CN106221633A - A kind of hole conductive glue and preparation method thereof - Google Patents
A kind of hole conductive glue and preparation method thereof Download PDFInfo
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- CN106221633A CN106221633A CN201610689766.4A CN201610689766A CN106221633A CN 106221633 A CN106221633 A CN 106221633A CN 201610689766 A CN201610689766 A CN 201610689766A CN 106221633 A CN106221633 A CN 106221633A
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- glue
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- hole conductive
- conductive glue
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- 239000003292 glue Substances 0.000 title claims abstract description 89
- 238000002360 preparation method Methods 0.000 title claims abstract description 31
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 claims abstract description 30
- 239000002994 raw material Substances 0.000 claims abstract description 24
- 229910000029 sodium carbonate Inorganic materials 0.000 claims abstract description 15
- 238000000034 method Methods 0.000 claims abstract description 13
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 claims abstract description 11
- 239000004327 boric acid Substances 0.000 claims abstract description 11
- 239000012286 potassium permanganate Substances 0.000 claims abstract description 11
- 239000003822 epoxy resin Substances 0.000 claims abstract description 10
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 10
- 238000006243 chemical reaction Methods 0.000 claims abstract description 9
- 239000000203 mixture Substances 0.000 claims abstract description 9
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims abstract description 8
- 239000001117 sulphuric acid Substances 0.000 claims abstract description 8
- 235000011149 sulphuric acid Nutrition 0.000 claims abstract description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 56
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 claims description 14
- 238000004140 cleaning Methods 0.000 claims description 6
- 230000005611 electricity Effects 0.000 claims description 5
- 238000005406 washing Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 239000000463 material Substances 0.000 abstract description 3
- 230000001737 promoting effect Effects 0.000 abstract description 2
- 239000000243 solution Substances 0.000 description 7
- 239000011347 resin Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000011231 conductive filler Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000007613 environmental effect Effects 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 2
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 2
- 238000001723 curing Methods 0.000 description 2
- 229910001385 heavy metal Inorganic materials 0.000 description 2
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000000016 photochemical curing Methods 0.000 description 2
- 238000004064 recycling Methods 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 241000500881 Lepisma Species 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N SnO2 Inorganic materials O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 239000012752 auxiliary agent Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 238000004513 sizing Methods 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000011345 viscous material Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
- C08K3/26—Carbonates; Bicarbonates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
- C08K3/26—Carbonates; Bicarbonates
- C08K2003/262—Alkali metal carbonates
Abstract
The present invention relates to Material Field, be specifically related to a kind of hole conductive glue and preparation method thereof, raw material includes: raw material glue, potassium permanganate, sodium carbonate and boric acid；Described raw material glue is epoxy resin and toner mixture.By by raw material glue at 45 55 DEG C, pH value be 10 11,4.5 5.5g/L sodium carbonate in do whole hole process, clean, obtain glue 1；At 85 90 DEG C, pH value is in the boric acid solution of 67, adds glue 1, reacts 3 5min, cleans, obtains glue 2；By glue 2, potassium permanganate and sulphuric acid at 16 22 DEG C, pH value is 1.8 2.2 times reaction 3 5min, cleans, dries, obtain hole conductive glue.The preparation method of the present invention is simple, and production efficiency is high, the hole conductive glue stay in grade of preparation, and excellent performance, significant to the application development promoting conducting resinl.
Description
Technical field
The present invention relates to Material Field, be specifically related to a kind of hole conductive glue and preparation method thereof.
Background technology
Conducting resinl is a kind of adhesive solidifying or having after drying certain electric conductivity, and it is generally with matrix resin and leading
Electricity filler i.e. conducting particles, for mainly comprising composition, is combined conducting particles by the bonding effect of matrix resin,
Form conductive path, it is achieved by being conductively connected of viscous material.Owing to the matrix resin of conducting resinl is a kind of adhesive, Ke Yixuan
Select suitable solidification temperature and carry out bonding, simultaneously as the miniaturization of electronic component, miniaturization and printed circuit board (PCB) is highly dense
Degreeization develops rapidly with Highgrade integration, and conducting resinl can make slurry, it is achieved the highest linear resolution.And conduct electricity
Adhesive process is simple, it is easy to operation, can improve production efficiency, so conducting resinl is to substitute slicker solder welding, it is achieved be conductively connected
Ideal chose.
