CN113840466A - LED lamp panel and manufacturing method thereof - Google Patents
LED lamp panel and manufacturing method thereof Download PDFInfo
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- CN113840466A CN113840466A CN202111116135.0A CN202111116135A CN113840466A CN 113840466 A CN113840466 A CN 113840466A CN 202111116135 A CN202111116135 A CN 202111116135A CN 113840466 A CN113840466 A CN 113840466A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 30
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 40
- 229910000679 solder Inorganic materials 0.000 claims abstract description 40
- 229910052802 copper Inorganic materials 0.000 claims abstract description 39
- 239000010949 copper Substances 0.000 claims abstract description 39
- 238000011161 development Methods 0.000 claims abstract description 22
- 238000000034 method Methods 0.000 claims abstract description 16
- 238000009713 electroplating Methods 0.000 claims abstract description 8
- 238000005553 drilling Methods 0.000 claims abstract description 7
- 230000008021 deposition Effects 0.000 claims abstract description 6
- 238000000227 grinding Methods 0.000 claims abstract description 5
- 238000004381 surface treatment Methods 0.000 claims abstract description 4
- 238000000465 moulding Methods 0.000 claims abstract description 3
- 238000001723 curing Methods 0.000 claims description 10
- 238000007650 screen-printing Methods 0.000 claims description 9
- 238000007639 printing Methods 0.000 claims description 7
- 238000000151 deposition Methods 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 238000011049 filling Methods 0.000 claims description 4
- 238000005520 cutting process Methods 0.000 claims description 3
- 238000012545 processing Methods 0.000 claims description 3
- 238000001029 thermal curing Methods 0.000 claims description 3
- 238000006087 Brown hydroboration reaction Methods 0.000 claims description 2
- 239000011347 resin Substances 0.000 abstract description 10
- 229920005989 resin Polymers 0.000 abstract description 10
- 229920001187 thermosetting polymer Polymers 0.000 abstract description 6
- 229910052751 metal Inorganic materials 0.000 abstract description 3
- 239000002184 metal Substances 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 32
- 238000005530 etching Methods 0.000 description 7
- 230000007547 defect Effects 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000004806 packaging method and process Methods 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 239000002274 desiccant Substances 0.000 description 1
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The invention discloses an LED lamp panel and a manufacturing method thereof, wherein the manufacturing method comprises the following steps: a core plate is formed, wherein one surface of the core plate is a front surface, and the other surface of the core plate is a back surface; drilling through holes on the core plate, and then sequentially performing copper deposition and full-plate electroplating to metalize the through holes; adopting solder resist ink to perform hole plugging treatment on the front surface of the core plate, and controlling the hole plugging plumpness to be 40-70%; then pre-curing the solder resist ink by pre-baking; curing the solder resist ink sequentially through exposure, development and thermosetting treatment; during exposure, the front side of the core plate is fully exposed, the back side of the core plate is exposed only at the position corresponding to the through hole, and the exposure size on the back side is smaller than that of the through hole; flattening the board surface by grinding the board; and the core board is sequentially subjected to outer layer circuit manufacturing, solder mask manufacturing, surface treatment and molding treatment to obtain the LED lamp panel. The method uses the solder resist photosensitive ink to replace the conventional thermosetting resin hole plugging, removes the residual ink on the hole wall through ink exposure and development, and ensures the metal property of the hole wall.
Description
Technical Field
The invention relates to the technical field of printed circuit board manufacturing, in particular to an LED lamp panel and a manufacturing method thereof.
Background
The LED display screen is a display screen which is formed by uniformly arranging tens of thousands to hundreds of thousands of semiconductor light-emitting diode pixel points by controlling the display mode of the semiconductor light-emitting diode so as to display various information such as characters, graphs, images, animation, quotation, videos, video signals and the like. The LED display screen overcomes the problem that the traditional LCD screen can not realize large-area seamless splicing, has remarkable advantages in the aspects of brightness, color gamut and the like, is developed rapidly since the advent, becomes a mainstream screen in the market at present, has the potential of replacing an LCD panel, and is expected to widen the application field of the LED display screen in the future and increase the demand of the LED display screen along with the further improvement and development of the social informatization process.
The Printed Circuit Board (PCB) is an important part of the LED display screen, the LED display screen is composed of small LED lamp group modules which are attached on PADs (PAD) which are arranged on the surface of the PCB in a specific rule one by one, and meanwhile, the other surface of the PCB is required to be attached with a plurality of IC core boards for forming patterns and pictures with bright colors on the large LED screen.
