JP2007189066A - Method for manufacturing electronic component, and substrate assembly of electronic components - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component manufacturing method capable of reliably recognizing recognition marks in separating/dividing an assembly substrate, and to provide the substrate assembly of the electronic components. <P>SOLUTION: The electronic component manufacturing method includes a first process (1) for preparing the substrate assembly 10 having boundary marks 22, which are arranged at positions to recognize the positions of the boundary lines 16x of substrate regions 16, at the outer side of a region (hereinafter referred to as an "assembly region") where the plurality of regions 16 (the "substrate regions") to be a substrate for one electronic component are arranged on at least one main surface; a second process (2) for arranging a prescribed amount of one or not less than two kinds of adhesives at the boundary marks 22, so as to form recognition marks 34 which are projected from one main surface of the substrate assembly 10; a third process (3) for arranging a sealing resin in at least the assembly region of one main surface of the substrate assembly 10; and a fourth process (4) for recognizing the recognition marks 34 from an outer part, so as to separate/divide the substrate assembly 10. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an electronic component manufacturing method and an electronic component board assembly, and more particularly, to an electronic component manufacturing method and an electronic component substrate assembly suitable for electronic components using a ceramic multilayer circuit board.

  In general, a module type electronic component formed by mounting a plurality of mounted components (SMD: Surface Mountable Device) on a substrate mechanically or electromagnetically protects the mounted SMD and other circuit elements. A metal case or (b) a sealing resin is provided.

To put it simply, module type electronic components with a sealing resin
(1) Production of parent substrate (also referred to as “collection substrate”, “mother substrate”, “substrate assembly”) (2) SMD mounting (usually solder reflow)
(3) Sealed with resin (4) Manufactured through the steps of separating and dividing the parent substrate.

  Here, in the step (4), the parent substrate is separated and divided using the recognition mark (alignment mark) as a target.

For example, as shown in FIG. 5, the electronic component 72 is arranged vertically and horizontally on the main surface of the ceramic mother substrate 71, and the electrodes 80 to 83 of the electronic component 72 are arranged on the surface opposite to the main surface. On the periphery of the ceramic mother board 71, recognition marks 88 used for recognizing dicing are formed at predetermined intervals on extension lines of the dicing lines m0 to m7 and n0 to n8 so as to delimit adjacent electronic components 72. It arrange | positions (for example, refer patent document 1).
JP 2002-246336 A

  Such a recognition mark is provided in a margin portion (abandoned portion) of the parent substrate. When a component is mounted on the same surface as the recognition mark and sealed with a sealing resin, it is necessary to prevent the recognition mark from being hidden by the sealing resin.

  In recent years, there has been a demand for a reduction in the area of the margin portion for increasing the number of substrates taken from the parent substrate, a reduction in the viscosity of the sealing resin for reliably filling the gap between the SMD and the substrate, and the like. In such a case, the sealing resin protrudes to the margin portion, and the recognition mark is easily hidden by the sealing resin.

  In view of such circumstances, the present invention intends to provide an electronic component manufacturing method and an electronic component assembly capable of reliably recognizing a recognition mark when the substrate assembly is separated and divided. Is.

  In order to solve the above problems, the present invention provides a method of manufacturing an electronic component configured as follows.

  The method for manufacturing an electronic component includes first to fourth steps. In the first step, a substrate assembly is prepared. The substrate assembly has a region (hereinafter referred to as “collection region”) in which a plurality of regions (hereinafter referred to as “substrate regions”) serving as substrates of one electronic component are arranged on at least one main surface. Outside the substrate (hereinafter referred to as “outer region”) has a boundary mark disposed at a position where the position of the boundary line of the substrate region can be recognized. In the second step, a predetermined amount of one type or two or more types of adhesives are arranged on the boundary mark to form a recognition mark protruding from the one main surface of the substrate assembly. In the third step, a sealing resin is disposed in at least the assembly region of the one main surface of the substrate assembly. In the fourth step, the recognition mark is recognized from the outside, and the substrate assembly is separated and divided.

  In the above manufacturing method, the boundary mark only needs to be arranged at a position where the position of the boundary line of the substrate region can be recognized, and is not limited to the boundary line of the substrate region, but is a position separated from the boundary line of the substrate region by a predetermined distance. Alternatively, it may be an extension of the center line of the substrate region. The boundary mark only needs to be arranged for at least a part of the boundary line of the substrate region, and is not necessarily arranged for all the boundary lines. The electric circuit of the electronic component is usually configured on the main surface of the substrate assembly or inside the substrate assembly before the sealing resin is disposed on the substrate assembly.

  In the above manufacturing method, since the recognition mark protrudes from one main surface of the substrate assembly, the sealing resin spreads to the outer region when the sealing resin is disposed in the assembly region of one main surface of the substrate assembly. However, it is easy to prevent the recognition mark from being completely hidden by the sealing resin (that is, at least a part of the recognition mark is exposed from the surface of the sealing resin).