China Patent Publication No. CN105754515A disclose a kind of degradable reclaim epoxy conducting and preparation and
Degradation recycling method, the percentage by weight accounted for by each component includes following raw material: epoxy resin 15～30%, firming agent 1～
10%, reaction diluent 0.1～2% and conductive filler 15～85%, described firming agent comprises the molecular structure that can rupture.This
Bright epoxy conducting is by the epoxy curing agent of the recyclable degraded of application specific molecular structure, to the ring in conducting resinl
After epoxy resins solidifies, can normal pressure, gentleness and specific under the conditions of degrade, not only operation is simple and convenient to operate, and
Environmental protection, greatly reduces cost recovery, and the recycling for conducting resinl has huge economy and environmental advantage.
China Patent Publication No. CN105733469A discloses conducting resinl of a kind of photocuring and preparation method thereof, and it includes
The raw material of following parts by weight: photosensitive resin sizing 15 ~ 30 parts, conductive filler 40 ~ 80 parts, activated monomer auxiliary agent 3 ~ 10 parts, light
Initiator 1 ~ 2 part, light curing agent 1 ~ 3 part, activity dilution cross-linking agent 8 ~ 20 parts, plasticization modifier 3 ~ 8 parts；Described photosensitive resin glues
Material is two functional aliphatic's polyurethane acrylic resins, polyoxyalkylene acrylate resin；Described conductive filler is nanoscale SnO2Micropowder
And Nano silver grain；The present invention discloses the preparation method of the conducting resinl of a kind of photocuring.
Existing conducting resinl, also exists preparation cost high, and production efficiency is low, uses formaldehyde or metal substances in preparation process
Matter is big to environmental hazard.Therefore, the present invention provide that a kind of production efficiency is high, preparation technology is simple, low cost and environmentally friendly
Hole conductive glue and preparation method thereof.
Summary of the invention
It is an object of the invention to solve above technical problem, it is provided that a kind of hole conductive glue and preparation method thereof, the party
Method can complete preparation technology at 15-20min, shortens preparation time, improves production efficiency, and hole conductive glue does not contains
Formaldehyde, cyanide and heavy metal, environmentally friendly.
For solve the problems referred to above, the present invention by the following technical solutions:
A kind of hole conductive glue, forms in parts by weight including following raw material:
Raw material glue 60-100 part；
Potassium permanganate 1.0-5.0 part；
Sodium carbonate 0.5-2.0 part；
Boric acid 0.5-3.0 part；
Described raw material glue is epoxy resin and toner mixture.
The preparation method of above-mentioned hole conductive glue, it is characterised in that comprise the following steps:
(1) by raw material glue at 45-55 DEG C, pH value be 10-11,4.5-5.5g/L sodium carbonate in do whole hole process, clean, obtain
Glue 1；
(2) at 85-90 DEG C, pH value is in the boric acid solution of 6-7, adds glue 1, reacts 3-5min, cleans, obtains glue 2；
(3) by glue 2, potassium permanganate and sulphuric acid at 16-22 DEG C, pH value is reaction 3-5min under 1.8-2.2, cleans, and dries, obtains
Hole conductive glue.
Further, described sodium carbonate is AR level sodium carbonate.
Further, in described step (1), cleaning cleans at least 2 times by pure water.
Further, cleaning and clean once by pure water in described step (2), city's water cleans at least 2 times.
Further, described step (3) is cleaned by city's water cleaning at least 2 times.