The existing customer requires to design a double-sided LED lamp panel, wherein one side of the double-sided LED lamp panel is designed with high-density PADs which are regularly arranged and used for mounting semiconductor light-emitting diodes; and a highly dense circuit and a PAD are designed on the other surface of the substrate for mounting an IC core board, and an in-board resin blind hole is designed on the PAD for improving the reliability of diode welding.
The total number of layers of the LED lamp panel is 2L, a 0.41mm0.5/0.5OZ (1OZ is approximately equal to 35 mu m) core plate is used, the size of the PAD is 0.25 x 0.25mm, the distance from the lamp to the lamp is 1.10mm, the minimum line width and line distance is 0.05/0.05mm, resin blind holes in the plate are designed on the PAD, different printing ink is used on the two sides of the PCB, and a Top surface uses green oil and a Bottom surface to manufacture a white oil alignment graph. The conventional technology has high manufacturing difficulty and can cause the following problems:
1. the conventional resin hole plugging technology can leave resin on the hole wall, and the resin cannot be removed after curing, so that the metallicity of the hole wall is influenced, and the connection performance of the LED and the like after mounting is influenced;
2. the line width and line distance are 0.05/0.05mm, the size of the bonding pad is 0.25 x 0.25mm, the circuit pattern is fine, and the young etched lines are easy to appear by adopting the conventional electroplating and etching methods;
3. one surface of the LED lamp panel is required to be printed with green oil by silk screen printing, the other surface of the LED lamp panel is required to be printed with white oil by silk screen printing, the difference of the developing resistance of the two kinds of printing ink is large, and the white oil has the problem of excessive falling of development when the two kinds of printing ink are simultaneously developed under the same condition.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides a method for manufacturing an LED lamp panel, which uses solder resist photosensitive ink to replace the conventional thermosetting resin hole plugging, removes the residual ink on the hole wall through ink exposure and development, and ensures the metal property of the hole wall.
In order to solve the technical problem, the invention provides a manufacturing method of an LED lamp panel, which comprises the following steps:
s1, cutting a core board according to the size of the jointed board, wherein one surface of the core board is a front surface, and the other surface of the core board is a back surface;
s2, drilling through holes on the core board, and then sequentially performing copper deposition and full board electroplating to metalize the through holes;
s3, plugging the through holes on the front surface of the core plate by adopting solder resist ink, and controlling the filling degree of the plugged holes to be 40-70%;
s4, pre-curing the solder resist ink by pre-baking;
s5, curing the solder resist ink through exposure, development and thermal curing treatment in sequence; during exposure, the front side of the core plate is fully exposed, the back side of the core plate is exposed only at the position corresponding to the through hole, and the exposure size on the back side is smaller than that of the through hole;
s6, flattening the board surface by grinding the board;
and S7, sequentially carrying out outer layer circuit manufacturing, solder mask manufacturing, surface treatment and molding treatment on the core board to obtain the LED lamp panel.
Further, in step S1, the copper layer thickness on both surfaces of the core board is 0.5 oz.
Further, the following steps are included between steps S1 and S2:
and S11, thinning the copper layers on the two surfaces of the core plate by microetching to reduce the thickness of the copper layers on the two surfaces of the core plate to 12-15 μm.
Furthermore, in step S2, the thickness of the copper layer on the aperture wall is controlled to be not less than 15 μm and the thickness of the copper layer on both surfaces of the core board is controlled to be 30 ± 4 μm after the whole board is electroplated.
Further, the following steps are included between steps S1 and S2:
and S21, performing brown oxidation treatment on the core plate.
Further, in step S3, plugging is performed at the position of the through hole by means of aluminum sheet plugging.
Further, in step S5, the exposure film on the front side of the core board is designed to be full exposure, and the exposure film on the back side of the core board is coaxially designed with a light-transmissive window only at the position corresponding to the through hole, wherein the size of the window is smaller than that of the through hole.
Further, in step S3, the diameter of the window is one side smaller than the diameter of the through hole by 0.2 mm.
Further, in step S7, when the solder mask layer is manufactured, the solder mask green oil is printed on the front surface of the core board by silk screen printing, and is sequentially subjected to exposure and development processing; and then, printing solder resist white oil on the back surface of the core plate by silk screen printing, and sequentially carrying out exposure and development treatment.
The invention also provides an LED lamp panel which is manufactured by the manufacturing method of any one of the above.
Furthermore, the thick copper plate is a multilayer plate formed by pressing an inner core plate and an outer copper foil into a whole through a prepreg, and the multilayer plate is subjected to the working procedures of drilling, copper deposition, full-plate electroplating and outer circuit manufacturing in sequence.
Compared with the prior art, the invention has the following beneficial effects:
in the invention, solder resist photosensitive ink is used to replace the conventional thermosetting resin for hole plugging, and the mode and the filling degree of the hole plugging are controlled, so that the residual ink on the hole wall on the reverse side of the core plate can be removed through ink exposure and development, and the metal property of the hole wall is ensured.
Secondly, the core plate with 0.5oz is subjected to microetching to reduce copper to 12-15 mu m and then plated with copper, so that the thickness of hole copper is more than or equal to 15 mu m, the surface copper is controlled to be 30 +/-4 mu m, and the problem that fine circuit etching lines are young due to over-thick surface copper is avoided while the copper thickness of the hole wall is met;
thirdly, after the front side of the core plate is printed with green oil by silk screen printing, exposed and developed, white oil is printed on the core plate by silk screen printing, exposed and developed, so that the problem of characteristic difference of the front ink and the back ink is effectively distinguished, the problem that the white oil falls off due to over development during simultaneous development is avoided, and the solder mask quality is ensured.
Detailed Description
In order to more fully understand the technical contents of the present invention, the technical solutions of the present invention will be further described and illustrated with reference to specific embodiments.
Examples
The manufacturing method of the LED lamp panel shown in this embodiment includes a variegated ink solder-resist process, and sequentially includes the following processing steps:
(1) cutting: a core board is cut according to the size of a jointed board, which is 520mm multiplied by 620mm, the thickness of the core board is 0.41mm, the thickness of copper layers on two surfaces of the core board is 0.5oz, one surface of the core board is a front surface (Top surface), and the other surface of the core board is a back surface (Bottom surface).
(2) Micro-etching: the thickness of the copper layers on the two surfaces of the core plate is reduced by microetching, so that the thickness of the copper layers on the two surfaces of the core plate is reduced to 12-15 mu m, and fine circuit etching lines caused by over-thick copper after electroplating are avoided.
(3) Drilling: according to the existing drilling technology, the core plate is drilled according to the design requirements, and a through hole to be subjected to hole plugging is drilled.
(4) Copper deposition: and (3) depositing a layer of thin copper on the plate surface and the wall of the through hole by using a chemical copper plating method, and testing the backlight to 10 grades, wherein the thickness of the deposited copper in the hole is 0.5 mu m.
(5) Electroplating the whole plate: and carrying out full-plate electroplating for 60min at the current density of 18ASF, thickening the thicknesses of the hole copper and the plate surface copper layer to ensure that the thickness of the hole wall copper layer is more than or equal to 15 mu m, and controlling the thicknesses of the copper layers on the two surfaces of the core plate to be 30 +/-4 mu m, so that the problem of fine circuit etching line largeness due to the fact that the surface copper is too thick is avoided while the hole wall copper thickness is met.
(6) Browning: the core plate is subjected to browning treatment, so that the roughness of the hole opening and the wall copper layer is increased, and the binding force with the printing ink is improved.
(7) Plugging a hole: adopting solder resist ink to perform hole plugging treatment on the front surface of the core plate, and controlling the hole plugging plumpness to be 40-70%; plugging is only carried out from the front side, so that under the condition of controlling the filling degree of the plugging, an orifice on the back side of the core plate is not filled with ink to form an in-disc resin blind hole required by the LED lamp panel, but the in-disc resin blind hole is influenced by the flow characteristic of the ink, solder resist ink also exists on the hole wall on the back side of the core plate, and the solder resist ink on the hole wall on the back side needs to be removed to ensure the connection performance of the LED; when plugging holes, plugging holes at the positions of the through holes by adopting an aluminum sheet plugging hole mode, namely, the aluminum sheet with the same size as the core plate is laminated on the front surface of the core plate, and drilling treatment is carried out on the aluminum sheet at the positions corresponding to the through holes to form a structure of local screen printing of the blocking points.
(8) Pre-baking: pre-baking the core plate to primarily cure the solder resist ink, namely, the solder resist ink is in a semi-cured state; the pre-baking temperature is 75 deg.C, and the baking time is 48 min.
(9) Exposure and development: carrying out exposure treatment on the core plate; during exposure, the exposure film on the front side of the core plate is designed to be fully exposed, the exposure film on the back side of the core plate is coaxially provided with a light-transmitting window only at the position corresponding to the through hole, the diameter of the window is 0.2mm smaller than that of the through hole on one side, namely the periphery of the exposure window is retracted 0.1mm inwards than that of the through hole, so that ink in the hole on the front side of the core plate is completely cured, ink in the middle of the hole on the back side of the core plate is cured, the ink on the hole wall on the back side of the core plate is not exposed and cured, the curing of the ink of the plug hole is ensured, the curing of dripping ink on the hole wall on the back side of the core plate is avoided, then the unexposed and cured solder resist ink is cleaned through development, namely the residual ink on the hole wall on the back side of the core plate is removed through development, the solder resist photosensitive ink is used for replacing the conventional thermosetting plug hole, the residual ink on the hole wall is removed through exposure and development, and the metallicity is ensured.
(10) Post-baking: and finally, completely curing the solder resist ink through thermal curing treatment.
(11) Grinding a plate by using ceramic: and removing the ink protruding out of the board surface by adopting a ceramic grinding board to ensure that the board surface is flat.
(12) Manufacturing an outer layer circuit (negative film process): transferring an outer layer pattern, coating a photosensitive film by using a vertical coating machine, controlling the film thickness of the photosensitive film to be 8 mu m, completing outer layer line exposure by using a full-automatic exposure machine and 5-6 exposure rulers (21 exposure rulers), and forming an outer layer line pattern after development; etching an outer layer, namely etching an outer layer circuit and a bonding pad positioned at an orifice on the reverse side of the core plate on the exposed and developed core plate, wherein the bonding pad is 0.25 x 0.25mm, the distance between the bonding pad and the bonding pad is 1.10mm (namely the distance between a lamp and a lamp which are mounted on the bonding pad in an upward direction at the later stage is 1.1mm), and the minimum line width line distance is 0.05/0.05 mm; and (4) inner layer AOI, and then, detecting defects of an inner layer circuit, such as open short circuit, circuit notch, circuit pinhole and the like, and performing defect scrapping treatment, wherein a defect-free product is discharged to the next flow.
(13) Solder resist and silk screen printing of characters: after the solder resist green oil is silk-screened on the front surface of the core plate, a solder resist pattern is formed on the front surface of the core plate through pre-curing, exposure and development in sequence, then solder resist white oil is silk-screened on the back surface of the core plate, a solder resist pattern is formed on the back surface of the core plate through pre-curing, exposure and development in sequence, and finally the printing ink on the two surfaces of the core plate is cured into a solder resist layer through thermosetting treatment, so that the problem that the white oil falls off under the same development condition due to large difference of the developing resistance of the green oil on one surface and the white oil on the other surface is solved, and the solder resist quality is ensured; in addition, solder resist characters are made on the solder resist ink layer on the TOP surface (front surface), and UL marks are added on the TOP surface characters, so that a protective layer which prevents bridging between circuits during welding, provides a permanent electrical environment and resists chemical corrosion is coated on the circuits and the base materials which do not need to be welded, and meanwhile, the TOP surface characters play a role in beautifying the appearance.
(14) Surface treatment (nickel-gold deposition): the copper surface of the welding pad at the solder stop windowing position is communicated with a chemical principle, a nickel layer and a gold layer with certain required thickness are uniformly deposited, and the thickness of the nickel layer is as follows: 3-5 μm; the thickness of the gold layer is as follows: 0.05-0.1 μm.
(15) And electrical test: testing the electrical conduction performance of the finished board, wherein the board use testing method comprises the following steps: and (5) flying probe testing.
(16) And forming: and routing the shape according to the design requirement and the tolerance of +/-0.05mm of the shape according to the prior art to obtain the LED lamp panel.
(17) FQC: according to the customer acceptance standard and the department inspection standard, the appearance of the LED lamp panel is inspected, if a defect exists, the defect is repaired in time, and the excellent quality control is guaranteed to be provided for the customer.
(18) FQA: and (4) measuring whether the appearance, the hole copper thickness, the dielectric layer thickness, the green oil thickness, the inner layer copper thickness and the like of the LED lamp panel meet the requirements of customers or not.
(19) And packaging: and hermetically packaging the LED lamp panels according to the packaging mode and the packaging quantity required by the customer, putting a desiccant and a humidity card, and then delivering.
