CN105142355A - Method for fabricating circuit board - Google Patents
Method for fabricating circuit board Download PDFInfo
- Publication number
- CN105142355A CN105142355A CN201510446847.7A CN201510446847A CN105142355A CN 105142355 A CN105142355 A CN 105142355A CN 201510446847 A CN201510446847 A CN 201510446847A CN 105142355 A CN105142355 A CN 105142355A
- Authority
- CN
- China
- Prior art keywords
- copper foil
- solder mask
- foil layer
- etched
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1377—Protective layers
- H05K2203/1394—Covering open PTHs, e.g. by dry film resist or by metal disc
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention discloses a method for fabricating a circuit board. The method comprises the steps as follows: a solder mask layer is printed on an outer circuit graph surface of a copper foil plate to expose a to-be-etched copper foil layer; the copper foil plate comprises a base material, a copper foil layer and a plated-through hole; the copper foil layer is located on the base material; the plated-through hole penetrates through the base material and the copper foil layer, and is covered with a dry film; the to-be-etched copper foil layer is etched; and the dry film and the solder mask layer are removed to obtain the circuit board. By the method for fabricating the circuit board, fabrication of an outer circuit graph of the copper foil plate can be optimized.
Description
Technical field
The present invention relates to circuit board manufacturing process technical field, particularly relate to a kind of manufacture method of circuit board.
Background technology
When preparing department's independent power source plate, in order to avoid high electric current by time the heat that produces make circuit board heating serious and affect the useful life of equipment, simultaneously, in order to improve the proof voltage ability of circuit board, general employing thick Copper Foil superelevation laminate (copper thickness is more than 3oz, and level is more than 8 layers) makes.
When carrying out skin to thick Copper Foil superelevation laminate and making, generally at the outer pad pasting of thick Copper Foil superelevation laminate, then in adopting, Photo imaging processes obtains outer-layer circuit figure.But, because the substrate in thick Copper Foil superelevation laminate adopts gummosis to carry out multiple stacking pressing, cause the thickness of slab of the thick Copper Foil superelevation laminate after pressing to occur difference of height (general difference of height is at more than 0.3mm).And when thickness of slab difference of height is more than 0.2mm, carrying out pad pasting to plate skin can make pad pasting bad, be unfavorable for the making of outer-layer circuit figure, thus cause following process difficulty.
Summary of the invention
The embodiment of the present invention proposes a kind of manufacture method of circuit board, can optimize the making of the outer-layer circuit figure of copper foil plate.
The embodiment of the present invention provides a kind of manufacture method of circuit board, comprising:
At the outer-layer circuit patterned surface printing solder mask of copper foil plate, make copper foil layer to be etched exposed; Described copper foil plate comprises base material, is positioned at the copper foil layer on described base material and runs through the plated-through hole of described base material and described copper foil layer;
Described plated-through hole covers dry film;
Described copper foil layer to be etched is etched;
Take off described dry film and described solder mask, obtain circuit board.
Further, the described printing of the outer-layer circuit patterned surface at copper foil plate solder mask, makes copper foil layer to be etched exposed, specifically comprises:
At the copper foil layer surface printing solder mask of copper foil plate;
Expose described solder mask, develop copper foil layer to be etched;
Remove the solder mask on described copper foil layer surface to be etched, expose described copper foil layer to be etched; Wherein, not exposed copper foil layer is outer-layer circuit figure.
Further, the described copper foil layer surface printing solder mask at described copper foil plate, specifically comprises:
Adopt electrostatic painting process, at the copper foil layer surface spraying solder mask of described copper foil plate.
Further, describedly on described plated-through hole, cover dry film, specifically comprise:
Dry film is sticked on described solder mask surface; Described dry film covers described plated-through hole;
Expose described dry film, develop described copper foil layer to be etched.
Preferably, described solder mask is photosensitive ink layer.
Implement the embodiment of the present invention, there is following beneficial effect:
The manufacture method of the circuit board that the embodiment of the present invention provides; can by the copper foil plate surface printing solder mask in thickness of slab inequality; the outer-layer circuit figure of protection copper foil plate; the plated-through hole of copper foil plate covers dry film; protection plated-through hole; thus etch required outer-layer circuit figure, avoid the bad problem causing outer-layer circuit graphic making deviation of pad pasting on copper foil plate, optimize the normal making of copper foil plate outer-layer circuit figure.
Accompanying drawing explanation
Fig. 1 is the schematic flow sheet of an embodiment of the manufacture method of circuit board provided by the invention;
Fig. 2 is the schematic diagram of step one in the manufacture method of circuit board provided by the invention;
Fig. 3 is the schematic diagram of step 2 in the manufacture method of circuit board provided by the invention;
Fig. 4 is the schematic diagram of step 3 in the manufacture method of circuit board provided by the invention;
Fig. 5 is the schematic diagram of step 4 in the manufacture method of circuit board provided by the invention.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, be clearly and completely described the technical scheme in the embodiment of the present invention, obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, belong to the scope of protection of the invention.
See Fig. 1, be the schematic flow sheet of an embodiment of the manufacture method of circuit board provided by the invention, comprise:
S1, copper foil plate outer-layer circuit patterned surface printing solder mask, make copper foil layer to be etched exposed; Described copper foil plate comprises base material, is positioned at the copper foil layer on described base material and runs through the plated-through hole of described base material and described copper foil layer;
S2, on described plated-through hole, cover dry film;
S3, described copper foil layer to be etched to be etched;
S4, take off described dry film and described solder mask, obtain circuit board.
Wherein, the copper thickness of copper foil plate is more than 3oz, and level is more than 8 layers.At the copper foil layer surface printing solder mask of copper foil plate, wherein, need the outer-layer circuit figure retained to cover solder mask, copper foil layer to be etched is out exposed.Because solder mask is without cap bore ability, also dry film need be covered on plated-through hole.Circuit etching is carried out to copper foil plate, unwanted exposed copper foil layer to be etched is etched away, retain outer-layer circuit figure.Wherein, solder mask protection outer-layer circuit figure is not etched, and dry film protection plated-through hole is not etched.After etching, take off the dry film that plated-through hole covers, then take off the solder mask on outer-layer circuit figure, required circuit board can be obtained.
Further, the described printing of the outer-layer circuit patterned surface at copper foil plate solder mask, makes copper foil layer to be etched exposed, specifically comprises:
At the copper foil layer surface printing solder mask of copper foil plate;
Expose described solder mask, develop copper foil layer to be etched;
Remove the solder mask on described copper foil layer surface to be etched, expose described copper foil layer to be etched; Wherein, not exposed copper foil layer is outer-layer circuit figure.
It should be noted that, because printing solder mask is to the thickness of slab uniformity no requirement (NR) of copper foil plate, therefore, at the copper foil layer surface printing solder mask of copper foil plate, required outer-layer circuit figure is protected.According to user's design requirement, adopt welding resistance imaging technique, removed by the solder mask of unwanted copper foil layer surface printing, expose copper foil layer to be etched, not exposed copper foil layer is the copper foil layer needing to retain, i.e. outer-layer circuit figure.
Further, the described copper foil layer surface printing solder mask at described copper foil plate, specifically comprises:
Adopt electrostatic painting process, at the copper foil layer surface spraying solder mask of described copper foil plate.
Further, describedly on described plated-through hole, cover dry film, specifically comprise:
Dry film is sticked on described solder mask surface; Described dry film covers described plated-through hole;
Expose described dry film, develop described copper foil layer to be etched.
It should be noted that, because solder mask is without cap bore ability, dry film need be sticked on solder mask surface, do not etched to protect plated-through hole.After sticking dry film, according to user's design requirement, adopt circuit imaging process, remove the dry film that unwanted copper foil layer covers, expose copper foil layer to be etched.
Preferably, described solder mask is photosensitive ink layer.
Below in conjunction with Fig. 2 ~ Fig. 5, the manufacture method of circuit board provided by the invention is described in detail.
Step one: welding resistance imaging
As shown in Figure 2, copper foil plate comprises base material 1, is positioned at the copper foil layer 2 on described base material 1 and runs through the plated-through hole 3 of described base material 1 and described copper foil layer 2.Adopt electrostatic painting process, at copper foil layer 2 surface spraying solder mask 4.Expose solder mask 4, develop copper foil layer 5 to be etched, and remove the solder mask on copper foil layer 5 surface to be etched, exposes copper foil layer 5 to be etched.Wherein, not exposed copper foil layer is outer-layer circuit figure.
Step 2: interior photoimaging
As shown in Figure 3, stick dry film 6 on solder mask 4 surface, make dry film 6 covering metal hole 3.Expose dry film 6, develop copper foil layer 5 to be etched.Remove the dry film on copper foil layer 5 to be etched, expose copper foil layer 5 to be etched.
Step 3: etching
As shown in Figure 4, the skin of copper foil plate is etched, etch away copper foil layer 5 to be etched.Wherein, solder mask 4 protects outer-layer circuit figure not etched, and dry film 6 protects plated-through hole 3 not etched.
Step 4: take off film
As shown in Figure 5, take off the dry film 6 on solder mask 4 surface, then take off the solder mask 4 of outer-layer circuit patterned surface, obtain the circuit board needed for user.
The manufacture method of the circuit board that the embodiment of the present invention provides; can by the copper foil plate surface printing solder mask in thickness of slab inequality; the outer-layer circuit figure of protection copper foil plate; the plated-through hole of copper foil plate covers dry film; protection plated-through hole; thus etch required outer-layer circuit figure, avoid the bad problem causing outer-layer circuit graphic making deviation of pad pasting on copper foil plate, optimize the normal making of copper foil plate outer-layer circuit figure.
The above is the preferred embodiment of the present invention; it should be pointed out that for those skilled in the art, under the premise without departing from the principles of the invention; can also make some improvements and modifications, these improvements and modifications are also considered as protection scope of the present invention.
Claims (5)
1. a manufacture method for circuit board, is characterized in that, comprising:
At the outer-layer circuit patterned surface printing solder mask of copper foil plate, make copper foil layer to be etched exposed; Described copper foil plate comprises base material, is positioned at the copper foil layer on described base material and runs through the plated-through hole of described base material and described copper foil layer;
Described plated-through hole covers dry film;
Described copper foil layer to be etched is etched;
Take off described dry film and described solder mask, obtain circuit board.
2. the manufacture method of circuit board as claimed in claim 1, is characterized in that, the described printing of the outer-layer circuit patterned surface at copper foil plate solder mask, makes copper foil layer to be etched exposed, specifically comprise:
At the copper foil layer surface printing solder mask of copper foil plate;
Expose described solder mask, develop copper foil layer to be etched;
Remove the solder mask on described copper foil layer surface to be etched, expose described copper foil layer to be etched; Wherein, not exposed copper foil layer is outer-layer circuit figure.
3. the manufacture method of circuit board as claimed in claim 2, it is characterized in that, the described copper foil layer surface printing solder mask at described copper foil plate, specifically comprises:
Adopt electrostatic painting process, at the copper foil layer surface spraying solder mask of described copper foil plate.
4. the manufacture method of as claimed in claim 2 or claim 3 circuit board, is characterized in that, describedly on described plated-through hole, covers dry film, specifically comprises:
Dry film is sticked on described solder mask surface; Described dry film covers described plated-through hole;
Expose described dry film, develop described copper foil layer to be etched.
5. the manufacture method of the circuit board as described in any one of claims 1 to 3, is characterized in that, described solder mask is photosensitive ink layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510446847.7A CN105142355A (en) | 2015-07-27 | 2015-07-27 | Method for fabricating circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510446847.7A CN105142355A (en) | 2015-07-27 | 2015-07-27 | Method for fabricating circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105142355A true CN105142355A (en) | 2015-12-09 |
Family
ID=54727515
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510446847.7A Pending CN105142355A (en) | 2015-07-27 | 2015-07-27 | Method for fabricating circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105142355A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107072046A (en) * | 2017-02-15 | 2017-08-18 | 深圳市景旺电子股份有限公司 | A kind of pcb board and its outer-layer circuit preparation method |
| CN112040658A (en) * | 2020-10-20 | 2020-12-04 | 东莞森玛仕格里菲电路有限公司 | Method for avoiding BGA area hole blocking |
| CN113194620A (en) * | 2021-04-25 | 2021-07-30 | 珠海方正科技多层电路板有限公司 | Method for drilling non-metallized hole and printed circuit board |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01290289A (en) * | 1988-05-18 | 1989-11-22 | Hitachi Plant Eng & Constr Co Ltd | Method of forming conductor pattern |
| CN1942057A (en) * | 2005-07-15 | 2007-04-04 | 新光电气工业株式会社 | Method of forming metal plate pattern and circuit board |
| CN102958282A (en) * | 2011-08-16 | 2013-03-06 | 悦虎电路(苏州)有限公司 | Circuit manufacturing method utilizing wet films and dry films for circuit boards |
| CN103108490A (en) * | 2011-11-11 | 2013-05-15 | 深南电路有限公司 | Circuit manufacturing method of super-thick copper circuit board |
| CN104378923A (en) * | 2014-11-14 | 2015-02-25 | 江门崇达电路技术有限公司 | Printed circuit board etching method |
-
2015
- 2015-07-27 CN CN201510446847.7A patent/CN105142355A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01290289A (en) * | 1988-05-18 | 1989-11-22 | Hitachi Plant Eng & Constr Co Ltd | Method of forming conductor pattern |
| CN1942057A (en) * | 2005-07-15 | 2007-04-04 | 新光电气工业株式会社 | Method of forming metal plate pattern and circuit board |
| CN102958282A (en) * | 2011-08-16 | 2013-03-06 | 悦虎电路(苏州)有限公司 | Circuit manufacturing method utilizing wet films and dry films for circuit boards |
| CN103108490A (en) * | 2011-11-11 | 2013-05-15 | 深南电路有限公司 | Circuit manufacturing method of super-thick copper circuit board |
| CN104378923A (en) * | 2014-11-14 | 2015-02-25 | 江门崇达电路技术有限公司 | Printed circuit board etching method |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107072046A (en) * | 2017-02-15 | 2017-08-18 | 深圳市景旺电子股份有限公司 | A kind of pcb board and its outer-layer circuit preparation method |
| CN112040658A (en) * | 2020-10-20 | 2020-12-04 | 东莞森玛仕格里菲电路有限公司 | Method for avoiding BGA area hole blocking |
| CN113194620A (en) * | 2021-04-25 | 2021-07-30 | 珠海方正科技多层电路板有限公司 | Method for drilling non-metallized hole and printed circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20151209 |
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| RJ01 | Rejection of invention patent application after publication |