CN102170758B - Circuit board double window resistance welding hole filling processing method and resistance welding exposure film - Google Patents
Circuit board double window resistance welding hole filling processing method and resistance welding exposure film Download PDFInfo
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- CN102170758B CN102170758B CN2011100926321A CN201110092632A CN102170758B CN 102170758 B CN102170758 B CN 102170758B CN 2011100926321 A CN2011100926321 A CN 2011100926321A CN 201110092632 A CN201110092632 A CN 201110092632A CN 102170758 B CN102170758 B CN 102170758B
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Abstract
The invention discloses a circuit board double window resistance welding plug hole processing method and resistance welding exposure film used therefore. The processing method comprises steps of: S01: resistance welding via hole filling: filling a through-hole on a circuit board with solder resist; S02: silk-screen printing ink: using silk-screen with printing ink; S03: exposure: aligning a negative film with the circuit board and carrying out exposure for the circuit board; wherein the negative film is a double window negative film, the negative film is equipped with a block point on the corresponding position of the through-hole in step S01, the size of the block point is same as the size of the through-hole, and the block point is provided with a plurality of photosensitive points in uniform distribution; S04: development: putting the circuit board into developing solvent to develop; S05: solidification. The processing method of the invention can shorten the process flow of the double window resistance welding plug hole on the circuit board and guarantee the quality of the product.
Description
Technical field
The present invention relates to the processing and manufacturing field of wiring board, relate in particular to the processing method and the resistance weldering exposure egative film that is used to process this two-sided resistance weldering consent of windowing of the two-sided resistance weldering consent of windowing of a kind of wiring board.
Background technology
The two-sided resistance weldering consent of windowing: through hole in the circuit board is set, needs the resistance weldering in this through hole, but the two sides in hole can not make public, the design of resistance weld cap can not be arranged.
Retaining point: the not photosensitive region that in egative film photosensitive material district, is provided with.
Circuit plate resistance weldering processing with the two-sided resistance weldering consent of windowing is relatively more difficult; Conventional resistance weldering consent is the once resistance weldering processing method of silk-screen surface ink behind the employing consent, and its technological process is: ... → hindering pre-welding treatment → resistance weldering consent → ink for screen printing → preliminary drying → contraposition/exposure → development → resistance postwelding solidifies → ....The egative film of the usefulness of making public in the method directly is designed to the two-sided egative film of windowing; Egative film is made up of with the auxiliary region that is used for artificial clamping the photosensitive material district; The photosensitive material plot structure of egative film is as shown in Figure 1; Comprise photosensitive region 2 and retaining point 1, wherein the position of retaining point 1 on egative film is corresponding to the position of the two-sided resistance weldering consent of windowing, and said retaining point covers in said resistance welding hole is not made public this resistance welding hole.Fig. 2 shows the state of wiring board in each flow process of this method; Adopt so conventional processing method, when develop in the exposure back, because the resistance welding hole is without exposure; The solder resist of filling in the resistance welding hole can be dissolved removal in developer solution; Solder mask very thin thickness in the resistance welding hole after developing can not satisfy resistance welding hole domestic demand and have the 70% partially filled requirement that solder resist is arranged at least, even the defective of without hindrance weldering in the part hole occur.
In order to solve the problems of the technologies described above; Method commonly used at present is to adopt twice resistance weldering; Promptly be first consent, solidify the resistance postwelding silk-screen surface resistance weldering again in the hole, the consent of resistance weldering for the first time; Solidify the resistance weldering in the hole; And then PCB surface hindered weldering, and adopt this method can satisfy hole internal resistance weldering requirement, the technological process of this processing method is: ... → resistance pre-welding treatment → resistance weldering consent → preliminary drying → rapid development → resistance postwelding curing → resistance pre-welding treatment → ink for screen printing → preliminary drying → contraposition/exposure → development → resistance postwelding curing → ...; The egative film of the usefulness of making public in the method also is directly to be designed to the two-sided egative film of windowing, and chassis construction is as shown in Figure 1.Fig. 3 shows the state of each flow process wiring board of this method; Because the resistance weldering that hinders for the first time in the postwelding hole is solidified; In silk-screen surface resistance weldering second time developing process, the resistance the hole in is welded can be not dissolved again, can satisfy two-sidedly to window and hinder the requirement that 70% solder resist is arranged in the welding hole.This method can solve the product defects that adopts conventional processing method, but this method technological process is long, and then causes the defective that production efficiency is low, processing cost is high and management and control is difficult.
