CN112738990A - Printed circuit board, display module and LED display screen - Google Patents
Printed circuit board, display module and LED display screen Download PDFInfo
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- CN112738990A CN112738990A CN202011265238.9A CN202011265238A CN112738990A CN 112738990 A CN112738990 A CN 112738990A CN 202011265238 A CN202011265238 A CN 202011265238A CN 112738990 A CN112738990 A CN 112738990A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
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Abstract
The application discloses a printed circuit board, a display module and an LED display screen, wherein the display module comprises the printed circuit board, and the printed circuit board comprises a copper-clad plate layer, a first semi-cured plate layer, a first copper foil layer and a first insulating layer which are sequentially stacked from bottom to top; the first copper foil layer is provided with a first bonding pad, and the first insulating layer is provided with a first through hole penetrating along the thickness direction; the first pad is located in the first through hole. When preparing display module assembly, can set up the soldering paste in first through-hole, under the limiting displacement of the inside wall of first through-hole, the position relatively fixed of first pad and soldering paste, the condition that the skew takes place for the position of soldering paste and first pad can not appear. Therefore, when the soldering paste is arranged, the inner side wall of the first through hole plays a limiting role, the printing precision of the soldering paste is improved, and the problem of the positive and negative screens of the display screen due to the position deviation of the bonding pad and the soldering paste is solved.
Description
Technical Field
The application relates to the technical field of display, especially, relate to a printed circuit board, display module assembly and LED display screen.
Background
An LED (light emitting diode) display screen has the advantages of wide color gamut, high brightness, large viewing angle, low power consumption, long service life, and the like, and thus, the LED display screen is widely used in the display field.
With the development of LED display screens, the improvement of pixel pitch and optical performance has been a major concern in the industry, wherein the pixel pitch is decreasing. However, as the pixel pitch is reduced, the process difficulty of the LED display screen is increased, and the optical performance of the LED display screen cannot be ensured. Among them, the most common problem is the appearance of yin-yang screens; for example: for one display module, the brightness of one side of the display module is higher than that of other display modules, and the brightness of the other side of the display module is lower than that of other display modules.
The brightness of two sides of a display module is not uniform due to the low precision of the mounting process. The general patch process mainly comprises the following steps: three steps of solder paste printing, mounting of an LED, and reflow soldering are sequentially performed on a Printed Circuit Board (PCB). In the process of the existing surface mounting technology, the following abnormal conditions can occur: in the solder paste printing process, the solder paste and the pad on the PCB are shifted due to insufficient printing accuracy of the solder paste. Above-mentioned circumstances can lead to appearing the yin yang screen to along with pixel interval is littleer and more, the position precision requirement between the pad of PCB and the soldering paste also is higher and more high, and the yin yang screen problem that appears thereupon also is more and more serious.
Disclosure of Invention
An object of the application is to provide a printed circuit board, display module assembly and LED display screen, through pile up first insulating layer on the first copper foil layer on printed circuit board, and establish first through-hole on first insulating layer. Therefore, when the display module is prepared, the soldering paste can be arranged in the first through hole, and the situation that the positions of the soldering paste and the first bonding pad deviate is avoided.
A first aspect of the present application provides a printed circuit board including: the laminated copper clad laminate comprises a copper clad laminate layer, a first semi-cured laminate layer, a first copper foil layer and a first insulating layer which are sequentially stacked from bottom to top; the first copper foil layer is provided with a first bonding pad, and the first insulating layer is provided with a first through hole penetrating along the thickness direction; the first pad is located in the first through hole.
Optionally, the printed circuit board further includes: an adhesive layer; the copper clad plate layer, the first semi-cured sheet layer, the first copper foil layer, the bonding layer and the first insulating layer are sequentially stacked from bottom to top; the bonding layer is provided with a second through hole penetrating along the thickness direction; the second through hole is communicated with the first through hole.
Optionally, the printed circuit board further includes: a first solder resist layer; the copper clad laminate layer, the first semi-cured laminate layer, the first copper foil layer, the first insulating layer and the first solder mask layer are sequentially stacked from bottom to top; the first solder mask layer is provided with a third through hole penetrating along the thickness direction, and the third through hole is communicated with the first through hole.
Optionally, the printed circuit board further includes: a second prepreg layer, a second copper foil layer and a second insulating layer; the first insulating layer, the first copper foil layer, the first prepreg layer, the copper clad layer, the second prepreg layer, the second copper foil layer and the second insulating layer are sequentially stacked from top to bottom; the second copper foil layer is provided with a second bonding pad, and the second insulating layer is provided with a fourth through hole penetrating along the thickness direction; the second pad is located in the fourth through hole.
Optionally, the printed circuit board further includes: a second solder resist layer; the first insulating layer, the first copper foil layer, the first prepreg layer, the copper clad layer, the second prepreg layer, the second copper foil layer, the second insulating layer and the second solder mask layer are sequentially stacked from top to bottom; the second solder mask layer is provided with a fifth through hole penetrating along the thickness direction, and the fifth through hole is communicated with the fourth through hole.
Optionally, the printed circuit board further includes: a third prepreg layer, a third copper foil layer and a third solder resist layer; the first insulating layer, the first copper foil layer, the first prepreg layer, the copper clad layer, the third prepreg layer, the third copper foil layer and the third solder resist layer are sequentially stacked from top to bottom; the third copper foil layer is provided with a third pad; the third solder mask layer is provided with a sixth through hole penetrating along the thickness direction, and the third pad is located in the sixth through hole.
