3, the solder resist film formed by printing the development-resistant photosensitive solder resist material prepared by the invention on a PCB has good acid and alkali resistance, high adhesion, soldering resistance, insulating property and development resistance. All the performances are better than those of the comparative example 1.
Claims (10)
1. The developing-resistant photosensitive solder resist material is characterized by comprising the following components in parts by weight:
the photosensitive resin is prepared by polymerizing acrylic acid and o-cresol formaldehyde epoxy resin, and reacting the obtained reaction product with anhydride and glycidyl methacrylate in sequence to obtain carboxyl and unsaturated groups on side chains.
2. The development-resistant photosensitive solder resist material according to claim 1, further comprising 1 to 4 parts by weight of a pigment and 1 to 5 parts by weight of an auxiliary.
3. The development-resistant photosensitive solder resist material according to claim 1 or 2, characterized in that the photosensitive resin is prepared by: according to the weight portion, 10-15 portions of acrylic acid, 40-45 portions of o-cresol formaldehyde epoxy resin, 35-45 portions of solvent, 0.2-0.8 portion of catalyst and 0.2-0.6 portion of hydroquinone are heated to 100-110 ℃ for reaction for 8-12 hours, then 6-8 portions of anhydride are added for reaction for 4-6 hours at 100-108 ℃, and then 1-4 portions of glycidyl methacrylate are added for continuous reaction for 4-6 hours, thus obtaining the photosensitive resin with the acid value of 25-35mgKOH/g and the solid content of 55-65 percent.
4. The development-resistant photosensitive solder resist material according to claim 1 or 2, wherein the polyester resin is a carboxyl group-containing polyester resin having an acid value of 25 to 35 mgKOH/g.
5. The development-resistant photosensitive solder resist material according to claim 1 or 2, wherein the acrylic monomer is one or more selected from trimethylolpropane triacrylate, di-pentaerythritol hexaacrylate and ethoxylated trimethylolpropane triacrylate.
6. The development-resistant photosensitive solder resist material according to claim 1 or 2, wherein the epoxy resin is selected from an o-cresol novolac epoxy resin or a bisphenol a novolac epoxy resin.
7. The development-resistant photosensitive solder resist material of claim 1, wherein the filler is selected from one or more of barium sulfate, talc and silica; the photoinitiator is selected from one or more of 2-methyl-1- (4-methylthiophenyl) -2-morpholine-1-acetone, 2-isopropyl thioxanthone, 2, 4-diethyl thioxanthone, 2,4, 6-trimethylbenzoyl-diphenylphosphine oxide and bis (2, 6-difluoro-3-pyrrolylphenyltitanocene); the solvent is selected from one or more of ketone solvent, ester solvent, ether solvent and petroleum solvent.
8. The development-resistant photosensitive solder resist material according to claim 2, wherein the auxiliary agent is one or more selected from a leveling agent, a defoaming agent and a dispersing agent; the pigment is selected from organic pigments or inorganic pigments.
9. The method for producing the development-resistant photosensitive solder resist material according to any one of claims 1 to 8, characterized by comprising the steps of:
1) mixing photosensitive resin, polyester resin, acrylic monomer, epoxy resin, photoinitiator, auxiliary agent, solvent, pigment and filler;
2) grinding to obtain the development-resistant photosensitive solder resist material.
10. The method for printing the development-resistant photosensitive solder mask material on the PCB to form the solder mask is characterized by comprising the following steps
1) Printing: diluting the development-resistant photosensitive solder resist material, and printing the diluted development-resistant photosensitive solder resist material on the surface of the PCB;
2) primary curing: drying the PCB printed in the step 1) to obtain a primary cured PCB;
3) exposure: cooling the PCB primarily cured in the step 2) into a dry film, and exposing to obtain an exposed PCB;
4) and (3) developing: developing the PCB exposed in the step 3) to obtain a developed PCB;
5) post-curing: and (4) curing the PCB developed in the step 4) to form the solder mask.
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| CN113126430A (en) * | 2019-12-31 | 2021-07-16 | 太阳油墨（苏州）有限公司 | Solder resist composition and printed wiring board having cured product thereof |
| WO2022151781A1 (en) * | 2021-01-12 | 2022-07-21 | 惠州市艾比森光电有限公司 | Matte solder mask ink, preparation method for led display module, and led display screen |
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