CN112672544A - Solder mask developing method for metallized hole of PCB (printed circuit board) - Google Patents
Solder mask developing method for metallized hole of PCB (printed circuit board) Download PDFInfo
- Publication number
- CN112672544A CN112672544A CN202011632159.7A CN202011632159A CN112672544A CN 112672544 A CN112672544 A CN 112672544A CN 202011632159 A CN202011632159 A CN 202011632159A CN 112672544 A CN112672544 A CN 112672544A
- Authority
- CN
- China
- Prior art keywords
- pcb
- hole
- diameter
- metallized
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 31
- 238000000034 method Methods 0.000 title claims abstract description 13
- 230000000903 blocking effect Effects 0.000 claims abstract description 18
- 238000007639 printing Methods 0.000 claims description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 238000007788 roughening Methods 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 230000006872 improvement Effects 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
Images
Landscapes
- Printing Plates And Materials Therefor (AREA)
Abstract
The invention discloses a solder mask developing method for a metallized hole of a PCB (printed circuit board), which is characterized by comprising the following steps of: when the PCB is subjected to solder mask development, the diameter of an oil blocking point, corresponding to a metalized hole on the PCB, on a film for the solder mask development of the PCB is set to be smaller than the diameter of the corresponding metalized hole on the PCB. According to the invention, the diameter of the metalized hole of the PCB is smaller than that of the metalized hole of the alignment film, so that ink cannot enter the metalized hole, and the thickness of the ink at the edge of the metalized hole is ensured, thereby solving the problem that the ink is thin due to the fact that one side of the oil blocking offset hole is formed in the silk-screen production process, and ensuring the product quality.
Description
Technical Field
The invention belongs to the technical field of PCB processing, and particularly relates to a solder mask developing method for a metallized hole of a PCB.
Background
The PCB circuit board solder mask development is to display a schematic diagram of the circuit board or each part of the circuit board through a developer or a developing machine. In the solder resist development process, for a metallized hole (abbreviated as a PTH hole) on a PCB, a corresponding oil blocking point needs to be set on a corresponding film so as to prevent ink from entering the PTH hole. However, the oil blocking points of the existing films corresponding to the metalized holes are all larger than the corresponding hole diameters of the metalized holes on the PCB, so that errors generated when the films and the circuit board are aligned are avoided. However, in this way, although the alignment error is reduced, one side of the PTH hole is always shielded, so that the ink cannot be printed on the edge of the hole, which results in a thinner ink on one side of the PTH hole, and further affects the subsequent development difficulty, and the product quality cannot be ensured.
Disclosure of Invention
In order to overcome the defects, the invention provides a solder resist developing method for a metallized hole of a PCB (printed circuit board), which can obviously improve the phenomenon that ink at one side edge of a PTH (plated through hole) is thinner, thereby ensuring the product quality.
The technical scheme adopted by the invention for solving the technical problem is as follows: when the PCB is subjected to solder mask development, a film for the solder mask development of the PCB and the diameter of an oil blocking point, corresponding to a metallized hole on the PCB, on a printing screen are set to be smaller than the diameter of the corresponding metallized hole on the PCB.
As a further improvement of the invention, when the aperture of the metallized hole on the PCB circuit board is larger than 0.60mm, the diameter of the oil blocking point of the metallized hole corresponding to the film for solder mask development and the printing screen is set to be 3mil less than the diameter of the metallized hole on one side; and when the aperture of the metallized hole on the PCB is less than or equal to 0.60mm, setting the diameter of the oil blocking point of the metallized hole corresponding to the film for solder resist development and the printing screen plate to be 2mil less than the diameter of the metallized hole on one side.
As a further improvement of the invention, the PCB is kept still for less than or equal to 40min after solder mask development.
As a further improvement of the invention, before the solder resist development of the PCB, the surface copper layer is subjected to super-roughening treatment, so that the roughness of the copper surface is increased, and the development difficulty of the metallized hole is reduced.
The invention has the beneficial effects that: according to the invention, the diameter of the metalized hole of the PCB is smaller than that of the metalized hole of the alignment film and the printing screen plate, so that ink cannot enter the metalized hole, and the thickness of the ink at the edge of the metalized hole is ensured, thereby solving the problem that the ink is thin due to the fact that one side of the oil blocking offset hole is thin in the silk-screen production process, and ensuring the product quality.
Drawings
Fig. 1 is a schematic diagram of the principle of the present invention.
The following description is made with reference to the accompanying drawings:
1-PCB circuit board; 2-screen printing plate;
3-metallized holes; 4-oil stopping point.
Detailed Description
A preferred embodiment of the present invention will be described in detail below with reference to the accompanying drawings.