Optionally, the first insulating layer includes a fourth prepreg layer or an organic coating.
Optionally, the organic coating layer includes: an organic material having a photo-curing property or an organic material having a thermosetting property.
Optionally, the organic coating is added with: a toner and/or a thermal expansion coefficient adjuster; the toner is used to adjust the color of the organic coating.
The second aspect of the present application provides a display module, including: an LED, a solder paste and a display module according to any one of the first aspect of the present application; the soldering paste is arranged in the first through hole and covers the first bonding pad; the surface of the soldering paste, which is far away from the first copper foil layer, is flush with the surface of the first insulating layer, which is far away from the first copper foil layer; or the surface of the soldering paste, which is far away from the first copper foil layer, is lower than the surface of the first insulating layer, which is far away from the first copper foil layer; the lamp pins of the LED and the soldering paste are connected with the surface of the first copper foil layer deviating from the soldering paste.
When preparing display module assembly, can set up the soldering paste in first through-hole, under the limiting displacement of the inside wall of first through-hole, the position relatively fixed of first pad and soldering paste, the condition that the skew takes place for the position of soldering paste and first pad can not appear. Therefore, when the soldering paste is arranged, the inner side wall of the first through hole plays a limiting role, the printing precision of the soldering paste is improved, and the problem of the positive and negative screens of the display screen caused by the position deviation of the soldering paste and the first bonding pad is solved.
The invention also provides an LED display screen which comprises a frame and the LED display module.
Drawings
In order to more clearly illustrate the technical solution of the present application, the drawings needed to be used in the embodiments will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a schematic structural diagram of a printed circuit board provided in an embodiment of the present application;
FIG. 2 is a schematic structural diagram of a printed circuit board provided in an embodiment of the present application;
FIG. 3 is a schematic structural diagram of a printed circuit board provided in an embodiment of the present application;
FIG. 4 is a schematic structural diagram of a printed circuit board provided in an embodiment of the present application;
FIG. 5 is a process of manufacturing the printed circuit board of FIG. 4;
FIG. 6 is another process for preparing the printed circuit board of FIG. 4;
FIG. 7 is a process for mounting LEDs on a printed circuit board according to an embodiment of the present disclosure;
FIG. 8 is a schematic structural diagram of a printed circuit board provided in an embodiment of the present application;
FIG. 9 is a process of manufacturing the printed circuit board of FIG. 8;
FIG. 10 is another process for making the printed circuit board of FIG. 8;
FIG. 11 is a schematic structural diagram of a printed circuit board provided in an embodiment of the present application;
FIG. 12 is a process of manufacturing the printed circuit board of FIG. 11;
FIG. 13 is a schematic structural diagram of a printed circuit board provided in an embodiment of the present application;
FIG. 14 is a schematic structural diagram of a printed circuit board provided in an embodiment of the present application;
fig. 15 is a schematic structural diagram of a display module according to an embodiment of the present application.
Description of reference numerals:
1-copper clad plate layer, 2-first prepreg layer, 3-first copper foil layer, 31-first pad, 4-first insulation layer, 41-first via, 5-adhesive layer, 6-first solder resist layer, 7-second prepreg layer, 8-second copper foil layer, 81-second pad, 9-second insulation layer, 91-fourth via, 10-second pad, 11-third solder resist layer, 12-third copper foil layer, 121-third pad, 13-third solder resist layer, 14-solder paste, 15-LED, 16-mask, 17-mold, 171-bottom case, 172-cover plate; 100-display module.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The application provides a printed circuit board, this printed circuit board includes: the laminated copper clad laminate comprises a copper clad laminate layer 1, a first semi-cured sheet layer 2, a first copper foil layer 3 and a first insulating layer 4 which are sequentially stacked. That is, with reference to the direction in fig. 1, from bottom to top are a copper clad laminate layer 1, a first prepreg layer 2, a first copper foil layer 3, and a first insulating layer 4 in this order.
Specifically, the first copper foil layer 3 has a first pad 31, and the first insulating layer 4 is provided with a first through hole 41 penetrating in the thickness direction; the first pad 31 is located within the first via hole 41. That is, the first via hole 41 on the first insulating layer 4 is aligned exactly with the first pad 31 on the first copper foil layer 3.
By stacking the first insulating layer 4 over the first copper foil layer 3, the first via hole 41 is provided on the first insulating layer 4. The process of mounting the LED on the printed circuit board can be seen in fig. 7, where it can be seen that the solder paste 14 is provided in the first through hole 41; since the first through hole 41 and the first pad 31 are aligned, the solder paste 14 may be overlaid on the first pad 31. Then, under the stopper action of the inner side wall of the first through hole 41, the positions of the first pad 31 and the solder paste 14 are relatively fixed, and the positions of the solder paste 14 and the first pad 31 do not shift. Therefore, when the soldering paste 14 is arranged, the inner side wall of the first through hole 41 plays a limiting role, the printing precision of the soldering paste 14 is improved, the process difficulty is reduced, and the problem of the positive and negative screens of the display screen caused by the position deviation of the soldering paste and the soldering pad is solved.