  Even if the recognition mark is completely hidden by the sealing resin, if the part of the sealing resin is removed from the side opposite to the substrate assembly, that is, from the surface side of the sealing resin, the recognition mark is removed. Can be exposed. At this time, since the recognition mark protrudes from one main surface of the substrate assembly, the amount of sealing resin to be removed for exposing the recognition mark is small, so that the recognition mark can be easily exposed.

  According to the above manufacturing method, by forming the recognition mark three-dimensionally, the recognition mark can be reliably recognized from the outside even when the recognition mark is covered with the sealing resin. As a result, in the fourth step, the boundary line of the substrate region is estimated by recognizing the recognition mark from the outside, and the substrate assembly is moved to one or more substrate regions along the estimated boundary line of the substrate region. Can be separated and divided into parts including

  Preferably, the boundary mark is made of a conductive metal. The adhesive is solder.

  In this case, by using a conductive metal for the boundary mark, the boundary mark can be simultaneously formed in the step of forming the surface electrode, the wiring pattern, or the like in the substrate region. Further, in the step of arranging the solder for fixing the mounted component in the substrate region, the solder can be arranged at the boundary mark at the same time. Therefore, it is not necessary to add another process only for forming the recognition mark.

  Preferably, the second step includes (a) a step of applying a solder paste to the boundary mark, and (b) the solder paste applied to the boundary mark (hereinafter referred to as “recognition mark solder”). And a step of solidifying by heat treatment.

  In this case, for example, when the solder paste (mounting solder) for fixing the mounting component to the board region is disposed (for example, during screen printing), the recognition mark solder can be applied to the boundary mark at the same time. . In addition to the mounting solder, the recognition mark solder can be solidified by heat treatment simultaneously with the mounting solder. Since the recognition mark solder is solidified after the second step is completed, it is easy to handle in the subsequent steps.

  Preferably, the adhesive has a relatively high affinity with the boundary mark and a relatively low affinity with the vicinity of the boundary mark. In the second step, the adhesive is disposed so as to protrude from the boundary mark.

  In this case, the adhesive has a relatively low affinity (wetting property) with the vicinity of the boundary mark as compared with the affinity with the boundary mark itself. It is repelled from the vicinity of the boundary mark. The adhesive is rounded by the surface tension and becomes a substantially spherical recognition mark supported only on the boundary mark. For example, the boundary mark has hydrophilicity, the vicinity of the boundary mark has water repellency, and the adhesive contains hydrophilic resin or metal as a component. In particular, when the substrate is ceramic or resin and the adhesive is solder, ball-shaped solder is formed as a recognition mark.

  Since the recognition mark formed in this way can increase the protruding height from one main surface of the substrate assembly, the recognition mark can be further prevented from being hidden by the sealing resin. it can.

  Preferably, in the second step, the recognition mark solder is applied to the boundary mark simultaneously with the application of the mounting solder for mounting the mounting component on the board region.

  In this case, the manufacturing process can be simplified by applying the recognition mark solder simultaneously with the mounting solder.

  Preferably, in the second step, the recognition mark solder and the mounting solder are simultaneously solidified by heat treatment.

  In this case, in the second step, for example, the entire assembly including the substrate assembly is reflowed, and the recognition mark solder is solidified by heat treatment simultaneously with the mounting solder, thereby simplifying the manufacturing process.

  Preferably, in the first step, the substrate assembly includes a plurality of substrate regions arranged in a lattice pattern in the assembly region on the one main surface of the substrate assembly. A dividing groove is formed along the boundary line and its extension line. The boundary mark is divided into two by the dividing groove. In the second step, the adhesive is disposed on the boundary mark across the dividing groove.

  In this case, since the adhesive is not divided by the dividing groove, the recognition mark formed by the adhesive can be prevented from being divided by the dividing groove. If the recognition mark is divided, it may be difficult to detect the position of the recognition mark. However, since the recognition mark is not divided, the recognition mark can be easily detected (recognized).

  Preferably, in the third step, after the sealing resin is disposed on the one main surface of the substrate assembly with a thickness not less than the height of the recognition mark, the sealing resin is disposed on the substrate assembly. The recognition mark is exposed from the sealing resin.

  In this case, the recognition mark can be exposed when the sealing resin is removed, which is suitable for reducing the height of the electronic component. The sealing resin is removed, for example, by polishing, and the recognition mark is exposed from the sealing resin. At this time, a part of the recognition mark may be removed together with the sealing resin. When the sealing resin is soft, the recognition resin may be exposed from the sealing resin by removing the sealing resin with a spatula or the like.

  Preferably, in the first step, the substrate assembly has a convex portion on which the recognition mark is arranged on the one main surface of the substrate assembly.

  In this case, since the recognition mark is raised by the convex part, the protruding height of the recognition mark can be secured even if the recognition mark is small.

  Preferably, in the fourth step, (a) in a state before the sealing resin is completely cured, the recognition mark is recognized from the outside, and the sealing is performed along the boundary line of the substrate region. After forming the dividing groove only in the stop resin, (b) the substrate aggregate is separated and divided along the boundary line of the substrate region in a state where the sealing resin is further cured.

  When deformation such as warpage occurs in the substrate assembly as the sealing resin cures, the deformation of the substrate assembly increases as the sealing resin cures. Since the deformation of the substrate aggregate is relatively small before the sealing resin is completely cured, the dividing grooves can be accurately formed in the sealing resin. In addition, since the sealing resin is relatively soft compared to the substrate assembly, it is possible to easily form the dividing grooves in the sealing resin with high accuracy.

  Even if the sealing resin is further cured after forming the dividing grooves in the sealing resin, the sealing resin is separated and divided into individual substrate regions. It becomes difficult to be affected. That is, the deformation of the substrate assembly is smaller than when the sealing resin is not separated and divided. Further, since the deformation of the substrate assembly is small, it can be easily separated and divided. Furthermore, since the curing of the sealing resin is progressing, adverse effects such as adhesion of cutting powder or the like generated in the process of separating / dividing the substrate aggregate to the sealing resin are reduced.

  Therefore, the substrate aggregate can be separated and divided with high accuracy and efficiency.

  The present invention also provides a board assembly of electronic components configured as follows.

  A board assembly of electronic components includes a boundary mark, a recognition mark, and a sealing resin. The boundary mark is a region (hereinafter referred to as “collection region”) in which a plurality of regions (hereinafter referred to as “substrate regions”) serving as substrates of one electronic component are arranged on at least one main surface of the substrate assembly. ”) (Hereinafter referred to as“ outer region ”) is disposed at a position where the position of the boundary line of the substrate region can be recognized. The recognition mark is formed of a predetermined amount of one type or two or more types of adhesive disposed on the boundary mark, and protrudes from the one main surface of the substrate assembly. The sealing resin is disposed at least in the assembly region of the one main surface of the substrate assembly. It is possible to separate and divide the substrate assembly by recognizing the recognition mark from the outside.

  In the above configuration, the boundary mark only needs to be disposed at a position where the position of the boundary line of the substrate region can be recognized, and is not limited to the boundary line of the substrate region. It may be on an extension line of the center line of the substrate region. The boundary mark only needs to be arranged for at least a part of the boundary line of the substrate region, and is not necessarily arranged for all the boundary lines. The electric circuit of the electronic component is usually configured on the main surface of the substrate assembly or inside the substrate assembly before the sealing resin is disposed on the substrate assembly.

  In the above configuration, since the recognition mark protrudes from one main surface of the substrate assembly, the sealing resin spreads to the outer region when the sealing resin is disposed in the assembly region of one main surface of the substrate assembly. However, it is easy to prevent the recognition mark from being completely hidden by the sealing resin (that is, at least a part of the recognition mark is exposed from the sealing resin).

  Even if the recognition mark is completely hidden by the sealing resin, if the part of the sealing resin is removed from the side opposite to the substrate assembly, that is, the surface side of the sealing resin, the recognition mark is exposed. be able to. At this time, since the recognition mark protrudes from one main surface of the substrate assembly, the amount of sealing resin to be removed for exposing the recognition mark is small, so that the recognition mark can be easily exposed.

  According to said structure, even if a recognition mark is covered with sealing resin by forming a recognition mark in three dimensions, a recognition mark can be reliably recognized from the outside. As a result, the boundary line of the substrate region is estimated by recognizing the recognition mark from the outside, and the substrate aggregate is separated into parts including one or more substrate regions along the estimated boundary line of the substrate region. Can be divided.

  Preferably, the boundary mark is made of a conductive metal. The adhesive is solder.

  In this case, by using a conductive metal for the boundary mark, the boundary mark can be simultaneously formed in the step of forming the surface electrode, the wiring pattern, or the like in the substrate region. Further, in the step of arranging the solder for fixing the mounted component in the substrate region, the solder can be arranged at the boundary mark at the same time. Therefore, it is not necessary to add another process only for forming the recognition mark.

  Preferably, the adhesive has a relatively high affinity with the boundary mark and a relatively low affinity with the vicinity of the boundary mark. The adhesive is disposed so as to protrude from the boundary mark.

  In this case, since the adhesive has a relatively low affinity with the vicinity of the boundary mark, the part of the adhesive that protrudes from the boundary mark is repelled from the vicinity of the boundary mark. The adhesive is rounded by the surface tension and becomes a substantially spherical recognition mark supported only on the boundary mark. For example, the boundary mark has hydrophilicity, the vicinity of the boundary mark has water repellency, and the adhesive contains hydrophilic resin or metal as a component. In particular, when the adhesive is solder, ball-shaped solder is formed as a recognition mark.

  Since the recognition mark formed in this way can increase the protruding height from one main surface of the substrate assembly, the recognition mark can be further prevented from being hidden by the sealing resin. it can.

  Preferably, a mounting component is mounted on the board region. The sealing resin is disposed so as to cover the mounted component.

  In this case, by exposing the recognition mark solder from the sealing resin that covers the mounted component, the board assembly can be easily separated into one or more sub boards.

  According to the present invention, the recognition mark can be reliably recognized when the substrate aggregate is separated and divided.

  Hereinafter, embodiments of the present invention will be described with reference to FIGS.

  <Example 1> The manufacturing method of the electronic component of Example 1 is demonstrated, referring FIG. 1A to 1F, (A) is a plan view of the parent substrate 10, and (B) is a cross-sectional view taken along line bb of (A).

  First, the parent substrate 10 shown in FIG. 1a is prepared.

  As shown in FIG. 1A (A), on one main surface of the parent substrate 10, that is, the upper surface 12 in the figure, a plurality of inner regions are formed on the inner region from the outer region along the outer peripheral edge, as indicated by dotted lines 16x. The substrate regions 16 are arranged in a grid pattern. A metal film is formed in a predetermined pattern on the upper surface 12 of the parent substrate 10. That is, the surface electrode 20 is formed in each substrate region 16, and the boundary mark 22 is formed on the extended region of the boundary line 16 x of the substrate region 16 in the outer region.

  As shown in FIG. 1A (B), the other main surface of the parent substrate 10, that is, the lower surface 14 in the drawing, corresponds to the boundary line 16x (see FIG. 1A) of the substrate region 16 and its extension line. A dividing groove 15 is formed.

  Next, as shown in FIG. 1b, solder pastes 30 and 32 are screen-printed on the upper surface 12 of the parent substrate 10 using a mask. That is, the solder pastes 30 and 32 are arranged on the surface electrode 20 in the substrate region 16 and the boundary mark 22 in the peripheral region 17. At this time, as shown in FIG. 1 b (C) in which the portion indicated by reference sign c in FIG. Printing is performed so as to protrude not only on the boundary mark 22 but also in the vicinity of the boundary mark 22, and preferably, the area S 1 of the boundary mark 22 is included in the area S 2 of the solder paste 32. However, even if the region S1 is not completely included in the region S2, it is only necessary that a part thereof overlaps.

  Next, as shown in FIG. 1 c, the mounting component 40 is mounted on the solder paste 30 of the surface electrode 20 in each substrate region 16 of the parent substrate 10.

  Next, the parent substrate 10 is put in a reflow furnace, subjected to heat treatment, and the solder pastes 30 and 32 are melted and then cooled. By solidifying the molten solder paste 30, the mounting component 40 is fixed to the surface electrode 20, as shown in FIG.

  The solder paste 32 (see FIGS. 1b and 1c) applied so as to protrude from the boundary mark 22 is an enlarged cross-sectional view of the main part of the portion indicated by reference numeral c in FIGS. 1d (B) and 1d (B). As indicated by reference numeral 34 in 1d (C), when melted, it becomes a ball shape due to its surface tension, and is substantially supported only on the boundary mark 22.

  Even if the printing position of the solder paste 32 is slightly deviated from the boundary mark 22, the solder paste 32 becomes a substantially spherical solder 34 supported on the boundary mark 22 by heat treatment. 22 substantially coincides with the center position.

  Next, as indicated by oblique lines in FIG. 1e, a sealing resin 50 is applied to the upper surface 12 of the parent substrate 10 on which the mounting component 40 is mounted. The sealing resin 50 is applied to the assembly region of the parent substrate 10, that is, each substrate region 16 with a predetermined thickness so that the mounting component 40 is embedded in the sealing resin 50. Even if the sealing resin 50 applied to the gathering region spreads to the outer region 17 by appropriately selecting the viscosity and the coating amount of the sealing resin 50, at least the upper part of the ball-shaped solder 34 is sealed. The resin 50 can be exposed.

  Next, as illustrated in FIG. 1 f, the division grooves 52 are formed in the sealing resin 50 of the parent substrate 10 along the boundary line 16 x of the substrate region 16. At this time, the ball-shaped solder 34 exposed in the outer region of the parent substrate 10 is used as a target. The dividing groove 52 is formed in the above.

  Next, the parent substrate 10 is bent along the boundary line 16x of the substrate region 16, separated and divided to form the child substrate 11 shown in FIG. 1g. At this time, since the dividing grooves 15 and 52 have a certain width, steps 18 and 19 are formed on the sub-board.

  In addition, it is not limited to the case where the substrate divided into the sub-boards 11 as shown in FIG. 1g is shipped as a product, but as shown in FIG. In some cases, the user himself / herself divides it into the sub-boards 11.

  Next, a specific manufacturing example will be described.

First, the parent substrate 10 is prepared. For example, a ceramic green sheet mainly composed of low-temperature sintered ceramic is formed on the carrier film by a doctor blade or the like. Thereafter, the ceramic green sheet is cut into a predetermined size together with the carrier film. Next, a via hole conductor hole is formed in the ceramic green sheet by irradiating the ceramic green sheet with laser light (for example, CO ₂ laser light) or mechanical punching. Next, the hole is filled with a conductor paste mainly composed of Ag and Cu to form a via-hole conductor (interlayer connection conductor). Next, using the same conductor paste, an in-plane conductor pattern that becomes a wiring line, a lead line, or the like is printed on the surface of the ceramic green sheet by screen printing or the like.

  After preparing each ceramic green sheet which becomes a required layer as mentioned above, a carrier film is peeled off, all the ceramic green sheets are laminated | stacked, and it crimps | bonds, and produces an unbaking ceramic laminated body. On one main surface (both main surfaces in Example 2 to be described later) of the unfired ceramic laminate, a portion to be a division groove 15 for dividing the sub-substrate is formed. In forming the groove, a mark (for example, an exposed end surface of the via-hole conductor in which the via-hole conductor hole is filled with the conductive paste) is recognized near the edge of the parent substrate 10 and the groove is formed with high accuracy.

  Next, after firing the unfired ceramic laminate, the end face of the via-hole conductor and the in-plane conductor pattern exposed on the surface are plated to form the surface electrode 20 and the boundary mark 22. The boundary mark 22 may be formed by a thick in-plane conductor pattern, but may be an exposed end face of the via-hole conductor. Further, if the wettability with an adhesive such as solder is excellent, plating is not necessarily required.

  Next, solder printing is performed on the surface of the surface electrode 20 and the boundary mark 22 of the prepared parent substrate 10, and the surface mounting component 40 is mounted on the surface electrode 20. That is, at the time of solder printing, the solder is also printed on the boundary mark 22 used to divide the daughter board 11.

  Next, the parent substrate 10 is put into a reflow furnace, the solder pastes 30 and 32 are melted to fix the external terminals of the components and the surface electrodes of the substrate, and the solder paste 32 on the boundary mark 22 is formed into a three-dimensional ball shape. The solder 34 (hereinafter also referred to as “solder ball 34”) is deformed.

  Next, an epoxy resin or the like is potted as the sealing resin 50 covering the surface mount component 40. In general, in the case of a ceramic substrate, since there is warping and undulation, substrate cracking becomes a problem in transfer molding, and transfer molding is difficult, so resin potting is preferable.

  When potting an epoxy resin, the parent substrate 10 and the sealing resin 50 are heated to improve the fluidity of the sealing resin 50, and the sealing resin 50 flows into a narrow gap between the parent substrate 10 and the surface mount component 40. Like that. Thereby, the fixation between the surface-mounted component 40 and the parent substrate 10 can be strengthened.

  When potting the epoxy resin, the epoxy resin spreads outside and may reach the solder balls 34 arranged near the edge of the parent substrate 10, but the solder balls 34 may be completely covered with the epoxy resin. It is desirable to adjust the coating amount and viscosity of the epoxy resin so that there is no problem.

  Next, defoaming is performed, and the epoxy resin is semi-cured in an oven.

  Next, the position is aligned with the solder ball 34 exposed from the epoxy resin, and the dicing groove 52 for dividing the sub board is formed in the epoxy resin by a dicer. At this time, if both the parent substrate 10 and the epoxy resin 50 are processed simultaneously with a dicer, the working efficiency is lowered. Therefore, only the semi-cured (B stage) epoxy resin is processed, and the blade reaches the parent substrate 10. It is desirable to ensure the dicer speed. At this time, the dividing groove may be formed in the entire resin thickness direction, or the dividing groove may be formed so as to leave a part in the resin thickness direction.

  Next, the semi-cured resin 50 having the divided grooves 52 is further cured (main cured) in an oven, and then the divided grooves 15 formed in the parent substrate 10 and the grooves 52 formed in the epoxy resin 50 are formed. As a trigger, it is divided into the sub-boards 11. As described above, it is desirable to form the division grooves in the sealing resin or the parent substrate in advance, but the division grooves are not necessarily required in both the sealing resin and the parent substrate. That is, the dividing groove may be formed only in one of them, or the dividing groove may not be formed at all. If the dividing groove is not formed, it may be fully cut with a dicer.

  Even if the sealing resin 50 is applied to the solder ball 34, that is, close to the boundary mark 22, the solder ball 34 is three-dimensional, so that it is exposed from the surface of the sealing resin 50 and the dividing groove 52 is formed in the sealing resin 50. When forming, the solder ball 34 can be used as a recognition mark (alignment mark). That is, as long as the solder balls 34 are not completely hidden, the sealing resin 50 can be formed high by being close to the solder balls 34, so that the solder balls 34 and the boundary marks 22 that serve as alignment marks are formed on the substrate region 16. Can be placed close together. As a result, the peripheral region (margin portion) where the alignment mark is arranged is reduced, the area occupied by the substrate region 16 arranged in the parent substrate 10 is increased, and more child substrates 11 are produced from the parent substrate 10 of the same size. It becomes possible to do.

  Further, when the resin is applied, the resin may reach the bottom surface or the side surface of the solder ball, and it is not necessary to accurately adjust the position where the resin is applied. For example, it is not necessary to position the resin application position with respect to the parent substrate with high accuracy, which is necessary in the past, and the processing time can be shortened.

  <Example 2> The manufacturing method of the electronic component of Example 2 is demonstrated referring FIG. 2a and FIG. 2b. The second embodiment is substantially the same as the first embodiment. In the following description, the same reference numerals are used for the same components, and differences from the first embodiment will be mainly described.

  Unlike Example 1, a parent substrate 10a shown in FIG. 2a is prepared. 2A is a top view, FIG. 2B is a cross-sectional view taken along the line bb of FIG. 2A, and FIG. 2C is an enlarged cross-sectional view of a main part indicated by reference numeral c in FIG. In order to facilitate the division of the parent substrate 10 a, a dividing groove 13 having a V-shaped cross section is formed on the upper surface 12 in addition to the dividing grooves 15 formed on the lower surface 14. For this reason, the boundary mark 23 is divided by the dividing groove 13 as shown in the top view and the cross-sectional view of FIG.

  Each process of the second embodiment is the same as that of the first embodiment.

  That is, a solder paste is printed on the upper surface of the prepared parent substrate 10a. At this time, as shown in the top view and the cross-sectional view of FIG. 2B (B), the solder paste 33 is applied to an area larger than the area of the divided boundary mark 23.

  Next, the parent substrate 10a is put into a reflow furnace and heat treatment is performed. When the heat treatment is performed, as shown in a top view and a cross-sectional view of FIG. 2B (C), one ball-like solder 35 is formed on the boundary mark 23 divided into two at the center.

  Next, a sealing resin is applied to the upper surface of the parent substrate 10a, and then a split groove is formed in the sealing resin using the ball-shaped solder 35 on the boundary mark 23 as a target.

  Finally, the parent substrate 10a is divided into child substrates.

  Ball-shaped solder 35 may be separately formed in each region of the boundary mark 23 divided by the second dividing groove 13, but in this case, detection (recognition of the center position) ) Becomes difficult. As shown in FIG. 2B (C), the central position can be easily detected (recognized) by forming a common ball-shaped solder 35 in the entire boundary mark 23 divided into a plurality of division grooves 13.

  <Example 3> The manufacturing method of the electronic component of Example 3 is demonstrated, referring FIG. The third embodiment is substantially the same as the first embodiment. In the following description, the same reference numerals are used for the same components, and differences from the first embodiment will be mainly described.

  The third embodiment is different from the first embodiment in that the sealing resin 50 is polished and removed.

  That is, as in the first embodiment, a solder paste is printed on the upper surface 12 of the parent substrate 10 and the mounting component 40 is mounted. Then, heat treatment is performed, and the sealing resin 50 is applied to the upper surface 12 of the parent substrate 10. The mounting component 40 is sealed.

  In this example, as shown in the cross-sectional view of FIG. 3A, the ball-shaped solder 34 formed on the boundary mark 22 is higher than the mounting component 40, and the ball-shaped solder 34 is the same as that of the first embodiment. Differently, it is embedded in the sealing resin 50.

  Next, as shown in FIG. 3B, the thickness of the sealing resin 50 is reduced. For example, the surface of the resin is polished using a polishing roller 60 of a polishing machine, and the resin application surface is flattened.

  Thereby, as shown in the cross-sectional view of FIG. 3C and the top view of FIG. 3D, the substantially circular cross-section of the ball-shaped solder 34 formed on the boundary mark 22 on the polishing surface of the sealing resin 50. To expose. The mounted component 40 is embedded and sealed in the sealing resin 50.

  Next, in the same manner as in Example 1, after forming a dividing groove in the sealing resin 50, it is divided into child substrates. When forming the dividing groove in the sealing resin 50, a substantially circular cross section 34s of the ball-shaped solder 34 exposed from the sealing resin is used as a target.

  Finally, the parent substrate 10 is divided into child substrates.

  In this example, since the solder ball 34 may be covered with the resin after the resin application, the degree of freedom in selecting the resin material and the application amount is high. Therefore, the processing time can be shortened and simplified.

  Further, since the solder ball 34 becomes spherical after reflowing, even if the height of the polished surface varies, the exposed cross-sectional surface is substantially circular, and it is easy to detect the center position.

  Since it is not necessary to expose the alignment mark at the time of resin application, the peripheral area where the alignment mark is arranged can be reduced, the area occupied by the individual substrate area 16 in the parent substrate 10 can be increased, and the number to be obtained can be further increased.

  <Example 4> The manufacturing method of the electronic component of Example 4 is demonstrated referring FIG. The fourth embodiment is substantially the same as the third embodiment. In the following description, the same reference numerals are used for the same components, and differences from the third embodiment will be mainly described.

  4A to 4C are cross-sectional views corresponding to FIGS. 3A to 3C of Example 3, respectively. FIG. 4D is an enlarged cross-sectional view of a main part of the portion indicated by reference sign d in FIG.

  In the fourth embodiment, as illustrated in FIG. 4, a parent substrate 10 x provided with a convex portion 12 x in the peripheral region 17 is used. A boundary mark 22 is formed on the convex portion 12x of the parent substrate 10x.