Referring to fig. 1, in order to provide a method for solder mask development of a metallized hole of a PCB circuit board according to the present invention, when performing solder mask development on the PCB circuit board, a film for solder mask development of the PCB circuit board 1 and a diameter of an oil blocking point 4 on a printing screen 2 corresponding to the metallized hole 3 on the PCB circuit board are set to be smaller than a diameter of the corresponding metallized hole on the PCB circuit board, specifically:
when the aperture of a metallized hole on the PCB circuit board is larger than 0.60mm, the diameter of an oil blocking point of the metallized hole corresponding to the film for solder resist development and the printing screen plate is set to be 3mil less than the diameter of the metallized hole on one side;
and when the aperture of the metallized hole on the PCB is less than or equal to 0.60mm, setting the diameter of the oil blocking point of the metallized hole corresponding to the film for solder resist development and the printing screen plate to be 2mil less than the diameter of the metallized hole on one side.
In addition, after the PCB is subjected to solder mask development, the standing time is set to be less than or equal to 40min, and the curing quality is further ensured.
According to the invention, the oil blocking points of the film and the printing screen plate are set to be smaller than the diameter of the corresponding metallized hole on the PCB, so that the edge of one side of the metallized hole is not shielded even due to alignment error, thereby ensuring the printing thickness of the printing ink and ensuring the subsequent developing quality. The aperture of the oil blocking point is only 2-3mil smaller than that of the corresponding metalized hole, so that the ink cannot enter the metalized hole under the action of the tension of the ink, the ink cannot enter the metalized hole, and the thickness of the ink at the edge of the metalized hole is ensured.
In addition, before the PCB is subjected to solder mask development, the surface copper layer is subjected to super-roughening treatment, so that the roughness of the copper surface is increased, and the development difficulty of a metallized hole opening is reduced.
Therefore, the diameter of the metalized hole of the PCB is smaller than that of the metalized hole of the PCB through correspondingly arranging the alignment film and the oil blocking point of the printing screen plate, so that ink cannot enter the metalized hole, the thickness of the ink at the edge of the metalized hole is ensured, the problem that the ink is thin due to the fact that one side of the oil blocking offset hole is thin in the silk-screen production process is solved, and the product quality is ensured.
In the previous description, numerous specific details were set forth in order to provide a thorough understanding of the present invention. The foregoing description is only a preferred embodiment of the invention, which can be embodied in many different forms than described herein, and therefore the invention is not limited to the specific embodiments disclosed above. And that those skilled in the art may, using the methods and techniques disclosed above, make numerous possible variations and modifications to the disclosed embodiments, or modify equivalents thereof, without departing from the scope of the claimed embodiments. Any simple modification, equivalent change and modification of the above embodiments according to the technical essence of the present invention are within the scope of the technical solution of the present invention.
Claims (4)
1. A solder mask developing method for a metallized hole of a PCB (printed circuit board) is characterized by comprising the following steps: when the PCB is subjected to solder mask development, the film for the solder mask development of the PCB and the diameter of an oil blocking point, corresponding to a metalized hole on the PCB, on the printing screen are set to be smaller than the diameter of the corresponding metalized hole on the PCB.
2. The solder resist developing method for the metallized holes of the PCB circuit board as claimed in claim 1, wherein:
when the aperture of a metallized hole on the PCB circuit board is larger than 0.60mm, the diameter of an oil blocking point of the metallized hole corresponding to the film for solder resist development and the printing screen plate is set to be 3mil less than the diameter of the metallized hole on one side;
and when the aperture of the metallized hole on the PCB is less than or equal to 0.60mm, setting the diameter of the oil blocking point of the metallized hole corresponding to the film for solder resist development and the printing screen plate to be 2mil less than the diameter of the metallized hole on one side.
3. The solder resist developing method for the metallized holes of the PCB circuit board as claimed in claim 1, wherein: and after the PCB is subjected to solder mask development, standing for less than or equal to 40 min.
4. The solder resist developing method for the metallized holes of the PCB circuit board as claimed in claim 1, wherein: before resistance welding development of the PCB is carried out, super-roughening treatment is carried out on a surface copper layer, so that the roughness of the copper surface is increased, and the development difficulty of a metallized hole is reduced.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011632159.7A CN112672544A (en) | 2020-12-31 | 2020-12-31 | Solder mask developing method for metallized hole of PCB (printed circuit board) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011632159.7A CN112672544A (en) | 2020-12-31 | 2020-12-31 | Solder mask developing method for metallized hole of PCB (printed circuit board) |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112672544A true CN112672544A (en) | 2021-04-16 |