In addition, when the solder paste 14 is provided, the solder paste 14 may be made flush with the first insulating layer 4, or the solder paste 14 may be made lower than the first insulating layer 4. Especially in the case where the solder paste 14 is lower than the first insulating layer 4, when the base of the LED15 is connected to the solder paste 14, the base of the LED15 may protrude into the first through hole 41 to be connected to the solder paste 14, thereby increasing the limit of the LED 15. Under the limiting effect of the inner side wall of the first through hole 41, the position of the LED15 and the position of the soldering paste 14 are relatively fixed, the situation that the positions of the LED15 and the soldering paste 14 deviate is avoided, the position accuracy of the LED15 is improved, the process difficulty is further reduced, and therefore the situation that a display screen is shaded due to the position deviation of the soldering paste 14 and the first soldering pad 31 can be avoided. In addition, because the lamp base of the LED15 is limited in the first through hole 41, the LED15 is not easy to loosen from the display module 100, the structural stability of the finished display screen is increased, and the service life of the display screen can be prolonged. In addition, since the lamp pin of the LED15 is confined in the first through hole 41, the gap between the LED15 and the printed circuit board is reduced, and the waterproof property can be enhanced.
The thickness H of the first insulating layer 4 may range from: h is more than or equal to 100 microns and is more than or equal to 300 microns; more specifically, the thickness of the first insulating layer 4 is selected according to the following: the required thickness of the solder paste 14 is determined according to the finally required lamp thrust index of the display screen, and since the depth of the first through hole 41 on the first insulating layer 4 needs to be greater than or equal to the thickness of the solder paste 14, the thickness of the first insulating layer 4 is set to be greater than or equal to the thickness of the solder paste 14.
Further, the first insulating layer 4 may be a fourth prepreg layer or an organic coating layer. That is, the first insulating layer 4 may be a fourth prepreg layer made of the same material as the first prepreg layer. Thereby, the positional accuracy of the solder paste 14 and the first pads 31 can be improved while the cost can be reduced.
The first insulating layer 4 may also be an organic coating. Optionally, the organic coating layer includes: an organic material having a photo-curing property or an organic material having a thermosetting property. For example: at least one organic material selected from epoxy resin, polyimide, polytetrafluoroethylene, silica gel, etc.
Further, the organic coating has added thereto: toner and/or thermal expansion coefficient modifier. The toner is used for adjusting the color of the organic coating; the thermal expansion coefficient adjuster is used to adjust the thermal expansion coefficient of the organic coating.
Specifically, when an organic coating is prepared using an organic material, black toner such as graphite is added, so that the surface color of the printed circuit board can be adjusted to improve the contrast of the finally prepared display screen.
Specifically, the thermal expansion coefficient adjuster may be particles of an inorganic material such as silicon dioxide, aluminum oxide, or silicon carbide. Specifically, when the organic coating is prepared by using an organic material, particles of inorganic materials such as silicon dioxide, aluminum oxide or silicon carbide are added, so that the expansion coefficient of the first insulating layer 4 is adjusted, the expansion coefficient of the organic coating is matched with that of the first copper foil layer 3 as much as possible, and the organic coating and the first copper foil layer 3 are prevented from being separated due to mismatch of the expansion coefficients.
Further, referring to fig. 2, the printed circuit board provided by this embodiment may further include an adhesive layer 5; the adhesive layer 5 is stacked between the first copper foil layer 3 and the first insulating layer 4. That is, the copper clad laminate layer 1, the first prepreg layer 2, the first copper foil layer 3, the adhesive layer 5, and the first insulating layer 4 are stacked in this order from bottom to top. Specifically, the adhesive layer 5 is provided with a second through hole penetrating in the thickness direction; the second through hole communicates with the first through hole 41. The adhesive layer 5 can be made of dry glue or water glue with adhesive property.
The thickness H1 of the adhesive layer 5 may range from: h1 is more than or equal to 150 microns and more than or equal to 10 microns. The thickness of the adhesive layer 5 is selected on the basis of the principle that a strong adhesion between the first insulating layer 4 and the first copper foil layer 3 is ensured, and that the overall thickness cannot be influenced too much.
The adhesive layer 5 can increase the adhesion between the first insulating layer 4 and the first copper foil layer 3, and prevent the first insulating layer 4 and the first copper foil layer 3 from being separated. On the other hand, after the adhesive layer 5 is provided, the first insulating layer 4 is formed on the adhesive layer 5 without being formed on the first copper foil layer 3, and therefore, when the material of the first insulating layer 4 is selected, the influence of the selected material on the first copper foil layer 3 may not be taken into consideration. Particularly, when the first insulating layer 4 is made of an organic material having a thermosetting property, the organic coating needs to be subjected to heat treatment; then, after the adhesive layer 5 is provided, the heat when the first insulating layer 4 is prepared does not affect the first copper foil layer 3, and thus, after the adhesive layer 5 is provided, the organic coating preparation material selection range is wider.
Optionally, referring to fig. 3, the printed circuit board provided in this embodiment may further include: the first solder resist layer 6. The first solder resist layer 6 is stacked over the first insulating layer 4. That is, the copper clad laminate layer 1, the first semi-cured sheet layer 2, the first copper foil layer 3, the first insulating layer 4, and the first solder resist layer 6 are stacked in this order from the bottom to the top. The first solder resist layer 6 is provided with a third through hole penetrating in the thickness direction, and the third through hole communicates with the first through hole 41.
Providing the first solder resist layer 6 over the first insulating layer 4 can prevent solder paste 14 from remaining on the surface of the first insulating layer 4 to cause a short circuit problem during subsequent mounting of the LED 15.
