CN118038766A - LED display and manufacturing method thereof - Google Patents
LED display and manufacturing method thereof Download PDFInfo
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- CN118038766A CN118038766A CN202410437131.XA CN202410437131A CN118038766A CN 118038766 A CN118038766 A CN 118038766A CN 202410437131 A CN202410437131 A CN 202410437131A CN 118038766 A CN118038766 A CN 118038766A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 35
- 239000000758 substrate Substances 0.000 claims abstract description 46
- 239000002184 metal Substances 0.000 claims abstract description 32
- 239000010410 layer Substances 0.000 claims description 81
- 239000000853 adhesive Substances 0.000 claims description 14
- 230000001070 adhesive effect Effects 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 6
- 238000009413 insulation Methods 0.000 claims description 5
- 238000003466 welding Methods 0.000 claims description 5
- 239000011358 absorbing material Substances 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 238000009792 diffusion process Methods 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 3
- 239000003292 glue Substances 0.000 claims description 3
- 239000011241 protective layer Substances 0.000 claims description 3
- 238000005507 spraying Methods 0.000 claims description 3
- 230000031700 light absorption Effects 0.000 claims description 2
- 239000000945 filler Substances 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 8
- 229910000679 solder Inorganic materials 0.000 description 6
- 238000002360 preparation method Methods 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 239000011324 bead Substances 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Abstract
The invention discloses an LED display and a manufacturing method thereof, wherein the manufacturing method comprises the following steps: mounting an LED chip on one side of a substrate; step two: a filling layer is arranged on the substrate, so that the filling layer is filled around the LED chip, and meanwhile, the electrode of the LED chip is exposed; step three: an insulating groove layer is arranged on the filling layer and the LED chip, a plurality of grooves corresponding to the electrodes of the LED chip are arranged on the insulating groove layer, and the electrodes of the LED chip are exposed in the grooves; step four: and preparing a metal circuit on the insulating groove layer, and filling the metal circuit in the groove so as to be connected with the electrode of the LED chip in the groove. The invention has the advantages of high production efficiency, low product manufacturing cost and good display effect of the produced LED display.
Description
Technical Field
The invention belongs to the technical field of display panels, and particularly relates to an LED display and a manufacturing method thereof.
Background
The conventional LED display completes the soldering by manufacturing a metal line on a substrate, then adding solder paste on the metal line, and then contacting the electrode of the LED chip with the solder paste, however, since the surface tension exists in the solder beads formed when the solder paste is melted, the LED chip placed on the metal line cannot ensure a stable state during soldering, and finally the soldered LED chip exhibits a positional deviation, which eventually results in a deterioration of the display effect of the LED display.
Disclosure of Invention
The present invention aims to solve at least one of the technical problems existing in the prior art.
Therefore, the invention provides the LED display and the manufacturing method thereof, and the manufacturing method of the LED display has the advantages of high production efficiency, low product manufacturing cost and good display effect of the produced LED display.
The manufacturing method of the LED display comprises the following steps: mounting an LED chip on one side of a substrate; step two: a filling layer is arranged on the substrate, so that the filling layer is filled around the LED chip, and meanwhile, the electrode of the LED chip is exposed; step three: an insulating groove layer is arranged on the filling layer and the LED chip, a plurality of grooves corresponding to the electrodes of the LED chip are arranged on the insulating groove layer, and the electrodes of the LED chip are exposed in the grooves; step four: and preparing a metal circuit on the insulating groove layer, and filling the metal circuit in the groove so as to be connected with the electrode of the LED chip in the groove.
According to one embodiment of the present invention, in the first step, a layer of adhesive is first adhered to the substrate, and the three LED chips of red, green and blue are arranged in an RGB arrangement and adhered to the adhesive, so that the light emitting surfaces of the LED chips face the substrate, and all the LED chips are kept on the same plane.
According to one embodiment of the invention, the substrate is glass or a transparent plate, and the adhesive material is transparent die bond adhesive.
According to an embodiment of the present invention, in the second step, a specific process of setting the filling layer is: coating a layer of photosensitive ink on a substrate to enable the ink to cover the LED chip, then carrying out exposure treatment from the other side of the substrate to enable the photosensitive ink to be gradually solidified from the side close to the substrate to the side far away from the substrate until the solidified height of the photosensitive ink is flush with the plane of the LED chip, and forming the solidified photosensitive ink into a filling layer.
According to one embodiment of the invention, the filling layer is a white highly reflective material or a black light absorbing material.
According to an embodiment of the present invention, in the third step, the preparation process of the insulation groove layer is as follows: and exposing and developing the photosensitive ink above the LED chip and the filling layer, so that corresponding grooves are formed in the areas of the photosensitive ink corresponding to the electrodes of the LED chip, and the electrodes of the LED chip are exposed through the grooves.