Further, described pure electrical conductivity of water≤10 μ S/cm, pH value 5-8, flow 5-20L/min, pressure 1.5-
2kg/cm2, chloride ion 0.1-10 ppm in pure water.
Further, described city electrical conductivity of water≤100 μ S/cm, pH value 5-8, flow 10-20L/min, pressure 1.5-
2kg/cm2, chloride ion 0.1-30 ppm in city's water.
Further, the temperature dried in described step (3) is 65-75 DEG C.
Further, it is aided with ultrasonic waves for cleaning during described step (1)-(3) being cleaned.
One hole conductive glue of the present invention and preparation method thereof, compared with prior art, its prominent feature and excellence
Effect is:
1. the method for the present invention can complete preparation technology at 15-20min, shortens preparation time, improves production efficiency.
2. the hole conductive glue of the present invention is without formaldehyde, cyanide and heavy metal, environmentally friendly.
3. the preparation method of the present invention is simple, the hole conductive glue stay in grade of preparation, and excellent performance, to promoting to lead
The application development of electricity glue is significant.
Detailed description of the invention
Below by way of detailed description of the invention, the present invention is described in further detail, but this should be interpreted as the present invention
Scope be only limitted to Examples below.In the case of without departing from said method thought of the present invention, according to ordinary skill
Various replacements that knowledge and customary means are made or change, should be included in the scope of the present invention.
Embodiment 1
A kind of hole conductive glue:
(1) by raw material glue at 45-55 DEG C, pH value is 11, does whole hole and process in the AR level sodium carbonate of 5.5g/L, and pure water cleans extremely
Few 2 times, obtain glue 1；
(2) at 85-90 DEG C, pH value is in the boric acid solution of 7, adds glue 1, reacts 5min, and pure water cleans once, and city's water cleans extremely
Few 2 times, obtain glue 2；
(3) by glue 2, potassium permanganate and sulphuric acid at 16-22 DEG C, pH value is 2.2 times reaction 5min, and city's water cleans at least 2 times,
Dry at 65-75 DEG C, obtain hole conductive glue；
Described raw material glue is epoxy resin and toner mixture, pure electrical conductivity of water 5 μ S/cm, pH value 8, flow 20L/min, pressure
Power 2kg/cm2, chloride ion 5ppm in pure water；Described city electrical conductivity of water 24 μ S/cm, pH value 8, flow 20L/min, pressure
2kg/cm2, chloride ion 7 ppm in city's water.
Embodiment 2
A kind of hole conductive glue:
(1) by raw material glue at 45-55 DEG C, pH value is 10.5, does whole hole and process in the AR level sodium carbonate of 4.9g/L, and pure water cleans 4
Secondary, obtain glue 1；
(2) at 85-90 DEG C, pH value is in the boric acid solution of 6.5, adds glue 1, reacts 4min, and pure water cleans once, and city's water cleans
3 times, obtain glue 2；
(3) by glue 2, potassium permanganate and sulphuric acid at 16-22 DEG C, pH value is 2.0 times reaction 3.5min, and city's water cleans 2 times, at 65-
Dry at 75 DEG C, obtain hole conductive glue；
Described raw material glue is epoxy resin and toner mixture, pure electrical conductivity of water 10 μ S/cm, pH value 6.5, flow 8L/min,
Pressure 1.8kg/cm2, chloride ion 10 ppm in pure water；Described city electrical conductivity of water 100 μ S/cm, pH value 7, flow 12L/min,
Pressure 1.6kg/cm2, chloride ion 30 ppm in city's water.