Of course, in the case where the adhesive layer 5 or the first solder resist layer 6 is provided, or both the adhesive layer 5 and the first solder resist layer 6 are provided, the adhesive layer 5 needs to be provided with a second through hole corresponding to the first through hole 41, and the first solder resist layer 6 needs to be provided with a third through hole corresponding to the first through hole 41, so that the first pad 31 can be exposed.
It will be understood by those skilled in the art that the first through-hole 41, the second through-hole and the third through-hole are preferably through-holes having the same shape and the same cross-sectional area; and the specific shape and the area of the cross section are determined according to the size and shape of the first pad 31. In the case where the adhesive layer 5, the first insulating layer 4, and the first solder resist layer 6 are stacked, the edges of the first through hole 41, the second through hole, and the third through hole are aligned.
Further, when the display module is prepared, the LED15 is generally required to be disposed on one side of the printed circuit board, and the driving circuit is generally required to be disposed on the other side of the printed circuit board.
Two printed circuit boards are provided below that can be provided with the LED15 on one side and the driver circuit on the other side.
The first method comprises the following steps:
looking at fig. 4, the printed circuit board comprises a copper clad laminate layer 1, the copper clad laminate layer 1 having a first surface and a second surface which are oppositely arranged; the first prepreg layer 2, the first copper foil layer 3 and the first insulating layer 4 are stacked in this order on the first surface. The printed circuit board further includes: a second prepreg layer 7, a second copper foil layer 8, and a second insulating layer 9 are sequentially stacked over the second surface. That is, the first insulating layer 4, the first copper foil layer 3, the first prepreg layer 2, the copper clad laminate layer 1, the second prepreg layer 7, the second copper foil layer 8, and the second insulating layer 9 are sequentially stacked from top to bottom. The second copper foil layer 8 has a second pad 81, and the second insulating layer 9 has a fourth through hole 91 penetrating in the thickness direction; the second pad 81 is located within the fourth through hole 91, i.e., the fourth through hole 91 is aligned with the second pad 81.
That is, with continued reference to fig. 4, both side surfaces of the copper clad laminate layer 1 adopt the identical structure, thereby facilitating the processing. Like the first insulating layer 4, the second insulating layer 9 may also be a fifth prepreg layer or an organic coating layer, and will not be described in detail.
Here, the manner of providing the LED15 on the first insulating layer 4 has been described, and a process of providing the driving circuit on the second insulating layer 9 will be briefly described below. Specifically, when the driving circuit is provided, the solder paste 14 may be provided in the fourth through hole 91; since the fourth through-hole 91 and the second pad 81 are aligned, the solder paste 14 may be overlaid on the second pad 81. Then, under the stopper action of the inner side wall of the fourth through hole 91, the positions of the second pad 81 and the solder paste 14 are relatively fixed, and the positions of the solder paste 14 and the second pad 81 do not shift. Therefore, when the solder paste 14 is arranged, the inner side wall of the fourth through hole 91 plays a limiting role, and the printing precision of the solder paste 14 is improved; after the printing accuracy of the solder paste 14 is improved, the subsequent driving circuit setting is more stable and less likely to come loose.
Alternatively, the printed circuit board further comprises a second solder resist layer 10, see fig. 13, similar to the first solder resist layer 6 provided on top of the first insulating layer 4; a second solder resist layer 10 is stacked on the second insulating layer 9. That is, the first insulating layer 4, the first copper foil layer 3, the first prepreg layer 2, the copper clad laminate layer 1, the second prepreg layer 7, the second copper foil layer 8, the second insulating layer 9, and the second solder resist layer 10 are sequentially stacked from top to bottom. The second solder resist layer 10 is provided with a fifth through hole penetrating in the thickness direction, and the fifth through hole communicates with the fourth through hole 91. Providing the second solder resist layer 10 on the second insulating layer 9 can prevent the solder paste 14 from remaining on the surface of the second insulating layer 9 to cause a short circuit problem in the subsequent mounting of the driving circuit.
Of course, it will be understood by those skilled in the art that the adhesive layer 5 may also be disposed between the second copper foil layer 8 and the second insulating layer 9, and the specific function and disposition of the adhesive layer 5 are the same as those of the adhesive layer 5 between the first copper foil layer 3 and the first insulating layer 4, which will not be described in detail.
And the second method comprises the following steps:
looking at fig. 8, the printed circuit board includes a copper clad layer 1, the copper clad layer 1 having a first surface and a second surface oppositely disposed; the first prepreg layer 2, the first copper foil layer 3 and the first insulating layer 4 are stacked in this order on the first surface. The printed circuit board further includes: a third prepreg 11 layer, a third copper foil layer 12 and a third solder resist layer 13 are sequentially stacked over the second surface. That is, the first insulating layer 4, the first copper foil layer 3, the first prepreg layer 2, the copper clad laminate layer 1, the third prepreg layer 11, the third copper foil layer 12, and the third solder resist layer 13 are stacked in order from top to bottom. The third copper foil layer 12 has a third land 121, the third solder resist layer 13 is provided with a sixth through hole penetrating in the thickness direction, and the third land is located in the sixth through hole 121.
