CN105744752B - The uniform method of anti-welding printing - Google Patents

The uniform method of anti-welding printing Download PDF

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Publication number
CN105744752B
CN105744752B CN201610156417.6A CN201610156417A CN105744752B CN 105744752 B CN105744752 B CN 105744752B CN 201610156417 A CN201610156417 A CN 201610156417A CN 105744752 B CN105744752 B CN 105744752B
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China
Prior art keywords
scraper
copper coin
ink
screen frame
pedestal
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Application number
CN201610156417.6A
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Chinese (zh)
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CN105744752A (en
Inventor
吴玉海
程涌
贺文辉
龚德勋
彭龙华
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Aoshikang Technology Co Ltd
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Aoshikang Technology Co Ltd
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Priority to CN201610156417.6A priority Critical patent/CN105744752B/en
Publication of CN105744752A publication Critical patent/CN105744752A/en
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • H05K3/282Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01Tools for processing; Objects used during processing
    • H05K2203/0104Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0134Drum, e.g. rotary drum or dispenser with a plurality of openings
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16Inspection; Monitoring; Aligning
    • H05K2203/163Monitoring a manufacturing process

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Methods (AREA)
  • Screen Printers (AREA)

Abstract

The uniform method of anti-welding printing, the placement location of screen frame and printed pattern is indicated among the exposure table top of halftone, according to the size of screen frame and the size design scraper pedestal of printed pattern, by scraper floor installation in the centre of screen frame, affixed scraper on the scraper pedestal, scraper is moved among the top of halftone, scraper pushes, adjust the height of scraper, record scraper rigid connection touches scale during pcb board face, scraper lifts, the knob on scraper both sides is rotated down 2 circles again, locking, copper coin is printed with ink, 2min is stood after printing, ink thickness on copper coin is measured.Operating type of the present invention is simple, easy to operate, easily grasps, applied widely;Ink thickness is uniform, and beneficial to the progress of subsequent handling, the rate of pass greatly improves.

