CN113490339A - Control method for canceling low-temperature sectional baking in post-curing of welding-proof hole plugging product - Google Patents
Control method for canceling low-temperature sectional baking in post-curing of welding-proof hole plugging product Download PDFInfo
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- CN113490339A CN113490339A CN202110892783.9A CN202110892783A CN113490339A CN 113490339 A CN113490339 A CN 113490339A CN 202110892783 A CN202110892783 A CN 202110892783A CN 113490339 A CN113490339 A CN 113490339A
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- ink
- hole
- plugging
- hole plugging
- post
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- 238000011417 postcuring Methods 0.000 title claims abstract description 20
- 238000000034 method Methods 0.000 title claims abstract description 18
- 229910000679 solder Inorganic materials 0.000 claims abstract description 9
- 238000009713 electroplating Methods 0.000 claims abstract description 8
- 238000007689 inspection Methods 0.000 claims abstract description 8
- 238000011161 development Methods 0.000 claims abstract description 7
- 239000007787 solid Substances 0.000 claims abstract description 7
- 238000013461 design Methods 0.000 claims abstract description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 4
- 229910052802 copper Inorganic materials 0.000 claims abstract description 4
- 239000010949 copper Substances 0.000 claims abstract description 4
- 238000005520 cutting process Methods 0.000 claims abstract description 4
- 230000008021 deposition Effects 0.000 claims abstract description 4
- 238000005553 drilling Methods 0.000 claims abstract description 4
- 238000001035 drying Methods 0.000 claims abstract description 4
- 238000005530 etching Methods 0.000 claims abstract description 4
- 238000003825 pressing Methods 0.000 claims abstract description 4
- 239000000126 substance Substances 0.000 claims abstract description 4
- 238000012360 testing method Methods 0.000 claims abstract description 4
- 238000002360 preparation method Methods 0.000 claims description 6
- 238000007639 printing Methods 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- 239000003795 chemical substances by application Substances 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 239000004848 polyfunctional curative Substances 0.000 claims description 3
- 230000002159 abnormal effect Effects 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 10
- 230000000740 bleeding effect Effects 0.000 abstract description 4
- 238000004134 energy conservation Methods 0.000 abstract description 4
- 230000009467 reduction Effects 0.000 abstract description 4
- 230000005587 bubbling Effects 0.000 abstract description 3
- 230000006872 improvement Effects 0.000 abstract description 3
- 230000008646 thermal stress Effects 0.000 abstract description 3
- 230000018109 developmental process Effects 0.000 description 5
- 230000008569 process Effects 0.000 description 3
- 230000005856 abnormality Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000011218 segmentation Effects 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 208000037656 Respiratory Sounds Diseases 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007726 management method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/227—Drying of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a control method for canceling low-temperature segmented baking in post-curing of a welding-proof plug hole product, which sequentially comprises the following steps of: engineering data design, cutting, drying, inner layer circuit, pressing, primary drilling, chemical copper deposition, whole board electroplating, outer layer circuit, pattern electroplating, alkaline etching, AOI inspection, solder mask, character, forming, electrical test and finished product inspection; the solid content of the hole plugging ink is set to be 80-85%, and low-temperature segmented baking is cancelled in cooperation with a high-temperature post-curing station, so that the expansion coefficient of the hole plugging ink in a hole can be effectively reduced, the thermal stress is reduced, the quality problems of oil bleeding, ink bubbling at the edge of a hole plugging hole, unqualified hole plugging fullness and ink cracks in the hole can not be generated, the hole plugging quality meets the customer requirements, and the development requirements of energy conservation, consumption reduction and production efficiency improvement of production enterprises are promoted.
Description
Technical Field
The invention relates to the field of anti-welding hole plugging product technology, in particular to a control method for eliminating low-temperature segmented baking in post-curing of an anti-welding hole plugging product.
Background
At present in the manufacturing process of circuit board (like the lamp plate), solder mask consent processing will be carried out usually, the solid content of the consent printing ink of its consent adoption of solder mask consent product among the prior art is very low, generally 75%, the management and control mode that traditional low temperature segmentation was toasted is generally adopted in the process of postcure, traditional this kind of low temperature segmentation toasts 3 hours of baking time of needs, to enterprise power consumption, plan delivery period have great influence, be not conform to "energy-conservation and loss reduction, production and improve efficiency" development demand, and can also appear "oil bleeding", "the marginal printing ink of consent blebbing bubble", "the hole plumpness is unqualified", "the quality problem of downthehole printing ink crackle", thereby make the consent quality can't satisfy customer's demand. Therefore, there is a need to develop a solution to the above problems.
Disclosure of Invention
In view of the above, the present invention is directed to the defects in the prior art, and the main objective of the present invention is to provide a control method for canceling low-temperature sectional baking in post-curing of a via hole preventing product, which can effectively solve the problems of energy consumption in manufacturing the via hole preventing product and quality failure to meet the customer requirements.