That is, the two sides of the copper clad laminate layer 1 adopt different structures, wherein one side provided with the first insulating layer 4 is used for mounting the LED15, and the other side is provided with the driving circuit. The side where the LED15 is mounted is provided with the first insulating layer 4, and the first insulating layer 4 is provided with the first through hole 41, whereby the positional accuracy of the first pad 31, the solder paste 14, and the LED15 can be improved. And a third solder resist layer 13 is provided on the side of the printed circuit board not provided with the first insulating layer 4. The structure can reduce the using amount of the insulating layer, reduce the layer number of the printed circuit board and save the cost while ensuring that the LED15 cannot have the problem of negative and positive screens.
Of course, in the second mode, as shown in fig. 11, the adhesive layer 5 may be provided; alternatively, as shown in fig. 14, the first solder resist layer 6 is provided.
In conjunction with the above disclosure, several printed circuit board embodiments are detailed below:
the first embodiment:
looking up fig. 4, and taking the direction in fig. 4 as a reference, it can be seen that the printed circuit board includes a fourth prepreg layer, a first copper foil layer 3, a first prepreg layer 2, a copper clad layer 1, a second prepreg layer 7, a second copper foil layer 8, and a fifth prepreg layer, which are sequentially stacked from top to bottom. That is, in this embodiment, the first insulating layer 4 is a fourth prepreg layer, and the second insulating layer 9 is a fifth prepreg layer.
The first copper foil layer 3 is provided with a first pad 31, and the fourth prepreg layer is provided with a first through hole 41 penetrating along the thickness direction; the first pad 31 is located within the first via hole 41. The second copper foil layer 8 is provided with a second bonding pad 81, and the fifth prepreg layer is provided with a fourth through hole 91 penetrating along the thickness direction; the second pad 81 is located in the fourth through hole 91. The thickness direction is the direction indicated by X in fig. 1, that is, the direction from the surface of the fourth prepreg layer close to the first copper foil layer 3 to the surface away from the first copper foil layer 3.
Referring to fig. 5, the process of preparing the printed circuit board is briefly described as follows:
s1: providing a printed circuit board, shown as a in fig. 5; the printed circuit board is provided with a first copper foil layer 3, a first prepreg layer 2, a copper-clad plate layer 1, a second prepreg layer 7 and a second copper foil layer 8 which are sequentially stacked from top to bottom.
S2: respectively pressing two prepregs on the first copper foil layer 3 and the second copper foil layer 8 to form a fourth cured sheet layer on the first copper foil layer 3 and a fifth prepreg layer on the second copper foil layer 8; shown as b in figure 5.
S3: etching the fourth prepreg layer by using a photolithography method to form a first through hole 41; and etching the fifth prepreg layer by using a photolithography method to form a fourth via 91, which is shown as c in fig. 5.
The position accuracy of the first through hole 41 and the fourth through hole 91 of the printed circuit board prepared by the method is high.
Referring to fig. 6, another process for manufacturing the printed circuit board is briefly described as follows:
s1: providing a printed circuit board, shown as a in fig. 6; the printed circuit board is provided with a first copper foil layer 3, a first prepreg layer 2, a copper-clad plate layer 1, a second prepreg layer 7 and a second copper foil layer 8 which are sequentially stacked from top to bottom.
S2: respectively forming through holes on the two prepregs; shown as b in fig. 6.
S3: pressing one prepreg provided with a through hole on the first copper foil layer 3 to form a fourth prepreg layer, wherein the through hole on the prepreg is a first through hole 41; pressing another prepreg provided with a through hole on the second copper foil layer 8 to form a fifth prepreg layer, wherein the through hole on the prepreg is a fourth through hole 91; shown as c in fig. 6.
By adopting the preparation method, the printed circuit board can be quickly prepared.
Looking at fig. 7, the process of mounting the LED15 on such a printed circuit board is briefly described as follows:
s1: filling the first via hole 41 with solder paste 14; and the upper surface of the solder paste 14 is made lower or flush with the upper surface of the first insulating layer 4, as shown by a in fig. 7. In detail, the first through hole 41 may be filled with the solder paste 14 by dispensing or screen printing.
S2: the surface of the first insulating layer 4 is cleaned. In detail, the surface of the first insulating layer 4 may be wiped using alcohol or the like to remove the solder paste 14 remaining on the surface of the first insulating layer 4 in step S1.
S3: the LED15 is mounted, shown as b in fig. 7. In detail, the LED15 may be mounted using a mounter.
The second embodiment:
looking up fig. 8, and taking the direction in fig. 8 as a reference, it can be seen that the printed circuit board includes an organic coating, a first copper foil layer 3, a first prepreg layer 2, a copper clad layer 1, a third prepreg layer 11, a third copper foil layer 12, and a third solder resist layer 13, which are sequentially stacked from top to bottom. The organic coating is made of organic materials with photocuring characteristics or organic materials with thermocuring characteristics. That is, in this embodiment, the first insulating layer 4 is an organic coating.
The first copper foil layer 3 has a first pad 31, and the organic coating layer is provided with a first through hole 41 penetrating in the thickness direction; the first pad 31 is located within the first via hole 41. The third copper foil layer 12 has a third pad 121; the third solder resist layer 13 is provided with a sixth through hole penetrating in the thickness direction, and the third pad is located in the sixth through hole 121.
In this embodiment, under the limiting action of the first through hole 41, no position deviation occurs between the solder pad and the lamp pin of the LED15 of the solder paste, so as to ensure that the display screen finally manufactured does not have a negative and positive screen.