According to an embodiment of the present invention, in the fourth step, the preparation process of the metal line is as follows: firstly, a screen plate is manufactured, the outline of holes on the screen plate is the same as that of metal lines, and then, conductive paste is filled in the holes of the screen plate and grooves of an insulation groove layer in a printing or spraying mode, so that the formed metal lines are connected with electrodes of an LED chip.
According to one embodiment of the present invention, further comprising the step five: an insulating protective layer is manufactured on one part of the metal circuit, a welding layer is manufactured on the other part of the metal circuit, and a driving chip and a flexible circuit board are mounted on the welding layer.
According to one embodiment of the present invention, further comprising step six: one of a reflecting layer, a light absorption layer, a diffusion layer, a fluorescent layer, an increment layer and a light homogenizing film is coated on the other side of the substrate.
According to one embodiment of the invention, an LED display is manufactured by the manufacturing method of the LED display.
The LED display has the advantages that the manufacturing process is simple and stable, the LED chips are pre-attached to one side of the substrate, the filling layer is arranged between the LED chips, the insulating groove layer is made on the filling layer, the metal circuit is manufactured and connected with the electrodes of the LED chips through the grooves, the whole manufacturing process is stable and reliable, the LED chips are accurately positioned, the display effect of the display is better by means of firstly mounting the LED chips and then manufacturing the metal circuit, photosensitive ink is gradually solidified from one side close to the substrate to one side far away from the substrate by means of solidifying the other side of the substrate, the filling layer formed by solidification can be ensured to be kept flush with the LED chips, the filling layer is fully filled between the LED chips, and the display effect of the LED display is improved.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.
In order to make the above objects, features and advantages of the present invention more comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
The foregoing and/or additional aspects and advantages of the present invention will become apparent and may be readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings, in which:
FIG. 1 is a schematic diagram of an LED display according to the present invention;
Reference numerals:
The LED packaging structure comprises a substrate 1, a glue material 2, a filling layer 3, an insulation groove layer 4, metal circuits 5, an LED chip 6, a welding layer 7, a driving chip 8 and a flexible circuit board 9.
Detailed Description
Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the invention.
In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present invention. Furthermore, features defining "first", "second" may include one or more such features, either explicitly or implicitly. In the description of the present invention, unless otherwise indicated, the meaning of "a plurality" is two or more.
In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
An LED display and a method of manufacturing the same according to an embodiment of the present invention are described in detail below with reference to the accompanying drawings.
As shown in fig. 1, a method of manufacturing an LED display according to an embodiment of the present invention includes,
Step one: the LED chip 6 is mounted on one side of the substrate 1.
The specific mounting process is that firstly, a layer of adhesive material 2 is stuck on a substrate 1, three kinds of LED chips 6 of red, green and blue are arranged in an RGB arrangement mode and stuck on the adhesive material 2, the light emitting surfaces of the LED chips 6 face the substrate 1, and all the LED chips 6 are kept on the same plane. Wherein, the substrate 1 is glass or transparent plate, and the adhesive material 2 is transparent die bond adhesive.
Of course, the size of the adhesive material 2 may be the same as that of the substrate 1, so that the adhesive material may be attached to one side of the substrate 1, then the LED chip 6 is attached, or the adhesive material 2 may be the same as that of the LED chip 6 facing the substrate 1, and then the adhesive material may be attached to the LED chip 6 and then the substrate 1. Thus, the LED chips 6 can be arranged and fixed in advance, and the position orientation of the LED chips 6 is ensured to be consistent, and the arrangement position is ensured to be stable.
Step two: a filling layer 3 is provided on the substrate 1 such that the filling layer 3 fills around the LED chip 6 while the electrodes of the LED chip 6 are exposed.
The specific process of setting the filling layer 3 is as follows: a layer of photosensitive ink is coated on the substrate 1 to cover the LED chip 6, then exposure treatment is carried out from the other side of the substrate 1 to enable the photosensitive ink to be gradually cured from the side close to the substrate 1 to the side far away from the substrate 1 until the curing height of the photosensitive ink is flush with the plane of the LED chip 6, and the cured photosensitive ink is formed into a filling layer 3.
In other words, due to the limitation of the exposure depth in the traditional exposure process, the exposure of the photosensitive ink at the bottom between the LED chips 6 is difficult to expose by adopting a front exposure mode, the unexposed ink can be removed during the subsequent cleaning of the developing solution, so that the connection stability of the whole filling layer 3 is poor, while the invention adopts a back curing mode, on one hand, the photosensitive ink can be ensured to be gradually cured from the bottom upwards, meanwhile, the curing height of the photosensitive ink can be controlled by controlling the exposure power, so that the filling layer 3 flush with the LED chips 6 is obtained, the filling layer 3 can effectively fill the LED chips 6, the LED chips 6 can be kept fixed, meanwhile, the mode of the invention can utilize the light blocking effect of the LED chips 6, when ultraviolet light is irradiated below, a mask plate is not required to be manufactured, the upper part of the LED chips 6 can not be irradiated, and can not be cured, and only part of the photosensitive ink between the LED chips 6 can be exposed and cured.