Summary of the invention
The technical problem that the present invention mainly solves provides the processing method and the resistance weldering exposure egative film that is used to process this two-sided resistance weldering consent of windowing of the two-sided resistance weldering consent of windowing of a kind of wiring board; Shorten the work flow of the two-sided resistance weldering consent of windowing on the wiring board, and guarantee product quality.
For solving the problems of the technologies described above, the technical scheme that the present invention adopts is: the processing method of the two-sided resistance weldering consent of windowing of a kind of wiring board is provided, comprises step:
S01: resistance weldering consent: fill the through hole on the wiring board with solder resist;
S02: ink for screen printing: at the PCB surface ink for screen printing;
S03: exposure: egative film is alignd behind the wiring board to the circuit board to explosure; Said egative film is the two-sided egative film of windowing, said egative film with step S01 in the corresponding position of through hole the retaining point is set, said retaining spot size is identical with said clear size of opening, said retaining point is provided with equally distributed sensitivity speck;
S04: develop: wiring board is put into developer solution develop;
S05: solidify.
Wherein, among the step S03, the ratio that the said egative film sensitivity speck gross area accounts for said retaining point area is 1/5～1/3.
Wherein, among the step S03, said egative film sensitivity speck is circular, and diameter is 0.5mil～1mil.
Wherein, among the step S03, said egative film sensitivity speck is square arrangement, and the spacing of adjacent two sensitivity specks is 4mil～5.5mil.
Wherein, among the step S03, exposure parameter is 11 grades of Residual oils.
Wherein, among the step S04, developing time is 120s.
For solving the problems of the technologies described above; Another technical scheme that the present invention adopts is: a kind of resistance weldering exposure egative film that is used for the circuit board double sided resistance weldering consent of windowing of processing line is provided; Said egative film is set to keep off a little corresponding to said two-sided position of windowing resistance weldering consent; Said retaining spot size and the said two-sided resistance weldering consent of windowing are measure-alike, and said retaining point is provided with equally distributed sensitivity speck.
Wherein, the said egative film sensitivity speck gross area ratio that accounts for said retaining point area is 1/5～1/3.
Wherein, said egative film sensitivity speck is circular, and diameter is 0.5mil～1mil.
Wherein, said egative film sensitivity speck is square arrangement, and the spacing of adjacent two sensitivity specks is 4mil～5.5mil.
The invention has the beneficial effects as follows: the conventional processing method of employing that is different from prior art makes that the solder mask quality can not get guaranteeing in the hole in, adopts that twice resistance weldering processing method flow process is oversize to be unfavorable for management and control, and the present invention improves the resistance weldering used egative film that makes public; On retaining point, add some equally distributed sensitivity specks corresponding to the two-sided resistance weldering consent of windowing; Make that not having the solder resist that makes public originally in the through hole obtains exposure to a certain degree, under identical development conditions, the printing ink of PCB surface is compared in the resistance weldering in the through hole; Developing powder is slower; Thereby make the solder resist in the through hole after development, only be developed sub-fraction, reaching only needs once resistance weldering processing just not only to satisfy two-sided requirement of windowing but also satisfies the requirement that the resistance that has in the through hole 70% or more is welded, technological process weak point; Working (machining) efficiency is high, and can guarantee the quality of product.
Description of drawings
Fig. 1 is the resistance weldering exposure chassis construction sketch map of prior art processing method;
Fig. 2 is the corresponding wiring board view of prior art processing method one each flow process;
Fig. 3 is the corresponding wiring board view of prior art processing method two each flow processs;
Fig. 4 is the process chart of processing method of the present invention;
Fig. 5 is the corresponding wiring board view of each flow process of processing method of the present invention;
Fig. 6 is the resistance weldering exposure chassis construction sketch map in the processing method of the present invention.
Embodiment
By specifying technology contents of the present invention, structural feature, realized purpose and effect, give explanation below in conjunction with execution mode and conjunction with figs. are detailed.