  For example, one or two or more step forming ceramic green sheets obtained by punching and removing portions other than the portion corresponding to the pedestal on which the boundary mark is formed are laminated on an ordinary ceramic green sheet laminate, and then firing the laminate. Thus, the parent substrate 10x is manufactured.

  As in the third embodiment, solder is placed on the parent substrate 10 x, heat-treated, solder balls 34 are formed on the boundary marks 22, and sealed with a sealing resin 50.

  If the size of the protrusion 12x protruding from the upper surface 12 of the parent substrate 10x is up to about 100 μm, the solder paste is simultaneously printed on the surface electrode 22 on the upper surface 12 of the parent substrate 10x and the boundary mark 22 of the protrusion 12x. Therefore, complication of the process can be avoided.

  When the protrusion 12x has a large dimension protruding from the upper surface 12 of the parent substrate 10x, the solder paste is printed on the boundary mark, or the solder paste is placed using a dispenser, separately from the surface electrode solder printing. That's fine.

  Even if the diameter of the solder 34 is small, the solder 34 can be exposed after polishing by the step of the convex portion 12x. Therefore, the application area of the solder paste 32 necessary for making a large (tall) solder ball 34 is reduced, and as a result, it is possible to further reduce the peripheral region where the alignment mark is arranged.

  Since the application area of the solder paste 32 for forming the solder 34 is reduced, the alignment marks can be brought closer to each other, and it is possible to cope with a small-sized product.

  That is, in the case of a ceramic substrate, the shrinkage amount during firing is not uniform, and warping and undulation occur. Therefore, when producing a substrate region from the parent substrate, it is preferable to align alignment marks at the arrangement pitch of the child substrate. However, the size of the solder balls is restricted by the arrangement pitch of the sub-boards. When the daughter board is downsized and the pitch for cutting out the individual boards is reduced, it becomes difficult to form a large solder ball, and the height of the solder ball is insufficient. In such a case, at the lower part of the solder ball, by partially thickening the substrate and raising the solder ball, the solder ball is exposed after the resin polishing and can be aligned.

  It is also conceivable that a configuration is provided in which only a step (projection) is provided on the substrate without using a solder ball, and a planar mark formed on the step (projection) is exposed. However, in order to perform solder printing on the surface electrode in the substrate region, the height of the step (projection) is limited to a maximum of about 100 μm, so that a planar mark formed on the step (projection) is exposed. Therefore, it is impossible to form a step (projection) having a sufficiently high height.

  <Summary> As explained above, by using a recognition mark (alignment mark) with solder placed on the surface of the boundary mark, it is reliably detected when the parent substrate is separated and divided after resin sealing. Can be recognized.

  Thereby, the degree of freedom of the resin application position and the resin application amount is increased, and the process can be simplified.

  Further, by forming a three-dimensional solder ball, labor for exposing the alignment mark is reduced. Solder balls that serve as alignment marks can be formed by a solder printing and reflow process for mounting surface-mounted components, and no additional process is required.

  Since the space for exposing the alignment mark may be small, more child substrates can be manufactured from the same size parent substrate, and the manufacturing cost can be reduced.

  Since the solder ball is formed in a ball shape, it is easy to recognize the center during alignment. Even if the printing position is slightly shifted during solder printing, the solder position is corrected by self-alignment during reflow.

  In Examples 3 and 4, since the solder balls may be hidden behind the resin after application of the resin, it is less necessary to adjust the application amount of the resin than in Examples 1 and 2. Therefore, compared to the first and second embodiments, the resin can be easily applied, and the process can be further simplified. In addition, since the space for exposing the alignment mark is smaller, the manufacturing cost can be further reduced.

  The present invention is not limited to the above-described embodiment, and can be implemented with various modifications. For example, the substrate may be a substrate having a single layer structure, and the material thereof may be a resin.

It is (A) top view and (B) sectional drawing of a parent board | substrate. Example 1 It is (A) top view, (B) sectional drawing, (C) principal part expanded sectional view of the parent board | substrate which apply | coated the solder paste. Example 1 It is (A) top view and (B) sectional drawing of the main board | substrate with which mounting components were mounted. Example 1 It is (A) top view, (B) sectional drawing, (C) principal part expanded sectional view of the parent board | substrate after heat processing. Example 1 It is (A) top view and (B) sectional drawing of the parent board | substrate with which sealing resin was apply | coated. Example 1 It is (A) top view and (B) sectional drawing of the parent board | substrate with which the division groove | channel was formed in sealing resin. Example 1 It is sectional drawing of the child board | substrate divided | segmented from the parent board | substrate. Example 1 It is (A) top view, (B) sectional drawing, (C) principal part expanded sectional view of the parent board | substrate with which the division groove | channel was formed in both surfaces. (Example 2) (A) When a division | segmentation groove | channel is formed, (B) When a solder paste is printed, (C) It is the principal part upper surface figure and principal part sectional drawing which show the time of heat processing. (Example 2) (A) Cross-sectional view before polishing, (B) Cross-sectional view during polishing, (C) Cross-sectional view after polishing, (D) Top view after polishing. (Example 3) (A) Cross-sectional view before polishing, (B) Cross-sectional view during polishing, (C) Cross-sectional view after polishing, (D) Enlarged cross-sectional view of main parts before polishing of the parent substrate. (Example 4) It is a top view of a mother board. (Conventional example)

Explanation of symbols

10, 10a, 11x Parent board (board assembly)
11 Substrate 13 Dividing groove 16 Substrate region 16x Boundary line 17 Outer region 20 Surface electrode 22 Boundary mark 30 Solder paste (solder for mounting)
32 Solder paste (adhesive, solder for recognition mark)
34 Solder (recognition mark)
40 Mounted parts 50 Sealing resin 52 Dividing groove

Claims (15)

On at least one main surface, a region (hereinafter referred to as “collection region”) where a plurality of regions (hereinafter referred to as “substrate regions”) serving as substrates of one electronic component are arranged (hereinafter referred to as “collection region”). A first step of preparing a substrate assembly having a boundary mark arranged at a position where the position of the boundary line of the substrate region can be recognized;
A second step of forming a recognition mark projecting from the one main surface of the substrate assembly by disposing a predetermined amount of one or more kinds of adhesives on the boundary mark;
A third step of disposing a sealing resin in at least the aggregate region of the one main surface of the substrate aggregate;
A method for manufacturing an electronic component, comprising: a fourth step of recognizing the recognition mark from the outside and separating and dividing the substrate assembly. The boundary mark is formed of a conductive metal,
The method of manufacturing an electronic component according to claim 1, wherein the adhesive is solder. The second step includes
Applying solder paste to the boundary mark;
The method of manufacturing an electronic component according to claim 2, further comprising a step of solidifying the solder paste (hereinafter referred to as “recognition mark solder”) applied to the boundary mark by heat treatment. The adhesive has a relatively high affinity with the boundary mark, and a relatively low affinity with the vicinity of the boundary mark,
4. The method of manufacturing an electronic component according to claim 1, wherein the adhesive is disposed so as to protrude from the boundary mark in the second step. 5. In the second step,
5. The electronic component manufacturing method according to claim 3, wherein the recognition mark solder is applied to the boundary mark simultaneously with the application of the mounting solder for mounting the mounting component on the board region. 6. Method. In the second step,
6. The method of manufacturing an electronic component according to claim 5, wherein the recognition mark solder and the mounting solder are simultaneously solidified by heat treatment. In the first step,
The substrate assembly has a plurality of substrate regions arranged in a lattice pattern in the assembly region on the one main surface of the substrate assembly, and along the boundary line and the extension line of the substrate region. Split grooves are formed,
The boundary mark is divided into two by the dividing groove,
In the second step,
The method for manufacturing an electronic component according to claim 1, wherein the adhesive is disposed on the boundary mark across the dividing groove. In the third step,
After disposing the sealing resin on the one main surface of the substrate assembly with a thickness greater than or equal to the height of the recognition mark, removing the sealing resin from the opposite side of the substrate assembly, The method for manufacturing an electronic component according to claim 1, wherein the recognition mark is exposed from a sealing resin. In the first step,
The said board | substrate aggregate | assembly has the convex part by which the said recognition mark is arrange | positioned in said one main surface of the said board | substrate aggregate | assembly, The any one of Claims 1-8 characterized by the above-mentioned. Manufacturing method for electronic parts. In the fourth step,
In a state before the sealing resin is completely cured, after recognizing the recognition mark from the outside, along the boundary line of the substrate region, after forming a dividing groove only in the sealing resin,
The method of manufacturing an electronic component according to claim 1, wherein the substrate assembly is separated and divided in a state where the sealing resin is further cured. On at least one main surface, a region (hereinafter referred to as “collection region”) in which a plurality of regions (hereinafter referred to as “substrate regions”) serving as a substrate of one electronic component are arranged (hereinafter referred to as “collection region”). A boundary mark arranged at a position where the position of the boundary line of the substrate region can be recognized;
A recognition mark formed from a predetermined amount of one or two or more types of adhesive disposed on the boundary mark, and protruding from the one main surface of the substrate assembly;
A sealing resin disposed in at least the assembly region of the one main surface of the substrate assembly,
A substrate assembly of electronic components, wherein the recognition mark can be recognized from outside and the substrate assembly can be separated and divided. The boundary mark is formed of a conductive metal,
The substrate assembly of electronic components according to claim 11, wherein the adhesive is solder. The adhesive has a relatively high affinity with the boundary mark, and a relatively low affinity with the vicinity of the boundary mark,
13. The electronic component substrate assembly according to claim 11, wherein the adhesive is disposed so as to protrude from the boundary mark. Mounted components are mounted on the board area,
The assembly of electronic components according to claim 11, wherein the sealing resin is disposed so as to cover the mounted component.   The assembly of electronic components according to claim 11, wherein a division groove for separating and dividing the substrate assembly is formed in the sealing resin.

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