In this embodiment, the filling layer 3 is a white highly reflective material or a black light absorbing material. The filling layer 3 is arranged to effectively improve the display effect according to different display requirements.
Step three: an insulating groove layer 4 is arranged on the filling layer 3 and the LED chip 6, a plurality of grooves corresponding to the electrodes of the LED chip 6 are arranged on the insulating groove layer 4, and the electrodes of the LED chip 6 are exposed in the grooves.
Wherein, the preparation process of the insulation groove layer 4 is as follows: the photosensitive ink above the LED chip 6 and the filling layer 3 is subjected to exposure and development treatment, so that corresponding grooves are formed in the areas of the photosensitive ink corresponding to the electrodes of the LED chip 6, and the electrodes of the LED chip 6 are exposed through the grooves.
That is, the photosensitive ink used for manufacturing the insulating groove layer 4 may be coated separately, or may be the photosensitive ink which is not exposed in the third step, so that the steps of cleaning with a developing solution and coating the photosensitive ink can be reduced, and the manufacturing process is simpler. On the other hand, the electrode is thinner, when the etching is lighter, the electrode is not exposed, and the electrode is heavier and is easy to damage, but the electrode on the LED chip 6 can be completely and effectively exposed by adopting an exposure and development mode, and compared with the etching process, the manufacturing process of the invention is more excellent.
Step four: metal lines 5 are prepared on the insulating groove layer 4, and the metal lines 5 are filled in the grooves so as to be connected with electrodes of the LED chips 6 in the grooves.
Specifically, the preparation process of the metal line 5 is as follows: firstly, a screen plate is manufactured, the outline of holes on the screen plate is the same as that of the metal circuit 5, and then, conductive paste is filled in the holes of the screen plate and the grooves of the insulating groove layer 4 in a printing or spraying mode, so that the formed metal circuit 5 is connected with the electrode of the LED chip 6.
Step five: an insulating protective layer is formed on one part of the metal wiring 5, a solder layer 7 is formed on the other part of the metal wiring 5, and a driving chip 8 and a flexible wiring board 9 are mounted on the solder layer 7.
Step six: one of a reflecting layer, a light absorbing layer, a diffusion layer, a fluorescent layer, an increment layer and a light homogenizing film is coated on the other side of the substrate 1.
The invention also discloses an LED display, which is manufactured by adopting the manufacturing method of the LED display.
In summary, the manufacturing process is simple and stable, the LED chips 6 are pre-attached to one side of the substrate 1, then the filling layer 3 is arranged between the LED chips 6, then the insulating groove layer 4 is made on the filling layer 3, then the metal circuit 5 is manufactured, the metal circuit 5 is connected with the electrode of the LED chips 6 through the groove, the whole manufacturing process is stable and reliable, the LED chips 6 are installed first, and then the metal circuit 5 is manufactured, so that the position of the LED chips 6 is accurate, the display effect of the display is better, and the photosensitive ink is gradually solidified from one side close to the substrate 1 to one side far away from the substrate 1 by solidifying the other side of the substrate 1, so that the filling layer 3 formed by solidification is kept flush with the LED chips 6, the filling layer 3 is fully filled between the LED chips 6, and the display effect of the LED display is improved.
In the description of the present specification, reference to the terms "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that: many changes, modifications, substitutions and variations may be made to the embodiments without departing from the spirit and principles of the invention, the scope of which is defined by the claims and their equivalents.
Claims (10)
1. A manufacturing method of an LED display is characterized by comprising the following steps,
Step one: mounting an LED chip on one side of a substrate;
step two: a filling layer is arranged on the substrate, so that the filling layer is filled around the LED chip, and meanwhile, the electrode of the LED chip is exposed;
Step three: an insulating groove layer is arranged on the filling layer and the LED chip, a plurality of grooves corresponding to the electrodes of the LED chip are arranged on the insulating groove layer, and the electrodes of the LED chip are exposed in the grooves;
Step four: and preparing a metal circuit on the insulating groove layer, and filling the metal circuit in the groove so as to be connected with the electrode of the LED chip in the groove.
2. The method of manufacturing an LED display of claim 1, wherein in step one, a layer of adhesive is first applied to the substrate, and three kinds of LED chips, red, green and blue, are arranged in an RGB arrangement and are adhered to the adhesive, so that the light-emitting surfaces of the LED chips face the substrate, and all the LED chips are maintained on the same plane.