See also Fig. 4 to Fig. 6, the present invention discloses the processing method of the two-sided resistance weldering consent of windowing of a kind of wiring board, comprises step:
S01: resistance weldering consent: with the through hole 20 on the solder resist 40 filling wiring boards 10;
S02: ink for screen printing: at wiring board 10 surperficial ink for screen printing 30;
S03: exposure: made public to wiring board 10 in egative film wiring board 10 back of aliging; Said egative film is the two-sided egative film of windowing; Be made up of with the auxiliary region that is used for artificial clamping the photosensitive material district, the photosensitive material plot structure of egative film is as shown in Figure 6, comprises photosensitive region 2 and retaining point 1; Wherein the position of retaining point 1 on egative film is corresponding to the position of through hole 20 among the step S01; 1 size put by said retaining and said through hole 20 is measure-alike, so that retaining point 1 can cover in through hole 20, and said retaining point 1 is provided with equally distributed sensitivity speck 3; Thereby make through hole 20 and these sensitivity speck 3 corresponding zones can obtain exposure, it is unexposed that through hole 20 and retaining are put 1 corresponding all the other zones;
S04: develop: wiring board 10 is put into developer solution develop;
S05: solidify: solidify in the through hole solder resist in through hole, forming solder mask, and said solder mask has been filled the space of the through hole 70% on the wiring board.
The present invention is through improving the used egative film of resistance weldering exposure; On retaining point 1, add equally distributed sensitivity speck 3 corresponding to the two-sided resistance weldering consent of windowing; Make that not having the solder resist 40 that makes public originally in the through hole 20 obtains exposure to a certain degree; Under identical development conditions; The printing ink 30 on wiring board 10 surfaces is compared in resistance weldering in the through hole 20, and developing powder is slower, thereby makes the solder resist 40 in the through hole 20 in developing process, have only the unexposed resistance weldering of fraction dissolved; That is: the resistance that also remains with in the through hole 40 more than 70% is welded; Only have once resistance weldering processing and just realized the two-sided beneficial effect of windowing and guaranteeing to have in the through hole resistance weldering 70% or more, and further improved production efficiency and reduced processing cost, overcome the conventional processing method of available technology adopting simultaneously and made in the hole solder mask quality can not get guaranteeing and adopt twice resistance to weld the oversize defective that is unfavorable for management and control of processing method flow process.
For more accurately guaranteeing crudy, in one embodiment, said egative film sensitivity speck 3 gross areas account for said retaining, and to put the ratio of 1 area be 1/5～1/3.
In the present embodiment, said egative film sensitivity speck 3 is circular, and diameter is 0.5mil～1mil; In one embodiment, said egative film sensitivity speck 3 is square arrangement, and the spacing of adjacent two sensitivity specks is 4mil～5.5mil.Mil is a long measure, expression mil, 1mil=1/1000inch=0.00254cm=0.0254mm.
In one embodiment, among the step S03, exposure parameter is 11 grades of Residual oils.Being defined as of 11 grades of Residual oils: develop by normal photographic parameter in an initial workpiece folder exposure guide rule exposure back; Observe the exposure guide rule scale; When folder is shown as 11 grades on the chi when locating residual a small amount of printing ink, 10 grades and locating not have printing ink, at this moment the exposure energy state of reaction is called 11 grades of Residual oils, is also referred to as 10 grades of lights.
In one embodiment, among the step S04, developing time is set to 95s between the 135s according to the difference of ink ingredient, is 120s in the present embodiment.
In one embodiment, before step S01, also comprise step S101: the resistance pre-welding treatment, promptly wiring board is cleaned.
Used resistance weldering exposure egative film in the processing method of the present invention, its engineering design process is: ... make the normal circuit resistance weldering egative film → egative film that makes public is welded in retaining point loading spot treatments → draftings resistance in two-sided hole of windowing; It is following that retaining point 1 adds the design that sensitivity speck 3 handles: intended diameter is the sensitivity speck 3 of 0.5mil～1mil in retaining point 1; Sensitivity speck 3 is square and is arranged in the retaining point 1; Distance between the two adjacent sensitivity specks 3 is arranged between 4mil～5.5mil; According to actual needs, sensitivity speck 3 arrange can also be rectangular, rhombus or other shapes be evenly distributed in the retaining point 1.Sensitivity speck 3 places are identical with the chassis construction at photosensitive region 2 places, carry sensitization medicine film by the sheet base and form, and sensitization medicine film is made up of silver salt particles such as silver bromide grain etc.