Description

The uniform method of anti-welding printing
Technical field
The present invention relates to pcb board technology manufacture fields, the particularly uniform method of anti-welding printing.
Background technology
Pcb board, also known as printed circuit board (PCB), printed wiring board, abbreviation printed board using insulation board as base material, are cut into a scale It is very little, it is at least attached there are one conductive pattern thereon, and hole (such as component hole, fastener hole, plated through-hole) is furnished with, and realize electronics member Interconnection between device.Since this plate is using electron printing making, therefore it is referred to as " printing " circuit board.It is this Circuit board needs to carry out anti-welding printing in process of production.
At present, common anti-welding printing flow is:Pre-treatment-printing-exposure-development, pre-treatment are cleaning plate face, are increased Roughness;Printing is to print last layer ink in plate face;Pre-baked is by the ink primary solidification after printing, so as to exposure operation;It exposes The just process of image transfer, then expose required pad by developing.
During printing, lowest level is pcb board, and centre is halftone, is above scraper, ink is poured on halftone, lead to It crosses scraper pressure and at the uniform velocity walks, ink is uniformly coated onto on pcb board face;There is a certain distance pre- between halftone and pcb board Quality problems, the longer both sides of scraper such as Antisticking, product ink are pressed onto the pressure in plate face due to the influence of halftone tension, scraper both sides Can be smaller than intermediate, easily it is present with ink both sides thickness, the phenomenon that intermediate thin;In addition, due to adjusting machine mode adjusted in printing process, Scraper both sides pressure can be caused inconsistent.Ink thickness uniformity during printing directly affects quality of finished, and because of halftone tension Related with the level of scraper, plank size is bigger, and ink thickness uniformity is poorer, the bad management and control of exposure energy during exposure, Easily there is the region of ink thickness, UV light is less, and polymerization is incomplete because bottom ink absorbs, and easily develops excessively in development;Oil The thin region absorption UV light of ink is more, causes to open a window less than normal.
The content of the invention
The technical problems to be solved by the invention are to overcome drawbacks described above existing in the prior art, provide a kind of energy control Ink thickness uniformity, the uniform method of the simple anti-welding printing of operating type.
The technical solution adopted by the present invention to solve the technical problems is the uniform method of anti-welding printing, in the exposure of halftone The placement location of mark screen frame and printed pattern among light table face, according to the size design scraper pedestal of screen frame and printed pattern Size, by scraper floor installation on the centre of screen frame, the scraper pedestal affixed scraper, scraper is moved in the top of halftone Between, scraper pushes, and adjusts the height of scraper, and record scraper rigid connection touches the scale in pcb board face, and scraper lifts, then by scraper both sides Knob be rotated down 2 circles, lock, copper coin is printed with ink, 2min is stood after printing, to the ink thickness on copper coin It is measured.
Further, the width of the scraper pedestal is smaller 20cm than the width of screen frame, and the width of scraper pedestal compares printed pattern Big more than the 5cm of width.
Further, the distance on the scraper pedestal to the opposite both sides of screen frame is identical.
Further, the ink thickness on the copper coin is measured using wet-film thickness measurement instrument.
Further, the ink thickness on the copper coin is chosen on the left of copper coin, intermediate and each 2 points of right side is measured.
Further, the copper coin left side, the very poor management and control of each 2 points of measurements ink thickness in intermediate and right side are within 5um.
Further, addition manner of the ink in printing is a small amount of multiple.
Compared with prior art, the invention has the advantages that:Operating type is simple, easy to operate, easily grasps, and is applicable in Scope is wide;Ink thickness is uniform, and beneficial to the progress of subsequent handling, the rate of pass greatly improves, effectively control job parameter and Material reduces ink thickness difference caused by scraper both ends are influenced without supporting deformation or halftone tension, in the centre of exposure table top The placement location of screen frame and printed pattern is indicated, according to the size of screen frame and the size design scraper pedestal of printed pattern, will be scraped Knife floor installation is in the centre of screen frame;Effectively avoid scraper both sides pressure inconsistent, caused by ink thickness difference, scraper is moved To the top of halftone, scraper pushes, and adjusts the height of scraper, and record scraper rigid connection touches the scale in pcb board face, scraper lift It rises, then the knob on scraper both sides is rotated down 2 circles, lock;Effectively control ink into factory's viscosity, be not required to adjustment viscosity, keep away Exempt from the difference that personnel adjust ink viscosity, ink is avoided to be raised for a long time using viscosity, influence ink thickness, ink is in printing Addition manner for it is a small amount of repeatedly.
Specific embodiment
The invention will be further described with reference to embodiments.
Embodiment
The present embodiment indicates the placement location of screen frame and printed pattern among the exposure table top of halftone, according to screen frame and print The size of the size design scraper pedestal of map brushing shape, by scraper floor installation in the centre of screen frame, it is ensured that printed pattern is placed in the middle, institute Affixed scraper on scraper pedestal is stated, scraper is moved among the top of halftone, scraper pushes, and adjusts the height of scraper, and record is scraped Knife rigid connection touches the scale in pcb board face, and scraper lifts, then the knob on scraper both sides is rotated down 2 circles, and locking avoids both sides from pressing Power is inconsistent, caused by ink thickness difference, copper coin is printed with ink, 2min is stood after printing, to the oil on copper coin Black thickness is measured.
In the present embodiment, the width of the scraper pedestal is smaller 20cm than the width of screen frame, and the width of scraper pedestal is than printing Big more than the 5cm of width of figure.
In the present embodiment, the distance on the opposite both sides of the scraper pedestal to screen frame is identical, reduces scraper both ends without support Ink thickness difference caused by deformation or halftone tension influence.
In the present embodiment, the ink thickness on the copper coin is measured using wet-film thickness measurement instrument.
In the present embodiment, the ink thickness on the copper coin is chosen on the left of copper coin, intermediate and each 2 points of right side is measured, The copper coin left side, the very poor management and control of each 2 points of measurements ink thickness in intermediate and right side are within 5um.
In the present embodiment, addition manner of the ink in printing is a small amount of multiple, and ink is avoided disposably to add It is more, it is raised for a long time using viscosity, causes ink thickness difference.
Operating type is simple, easy to operate, easily grasps, applied widely;Ink thickness is uniform, beneficial to subsequent handling into Row, the rate of pass greatly improve.