In order to achieve the purpose, the invention adopts the following technical scheme:
a control method for canceling low-temperature segmented baking in post-curing of a welding-proof hole plugging product sequentially comprises the following steps of: engineering data design, cutting, drying, inner layer circuit, pressing, primary drilling, chemical copper deposition, whole board electroplating, outer layer circuit, pattern electroplating, alkaline etching, AOI inspection, solder mask, character, forming, electrical test and finished product inspection;
wherein the welding-proof procedure comprises the following procedures in sequence: pretreatment, oiling, hole plugging, printing, pre-baking, exposure, development and post-curing; wherein the oil preparation is to mix the hardener and the main agent in an ink mixer to be fully and uniformly stirred to form the hole plugging ink, the oil preparation is stirred for 15-30min, and the solid content of the hole plugging ink is 80-85%; plugging is performed by adopting a plugging machine, a plugging aluminum sheet screen and a plugging scraper, and the plugging plumpness is 80-100%; during post-curing, the plates to be subjected to high-temperature post-curing are conveyed into an oven, uniformly placed in the downwind direction, the oven door is closed, a timing and heating switch is turned on, the temperature is directly raised to 150 ℃ for baking for 60 min.
As a preferable scheme, the hole plugging ink is colorless special hole plugging ink, and when oil is opened, the green oil, the blue oil and the hole plugging ink are respectively adjusted according to the color of the main face oil used by the product structure to obtain mixed ink, so that the obtained mixed ink has the same color with the face oil, and has no color difference abnormality.
Compared with the prior art, the invention has obvious advantages and beneficial effects, and specifically, the technical scheme includes that:
the solid content of the hole plugging ink is set to be 80-85%, and low-temperature segmented baking is cancelled in cooperation with a high-temperature post-curing station, so that the expansion coefficient of the hole plugging ink in a hole can be effectively reduced, the thermal stress is reduced, the quality problems of oil bleeding, ink bubbling at the edge of a hole plugging hole, unqualified hole plugging fullness and ink cracks in the hole can not be generated, the hole plugging quality meets the customer requirements, and the development requirements of energy conservation, consumption reduction and production efficiency improvement of production enterprises are promoted.
Drawings
FIG. 1 is a schematic overall process flow diagram of the preferred embodiment of the present invention;
FIG. 2 is a flow chart of the solder mask manufacturing process in the preferred embodiment of the present invention.
Detailed Description
The invention discloses a control method for canceling low-temperature sectional baking in post-curing of a welding-proof plug hole product, which comprises the following steps in sequence as shown in figure 1: engineering data design, cutting, drying, inner layer circuit, pressing, primary drilling, chemical copper deposition, whole board electroplating, outer layer circuit, pattern electroplating, alkaline etching, AOI inspection, solder mask, character, forming, electrical test and finished product inspection;
as shown in fig. 2, the solder mask process sequentially includes the following steps: pretreatment, oiling, hole plugging, printing, pre-baking, exposure, development and post-curing; wherein the oil preparation is to mix the hardener and the main agent in an ink mixer to be fully and uniformly stirred to form the hole plugging ink, the oil preparation is stirred for 15-30min, and the solid content of the hole plugging ink is 80-85%; plugging is performed by adopting a plugging machine, a plugging aluminum sheet screen and a plugging scraper, and the plugging plumpness is 80-100%; during post-curing, the plates to be subjected to high-temperature post-curing are conveyed into an oven, uniformly placed in the downwind direction, the oven door is closed, a timing and heating switch is turned on, the temperature is directly raised to 150 ℃ for baking for 60 min. And the hole plugging ink is colorless special hole plugging ink, and when the ink is opened, the green oil, the blue oil and the hole plugging ink are respectively adjusted according to the main face oil color used by the product structure to obtain mixed ink, so that the obtained mixed ink and the face oil have the same color and have no color difference abnormality.
The design of the invention is characterized in that: the solid content of the hole plugging ink is set to be 80-85%, and low-temperature segmented baking is cancelled in cooperation with a high-temperature post-curing station, so that the expansion coefficient of the hole plugging ink in a hole can be effectively reduced, the thermal stress is reduced, the quality problems of oil bleeding, ink bubbling at the edge of a hole plugging hole, unqualified hole plugging fullness and ink cracks in the hole can not be generated, the hole plugging quality meets the customer requirements, and the development requirements of energy conservation, consumption reduction and production efficiency improvement of production enterprises are promoted.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the technical scope of the present invention, so that any minor modifications, equivalent changes and modifications made to the above embodiment according to the technical spirit of the present invention are within the technical scope of the present invention.