Embodiment 3
A kind of hole conductive glue:
(1) by raw material glue at 45-55 DEG C, pH value is 10, does whole hole and process in the AR level sodium carbonate of 4.5g/L, and pure water cleans at least
2 times, obtain glue 1；
(2) at 85-90 DEG C, pH value is in the boric acid solution of 6, adds glue 1, reacts 3min, and pure water cleans once, and city's water cleans extremely
Few 2 times, obtain glue 2；
(3) by glue 2, potassium permanganate and sulphuric acid at 16-22 DEG C, pH value is 1.8 times reaction 3min, and city's water cleans at least 2 times,
Dry at 65-75 DEG C, obtain hole conductive glue；
Described raw material glue is epoxy resin and toner mixture, pure electrical conductivity of water 8 μ S/cm, pH value 5, flow 5L/min, pressure
Power 1.5kg/cm2, chloride ion 6 ppm in pure water；Described city electrical conductivity of water 11 μ S/cm, pH value 5, flow 10L/min, pressure
1.5kg/cm2, chloride ion 20 ppm in city's water.
Embodiment 4
A kind of hole conductive glue:
(1) by raw material glue at 45-55 DEG C, pH value is 10.2, does whole hole and process in the AR level sodium carbonate of 5.2g/L, and pure water cleans 2
Secondary, obtain glue 1；
(2) at 85-90 DEG C, pH value is in the boric acid solution of 6.6, adds glue 1, reacts 4.5min, and pure water cleans once, and city's water is clear
Wash 4 times, obtain glue 2；
(3) by glue 2, potassium permanganate and sulphuric acid at 16-22 DEG C, pH value is 2.1 times reaction 4.5min, and city's water cleans 3 times, at 65-
Dry at 75 DEG C, obtain hole conductive glue；
Described raw material glue is epoxy resin and toner mixture, pure electrical conductivity of water 0.1 μ S/cm, pH value 6.4, flow 7L/
Min, pressure 1.8kg/cm2, chloride ion 0.1ppm in pure water；Described city electrical conductivity of water 0.1 μ S/cm, pH value 7.2, flow
13L/min, pressure 1.7kg/cm2, chloride ion 0.1 ppm in city's water.
Embodiment 5
A kind of hole conductive glue:
(1) by raw material glue at 45-55 DEG C, pH value is 10.6, does whole hole and process in the AR level sodium carbonate of 4.6g/L, and pure water cleans 4
Secondary, obtain glue 1；
(2) at 85-90 DEG C, pH value is in the boric acid solution of 6.6, adds glue 1, reacts 4.5min, and pure water cleans once, and city's water is clear
Wash 3 times, obtain glue 2；
(3) by glue 2, potassium permanganate and sulphuric acid at 16-22 DEG C, pH value is 1.9 times reaction 4min, and city's water cleans 3 times, at 65-75
Dry at DEG C, obtain hole conductive glue；
Described raw material glue is epoxy resin and toner mixture, pure electrical conductivity of water 0.1 μ S/cm, pH value 6.4, flow 7L/
Min, pressure 1.8kg/cm2, chloride ion 0.1ppm in pure water；Described city electrical conductivity of water 0.1 μ S/cm, pH value 7.2, flow
13L/min, pressure 1.7kg/cm2, chloride ion 0.1 ppm in city's water, it is aided with super during described step (1)-(3) are cleaned
Sound wave cleans.
Claims (10)
1. a hole conductive glue, it is characterised in that include that following raw material forms in parts by weight:
Raw material glue 60-100 part；
Potassium permanganate 1.0-5.0 part；
Sodium carbonate 0.5-2.0 part；
Boric acid 0.5-3.0 part；
Described raw material glue is epoxy resin and toner mixture.
The preparation method of hole conductive glue the most according to claim 1, it is characterised in that comprise the following steps:
(1) by raw material glue at 45-55 DEG C, pH value be 10-11,4.5-5.5g/L sodium carbonate in do whole hole process, clean, obtain
Glue 1；
(2) at 85-90 DEG C, pH value is in the boric acid solution of 6-7, adds glue 1, reacts 3-5min, cleans, obtains glue 2；
(3) by glue 2, potassium permanganate and sulphuric acid at 16-22 DEG C, pH value is reaction 3-5min under 1.8-2.2, cleans, and dries, obtains
Hole conductive glue.