That is, in this embodiment, the surfaces of the copper clad laminate layer 1 on both sides have different structures.
Referring to fig. 9, the process of preparing the printed circuit board is briefly described as follows:
s1: providing a printed circuit board, shown as a in fig. 9; the printed circuit board is provided with a first copper foil layer 3, a first prepreg layer 2, a copper clad layer 1, a third prepreg 11 layer, a third copper foil layer 12 and a third solder resist layer 13 which are sequentially stacked from top to bottom.
S2: an organic material having a photo-curing property is coated on the first copper foil layer 3 to form an organic coating layer, which is shown as b in fig. 9. In particular, a blade coating or spin coating method can be adopted.
S3: a mask 16 is provided on the surface of the organic coating, and the position of the mask 16 corresponding to the first pad 31 is a light-opaque region, and the other positions are light-transmissive regions, as shown in c in fig. 9.
S4: by exposure and development, the region of the organic coating layer not corresponding to the first pad 31 is cured, and the region corresponding to the first pad 31 is removed, as shown by d in fig. 9. Specifically, exposure and development may be performed using an appropriate light wavelength and power depending on the photocuring characteristics of the organic material.
The position accuracy of the first through hole 41 and the fourth through hole 91 of the printed circuit board prepared by the method is high.
Referring to fig. 10, another process for manufacturing the printed circuit board is briefly described as follows:
s1: providing a printed circuit board, shown as a in fig. 10; the printed circuit board is provided with a first copper foil layer 3, a first prepreg layer 2, a copper clad layer 1, a third prepreg 11 layer, a third copper foil layer 12 and a third solder resist layer 13 which are sequentially stacked from top to bottom.
S2: providing a mold 17; the mold 17 includes a bottom shell 171 and a cover plate 172, the cover plate 172 having a blocking structure and a channel therein, shown as b in fig. 10, in which the bottom shell 171 is omitted.
S3: placing the printed circuit board in the bottom case 171, and covering the cover plate 172 on the bottom case 171 such that the blocking structures correspond to the positions of the first pads 31, and the channels correspond to the positions of the other regions, as shown in c in fig. 10; then, an organic material having thermosetting properties, such as an epoxy resin material or the like, is filled in the channel of the cap plate 172, the epoxy resin material is subjected to a heat curing process, and then, the mold is released.
By adopting the preparation method, the printed circuit board can be quickly prepared.
The process of mounting the LED15 on the pcb is the same as the first embodiment, and will not be described again.
Third embodiment:
looking up fig. 11, and taking the direction in fig. 11 as a reference, it can be seen that the printed circuit board includes an organic coating, an adhesive layer 5, a first copper foil layer 3, a first prepreg layer 2, a copper clad layer 1, a third prepreg layer 11, a third copper foil layer 12, and a third solder resist layer 13, which are sequentially stacked from top to bottom. The organic coating is made of organic materials with photocuring characteristics or organic materials with thermocuring characteristics. That is, in this embodiment, the first insulating layer 4 is an organic coating.
The first copper foil layer 3 has a first pad 31, and the organic coating layer is provided with a first through hole 41 penetrating in the thickness direction; the first pad 31 is located within the first via hole 41. The bonding layer 5 is provided with a second through hole penetrating along the thickness direction; the second through hole communicates with the first through hole 41. The third copper foil layer 12 has a third pad 121; the third solder resist layer 13 is provided with a sixth through hole penetrating in the thickness direction, and the third pad is located in the sixth through hole 121.
In this kind of implementation, LED15 sets up on organic coating, and drive circuit sets up on third solder mask 13, utilizes first through-hole 41 to carry on spacingly to the lamp base of pad, soldering paste and LED15 for pad, soldering paste and LED 15's lamp base position can not the deviation appear, in order to guarantee that the negative and positive screen can not appear in the display screen of finally making.
Referring to fig. 12, the process of preparing the printed circuit board is briefly described as follows:
s1: providing a printed circuit board, shown as a in fig. 12; the printed circuit board is provided with a first copper foil layer 3, a first prepreg layer 2, a copper clad layer 1, a third prepreg 11 layer, a third copper foil layer 12 and a third solder resist layer 13 which are sequentially stacked from top to bottom.
S2: the organic material is molded by injection molding or compression molding, and then the organic material is cured and demolded to form an organic coating layer having first through holes 41, which are shown in fig. 12 b.
S3: the surface of the organic coating is coated with an adhesive layer 5, shown as c in fig. 12.
S4: the surface of the organic coating layer-coated adhesive layer 5 is attached on the first copper foil layer 3 so that the first via hole 41 corresponds to the first pad 31, exposing the first pad 31, as shown in d in fig. 12.
The process of mounting the LED15 on the pcb is the same as the first embodiment, and will not be described again.
Fourth embodiment:
looking up fig. 13, and taking the direction in fig. 13 as a reference, it can be seen that the printed circuit board includes a first solder mask layer 6, a fourth prepreg layer, a first copper foil layer 3, a first prepreg layer 2, a copper clad layer 1, a second prepreg layer 7, a second copper foil layer 8, a fifth prepreg layer, and a second solder mask layer 10, which are stacked in sequence from top to bottom. That is, in this embodiment, the first insulating layer 4 is a fourth prepreg layer, and the second insulating layer 9 is a fifth prepreg layer.
