CN102958282A - Circuit manufacturing method utilizing wet films and dry films for circuit boards - Google Patents

Abstract

The invention discloses a circuit manufacturing method utilizing wet films and dry films for circuit boards. The circuit manufacturing method includes the steps of firstly, removing oxidation; secondly, coarsening surface; thirdly, coating wet films; fourthly, baking; fifthly, pressing dry films; sixthly, performing exposure; seventhly, developing; eighthly, copper etching; ninthly, removing films; and tenthly, framing. By the technical scheme, fine concave point filling capacity of wet films and fine convex point covering capacity of dry films are combined. A wet film layer being 7-8 micrometers in thickness is evenly coated on a circuit board to well fill concave points of the circuit board, the circuit board is then baked for a certain period of time prior to adhering of the dry film which covers convex points of the circuit board, and accordingly the convex points and concave points on the circuit board are controlled effectively, yield of the circuit is increased greatly, and open circuit, notch and short circuit are reduced.

Description

A kind of wiring board adopts the circuit manufacturing method of wet film+dry film

Technical field

The present invention relates to a kind of circuit manufacturing method of wiring board, especially a kind ofly can with the manufacture method of the wiring board of the salient point of plate face, employing wet film+dry film that concave point covers simultaneously, belong to the wiring board processing technique field.

Background technology

The circuit of wiring board is made grade by traditional live width/line-spacing at present: 100 μ m/100 μ m rise to live width/line-spacing: the making requirement of 50 μ m/50 μ m, the defectives such as product open circuit/breach of using traditional dry film facture to produce constantly raise, former have through processing such as plating and nog plates because make the front copper face of circuit, copper face exists salient point and concave point on the microcosmic, and this type of copper face anomalous effects is then larger when making fine-line; Make circuit after the manufacture method aspect industry of circuit is generally used the dry film pad pasting at present, dry film is because of itself illiquidity characteristic, although salient point that can well the overlay face when making circuit, but fill then poor effect for the concave point of plate face, after making circuit, have the defective of open circuit, breach.

Summary of the invention

Technical problem for above-mentioned existence the objective of the invention is: proposed a kind of circuit manufacturing method that the salient point of plate face, wiring board that concave point covers simultaneously can be adopted wet film+dry film.

Technical solution of the present invention is achieved in that a kind of wiring board adopts the circuit manufacturing method of wet film+dry film, comprises following steps:

1., remove oxidation: use the adhesive-bonded fabric emery wheel of 1 group+1000*1 of 800 order * group to carry out the oxidation of polish-brush removal plate face, plate face foul;

2., coarse surface: use sulfuric acid+hydrogen peroxide solution of 3%-5% that wiring board plate face is carried out alligatoring, 35 ± 5 ℃ of temperature controls;

3., wet film coating: walk spraying coating line pure resin wet film is uniformly sprayed on the plate face, THICKNESS CONTROL 6-8 μ M, infill panel face recessed position;

4. baking: walk the automatic baking line and carry out the wet film oven dry, divide four sections and carry out Temperature Setting, be respectively 80 ℃, 85 ℃, 90 ℃, 85 ℃, 80 ℃, every period all is set as 5MIN;

5., press dry film: use film laminator photosensitive dry film to be covered on the plate face of finishing the wet film spraying, cover the salient point position of board falling face;

6., exposure: the plank that uses the circuit egative film will finish the press mold making exposes energy settings 6-8 lattice;

7., develop: use the operation of developing of 1% sodium carbonate liquor, unexposed position wet film and dry film are developed get rid of, expose copper face;

8., erosion copper: the copper that uses Cucl2 solution that plate is showed out the position of copper face etches away, and obtains the line pattern that needs;

9., move back film: use the NaOH solution of 2-3.5% that the wet film of plate face exposure position is got rid of, namely finish the wet film action of windowing;

10., frame up: circuit completes, and frames up.

Because the utilization of technique scheme, the present invention compared with prior art has following advantages:

Wiring board of the present invention adopts the circuit manufacturing method of wet film+dry film, the concave point fillibility that wet film is good and the good salient point spreadability of dry film combine, at the wet film that evenly is coated with the about 7-8 μ of a layer thickness M the concave point on the plate face is carried out good filling at the plate face first, carry out the dry film laminating action at the plate face after finishing the baking of carrying out certain hour after above, the salient point of plate face is covered, salient point and the concave point finished on the above rear plate face all are controlled effectively, and open circuit, breach, the short circuit yield of finishing circuit all have very large lifting.