The technical solutions provided by the embodiments of the present invention are described in detail above, and the principles and embodiments of the present invention are explained herein by using specific examples, and the descriptions of the embodiments are only used to help understanding the principles of the embodiments of the present invention; meanwhile, for a person skilled in the art, according to the embodiments of the present invention, there may be variations in the specific implementation manners and application ranges, and in summary, the content of the present description should not be construed as a limitation to the present invention.
Claims (10)
1. A manufacturing method of an LED lamp panel is characterized by comprising the following steps:
s1, cutting a core board according to the size of the jointed board, wherein one surface of the core board is a front surface, and the other surface of the core board is a back surface;
s2, drilling through holes on the core board, and then sequentially performing copper deposition and full board electroplating to metalize the through holes;
s3, plugging the through holes on the front surface of the core plate by adopting solder resist ink, and controlling the filling degree of the plugged holes to be 40-70%;
s4, pre-curing the solder resist ink by pre-baking;
s5, curing the solder resist ink through exposure, development and thermal curing treatment in sequence; during exposure, the front side of the core plate is fully exposed, the back side of the core plate is exposed only at the position corresponding to the through hole, and the exposure size on the back side is smaller than that of the through hole;
s6, flattening the board surface by grinding the board;
and S7, sequentially carrying out outer layer circuit manufacturing, solder mask manufacturing, surface treatment and molding treatment on the core board to obtain the LED lamp panel.
2. The method for manufacturing an LED lamp panel according to claim 1, wherein in step S1, the thickness of the copper layers on the two surfaces of the core board is 0.5 oz.
3. The method for manufacturing the LED lamp panel according to claim 2, wherein the steps between S1 and S2 further comprise the following steps:
and S11, thinning the copper layers on the two surfaces of the core plate by microetching to reduce the thickness of the copper layers on the two surfaces of the core plate to 12-15 μm.
4. The method for manufacturing the LED lamp panel according to claim 1, wherein in step S2, the thickness of the copper layer on the aperture wall is controlled to be not less than 15 μm and the thickness of the copper layer on the two surfaces of the core board is controlled to be 30 +/-4 μm after the whole board is electroplated.
5. The method for manufacturing the LED lamp panel according to claim 1, wherein the steps between S1 and S2 further comprise the following steps:
and S21, performing brown oxidation treatment on the core plate.
6. The method for manufacturing the LED lamp panel according to claim 5, wherein in the step S3, the holes are plugged at the positions of the through holes in a manner of aluminum sheet plugging.
7. The method for manufacturing an LED lamp panel according to claim 1, wherein in step S5, the exposure film on the front side of the core board is designed to be full exposure, and the exposure film on the back side of the core board is coaxially designed with a light-transmissive window only at a position corresponding to the through hole, wherein the window has a size smaller than that of the through hole.
8. The method for manufacturing the LED lamp panel according to claim 7, wherein in the step S3, the diameter of the window is 0.2mm smaller than that of the through hole.
9. The method for manufacturing the LED lamp panel according to claim 1, wherein in the step S7, when the solder mask layer is manufactured, solder mask green oil is printed on the front surface of the core board in a silk-screen manner, and exposure and development processing are sequentially performed; and then, printing solder resist white oil on the back surface of the core plate by silk screen printing, and sequentially carrying out exposure and development treatment.
10. An LED lamp panel, characterized in that, the LED lamp panel is manufactured by the manufacturing method of any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111116135.0A CN113840466A (en) | 2021-09-23 | 2021-09-23 | LED lamp panel and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111116135.0A CN113840466A (en) | 2021-09-23 | 2021-09-23 | LED lamp panel and manufacturing method thereof |
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| CN113840466A true CN113840466A (en) | 2021-12-24 |
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| CN202111116135.0A Pending CN113840466A (en) | 2021-09-23 | 2021-09-23 | LED lamp panel and manufacturing method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118038766A (en) * | 2024-04-12 | 2024-05-14 | 常州明耀半导体科技有限公司 | LED display and manufacturing method thereof |
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| JP2004022874A (en) * | 2002-06-18 | 2004-01-22 | Showa Mining Co Ltd | Printed wiring board having via hole closed, and its manufacturing method |
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| CN109257878A (en) * | 2018-09-21 | 2019-01-22 | 珠海杰赛科技有限公司 | A kind of method of welding resistance consent |
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