The first copper foil layer 3 is provided with a first pad 31, and the fourth prepreg layer is provided with a first through hole 41 penetrating along the thickness direction; the first pad 31 is located within the first via hole 41. The first solder resist layer 6 is provided with a third through hole penetrating in the thickness direction, and the third through hole communicates with the first through hole 41.
The second copper foil layer 8 is provided with a second bonding pad 81, and the fifth prepreg layer is provided with a fourth through hole 91 penetrating along the thickness direction; the second pad 81 is located in the fourth through hole 91. The second solder resist layer 10 is provided with a fifth through hole penetrating in the thickness direction, and the fifth through hole communicates with the fourth through hole 91.
In this embodiment, the LED15 is provided on the first solder resist layer 6, and the driving circuit is provided on the second solder resist layer 10; or conversely the LED15 is disposed on the second solder mask layer 10 and the driver circuit is disposed on the first solder mask layer 6; no matter which mode, all can utilize corresponding through-hole to carry on spacingly to pad, soldering paste and LED 15's lamp base for pad, soldering paste and LED 15's lamp base position is accurate, can guarantee that negative and positive screen can not appear in the display screen that finally makes.
The process for manufacturing the printed circuit board provided by this embodiment is similar to that of the first embodiment, and the process for mounting the LED15 on the printed circuit board is the same as that of the first embodiment, and is not described again.
Fifth embodiment:
looking up fig. 14, and taking the direction in fig. 14 as a reference, it can be seen that the printed circuit board includes a first solder resist layer 6, an organic coating layer, a first copper foil layer 3, a first prepreg layer 2, a copper clad layer 1, a third prepreg layer 11, a third copper foil layer 12, and a third solder resist layer 13, which are sequentially stacked from top to bottom. The organic coating is made of organic materials with photocuring characteristics or organic materials with thermocuring characteristics. That is, in this embodiment, the first insulating layer 4 is an organic coating.
The first copper foil layer 3 has a first pad 31, and the organic coating layer is provided with a first through hole 41 penetrating in the thickness direction; the first pad 31 is located within the first via hole 41. The first solder resist layer 6 is provided with a third through hole penetrating in the thickness direction, and the third through hole communicates with the first through hole 41.
The third copper foil layer 12 has a third pad 121; the third solder resist layer 13 is provided with a sixth through hole penetrating in the thickness direction, and the third pad is located in the sixth through hole 121.
In this embodiment, the LED15 is disposed on the first solder mask layer 6, the driving circuit is disposed on the third solder mask layer 13, and the first through hole 41 is used to limit the first pad 31, the solder paste and the lamp pin of the LED15, so that the three are accurate in position, and it is ensured that the display screen manufactured finally does not have a shadow.
The process for manufacturing the printed circuit board provided by this embodiment is similar to that of the second embodiment, and the process for mounting the LED15 on the printed circuit board of the display module is the same as that of the first embodiment, and is not repeated.
In addition, referring to fig. 15, the embodiment of the present application further provides a display module 100, where the display module 100 includes an LED, a solder paste 14, and the display module of any embodiment of the present application.
The solder paste 14 is provided in the first through hole 41 and covers the first pad 31. The surface of the solder paste 14 facing away from the first copper foil layer 3 is flush with the surface of the first insulating layer 4 facing away from the first copper foil layer 3; alternatively, the surface of the solder paste 14 facing away from the first copper foil layer 3 is lower than the surface of the first insulating layer 4 facing away from the first copper foil layer 3. The legs of the LED and the surface of the solder paste 14 facing away from the first copper foil layer 3 are connected.
In addition, the embodiment of the application also provides an LED display screen, which comprises a frame and the LED display module.
The foregoing detailed description of the embodiments of the present application has been presented to illustrate the principles and implementations of the present application, and the above description of the embodiments is only provided to help understand the method and the core concept of the present application; meanwhile, for a person skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.
Claims (11)
1. A printed circuit board, comprising: the laminated copper clad laminate comprises a copper clad laminate layer, a first semi-cured laminate layer, a first copper foil layer and a first insulating layer which are sequentially stacked from bottom to top;
the first copper foil layer is provided with a first bonding pad, and the first insulating layer is provided with a first through hole penetrating along the thickness direction; the first pad is located in the first through hole.
2. The printed circuit board of claim 1, further comprising: an adhesive layer;
the copper-clad plate layer, the first semi-cured sheet layer, the first copper foil layer, the bonding layer and the first insulating layer are sequentially stacked from bottom to top;
the bonding layer is provided with a second through hole penetrating along the thickness direction; the second through hole is communicated with the first through hole.
3. The printed circuit board of claim 1, further comprising: a first solder resist layer;
the copper clad plate layer, the first semi-cured sheet layer, the first copper foil layer, the first insulating layer and the first solder mask layer are sequentially stacked from bottom to top;
the first solder mask layer is provided with a third through hole penetrating along the thickness direction, and the third through hole is communicated with the first through hole.
4. The printed circuit board of claim 1, wherein the display module further comprises: a second prepreg layer, a second copper foil layer and a second insulating layer;
the first insulating layer, the first copper foil layer, the first prepreg layer, the copper clad layer, the second prepreg layer, the second copper foil layer and the second insulating layer are sequentially stacked from top to bottom;
the second copper foil layer is provided with a second bonding pad, and the second insulating layer is provided with a fourth through hole penetrating along the thickness direction; the second pad is located in the fourth through hole.