The above is merely embodiments of the invention; Be not so limit claim of the present invention; Every equivalent structure or equivalent flow process conversion that utilizes specification of the present invention and accompanying drawing content to be done; Or directly or indirectly be used in other relevant technical fields, all in like manner be included in the scope of patent protection of the present invention.
Claims (10)
1. the processing method of the two-sided resistance weldering consent of windowing of wiring board is characterized in that, comprises step:
S01: resistance weldering consent: fill the through hole on the wiring board with solder resist;
S02: ink for screen printing: at the PCB surface ink for screen printing;
S03: exposure: egative film is alignd behind the wiring board to the circuit board to explosure; Said egative film is the two-sided egative film of windowing, said egative film with step S01 in the corresponding position of through hole the retaining point is set, said retaining spot size is identical with said clear size of opening, said retaining point is provided with equally distributed sensitivity speck;
S04: develop: wiring board is put into developer solution develop;
S05: solidify.
2. the processing method of the two-sided resistance weldering consent of windowing of wiring board according to claim 1, it is characterized in that: among the step S03, the ratio that the said egative film sensitivity speck gross area accounts for said retaining point area is 1/5～1/3.
3. the processing method of the two-sided resistance weldering consent of windowing of wiring board according to claim 2 is characterized in that: among the step S03, said egative film sensitivity speck is circular, and diameter is 0.5mil～1mil.
4. the processing method of the two-sided resistance weldering consent of windowing of wiring board according to claim 3, it is characterized in that: among the step S03, said egative film sensitivity speck is square arrangement, and the spacing of adjacent two sensitivity specks is 4mil～5.5mil.
5. according to the processing method of the two-sided resistance weldering consent of windowing of each described wiring board of claim 1-4, it is characterized in that: among the step S03, exposure parameter is 11 grades of Residual oils.
6. according to the processing method of the two-sided resistance weldering consent of windowing of each described wiring board of claim 1-4, it is characterized in that: among the step S04, developing time is 120s.
7. one kind is used for the resistance weldering exposure egative film that consent is welded in the circuit board double sided resistance of windowing of processing line; It is characterized in that; Said egative film is set to keep off a little corresponding to said two-sided position of windowing resistance weldering consent; Said retaining spot size and the said two-sided resistance weldering consent of windowing are measure-alike, and said retaining point is provided with equally distributed sensitivity speck.
8. the resistance weldering exposure egative film that is used for the circuit board double sided resistance weldering consent of windowing of processing line according to claim 7, it is characterized in that: the ratio that the said egative film sensitivity speck gross area accounts for said retaining point area is 1/5～1/3.
9. the resistance weldering exposure egative film that is used for the circuit board double sided resistance weldering consent of windowing of processing line according to claim 8, it is characterized in that: said egative film sensitivity speck is for circular, and diameter is 0.5mil～1mil.