The preparation method of a kind of hole conductive glue the most according to claim 2, it is characterised in that described sodium carbonate is AR level
Sodium carbonate.
The preparation method of a kind of hole conductive glue the most according to claim 2, it is characterised in that clear in described step (1)
Wash and clean at least 2 times by pure water.
The preparation method of a kind of hole conductive glue the most according to claim 2, it is characterised in that clear in described step (2)
Washing and clean once by pure water, city's water cleans at least 2 times.
The preparation method of a kind of hole conductive glue the most according to claim 2, it is characterised in that clear in described step (3)
Wash and cleaned at least 2 times by city's water.
7. according to the preparation method of a kind of hole conductive glue described in claim 4 or 5, it is characterised in that the electricity of described pure water
Conductance 0.1-10 μ S/cm, pH value 5-8, flow 5-20L/min, pressure 1.5-2kg/cm2, chloride ion 0.1-10ppm in pure water.
8. according to the preparation method of a kind of hole conductive glue described in claim 5 or 6, it is characterised in that the electricity of described city water
Conductance 0.1-100 μ S/cm, pH value 5-8, flow 10-20L/min, pressure 1.5-2kg/cm2, chloride ion 0.1-30 in city's water
ppm。
The preparation method of a kind of hole conductive glue the most according to claim 2, it is characterised in that dry in described step (3)
Dry temperature is 65-75 DEG C.
The preparation method of a kind of hole conductive glue the most according to claim 2, it is characterised in that described step (1)-(3)
It is aided with ultrasonic waves for cleaning during middle cleaning.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201610689766.4A CN106221633B (en) | 2016-08-19 | 2016-08-19 | A kind of hole conductive glue and preparation method thereof |
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| CN201610689766.4A CN106221633B (en) | 2016-08-19 | 2016-08-19 | A kind of hole conductive glue and preparation method thereof |
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| CN106221633B CN106221633B (en) | 2019-03-19 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106752998A (en) * | 2016-12-30 | 2017-05-31 | 芜湖研高粘胶新材料有限公司 | Without base material bond plies |
| CN106811165A (en) * | 2016-12-29 | 2017-06-09 | 芜湖研高粘胶新材料有限公司 | A kind of high performance polyurethane fluid sealant |
| CN106833419A (en) * | 2016-12-30 | 2017-06-13 | 芜湖研高粘胶新材料有限公司 | A kind of two-sided difference type adhesive tape and its production method |
| CN106833467A (en) * | 2016-12-29 | 2017-06-13 | 芜湖研高粘胶新材料有限公司 | A kind of electrical apparatus insulation fluid sealant |
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| CN102120918A (en) * | 2010-01-09 | 2011-07-13 | 爱克工业株式会社 | Adhesive composition |
| CN105860871A (en) * | 2016-06-20 | 2016-08-17 | 王璐 | LED (light-emitting diode) display screen adhesive |
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Patent Citations (2)
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| CN102120918A (en) * | 2010-01-09 | 2011-07-13 | 爱克工业株式会社 | Adhesive composition |
| CN105860871A (en) * | 2016-06-20 | 2016-08-17 | 王璐 | LED (light-emitting diode) display screen adhesive |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106811165A (en) * | 2016-12-29 | 2017-06-09 | 芜湖研高粘胶新材料有限公司 | A kind of high performance polyurethane fluid sealant |
| CN106833467A (en) * | 2016-12-29 | 2017-06-13 | 芜湖研高粘胶新材料有限公司 | A kind of electrical apparatus insulation fluid sealant |
| CN106752998A (en) * | 2016-12-30 | 2017-05-31 | 芜湖研高粘胶新材料有限公司 | Without base material bond plies |
| CN106833419A (en) * | 2016-12-30 | 2017-06-13 | 芜湖研高粘胶新材料有限公司 | A kind of two-sided difference type adhesive tape and its production method |
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| CN106221633B (en) | 2019-03-19 |
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