Claims (2)
1. A control method for canceling low-temperature segmented baking in post-curing of a welding-proof plug hole product is characterized by comprising the following steps: the method sequentially comprises the following steps: engineering data design, cutting, drying, inner layer circuit, pressing, primary drilling, chemical copper deposition, whole board electroplating, outer layer circuit, pattern electroplating, alkaline etching, AOI inspection, solder mask, character, forming, electrical test and finished product inspection;
wherein the welding-proof procedure comprises the following procedures in sequence: pretreatment, oiling, hole plugging, printing, pre-baking, exposure, development and post-curing; wherein the oil preparation is to mix the hardener and the main agent in an ink mixer to be fully and uniformly stirred to form the hole plugging ink, the oil preparation is stirred for 15-30min, and the solid content of the hole plugging ink is 80-85%; plugging is performed by adopting a plugging machine, a plugging aluminum sheet screen and a plugging scraper, and the plugging plumpness is 80-100%; during post-curing, the plates to be subjected to high-temperature post-curing are conveyed into an oven, uniformly placed in the downwind direction, the oven door is closed, a timing and heating switch is turned on, the temperature is directly raised to 150 ℃ for baking for 60 min.
2. The method of claim 1 wherein the post-cure termination of the solder mask via product is controlled by a low temperature staged bake out of the oven, wherein the method comprises the steps of: the hole plugging ink is colorless special hole plugging ink, and when oil is opened, the green oil, the blue oil and the hole plugging ink are respectively adjusted according to the color of the main face oil used by the product structure to obtain mixed ink, so that the color of the obtained mixed ink is consistent with that of the face oil, and no color difference is abnormal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110892783.9A CN113490339A (en) | 2021-08-04 | 2021-08-04 | Control method for canceling low-temperature sectional baking in post-curing of welding-proof hole plugging product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110892783.9A CN113490339A (en) | 2021-08-04 | 2021-08-04 | Control method for canceling low-temperature sectional baking in post-curing of welding-proof hole plugging product |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113490339A true CN113490339A (en) | 2021-10-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110892783.9A Pending CN113490339A (en) | 2021-08-04 | 2021-08-04 | Control method for canceling low-temperature sectional baking in post-curing of welding-proof hole plugging product |
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| CN (1) | CN113490339A (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104486913A (en) * | 2014-12-23 | 2015-04-01 | 深圳市五株科技股份有限公司 | Printing ink hole plugging process method for circuit boards |
| CN104902695A (en) * | 2015-06-08 | 2015-09-09 | 深圳崇达多层线路板有限公司 | Solder resist manufacturing method of windowing taphole design |
| CN105555034A (en) * | 2016-02-02 | 2016-05-04 | 东莞翔国光电科技有限公司 | Process of plugging holes in printed circuit board with ink |
| CN106817849A (en) * | 2015-11-30 | 2017-06-09 | 赵敏 | A kind of thick copper plate solder resistance process |
| CN108513451A (en) * | 2017-02-28 | 2018-09-07 | 胜宏科技（惠州）股份有限公司 | A kind of production method of the wiring board through-hole solder mask consent depth more than 80% |
| CN108521714A (en) * | 2018-04-19 | 2018-09-11 | 昆山苏杭电路板有限公司 | Wiring board jack process using grapheme material as rabbet ink |
| CN109257886A (en) * | 2018-10-23 | 2019-01-22 | 景旺电子科技(龙川)有限公司 | A kind of rigid-flexible combination multi-layer board solder-resisting manufacturing methods |
| CN110402029A (en) * | 2019-07-19 | 2019-11-01 | 华芯电子(天津)有限责任公司 | A kind of processing technology of PCB substrate ink plugging |
| CN110730565A (en) * | 2019-09-17 | 2020-01-24 | 沪士电子股份有限公司 | PCB capable of realizing half plug hole in stepped groove and manufacturing method thereof |
-
2021
- 2021-08-04 CN CN202110892783.9A patent/CN113490339A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104486913A (en) * | 2014-12-23 | 2015-04-01 | 深圳市五株科技股份有限公司 | Printing ink hole plugging process method for circuit boards |
| CN104902695A (en) * | 2015-06-08 | 2015-09-09 | 深圳崇达多层线路板有限公司 | Solder resist manufacturing method of windowing taphole design |
| CN106817849A (en) * | 2015-11-30 | 2017-06-09 | 赵敏 | A kind of thick copper plate solder resistance process |
| CN105555034A (en) * | 2016-02-02 | 2016-05-04 | 东莞翔国光电科技有限公司 | Process of plugging holes in printed circuit board with ink |
| CN108513451A (en) * | 2017-02-28 | 2018-09-07 | 胜宏科技（惠州）股份有限公司 | A kind of production method of the wiring board through-hole solder mask consent depth more than 80% |
| CN108521714A (en) * | 2018-04-19 | 2018-09-11 | 昆山苏杭电路板有限公司 | Wiring board jack process using grapheme material as rabbet ink |
| CN109257886A (en) * | 2018-10-23 | 2019-01-22 | 景旺电子科技(龙川)有限公司 | A kind of rigid-flexible combination multi-layer board solder-resisting manufacturing methods |
| CN110402029A (en) * | 2019-07-19 | 2019-11-01 | 华芯电子(天津)有限责任公司 | A kind of processing technology of PCB substrate ink plugging |
| CN110730565A (en) * | 2019-09-17 | 2020-01-24 | 沪士电子股份有限公司 | PCB capable of realizing half plug hole in stepped groove and manufacturing method thereof |
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Application publication date: 20211008 |