Embodiment

A kind of wiring board of the present invention adopts the circuit manufacturing method of wet film+dry film, comprises following steps:

1., remove oxidation: use the adhesive-bonded fabric emery wheel of 1 group+1000*1 of 800 order * group to carry out the oxidation of polish-brush removal plate face, plate face foul;

2., coarse surface: use sulfuric acid+hydrogen peroxide solution of 3%-5% that wiring board plate face is carried out alligatoring, 35 ± 5 ℃ of temperature controls;

3., wet film coating: walk spraying coating line pure resin wet film is uniformly sprayed on the plate face, THICKNESS CONTROL 6-8 μ M, infill panel face recessed position;

4. baking: walk the automatic baking line and carry out the wet film oven dry, divide four sections and carry out Temperature Setting, be respectively 80 ℃, 85 ℃, 90 ℃, 85 ℃, 80 ℃, every period all is set as 5MIN;

5., press dry film: use film laminator photosensitive dry film to be covered on the plate face of finishing the wet film spraying, cover the salient point position of board falling face;

6., exposure: the plank that uses the circuit egative film will finish the press mold making exposes energy settings 6-8 lattice;

7., develop: use the operation of developing of 1% sodium carbonate liquor, unexposed position wet film and dry film are developed get rid of, expose copper face;

8., erosion copper: use Cucl ₂The copper that solution is showed out the position of copper face with plate etches away, and obtains the line pattern that needs;

9., move back film: use the NaOH solution of 2-3.5% that the wet film of plate face exposure position is got rid of, namely finish the wet film action of windowing;

10., frame up: circuit completes, and frames up.

Because the utilization of technique scheme, the present invention compared with prior art has following advantages:

Wiring board of the present invention adopts the circuit manufacturing method of wet film+dry film, the concave point fillibility that wet film is good and the good salient point spreadability of dry film combine, at the wet film that evenly is coated with the about 7-8 μ of a layer thickness M the concave point on the plate face is carried out good filling at the plate face first, carry out the dry film laminating action at the plate face after finishing the baking of carrying out certain hour after above, the salient point of plate face is covered, salient point and the concave point finished on the above rear plate face all are controlled effectively, and open circuit, breach, the short circuit yield of finishing circuit all have very large lifting.

Above-described embodiment only is explanation technical conceive of the present invention and characteristics; its purpose is to allow the personage that is familiar with technique can understand content of the present invention and is implemented; can not limit protection scope of the present invention with this; all equivalences that Spirit Essence is done according to the present invention change or modify, and all should be encompassed in protection scope of the present invention.

Claims (1)

1. a wiring board adopts the circuit manufacturing method of wet film+dry film, comprises following steps:

1., remove oxidation: use the adhesive-bonded fabric emery wheel of 1 group+1000*1 of 800 order * group to carry out the oxidation of polish-brush removal plate face, plate face foul;

2., coarse surface: use sulfuric acid+hydrogen peroxide solution of 3%-5% that wiring board plate face is carried out alligatoring, 35 ± 5 ℃ of temperature controls;

3., wet film coating: walk spraying coating line pure resin wet film is uniformly sprayed on the plate face, THICKNESS CONTROL 6-8 μ M, infill panel face recessed position;

4. baking: walk the automatic baking line and carry out the wet film oven dry, divide four sections and carry out Temperature Setting, be respectively 80 ℃, 85 ℃, 90 ℃, 85 ℃, 80 ℃, every period all is set as 5MIN;

5., press dry film: use film laminator photosensitive dry film to be covered on the plate face of finishing the wet film spraying, cover the salient point position of board falling face;

6., exposure: the plank that uses the circuit egative film will finish the press mold making exposes energy settings 6-8 lattice;

7., develop: use the operation of developing of 1% sodium carbonate liquor, unexposed position wet film and dry film are developed get rid of, expose copper face;

8., erosion copper: use Cucl ₂The copper that solution is showed out the position of copper face with plate etches away, and obtains the line pattern that needs;

9., move back film: use the NaOH solution of 2-3.5% that the wet film of plate face exposure position is got rid of, namely finish the wet film action of windowing;

10., frame up: circuit completes, and frames up.