3. The method of manufacturing an LED display of claim 2, wherein the substrate is glass or a transparent plate, and the glue is a transparent die bond glue.
4. The method of manufacturing an LED display of claim 1, wherein in step two, the specific process of disposing the filling layer is: coating a layer of photosensitive ink on a substrate to enable the ink to cover the LED chip, then carrying out exposure treatment from the other side of the substrate to enable the photosensitive ink to be gradually solidified from the side close to the substrate to the side far away from the substrate until the solidified height of the photosensitive ink is flush with the plane of the LED chip, and forming the solidified photosensitive ink into a filling layer.
5. The method of manufacturing an LED display of claim 4, wherein the filler layer is a white highly reflective material or a black light absorbing material.
6. The method of manufacturing an LED display of claim 4, wherein in step three, the insulating groove layer is prepared by: and exposing and developing the photosensitive ink above the LED chip and the filling layer, so that corresponding grooves are formed in the areas of the photosensitive ink corresponding to the electrodes of the LED chip, and the electrodes of the LED chip are exposed through the grooves.
7. The method of manufacturing an LED display of claim 1, wherein in step four, the metal wiring is manufactured by: firstly, a screen plate is manufactured, the outline of holes on the screen plate is the same as that of metal lines, and then, conductive paste is filled in the holes of the screen plate and grooves of an insulation groove layer in a printing or spraying mode, so that the formed metal lines are connected with electrodes of an LED chip.
8. The method of manufacturing an LED display of claim 1, further comprising the step of: an insulating protective layer is manufactured on one part of the metal circuit, a welding layer is manufactured on the other part of the metal circuit, and a driving chip and a flexible circuit board are mounted on the welding layer.
9. The method of manufacturing an LED display of claim 1, further comprising the step of: one of a reflecting layer, a light absorption layer, a diffusion layer, a fluorescent layer, an increment layer and a light homogenizing film is coated on the other side of the substrate.
10. An LED display manufactured by the method of manufacturing an LED display according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410437131.XA CN118038766A (en) | 2024-04-12 | 2024-04-12 | LED display and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410437131.XA CN118038766A (en) | 2024-04-12 | 2024-04-12 | LED display and manufacturing method thereof |
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| CN118038766A true CN118038766A (en) | 2024-05-14 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202410437131.XA Pending CN118038766A (en) | 2024-04-12 | 2024-04-12 | LED display and manufacturing method thereof |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20140067595A (en) * | 2012-11-27 | 2014-06-05 | 서울반도체 주식회사 | Led package and manufacturing method thereof |
| CN104779339A (en) * | 2015-01-15 | 2015-07-15 | 大连德豪光电科技有限公司 | Inverted high-voltage LED chip and preparation method thereof |
| CN105428507A (en) * | 2015-11-20 | 2016-03-23 | 华天科技（昆山）电子有限公司 | Chip packaging structure and method |
| CN106206332A (en) * | 2016-07-17 | 2016-12-07 | 王培培 | A kind of manufacture method of integrated circuit package structure |
| CN108493184A (en) * | 2018-04-27 | 2018-09-04 | 孙爱芬 | A kind of manufacturing method of lighting device |
| CN113840466A (en) * | 2021-09-23 | 2021-12-24 | 江门崇达电路技术有限公司 | LED lamp panel and manufacturing method thereof |
| CN117276454A (en) * | 2023-09-28 | 2023-12-22 | 深圳瑞沃微半导体科技有限公司 | Method for bonding miniature luminous chip and chip bonding piece |
-
2024
- 2024-04-12 CN CN202410437131.XA patent/CN118038766A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20140067595A (en) * | 2012-11-27 | 2014-06-05 | 서울반도체 주식회사 | Led package and manufacturing method thereof |
| CN104779339A (en) * | 2015-01-15 | 2015-07-15 | 大连德豪光电科技有限公司 | Inverted high-voltage LED chip and preparation method thereof |
| CN105428507A (en) * | 2015-11-20 | 2016-03-23 | 华天科技（昆山）电子有限公司 | Chip packaging structure and method |
| CN106206332A (en) * | 2016-07-17 | 2016-12-07 | 王培培 | A kind of manufacture method of integrated circuit package structure |
| CN108493184A (en) * | 2018-04-27 | 2018-09-04 | 孙爱芬 | A kind of manufacturing method of lighting device |
| CN113840466A (en) * | 2021-09-23 | 2021-12-24 | 江门崇达电路技术有限公司 | LED lamp panel and manufacturing method thereof |
| CN117276454A (en) * | 2023-09-28 | 2023-12-22 | 深圳瑞沃微半导体科技有限公司 | Method for bonding miniature luminous chip and chip bonding piece |
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