CN112672504B - Method for monitoring solder resist ink of buried copper PCB - Google Patents
Method for monitoring solder resist ink of buried copper PCB Download PDFInfo
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- CN112672504B CN112672504B CN202011228662.6A CN202011228662A CN112672504B CN 112672504 B CN112672504 B CN 112672504B CN 202011228662 A CN202011228662 A CN 202011228662A CN 112672504 B CN112672504 B CN 112672504B
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Abstract
The invention discloses a method for monitoring solder resist ink of a buried copper sub PCB, which comprises the following steps: ink weight control: the thickness of the printing ink generated after the primary printing of the PCB is reversely pushed by the weight difference of the printing ink before and after the white paper; post-curing: the thickness of the ink after curing is fed back by the weight of the ink in a unit area through the calculation of a formula of T (ink thickness) =K (coefficient) ×G (weight), and the problems that the thickness and uniformity of the ink in different batches with the same material number under the actual condition cannot be effectively monitored are solved through the arrangement of the ink weight control step and the post curing step, so that the product yield is ensured, the quality leakage risk is reduced, the ink is uniform, the impedance value is stable, reworking is not needed, the process capability is improved, the production efficiency is improved, and the core competitiveness of the production process is improved.
Description
Technical Field
The invention belongs to the technical field of PCB manufacturing monitoring, and particularly relates to a method for monitoring solder resist ink of a copper-clad PCB.
Background
Aiming at the thickness and uniformity of the solder resist ink of the copper-clad PCB, most companies currently adopt the number of printing screens T and visual monitoring, and the method cannot effectively monitor the thickness and uniformity of the ink with the same material number and different batches under actual conditions, so that the generated reliability and appearance anomalies such as false copper leakage, too thick ink and the like are caused, the production difficulty is high, and the rework rate is high and the quality leakage risk exists.
Disclosure of Invention
According to the method for monitoring the solder resist ink of the PCB with the copper buried layer, the problems that the thickness and uniformity of the ink with the same material number and different batches cannot be effectively monitored under actual conditions are solved by setting the ink weight control step and the post-curing step, so that the product yield is guaranteed, the quality leakage risk is reduced, the ink is uniform, the impedance value is stable, reworking is not needed, the processing capacity is improved, the production efficiency is improved, and the core competitiveness of the production process is improved.
The technical scheme of the invention is as follows:
the method for monitoring the solder resist ink of the copper-buried PCB is characterized by comprising the following steps of:
s1, performing solder mask pretreatment: cleaning and roughening the surface of the production plate;
s2, solder mask plugging: filling the target holes on the production plate with solder resist ink;
s3, ink weight control: the thickness of the printing ink generated after the primary printing of the PCB is reversely pushed by the weight difference of the printing ink before and after the white paper;
s4, solder resist printing: solder resist printing ink on the welding surface and the element surface of the production plate, and then standing the production plate under normal pressure or vacuumizing the production plate;
s5, pre-baking: pre-baking the production plate to form a film of solder resist ink;
s6, exposure: placing the production plate under the irradiation of a purple light lamp to perform polymerization crosslinking reaction;
s7, developing: washing the unreacted ink with a developer to leave a photopolymerized portion;
s8, detecting: checking whether the steps have problems;
s9, post-curing: feedback of post-cured ink thickness by ink weight per unit area calculated by the formula T (ink thickness) =k (coefficient) ×g (weight); the formula is also suitable for other factors influencing the ink quantity, such as roughness of a carrier, viscosity of the ink at different moments, temperature and humidity of air and other microscopic factors, and the thickness of the ink is influenced by the uncontrollable factors to be +/-0.2 um;
s10, the following working procedures: the monitoring of the ink thickness can be converted into the monitoring of the ink weight, the ink weight can be adjusted through production parameters such as the mesh number of the screen, the inclination angle of the scraper, the ink viscosity and the like, and the control of the uniformity of the ink thickness is completed, so that a PCB finished product is obtained.
Further, the preparation method of the ink comprises the following steps: the main agent and the curing agent are fully and uniformly stirred during oil mixing, and then the thinner can be added, and the thinner is added by 40ml firstly, and then the thinner is added one by one through process viscosity monitoring, so that the viscosity of the ink is kept at 80-100 PS (non-conventional printing) or 180-200 PS (conventional printing), and the ink can be used after standing for 30 minutes after the oil mixing is finished.
In step S4, the printing is uniformly performed by adopting an empty inclined screen, and the hardness of the scraper is 70-75 ℃; the thickness of the scraper is 10mm plus or minus 1mm; the angle of inclination of the scraper is 0-15 degrees.
Further, the height of the lifting screen is controlled to be 3-4mm.
Through this setting, be favorable to utilizing production parameters such as half tone mesh number, scraper inclination, printing ink viscosity to adjust effectively to guarantee the product yield, reduce the quality and leak the risk, promote the process ability, promote production efficiency.
Further, in step S9, for a product with high copper or low copper residue, the ink weight is calculated by the formula of T (thickness) =k (coefficient) ×g (weight) - (1-C (copper residue))×h (copper thickness), and the ink viscosity used is controlled to 80-100 PS. And specific products are metered through a specific formula, so that the monitoring accuracy is effectively improved, the product yield is ensured, the process capability is improved, and the production efficiency is improved.
Further, the humidity in the air of the single-room printing chamber is adjusted to treat the static electricity on the copper daughter board.
Through the design, the moisture in the air is favorable for reducing static accumulation and uniformly distributing the ink, so that the yield of products is ensured, and the process capability is improved.
Further, in the method of the invention, the control of parameters is as follows: the thickness of the solder resist ink is T=10+/-3 um, the screen printing number is 77T, and the weight of the ink is 3.0-3.5g/ft 2 。
Further, in the method of the invention, the control of parameters is as follows: the thickness of the solder resist ink is T=16+/-3 um, the screen printing number is 61T, and the weight of the ink is 4.0-4.5g/ft 2 。
Further, in the method of the invention, the control of parameters is as follows: the thickness of the solder resist ink is T=22+/-3 um, the screen printing number is 51T, and the weight of the ink is 4.9-5.4g/ft 2 。
Further, in the method of the invention, the control of parameters is as follows: the thickness of the solder resist ink is T=28+/-3 um, the screen printing number is 43T, and the weight of the ink is 5.5-6.0g/ft 2 。
The invention has the beneficial effects that:
through setting up printing ink weight management and control step and the step of post-curing, the problem of the different batch of printing ink thickness and the homogeneity of same material number under the unable effective monitoring actual conditions has been solved to guarantee the product yield, reduce the quality and leak the risk, printing ink is even, impedance numerical value is stable, need not to rework, promotes the process capability, promotes production efficiency, improves production technology core competitiveness.
Drawings
FIG. 1 is a flow chart of a prior art preparation of a PCB solder mask ink;
fig. 2 is a flowchart of the preparation of the solder mask ink for PCBs according to the present invention.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Example 1
The method for monitoring the solder resist ink of the copper-buried PCB is characterized by comprising the following steps of:
s1, performing solder mask pretreatment: cleaning and roughening the surface of the production plate;
s2, solder mask plugging: filling the target holes on the production plate with solder resist ink;
s3, ink weight control: the thickness of the printing ink generated after the primary printing of the PCB is reversely pushed by the weight difference of the printing ink before and after the white paper;
s4, solder resist printing: solder resist printing ink on the welding surface and the element surface of the production plate, and then standing the production plate under normal pressure or vacuumizing the production plate;
s5, pre-baking: pre-baking the production plate to form a film of solder resist ink;
s6, exposure: placing the production plate under the irradiation of a purple light lamp to perform polymerization crosslinking reaction;
s7, developing: washing the unreacted ink with a developer to leave a photopolymerized portion;
s8, detecting: checking whether the steps have problems;
s9, post-curing: feedback of post-cured ink thickness by ink weight per unit area calculated by the formula T (ink thickness) =k (coefficient) ×g (weight); the formula is also suitable for other factors influencing the ink quantity, such as roughness of a carrier, viscosity of the ink at different moments, temperature and humidity of air and other microscopic factors, and the thickness of the ink is influenced by the uncontrollable factors to be +/-0.2 um;
s10, the following working procedures: the monitoring of the ink thickness can be converted into the monitoring of the ink weight, the ink weight can be adjusted through production parameters such as the mesh number of the screen, the inclination angle of the scraper, the ink viscosity and the like, and the control of the uniformity of the ink thickness is completed, so that a PCB finished product is obtained.
Further, the preparation method of the ink comprises the following steps: the main agent and the curing agent are fully and uniformly stirred during oil mixing, and then the thinner can be added, and the thinner is added by 40ml firstly, and then the thinner is added one by one through process viscosity monitoring, so that the viscosity of the ink is kept at 80-100 PS (non-conventional printing) or 180-200 PS (conventional printing), and the ink can be used after standing for 30 minutes after the oil mixing is finished.
In step S4, the printing is uniformly performed by adopting an empty inclined screen, and the hardness of the scraper is 70-75 ℃; the thickness of the scraper is 10mm plus or minus 1mm; the angle of inclination of the scraper is 0-15 degrees.
Further, the height of the lifting screen is controlled to be 3-4mm.
Through this setting, be favorable to utilizing production parameters such as half tone mesh number, scraper inclination, printing ink viscosity to adjust effectively to guarantee the product yield, reduce the quality and leak the risk, promote the process ability, promote production efficiency.
Further, in step S9, for a product with high copper or low copper residue, the ink weight is calculated by the formula of T (thickness) =k (coefficient) ×g (weight) - (1-C (copper residue))×h (copper thickness), and the ink viscosity used is controlled to 80-100 PS. And specific products are metered through a specific formula, so that the monitoring accuracy is effectively improved, the product yield is ensured, the process capability is improved, and the production efficiency is improved.
Further, the humidity in the air of the single-room printing chamber is adjusted to treat the static electricity on the copper daughter board.
Through the design, the moisture in the air is favorable for reducing static accumulation and uniformly distributing the ink, so that the yield of products is ensured, and the process capability is improved.
Through setting up printing ink weight management and control step and the step of post-curing, the problem of the different batch of printing ink thickness and the homogeneity of same material number under the unable effective monitoring actual conditions has been solved to guarantee the product yield, reduce the quality and leak the risk, printing ink is even, impedance numerical value is stable, need not to rework, promotes the process capability, promotes production efficiency, improves production technology core competitiveness.
Example 2
The present embodiment provides a method for monitoring solder resist ink of a copper-clad sub-PCB in the same manner as in embodiment 1, except that in the method of the present invention, parameters are controlled as follows: the thickness of the solder resist ink is T=10+/-3 um, the screen printing number is 77T, and the weight of the ink is 3.0-3.5g/ft 2 。
Example 3
The present embodiment provides a method for monitoring solder resist ink of a copper-clad sub-PCB in the same manner as in embodiment 1, except that in the method of the present invention, parameters are controlled as follows: the thickness of the solder resist ink is T=16+/-3 um, the screen printing number is 61T, and the weight of the ink is 4.0-4.5g/ft 2 。
Example 4
The present embodiment provides a method for monitoring solder resist ink of a copper-clad sub-PCB in the same manner as in embodiment 1, except that in the method of the present invention, parameters are controlled as follows: the thickness of the solder resist ink is T=22+/-3 um, the screen printing number is 51T, and the weight of the ink is 4.9-5.4g/ft 2 。
Example 5
The present embodiment provides a method for monitoring solder resist ink of a copper-clad sub-PCB in the same manner as in embodiment 1, except that in the method of the present invention, parameters are controlled as follows: the thickness of the solder resist ink is T=28+/-3 um, the screen printing number is 43T, and the weight of the ink is 5.5-6.0g/ft 2 。
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present disclosure describes embodiments, not every embodiment is provided with a separate embodiment, and that this description is provided for clarity only, and that the disclosure is not limited to the embodiments described in detail below, and that the embodiments described in the examples may be combined as appropriate to form other embodiments that will be apparent to those skilled in the art. It should be noted that technical features not described in detail in the present invention may be implemented by any prior art.
Claims (10)
1. The method for monitoring the solder resist ink of the copper-buried PCB is characterized by comprising the following steps of:
s1, performing solder mask pretreatment: cleaning and roughening the surface of the production plate;
s2, solder mask plugging: filling the target holes on the production plate with solder resist ink;
s3, ink weight control: the thickness of the printing ink generated after the primary printing of the PCB is reversely pushed by the weight difference of the printing ink before and after the white paper;
s4, solder resist printing: printing solder resist ink on the welding surface and the element surface of the production plate, and then standing the production plate under normal pressure or vacuumizing the production plate;
s5, pre-baking: pre-baking the production plate to form a film of solder resist ink;
s6, exposure: placing the production plate under the irradiation of a purple light lamp to perform polymerization crosslinking reaction;
s7, developing: washing the unreacted ink with a developer to leave a photopolymerized portion;
s8, detecting: checking whether the steps have problems;
s9, post-curing: feedback of post-cured ink thickness by ink weight per unit area calculated by the formula t=k×g; wherein T is the thickness of the ink, K is a coefficient, and G is the weight;
s10, the following working procedures: the monitoring ink thickness is converted into the monitoring ink weight, and the ink weight is adjusted according to production parameters of the screen mesh number, the scraper inclination angle and the ink viscosity, so that the uniformity control of the ink thickness is completed, and the PCB finished product is manufactured.
2. The method for monitoring the solder resist ink of the copper-clad sub-PCB according to claim 1, wherein the method for preparing the ink is as follows: the main agent and the curing agent are fully and uniformly stirred during oil mixing, and then the thinner can be added, wherein the thinner is added by 40ml firstly, then the thinner is added one by one through process viscosity monitoring, so that the viscosity of the ink is kept at 80-100 PS or 180-200 PS, and the ink is used after the preparation is finished and is kept stand for 30 minutes.
3. The method for monitoring solder resist ink of a copper-clad sub-PCB according to claim 1, wherein in the step S4, a blank inclined screen is uniformly adopted for printing, and the hardness of a scraper is 70-75 degrees; the thickness of the scraper is 10mm plus or minus 1mm; the angle of inclination of the scraper is 0-15 degrees.
4. A method for monitoring solder resist ink of a copper-clad sub-PCB according to claim 3, wherein the height of the raised screen is controlled to be 3-4mm.
5. The method for monitoring solder resist ink of a copper-clad sub-PCB according to claim 1, wherein in step S9, for a product with high copper or low copper residue, the weight of the ink is calculated by a formula of t=k×g- (1-C) ×h, and the viscosity of the ink used is controlled to be 80-100 PS; wherein T is the thickness of the ink, K is a coefficient, G is the weight, C is the copper residue rate, and h is the copper thickness.
6. The method of claim 1, wherein the static electricity on the copper daughter board is treated by adjusting the humidity in the air of the single room.
7. The method for monitoring solder resist ink of a copper-clad PCB according to any one of claims 1 to 6, wherein the thickness of the solder resist ink is T=10+ -3 um, the mesh number is 77T, and the weight of the ink is 3.0 to 3.5g/ft 2 。
8. The method for monitoring solder resist ink of a copper-clad PCB according to any one of claims 1 to 6, wherein the thickness of the solder resist ink is T=16+ -3 um, the mesh number is 61T, and the weight of the ink is 4.0 to 4.5g/ft 2 。
9. The method for monitoring solder resist ink of a copper-clad PCB according to any one of claims 1 to 6, wherein the thickness of the solder resist ink is T=22±3 μm, the mesh number is 51T, and the weight of the ink is 4.9 to 5.4g/ft 2 。
10. The method for monitoring solder resist ink of a copper-clad PCB according to any one of claims 1 to 6, wherein the thickness of the solder resist ink is T=28±3 μm, the mesh number is 43T, and the weight of the ink is 5.5 to 6.0g/ft 2 。
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015035622A (en) * | 2014-10-24 | 2015-02-19 | 東海神栄電子工業株式会社 | Circuit board |
| CN109475045A (en) * | 2018-11-21 | 2019-03-15 | 奥士康精密电路（惠州）有限公司 | A kind of method of control panel upper thread angle ink thickness |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| DE10105990A1 (en) * | 2000-03-03 | 2001-09-06 | Heidelberger Druckmasch Ag | Method for controlling ink layer parameters for selected print zones in printer output to ensure there is a more homogenous ink distribution with sharper definition between print zones |
| CN106132110A (en) * | 2016-07-12 | 2016-11-16 | 奥士康科技股份有限公司 | A kind of monitoring method of pcb board anti-welding printing ink thickness |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015035622A (en) * | 2014-10-24 | 2015-02-19 | 東海神栄電子工業株式会社 | Circuit board |
| CN109475045A (en) * | 2018-11-21 | 2019-03-15 | 奥士康精密电路（惠州）有限公司 | A kind of method of control panel upper thread angle ink thickness |
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