10. the resistance weldering exposure egative film that is used for the circuit board double sided resistance weldering consent of windowing of processing line according to claim 9, it is characterized in that: said egative film sensitivity speck is square arrangement, and the spacing of adjacent two sensitivity specks is 4mil～5.5mil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100926321A CN102170758B (en) | 2011-04-13 | 2011-04-13 | Circuit board double window resistance welding hole filling processing method and resistance welding exposure film |
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| Application Number | Priority Date | Filing Date | Title |
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| CN2011100926321A CN102170758B (en) | 2011-04-13 | 2011-04-13 | Circuit board double window resistance welding hole filling processing method and resistance welding exposure film |
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| CN102170758A CN102170758A (en) | 2011-08-31 |
| CN102170758B true CN102170758B (en) | 2012-11-14 |
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| CN2011100926321A Expired - Fee Related CN102170758B (en) | 2011-04-13 | 2011-04-13 | Circuit board double window resistance welding hole filling processing method and resistance welding exposure film |
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| CN102378499B (en) * | 2011-10-18 | 2013-03-20 | 东莞生益电子有限公司 | Method for manufacturing window plug holes at two sides during PCB (Printed Circuit Board) resistance welding |
| CN102387671B (en) * | 2011-10-18 | 2013-09-25 | 东莞生益电子有限公司 | Manufacturing method for single face windowing hole plugging of tin spayed plate |
| CN102413645B (en) * | 2011-10-31 | 2014-02-19 | 深圳市景旺电子股份有限公司 | Manufacturing method of PCB (printed circuit board) semi-plugged hole |
| CN102802357B (en) * | 2012-08-10 | 2015-01-07 | 东莞市五株电子科技有限公司 | Method for preventing solder mask of singleside-windowed PCB (Printed Circuit Board) from oil leakage |
| CN103220888B (en) * | 2013-04-18 | 2016-03-02 | 梅州市志浩电子科技有限公司 | Printed circuit board (PCB) mesh screen plughole method |
| CN103415164B (en) * | 2013-08-30 | 2016-04-27 | 武汉七零九印制板科技有限公司 | A kind of pcb board aperture is greater than the method for 1.0mm via hole ink plugging |
| CN104640376A (en) * | 2013-11-13 | 2015-05-20 | 宏启胜精密电子(秦皇岛)有限公司 | Circuit board plug hole forming method |
| CN103607858B (en) * | 2013-12-03 | 2017-02-22 | 奥士康科技（益阳）有限公司 | Anti-welding processing method of PCB via hole with open window formed in single face |
| CN105530756B (en) * | 2014-09-29 | 2018-04-20 | 深南电路有限公司 | A kind of exposure imaging method of circuit board |
| CN104768339A (en) * | 2015-04-28 | 2015-07-08 | 清远市富盈电子有限公司 | PCB anti-welding double-face window and taphole manufacturing process |
| CN106413264B (en) * | 2016-11-14 | 2018-11-06 | 江门崇达电路技术有限公司 | A kind of production method of the PCB of solder mask consent |
| CN108513451A (en) * | 2017-02-28 | 2018-09-07 | 胜宏科技（惠州）股份有限公司 | A kind of production method of the wiring board through-hole solder mask consent depth more than 80% |
| CN107750090B (en) * | 2017-09-30 | 2019-11-05 | 生益电子股份有限公司 | A kind of production method of PCB |
| CN108055776A (en) * | 2017-11-09 | 2018-05-18 | 建业科技电子（惠州）有限公司 | A kind of improvement welding resistance consent oil spilling production method |
| CN109257886A (en) * | 2018-10-23 | 2019-01-22 | 景旺电子科技(龙川)有限公司 | A kind of rigid-flexible combination multi-layer board solder-resisting manufacturing methods |
| CN109287076A (en) * | 2018-11-14 | 2019-01-29 | 大连崇达电路有限公司 | The method of the single side opening bleed of aperture 0.8mm or more is prevented in welding resistance technique |
| CN111642072A (en) * | 2020-05-20 | 2020-09-08 | 胜宏科技（惠州）股份有限公司 | Manufacturing method for improving ink inlet hole |
| CN114501833B (en) * | 2020-10-23 | 2024-05-14 | 深南电路股份有限公司 | Processing method of solder mask layer on circuit board |
| CN115038253B (en) * | 2022-06-15 | 2023-07-14 | 江门崇达电路技术有限公司 | Method for manufacturing multiple types of PADs (PAD area data) on circuit board accurately and equally |
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| CN101868122A (en) * | 2010-06-24 | 2010-10-20 | 深南电路有限公司 | PCB manufacturing process and hole plugging process thereof |
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| JP2550899B2 (en) * | 1993-12-13 | 1996-11-06 | 日本電気株式会社 | Method for manufacturing printed wiring board |
| JP5106726B2 (en) * | 2001-08-10 | 2012-12-26 | イビデン株式会社 | Wiring board manufacturing method |
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| CN101868122A (en) * | 2010-06-24 | 2010-10-20 | 深南电路有限公司 | PCB manufacturing process and hole plugging process thereof |
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| JP特开2003-60332A 2003.02.28 |
| JP特开平7-162136A 1995.06.23 |
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