Claims (6)

1. the uniform method of anti-welding printing, which is characterized in that indicate screen frame and printed pattern among the exposure table top of halftone Placement location, according to the size of screen frame and the size design scraper pedestal of printed pattern, by scraper floor installation in screen frame Between, affixed scraper on the scraper pedestal moves to scraper among the top of halftone, and scraper pushes, and adjusts the height of scraper, note Record scraper rigid connection touches the scale in pcb board face, and scraper lifts, then the knob on scraper both sides is rotated down 2 circles, and ink is used in locking Copper coin is printed, 2min is stood after printing, the ink thickness on copper coin is measured.
2. the uniform method of anti-welding printing according to claim 1, which is characterized in that the width of the scraper pedestal compares net The small 20cm of width of frame, the width of scraper pedestal are bigger more than 5cm than the width of printed pattern.
3. the uniform method of anti-welding printing according to claim 1 or 2, which is characterized in that the scraper pedestal to screen frame Opposite both sides distance it is identical.
4. the uniform method of anti-welding printing according to claim 3, which is characterized in that the ink thickness on the copper coin is adopted It is measured with wet-film thickness measurement instrument.
5. the uniform method of anti-welding printing according to claim 4, which is characterized in that the ink thickness choosing on the copper coin It takes on the left of copper coin, intermediate and each 2 points of right side is measured.
6. the uniform method of anti-welding printing according to claim 5, which is characterized in that the copper coin left side, the intermediate and right side The very poor management and control of each 2 points of measurements ink thickness in side is within 5um.
CN201610156417.6A 2016-03-18 2016-03-18 The uniform method of anti-welding printing Active CN105744752B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610156417.6A CN105744752B (en) 2016-03-18 2016-03-18 The uniform method of anti-welding printing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610156417.6A CN105744752B (en) 2016-03-18 2016-03-18 The uniform method of anti-welding printing

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CN105744752B true CN105744752B (en) 2018-05-18

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Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106132110A (en) * 2016-07-12 2016-11-16 奥士康科技股份有限公司 A kind of monitoring method of pcb board anti-welding printing ink thickness
CN109124641A (en) * 2018-06-27 2019-01-04 邹可权 A kind of intelligence sign language perception gloves and its manufacturing process

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1446039A (en) * 2002-03-14 2003-10-01 华通电脑股份有限公司 Solder paste print deice for remnant stannum easy to be shed-off
CN102271466A (en) * 2011-07-08 2011-12-07 深圳市精诚达电路有限公司 Method for protecting surface of flexible printed circuit board
CN102371752A (en) * 2010-08-23 2012-03-14 富葵精密组件(深圳)有限公司 Printing device
CN202310321U (en) * 2011-10-09 2012-07-04 深圳市丰达兴线路板制造有限公司 Screen printing hole plugging equipment
CA2910431A1 (en) * 2013-04-26 2014-10-30 Nissan Motor Co., Ltd. Screen printing apparatus with ink recovery mechanism and related method

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1446039A (en) * 2002-03-14 2003-10-01 华通电脑股份有限公司 Solder paste print deice for remnant stannum easy to be shed-off
CN102371752A (en) * 2010-08-23 2012-03-14 富葵精密组件(深圳)有限公司 Printing device
CN102271466A (en) * 2011-07-08 2011-12-07 深圳市精诚达电路有限公司 Method for protecting surface of flexible printed circuit board
CN202310321U (en) * 2011-10-09 2012-07-04 深圳市丰达兴线路板制造有限公司 Screen printing hole plugging equipment
CA2910431A1 (en) * 2013-04-26 2014-10-30 Nissan Motor Co., Ltd. Screen printing apparatus with ink recovery mechanism and related method

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