5. The printed circuit board of claim 4, wherein the display module further comprises: a second solder resist layer;
the first insulating layer, the first copper foil layer, the first prepreg layer, the copper clad layer, the second prepreg layer, the second copper foil layer, the second insulating layer and the second solder mask layer are sequentially stacked from top to bottom;
the second solder mask layer is provided with a fifth through hole penetrating along the thickness direction, and the fifth through hole is communicated with the fourth through hole.
6. The printed circuit board of claim 1,
the display module assembly still includes: a third prepreg layer, a third copper foil layer and a third solder resist layer;
the first insulating layer, the first copper foil layer, the first prepreg layer, the copper clad layer, the third prepreg layer, the third copper foil layer and the third solder resist layer are sequentially stacked from top to bottom;
the third copper foil layer is provided with a third pad; the third solder mask layer is provided with a sixth through hole penetrating along the thickness direction, and the third pad is located in the sixth through hole.
7. The printed circuit board according to any one of claims 1 to 6, wherein the first insulating layer comprises a fourth prepreg layer or an organic coating.
8. The printed circuit board of claim 7, wherein the organic coating comprises: an organic material having a photo-curing property or an organic material having a thermosetting property.
9. The printed circuit board of claim 8, wherein the organic coating has added thereto: toner and/or thermal expansion coefficient modifier.
10. A display module, comprising: an LED, solder paste, and the printed circuit board of any one of claims 1 to 9;
the soldering paste is arranged in the first through hole and covers the first bonding pad;
the surface of the soldering paste, which faces away from the first copper foil layer, and the surface of the first insulating layer, which faces away from the first copper foil layer, are flush; or the surface of the soldering paste, which faces away from the first copper foil layer, is lower than the surface of the first insulating layer, which faces away from the first copper foil layer;
and the lamp pins of the LED are connected with the surface of the soldering paste deviated from the first copper foil layer.
11. An LED display screen, comprising the display module of claim 10.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011265238.9A CN112738990B (en) | 2020-11-12 | 2020-11-12 | Printed circuit board, display module and LED display screen |
| PCT/CN2021/115449 WO2022100210A1 (en) | 2020-11-12 | 2021-08-30 | Printed circuit board, display module, and led display screen |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011265238.9A CN112738990B (en) | 2020-11-12 | 2020-11-12 | Printed circuit board, display module and LED display screen |
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| Publication Number | Publication Date |
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| CN112738990A true CN112738990A (en) | 2021-04-30 |
| CN112738990B CN112738990B (en) | 2022-08-23 |
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| CN202011265238.9A Active CN112738990B (en) | 2020-11-12 | 2020-11-12 | Printed circuit board, display module and LED display screen |
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| CN (1) | CN112738990B (en) |
| WO (1) | WO2022100210A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022100210A1 (en) * | 2020-11-12 | 2022-05-19 | 深圳市艾比森光电股份有限公司 | Printed circuit board, display module, and led display screen |
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| US20060278999A1 (en) * | 2003-09-29 | 2006-12-14 | Phoenix Precision Technology Corporation | Substrate for Pre-Soldering Material and Fabrication Method Thereof |
| US20100116534A1 (en) * | 2008-11-12 | 2010-05-13 | Samsung Electro-Mechanics Co., Ltd. | Printed Circuit Board Having Flow Preventing Dam And Manufacturing Method Thereof |
| KR20130003917A (en) * | 2011-07-01 | 2013-01-09 | 대덕전자 주식회사 | Method of manufacturing a pad for chip-embedded printed circuit board |
| CN103545439A (en) * | 2013-10-09 | 2014-01-29 | 厦门吉瓦特照明科技有限公司 | Flip-chip LED COB light source radiating substrate device |
| CN107278050A (en) * | 2017-08-07 | 2017-10-20 | 郑州云海信息技术有限公司 | A kind of asymmetric pad steel mesh windowing methods of PCBA and system |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112738990B (en) * | 2020-11-12 | 2022-08-23 | 深圳市艾比森光电股份有限公司 | Printed circuit board, display module and LED display screen |
-
2020
- 2020-11-12 CN CN202011265238.9A patent/CN112738990B/en active Active
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2021
- 2021-08-30 WO PCT/CN2021/115449 patent/WO2022100210A1/en active Application Filing
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| US20060278999A1 (en) * | 2003-09-29 | 2006-12-14 | Phoenix Precision Technology Corporation | Substrate for Pre-Soldering Material and Fabrication Method Thereof |
| US20100116534A1 (en) * | 2008-11-12 | 2010-05-13 | Samsung Electro-Mechanics Co., Ltd. | Printed Circuit Board Having Flow Preventing Dam And Manufacturing Method Thereof |
| KR20130003917A (en) * | 2011-07-01 | 2013-01-09 | 대덕전자 주식회사 | Method of manufacturing a pad for chip-embedded printed circuit board |
| CN103545439A (en) * | 2013-10-09 | 2014-01-29 | 厦门吉瓦特照明科技有限公司 | Flip-chip LED COB light source radiating substrate device |
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| WO2022100210A1 (en) * | 2020-11-12 | 2022-05-19 | 深圳市艾比森光电股份有限公司 | Printed circuit board, display module, and led display screen |
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| Publication number | Publication date |
|---|---|
| CN112738990B (en) | 2022-08-23 |
| WO2022100210A1 (en) | 2022-05-19 |
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