Family
ID=75413057
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011632159.7A Pending CN112672544A (en) | 2020-12-31 | 2020-12-31 | Solder mask developing method for metallized hole of PCB (printed circuit board) |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112672544A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114916150A (en) * | 2022-04-18 | 2022-08-16 | 奥士康精密电路（惠州）有限公司 | Method for improving tailing of solder-proof screen printing of PCB |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002368415A (en) * | 2001-06-01 | 2002-12-20 | Goo Chemical Co Ltd | Method of manufacturing printed wiring board |
| US20050024443A1 (en) * | 1997-07-15 | 2005-02-03 | Silverbrook Research Pty Ltd | Inkjet nozzle with ink supply channel parallel to drop trajectory |
| CN102378499A (en) * | 2011-10-18 | 2012-03-14 | 东莞生益电子有限公司 | Method for manufacturing window plug holes at two sides during PCB (Printed Circuit Board) resistance welding |
| CN102795006A (en) * | 2012-08-09 | 2012-11-28 | 皆利士多层线路版(中山)有限公司 | Green oil silk-printing method for printed circuit board |
| CN105338744A (en) * | 2015-10-22 | 2016-02-17 | 江门崇达电路技术有限公司 | Manufacturing method for PCB with double-sided oil-coating via hole and tin spraying surface treatment |
| CN107318232A (en) * | 2017-07-06 | 2017-11-03 | 深圳明阳电路科技股份有限公司 | A kind of preparation method of PCB mechanical blind holes |
| CN107529281A (en) * | 2017-09-30 | 2017-12-29 | 生益电子股份有限公司 | A kind of PCB preparation method and PCB |
| CN109287076A (en) * | 2018-11-14 | 2019-01-29 | 大连崇达电路有限公司 | The method of the single side opening bleed of aperture 0.8mm or more is prevented in welding resistance technique |
| CN110493964A (en) * | 2019-09-11 | 2019-11-22 | 深圳市景旺电子股份有限公司 | A kind of production method in the non-metallic hole without etching ring |
-
2020
- 2020-12-31 CN CN202011632159.7A patent/CN112672544A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050024443A1 (en) * | 1997-07-15 | 2005-02-03 | Silverbrook Research Pty Ltd | Inkjet nozzle with ink supply channel parallel to drop trajectory |
| JP2002368415A (en) * | 2001-06-01 | 2002-12-20 | Goo Chemical Co Ltd | Method of manufacturing printed wiring board |
| CN102378499A (en) * | 2011-10-18 | 2012-03-14 | 东莞生益电子有限公司 | Method for manufacturing window plug holes at two sides during PCB (Printed Circuit Board) resistance welding |
| CN102795006A (en) * | 2012-08-09 | 2012-11-28 | 皆利士多层线路版(中山)有限公司 | Green oil silk-printing method for printed circuit board |
| CN105338744A (en) * | 2015-10-22 | 2016-02-17 | 江门崇达电路技术有限公司 | Manufacturing method for PCB with double-sided oil-coating via hole and tin spraying surface treatment |
| CN107318232A (en) * | 2017-07-06 | 2017-11-03 | 深圳明阳电路科技股份有限公司 | A kind of preparation method of PCB mechanical blind holes |
| CN107529281A (en) * | 2017-09-30 | 2017-12-29 | 生益电子股份有限公司 | A kind of PCB preparation method and PCB |
| CN109287076A (en) * | 2018-11-14 | 2019-01-29 | 大连崇达电路有限公司 | The method of the single side opening bleed of aperture 0.8mm or more is prevented in welding resistance technique |
| CN110493964A (en) * | 2019-09-11 | 2019-11-22 | 深圳市景旺电子股份有限公司 | A kind of production method in the non-metallic hole without etching ring |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114916150A (en) * | 2022-04-18 | 2022-08-16 | 奥士康精密电路（惠州）有限公司 | Method for improving tailing of solder-proof screen printing of PCB |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8143533B2 (en) | Method for forming resist pattern, method for producing circuit board, and circuit board | |
| KR100614864B1 (en) | Printed wiring board and semiconductor device | |
| CN104883820B (en) | A kind of outer-layer circuit production method of the structure asymmetry backboard of warpage | |
| CN112672544A (en) | Solder mask developing method for metallized hole of PCB (printed circuit board) | |
| CN113597113A (en) | Manufacturing method of high-reflectivity white oil circuit board | |
| CN113133224B (en) | FPCB plate via hole selective plating process | |
| US20180368265A1 (en) | Flexible printed circuit board | |
| JP4676317B2 (en) | Resist pattern forming method, circuit board manufacturing method, and circuit board | |
| CN108551725B (en) | Method for electroplating nickel and gold on printed circuit board circuit and printed circuit board circuit thereof | |
| JP3624423B2 (en) | Printed wiring board and manufacturing method thereof | |
| CN114486887A (en) | Lead-free tin spraying process capability test method and control method for different solder mask thicknesses | |
| CN109788661B (en) | Flexible circuit board and preparation method thereof | |
| KR20050027655A (en) | Duplicate coating method for psr | |
| KR101170753B1 (en) | Method of manufacturing flexible printed circuit board | |
| CN111565514A (en) | Production method of 5G power amplifier circuit board | |
| KR20110110664A (en) | Manufacturing method of double-sided printed circuit board | |
| JP4705972B2 (en) | Printed wiring board and manufacturing method thereof | |
| JPH036880A (en) | Printed wiring board and manufacture thereof | |
| JP4676376B2 (en) | Circuit board manufacturing method | |
| JP3068596B1 (en) | Manufacturing method of printed wiring board | |
| JP5743208B2 (en) | Circuit board manufacturing method | |
| CN116744564A (en) | Method for preparing circuit substrate full-plate copper plating relief using ultra-thin photoresist | |
| CN111328208A (en) | Solution for electroless plating of gold on electroless nickel-gold plate | |
| CN114430623A (en) | Method for improving oil spilling of single-side windowed VIA hole after solder mask development | |
| CN117135833A (en) | Processing method of circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |