CN108882546B - Processing technology of circuit board with super-strong corrosion resistance - Google Patents
Processing technology of circuit board with super-strong corrosion resistance Download PDFInfo
- Publication number
- CN108882546B CN108882546B CN201810766853.4A CN201810766853A CN108882546B CN 108882546 B CN108882546 B CN 108882546B CN 201810766853 A CN201810766853 A CN 201810766853A CN 108882546 B CN108882546 B CN 108882546B
- Authority
- CN
- China
- Prior art keywords
- corrosion resistance
- ink
- corrosion
- copper surface
- super
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
- Paints Or Removers (AREA)
Abstract
The invention relates to a processing technology of a circuit board with super-strong corrosion resistance, which comprises the following steps: s1, adjusting a solder resist pretreatment mode, increasing the roughness of the board surface and enhancing the bonding force between the board surface and the printing ink; s2, upgrading the formula of the ink, and using the ink with super-strong corrosion resistance, so that the circuit board has super-strong corrosion resistance; s3, corrosion-retarding antioxidant liquid medicine is selected, the plate has a copper surface which is not covered by printing ink after being subjected to solder resistance, and when the plate reaches an antioxidant line, the corrosion resistance of the copper surface is ensured by selecting the corrosion-retarding antioxidant liquid medicine. The processing technology of the invention can lead the circuit board to have super-strong corrosion resistance, thereby prolonging the service life of the mainboard and ensuring the performance stability of the mainboard.
Description
Technical Field
The invention relates to a PCB processing technology, in particular to a processing technology of a circuit board with super-strong corrosion resistance.
Background
Electronic equipment can fail due to corrosion effect when being subjected to moisture or other severe weather environments, wherein the failure of a circuit board is one of the key factors of equipment failure, and the circuit board material is damaged and deteriorated due to corrosion, so that the electronic equipment fails in advance.
The factors influencing the corrosion of the circuit board of the electronic equipment comprise atmospheric corrosion, corrosion of various medicaments in the processing process, corrosion in the using process and other corrosion, and improvement needs to be carried out from the production process and raw materials in order to delay various corrosion.
Disclosure of Invention
In order to solve the technical problems, the invention provides a processing technology capable of obviously enhancing the corrosion resistance of a circuit board, and the invention provides the following technical scheme:
a processing technology of a circuit board with super corrosion resistance comprises the following steps:
s1, solder resist pretreatment: the resistance welding pretreatment comprises acid cleaning, plate grinding, sand blasting and micro-etching; the acid cleaning is used for removing oxides on the surface of the copper plate; the grinding plate is used for grinding the copper surface by adopting a 320# nylon grinding brush; the sand blasting is to wash the copper surface under high pressure by using 280# carborundum; the microetching treatment is to use hydrogen peroxide to coarsen the microetching agent to carry out secondary coarsening on the copper surface;
compared with the traditional solder resist pretreatment process, the solder resist pretreatment process provided by the invention increases two procedures of sand blasting and micro etching, and selects nylon with higher roughness to brush when a board is ground, so that the whole roughening process is finer, and the roughness of the copper surface is increased and the uniformity of the whole rough surface is improved.
S2, improving the formula of the ink, wherein the ink is compounded with the ink with super-strong corrosion resistance, and comprises the following components in percentage by mass: 17-18% of thermosetting water-soluble resin, 2.5-3.0% of curing agent A, 6.5-7.0% of acrylic resin, 0.5-0.8% of epoxy resin, 0.03-0.05% of curing agent B, 0.1-0.3% of rare earth complex nano luminescent material, 0.8-1% of initiator, 8-10% of titanium dioxide, 4-5% of barium sulfate, 0.0005% of toner and the balance of solvent;
compared with the traditional ink, the ink disclosed by the invention reduces the using amount of titanium dioxide, so that the production cost can be reduced, and the environmental pollution easily caused in the production process of the titanium dioxide is reduced; meanwhile, the rare earth complex nano luminescent material is matched with titanium dioxide, so that the acid and alkali corrosion resistance of the ink can be obviously improved;
s3, improving the formula of the corrosion-retarding antioxidant liquid medicine, wherein the improved formula comprises the following components in percentage by mass: 8-10% of corrosion inhibitor, 18-30% of composite surfactant system, 15-20% of ion chelating agent, 5-8% of pH regulator, 25-35% of builder and the balance of pure water;
the corrosion-retarding antioxidant liquid medicine disclosed by the invention is prepared by compounding the composite surfactant and the ion chelating agent, so that the antioxidant performance of the liquid medicine can be greatly improved.
Further, in the step S1, the secondary roughening temperature is controlled to be 60-70 ℃, and the hydrogen peroxide roughening microetching agent used in the secondary roughening has quicker microetching and better effect at higher temperature; compared with the traditional normal temperature micro-etching, the method has obvious advantages.
Further, the ink in step S2 further includes 1.2-2.5% of calcium bicarbonate and 0.1-0.2% of benzoic acid. The calcium bicarbonate and the benzoic acid exist as antioxidant synergists in the formula of the ink, and the compatibility of the calcium bicarbonate and the benzoic acid can obviously improve the antioxidant effect.
Further, in the step S3, the composite surfactant system is formed by compounding sodium carbonate, a quaternary ammonium type cationic surfactant, a deflocculant, and an acrylic acid copolymer.
The invention has the beneficial effects that:
1. the anti-welding pretreatment process is added, and the roughness and uniformity of the copper surface are increased through polishing in different times, so that the binding force between the plate surface and the printing ink is enhanced;
2. the printing ink with super acid and alkali corrosion resistance is used, so that the circuit board has super corrosion resistance;
3. the corrosion-retarding antioxidant liquid medicine is selected, the copper surface which is not covered by the printing ink can be formed on the plate after the plate is subjected to solder resist, and the corrosion resistance of the copper surface can be achieved by selecting the corrosion-retarding antioxidant liquid medicine when the plate reaches the antioxidant line.
Detailed Description
Examples 1,
A processing technology of a circuit board with super corrosion resistance comprises the following steps:
s1, solder resist pretreatment: the resistance welding pretreatment comprises acid cleaning, plate grinding, sand blasting and micro-etching; the acid cleaning is used for removing oxides on the surface of the copper plate; the grinding plate is used for grinding the copper surface by adopting a 320# nylon grinding brush; the sand blasting is to wash the copper surface under high pressure by using 280# carborundum; the microetching treatment is to use hydrogen peroxide to coarsen the microetching agent to carry out secondary coarsening on the copper surface; in the step S1, the secondary roughening temperature is controlled to be 60-70 ℃, and the hydrogen peroxide roughening microetching agent used in the secondary roughening has quicker microetching and better effect at higher temperature; compared with the traditional normal temperature micro-etching, the method has obvious advantages.
Compared with the traditional solder resist pretreatment process, the solder resist pretreatment process provided by the invention increases two procedures of sand blasting and micro etching, and selects nylon with higher roughness to brush when a board is ground, so that the whole roughening process is finer, and the roughness of the copper surface is increased and the uniformity of the whole rough surface is improved.
S2, improving the formula of the ink, wherein the ink is compounded with the ink with super-strong corrosion resistance, and comprises the following components in percentage by mass: 17-18% of thermosetting water-soluble resin, 2.5-3.0% of curing agent A, 6.5-7.0% of acrylic resin, 0.5-0.8% of epoxy resin, 0.03-0.05% of curing agent B, 0.1-0.3% of rare earth complex nano luminescent material, 0.8-1% of initiator, 8-10% of titanium dioxide, 4-5% of barium sulfate, 0.0005% of toner and the balance of solvent; the ink in step S2 further comprises 1.2-2.5% of calcium bicarbonate and 0.1-0.2% of benzoic acid. The calcium bicarbonate and the benzoic acid exist as antioxidant synergists in the formula of the ink, and the compatibility of the calcium bicarbonate and the benzoic acid can obviously improve the antioxidant effect.
Compared with the traditional ink, the ink disclosed by the invention reduces the using amount of titanium dioxide, so that the production cost can be reduced, and the environmental pollution easily caused in the production process of the titanium dioxide is reduced; meanwhile, the rare earth complex nano luminescent material is matched with titanium dioxide, so that the acid and alkali corrosion resistance of the ink can be obviously improved;
s3, improving the formula of the corrosion-retarding antioxidant liquid medicine, wherein the improved formula comprises the following components in percentage by mass: 8-10% of corrosion inhibitor, 18-30% of composite surfactant system, 15-20% of ion chelating agent, 5-8% of pH regulator, 25-35% of builder and the balance of pure water; the composite surfactant system in the step S3 is formed by compounding sodium carbonate, quaternary ammonium type cationic surfactant, deflocculant and acrylic acid copolymer.
The corrosion-retarding antioxidant liquid medicine disclosed by the invention is prepared by compounding the composite surfactant and the ion chelating agent, so that the antioxidant performance of the liquid medicine can be greatly improved.
The PCB prepared by the processing technology of the invention has no corrosion on the surface after 240h of damp-heat experiment, does not turn green when being soaked in concentrated nitric acid at 20 +/-2 ℃ for 8min, and has super corrosion resistance.
In light of the foregoing description of the preferred embodiment of the present invention, many modifications and variations will be apparent to those skilled in the art without departing from the spirit and scope of the invention. The technical scope of the present invention is not limited to the content of the specification, and must be determined according to the scope of the claims.
Claims (4)
1. A processing technology of a circuit board with corrosion resistance is characterized by comprising the following steps:
s1, solder resist pretreatment: the resistance welding pretreatment comprises acid cleaning, plate grinding, sand blasting and micro-etching; the acid cleaning is used for removing oxides on the surface of the copper plate; the grinding plate is used for grinding the copper surface by adopting a 320# nylon grinding brush; the sand blasting is to wash the copper surface under high pressure by using 280# carborundum; the microetching treatment is to use hydrogen peroxide to coarsen the microetching agent to carry out secondary coarsening on the copper surface;
s2, improving the formula of the ink, wherein the ink comprises the following components in percentage by mass: 17-18% of thermosetting water-soluble resin, 2.5-3.0% of curing agent A, 6.5-7.0% of acrylic resin, 0.5-0.8% of epoxy resin, 0.03-0.05% of curing agent B, 0.1-0.3% of rare earth complex nano luminescent material, 0.8-1% of initiator, 8-10% of titanium dioxide, 4-5% of barium sulfate, 0.0005% of toner and the balance of solvent;
s3, improving the formula of the corrosion-retarding antioxidant liquid medicine, wherein the improved formula comprises the following components in percentage by mass: 8-10% of corrosion inhibitor, 18-30% of composite surfactant system, 15-20% of ion chelating agent, 5-8% of pH regulator, 25-35% of builder and the balance of pure water; the board has a copper surface which is not covered by the printing ink after being subjected to solder resistance, and the corrosion resistance of the copper surface is achieved by selecting the corrosion-retarding antioxidant liquid medicine when the board reaches the antioxidant line.
2. The process for manufacturing a wiring board having corrosion resistance according to claim 1, wherein: in step S1, the temperature of the secondary coarsening is controlled to be 60-70 ℃.
3. The process for manufacturing a wiring board having corrosion resistance according to claim 1, wherein: the ink in step S2 further comprises 1.2-2.5% of calcium bicarbonate and 0.1-0.2% of benzoic acid.
4. The process for manufacturing a wiring board having corrosion resistance according to claim 1, wherein: the composite surfactant system in the step S3 is formed by compounding sodium carbonate, quaternary ammonium type cationic surfactant, deflocculant and acrylic acid copolymer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810766853.4A CN108882546B (en) | 2018-07-13 | 2018-07-13 | Processing technology of circuit board with super-strong corrosion resistance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810766853.4A CN108882546B (en) | 2018-07-13 | 2018-07-13 | Processing technology of circuit board with super-strong corrosion resistance |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108882546A CN108882546A (en) | 2018-11-23 |
| CN108882546B true CN108882546B (en) | 2020-12-01 |
Family
ID=64301335
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810766853.4A Active CN108882546B (en) | 2018-07-13 | 2018-07-13 | Processing technology of circuit board with super-strong corrosion resistance |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108882546B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109890140B (en) * | 2019-03-09 | 2020-12-15 | 信丰福昌发电子有限公司 | Processing technology of circuit board with low corrosion resistance and low loss |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102076792A (en) * | 2009-05-11 | 2011-05-25 | 录象射流技术公司 | Thermal ink jet ink composition |
| CN104693894A (en) * | 2015-03-26 | 2015-06-10 | 广东三水大鸿制釉有限公司 | Anion ink for ink jet printing and preparation method and coating method thereof |
| CN104918417A (en) * | 2015-05-15 | 2015-09-16 | 江门崇达电路技术有限公司 | Method for producing organic solderability preservative on surface of circuit board |
| CN106380929A (en) * | 2016-08-30 | 2017-02-08 | 江门市阪桥电子材料有限公司 | UV-cured liquid photosensitive solder resist soft board printing ink and preparation method thereof |
| CN106398393A (en) * | 2016-08-31 | 2017-02-15 | 江门市阪桥电子材料有限公司 | Thermally curable white solder-resist material and preparation method thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20140154808A1 (en) * | 2012-12-03 | 2014-06-05 | Gordhanbhai N. Patel | Monitoring system based on etching of metals |
-
2018
- 2018-07-13 CN CN201810766853.4A patent/CN108882546B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102076792A (en) * | 2009-05-11 | 2011-05-25 | 录象射流技术公司 | Thermal ink jet ink composition |
| CN104693894A (en) * | 2015-03-26 | 2015-06-10 | 广东三水大鸿制釉有限公司 | Anion ink for ink jet printing and preparation method and coating method thereof |
| CN104918417A (en) * | 2015-05-15 | 2015-09-16 | 江门崇达电路技术有限公司 | Method for producing organic solderability preservative on surface of circuit board |
| CN106380929A (en) * | 2016-08-30 | 2017-02-08 | 江门市阪桥电子材料有限公司 | UV-cured liquid photosensitive solder resist soft board printing ink and preparation method thereof |
| CN106398393A (en) * | 2016-08-31 | 2017-02-15 | 江门市阪桥电子材料有限公司 | Thermally curable white solder-resist material and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108882546A (en) | 2018-11-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TW200940747A (en) | Etching composition for copper-containing materials | |
| CN108882546B (en) | Processing technology of circuit board with super-strong corrosion resistance | |
| KR102192353B1 (en) | Method for forming circuits using selective etching of electroconductive metal thin film seed layer and etchant composition | |
| CN101962775B (en) | Sulfuric acid/hydrogen peroxide microetchant stabilizer and preparation method thereof | |
| US6830627B1 (en) | Copper cleaning compositions, processes and products derived therefrom | |
| CN108359990A (en) | A kind of alkaline etching liquid and its recycling method | |
| CN103695908A (en) | Novel organic alkali micro-etching solution | |
| CN106221633A (en) | A kind of hole conductive glue and preparation method thereof | |
| WO2021258509A1 (en) | Circuit board processing method for decreasing galvanic effect | |
| JPH0415635B2 (en) | ||
| WO2011043881A1 (en) | Nickel-chromium alloy stripper for flexible wiring boards | |
| CA1336273C (en) | Desmear and etchback of printed circuit boards using an nf_/o_ plasma gas mixture | |
| CN101760200A (en) | Alkaline etching solution | |
| CN109890140B (en) | Processing technology of circuit board with low corrosion resistance and low loss | |
| CN110461104A (en) | A kind of wiring board roughening treatment agent | |
| CN107683025B (en) | Manufacturing method of PCB with same layer surface and non-uniform copper thickness | |
| CN105376927A (en) | A PTFE product hole wall machining method | |
| CN111372379A (en) | Manufacturing method for improving hole diameter precision of PTH hole | |
| CN108377615B (en) | Copper surface bonding solution for PCB pattern transfer pretreatment process | |
| WO2005059057A3 (en) | Additives to stop copper attack by alkaline etching agents such as ammonia and monoethanol amine (mea) | |
| JP2007002121A (en) | Epoxy adhesive, cover lay, prepreg, metal-clad laminate, printed circuit substrate | |
| CN113973440B (en) | Circuit board insulating layer treatment process | |
| JP4069387B2 (en) | Etching solution | |
| CN106279746A (en) | High viscosity modification PI film | |
| TW200516177A (en) | Improved methods of cleaning copper surfaces in the manufacture of printed circuit boards |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: No. 1801, Tongjiang Avenue, Xinbei District, Changzhou, Jiangsu province (Electronic Industrial Park) Applicant after: Changzhou Aohong Electronics Co.,Ltd. Address before: No. 1801, Tongjiang Avenue, Xinbei District, Changzhou, Jiangsu province (Electronic Industrial Park) Applicant before: CHANGZHOU AOHONG ELECTRONICS Co.,Ltd. |
|
| CB02 | Change of applicant information | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |