CN105696037A - Electroplating method for workpiece and electroplating protective glue - Google Patents
Electroplating method for workpiece and electroplating protective glue Download PDFInfo
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- CN105696037A CN105696037A CN201410695541.0A CN201410695541A CN105696037A CN 105696037 A CN105696037 A CN 105696037A CN 201410695541 A CN201410695541 A CN 201410695541A CN 105696037 A CN105696037 A CN 105696037A
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Abstract
The invention discloses an electroplating method for a workpiece. The method includes the steps of: providing an ultraviolet curing adhesive; coating a to-be-protected area on the workpiece with the ultraviolet curing adhesive, and performing ultraviolet irradiation on the ultraviolet curing adhesive coating the workpiece to perform crosslinking curing, thus forming an electroplating protection mask with a predetermined pattern on the workpiece; immersing the workpiece into an electroplating solution so as to form a layer of noble metal on an area that is not coated with the ultraviolet curing adhesive and needs electroplating; and removing the ultraviolet curing adhesive from the workpiece already electroplated with a layer of noble metal. The ultraviolet curing adhesive has fast curing speed and has no need for high temperature during curing, therefore, the electroplating efficiency and electroplating quality of the workpiece are improved. In addition, the invention also discloses an electroplating protective glue made of ultraviolet curing resin.
Description
Technical field
The present invention relates to one and workpiece is carried out electric plating method。
Background technology
Plating protection glue is a kind of resist that can resist electroplate liquid corrosion。In the prior art, before plating, this plating protection glue covers on the region that need not electroplate of workpiece (such as, the electric product of circuit substrate, electric contact terminal or other needs plating) of electroplated。When plating, this plating protection glue can protect the region that need not electroplate of this workpiece。After plating, it is necessary to from workpiece, remove these plating protection glue。
Due to noble metal, for instance, gold, silver etc., there is good electrical conductance and low resistance, it is often plated on workpiece, to realize good electrical connection。But, noble metal costly, this promotes in electroplating technology the only regional area needing plating at workpiece to carry out selective electroplating。
This selective electroplating technical process generally comprises following steps:
First, coating plating protection glue on workpiece, then heats this plating protection glue, so as to solidify；
Then, by the mode of laser lift-off, the plating protection glue on the region needing plating covering workpiece is removed, thus making the plating protection glue mask pattern of needs on the surface of workpiece；
Then, being immersed in electroplate liquid by workpiece, on the region needing plating of workpiece, plating forms one layer of noble metal, and other region that need not electroplate of workpiece is then plated protection glue mask and is protected, and will not be subject to the impact of electroplate liquid；With
Finally, the workpiece after plating is immersed in Alkaline solubilization liquid, removes remaining plating protection glue on workpiece。
This selective electroplating technique can accurately control plating area and the size of noble metal, thus saving substantial amounts of noble metal。This selective electroplating technique has had the developing history of decades, but, up to now, this existing electroplating technology all there is problems in that
1. plating protection adhesive curing speed is slow, it is necessary to through the very long passage that is heating and curing, and usually time is long, at least needs 30 seconds whole hardening time, and this has become as a technical bottleneck of restriction plating productivity ratio；
2. needing to solidify plating protection glue under the high temperature of at least 150 DEG C, this can cause the metal works being plated oxidation and deformation；
3. removing the overlong time of plating protection glue, after plating, removing remaining plating protection glue on workpiece with Alkaline solubilization liquid at least needs 30 seconds, and this also becomes a technical bottleneck of restriction plating productivity ratio；
4. the corrosion resistance of plating protection glue is poor, can only tolerate 1 minute in the electroplate liquid of 60 DEG C, if the time being immersed in electroplate liquid was more than 1 minute, the plating protection glue on workpiece will come off from workpiece, loses defencive function。
Summary of the invention
The purpose of the present invention aims to solve the problem that at least one aspect of the above-mentioned problems in the prior art and defect。
It is an object of the present invention to provide one and workpiece is carried out electric plating method, it can improve electroplating efficiency and electroplating quality。
Further object is that and a kind of plating in plating, workpiece protected protection glue is provided, its can fast setting and when solidifying without high temperature。
According to an aspect of the present invention, it is provided that workpiece is carried out electric plating method by one, comprises the following steps:
S110: a kind of ultra-violet curing glue is provided；
S120: being coated on workpiece by described ultra-violet curing glue needs in area to be protected, and the ultra-violet curing glue on workpiece it is coated in ultraviolet radiation, so as to crosslinking curing, thus forming the plating protection mask with predetermined pattern on workpiece；
S130: workpiece is immersed in electroplate liquid, in order to not being coated with on ultra-violet curing glue, needs plating region and electroplating forming one layer of noble metal at workpiece；With
S140: remove the ultra-violet curing glue being electroplate with on the workpiece of one layer of noble metal。
Embodiment according to an example of the present invention, described step S140 includes:
S141: with the ultra-violet curing glue on LASER HEATING workpiece, make a part for the ultra-violet curing glue on workpiece be stripped；With
S142: be immersed in lysate by workpiece, makes remaining ultra-violet curing glue on workpiece be dissolved into lysate。
The embodiment of another exemplary according to the present invention, described ultra-violet curing glue is acrylic ester type ultraviolet-curing resin。
The embodiment of another exemplary according to the present invention, described ultra-violet curing glue comprises: the acrylic polymer of 50%～80% by weight；The reactive diluent of 10%～40% by weight；The photoinitiator of 1%～10% by weight。
The embodiment of another exemplary according to the present invention, described ultra-violet curing glue comprises: the polyurethane acrylate prepolymer of 60% by weight；The isobornyl thiocyanoacetate of 35% by weight；Dimethoxy-2-the phenyl acetophenone of 3% by weight；Other additives of 2% by weight。
The embodiment of another exemplary according to the present invention, in described step S120, with the time of ultra-violet curing glue described in ultraviolet curing within the scope of 3 seconds to 5 seconds。
The embodiment of another exemplary according to the present invention, in described step S140, removes the time of the ultra-violet curing glue being electroplate with on the workpiece of one layer of noble metal less than 15 seconds。
The embodiment of another exemplary according to the present invention, described ultra-violet curing glue does not comprise organic solvent。
The embodiment of another exemplary according to the present invention, described ultra-violet curing glue meets following corrosion stability condition: in the electroplate liquid more than 60 DEG C, experience will not be plated corrosion in more than 3 minutes。
The embodiment of another exemplary according to the present invention, in described step S120, utilizes the technique of spraying, brushing, roller coating or silk screen printing to be coated with on the workpiece by described ultra-violet curing glue。
The embodiment of another exemplary according to the present invention, in described step S120, forms plating on the workpiece and protects the thickness of mask less than 40 microns。
The embodiment of another exemplary according to the present invention, described workpiece is circuit substrate, electric contact terminal or electronic chip。
According to another aspect of the present invention, it is provided that a kind of plating protection glue, described plating protection glue is made up of ultraviolet-curing resin。
Embodiment according to an example of the present invention, described ultraviolet-curing resin is acrylic ester type ultraviolet-curing resin。
The embodiment of another exemplary according to the present invention, described ultraviolet-curing resin comprises: the acrylic polymer of 50%～80% by weight；The reactive diluent of 10%～40% by weight；The photoinitiator of 1%～10% by weight。
The embodiment of another exemplary according to the present invention, described ultraviolet-curing resin comprises: the polyurethane acrylate prepolymer of 60% by weight；The isobornyl thiocyanoacetate of 35% by weight；Dimethoxy-2-the phenyl acetophenone of 3% by weight；Other additives of 2% by weight。
In each embodiment above-mentioned of the present invention, the workpiece of application ultra-violet curing glue coating electroplated, the part that need not electroplate is protected。Ultra-violet curing adhesive curing speed is fast, it is not necessary to heating, without organic solvent。Meanwhile, the corrosion of ultra-violet curing glue electroplate liquid more resistance to than existing thermoplasticity plating protection glue。
It addition, in one embodiment of the invention, combination employs laser technology and electrolysis tech and removes ultra-violet curing gel coating from workpiece, makes the peeling rate of ultra-violet curing glue more accelerate, further increases the production efficiency of plating。
By below with reference to accompanying drawing description made for the present invention, other purpose of the present invention and advantage will be apparent to, and can help the present invention is fully understood by。
Accompanying drawing explanation
Figure 1A shows the schematic diagram of the workpiece of electroplated according to an embodiment of the invention；
Figure 1B is shown on the workpiece shown in Figure 1A and is coated with one layer of ultra-violet curing glue, and with ultraviolet so as to solidify；
Fig. 1 C shows and is immersed in the electroplate liquid of electrolyzer by the workpiece being coated with ultra-violet curing glue shown in Figure 1B, in order on the region needing plating of workpiece, plating forms one layer of noble metal；
The schematic diagram of the workpiece that Fig. 1 D display noble metal has been electroplated onto on the region needing plating；
The schematic diagram of a part of ultra-violet curing glue on Fig. 1 E display laser ablation workpiece；With
Fig. 1 F shows that the workpiece by a part of ultra-violet curing glue shown in Fig. 1 E has been removed is immersed in Alkaline solubilization liquid, to remove remaining ultra-violet curing glue on workpiece；With
Fig. 1 G show ultra-violet curing glue remove completely after the schematic diagram of workpiece。
Detailed description of the invention
By the examples below, and in conjunction with accompanying drawing, technical scheme is described in further detail。In the description, same or analogous drawing reference numeral indicates same or analogous parts。Following it is intended to the explanation of embodiment of the present invention with reference to accompanying drawing the present general inventive concept of the present invention is made an explanation, and is not construed as a kind of restriction to the present invention。
It addition, in the following detailed description, for ease of explaining, elaborate that many concrete details are to provide the comprehensive understanding to present disclosure embodiment。It should be apparent, however, that one or more embodiments can also be implemented when not having these details。In other cases, known construction and device diagrammatically embodies to simplify accompanying drawing。
A general technical design according to the present invention, it is provided that workpiece is carried out electric plating method by one, comprises the following steps: provide a kind of ultra-violet curing glue；It is coated on workpiece by described ultra-violet curing glue to need in area to be protected, and is coated in the ultra-violet curing glue on workpiece with ultraviolet radiation, so as to crosslinking curing, thus forming the plating protection mask with predetermined pattern on workpiece；Workpiece is immersed in electroplate liquid, in order to not being coated with on ultra-violet curing glue, needs plating region and electroplating forming one layer of noble metal at workpiece；The ultra-violet curing glue on the workpiece of one layer of noble metal it has been electroplate with removal。
Describe in detail below with reference to Figure 1A to Fig. 1 G and utilize the process that workpiece is electroplated。
First, as shown in Figure 1A, it is provided that the workpiece 100 of an electroplated, such as, in the illustrated embodiment, workpiece is an electric contact terminal, but, the present invention is not limited to this, and the workpiece of electroplated can be the electronic product of circuit substrate, electronic chip or the plating of other any needs。
Secondly; as shown in Figure 1B; being coated on workpiece 100 by ultra-violet curing glue 200 needs in area to be protected (region that need not electroplate); and the ultra-violet curing glue 200 being coated on workpiece 100 is irradiated with ultraviolet 300; so as to crosslinking curing, thus on workpiece 100, form the plating protection mask with predetermined pattern。
Then; as shown in Fig. 1 C and Fig. 1 D; workpiece 100 is immersed in the electroplate liquid in electrolyzer 400; so that the upper plating in region (not being coated with the region of ultra-violet curing glue) needing plating at workpiece 100 forms one layer of noble metal 500; other region that need not electroplate of workpiece 100 is then protected by ultra-violet curing glue, will not be subject to the impact of electroplate liquid。
Then, as referring to figure 1e, with the ultra-violet curing glue 200 on laser 600 heated parts 100, the major part of the ultra-violet curing glue 200 on workpiece 100 is made to be stripped。
Finally, as shown in Fig. 1 F and Fig. 1 G, workpiece 100 is immersed in lysate, makes remaining ultra-violet curing glue 200 on workpiece 100 be dissolved in lysate, thus the ultra-violet curing glue 200 removed completely on the workpiece 100 being electroplate with one layer of noble metal 500。
So, after aforementioned selective electroplating, electroplating parts as shown in Figure 1 G can be obtained, as shown in Figure 1 G, noble metal 500 is only formed on the regional area (such as, the contact region of electric contact terminal) needing plating of workpiece 100, without being formed on the whole region of workpiece 100, thus saving the amount of noble metal 500, save cost。
In the embodiment of an example of the present invention, it is possible to ultra-violet curing glue 200 is coated on workpiece 100 by the technique of spraying, brushing, roller coating or silk screen printing。
In the embodiment of another exemplary of the present invention, it is possible to change the viscosity of ultra-violet curing glue 200 by changing the content of each component of ultra-violet curing glue 200。In this manner it is possible to accurately control the thickness of the ultra-violet curing glue 200 being coated on workpiece 100。In one embodiment of the invention, the thickness of the ultra-violet curing glue being coated on workpiece 100 is less than 40 microns。
In previously described embodiments of the present invention, solidify the time of ultra-violet curing glue 200 within the scope of 3 seconds to 5 seconds with ultraviolet 300。Therefore, the ultra-violet curing glue of the present invention is heating and curing very short, is greatly enhanced the production efficiency of selective electroplating。
In previously described embodiments of the present invention, remove the time of ultra-violet curing glue 200 on the workpiece 100 being electroplate with one layer of noble metal 500 completely less than 15 seconds。Therefore, the removal speed of the ultra-violet curing glue of the present invention is fast, and this is also greatly enhanced the production efficiency of selective electroplating。
In previously described embodiments of the present invention, ultra-violet curing glue is capable of withstanding in the electroplate liquid more than 60 DEG C by more than 3 minutes。Therefore, the ultra-violet curing glue of the present invention has stronger anti-plate corrosion, improves the electroplating quality to workpiece and drastically increases the qualification rate of electroplated product。
In the embodiment of another exemplary of the present invention, ultra-violet curing glue 200 does not comprise organic solvent。Therefore, environment will not be caused any adverse effect by ultra-violet curing glue 200, decreases the pollution to environment。
The specific embodiment of aforementioned ultra-violet curing glue 200 is exemplified below。
In one embodiment of the invention, ultra-violet curing glue 200 can be made up of ultraviolet-curing resin, for instance, it is possible to it is made up of acrylic ester type ultraviolet-curing resin (AcrylatetypeUVcuringresin)。
In another embodiment of the present invention, this ultra-violet curing glue 200 can comprise: the acrylic polymer (Acrylateprepolymer) of 50%～80% by weight；The reactive diluent (Reactivediluent) of 10%～40% by weight；The photoinitiator (Photoinitiator) of 1%～10% by weight。
In another embodiment of the present invention, this ultra-violet curing glue 200 can comprise: the polyurethane acrylate prepolymer (Polyurethaneacrylateprepolymer) of 60% by weight；The isobornyl thiocyanoacetate (Iso-Bornylacrylate) of 35% by weight；The dimethoxy-2-phenyl acetophenone (2,2-Dimethoxy-2-phenylacetophenone) of 3% by weight；Other additives of 2% by weight。
Note that the composition of the ultra-violet curing glue of the present invention is not limited to aforementioned embodiment, it is possible to be any one suitable ultra-violet curing glue existing。The present invention it is critical only that the plating protection glue adopting ultra-violet curing glue as the region need not electroplated on protection workpiece, rather than adopts thermoplasticity of the prior art plating protection glue。
In each embodiment above-mentioned of the present invention, adopt ultra-violet curing glue as the protection glue in the region need not electroplated on protection workpiece。Faster, 3～5s achieves that solidification (existing plating protection glue needs 30s hardening time) to ultra-violet curing adhesive curing speed。Without high temperature in ultra-violet curing adhesive curing process, it is to avoid the oxidation of metal works and deformation (existing plating protection glue needs could solidify under the high temperature of 150 DEG C)。Having cross-linked structure after ultra-violet curing adhesive curing, in electroplate liquid, corrosion resistance is more higher than existing thermoplasticity plating protection glue, while keeping the integrity of mask pattern, will not plating solution be polluted。
In addition; in one embodiment of the invention; combination employs laser stripping gluing method and electrochemistry stripping gluing method, it is possible to remove ultra-violet curing glue rapidly from workpiece, and ultra-violet curing glue can be removed within 15s (the existing plating protection glue time of removing photoresist is at least 30s) completely。
Additionally, in one embodiment of the invention, ultra-violet curing glue, without organic solvent, does not use organic solvent in whole process, decreases environmental pollution (needing to add organic solvent in existing plating protection glue)。
Although describing the present invention in conjunction with accompanying drawing, but the embodiment disclosed in accompanying drawing is intended to embodiments of the present invention illustrative, and it is not intended that a kind of of the present invention is limited。
Although some embodiments of this present general inventive concept are shown and explanation, those skilled in the art will appreciate that, when without departing substantially from the principle of this present general inventive concept and spirit, can these embodiments being made a change, the scope of the present invention limits with claim and their equivalent。
It should be noted that in this article, word " includes " being not excluded for other element or step, and word "a" or "an" is not excluded for multiple。It addition, any element numbers of claim should not be construed as restriction the scope of the present invention。
Claims (16)
1. workpiece is carried out an electric plating method, comprises the following steps:
S110: a kind of ultra-violet curing glue is provided；
S120: described ultra-violet curing glue (200) is coated in and needs in area to be protected on workpiece (100); and the ultra-violet curing glue (200) on workpiece (100) it is coated in ultraviolet radiation; so as to crosslinking curing, thus there is in the upper formation of workpiece (100) the plating protection mask of predetermined pattern；
S130: workpiece (100) is immersed in electroplate liquid, in order to not being coated with on ultra-violet curing glue, needs plating region and electroplating forming one layer of noble metal (500) at workpiece (100)；With
S140: remove the ultra-violet curing glue (200) being electroplate with on the workpiece (100) of one layer of noble metal (500)。
2. method according to claim 1, it is characterised in that described step S140 includes:
S141: with the ultra-violet curing glue (200) on laser (600) heated parts (100), make a part for the ultra-violet curing glue (200) on workpiece (100) be stripped；With
S142: be immersed in lysate by workpiece (100), makes the upper remaining ultra-violet curing glue (200) of workpiece (100) be dissolved into lysate。
3. method according to claim 1 and 2, it is characterised in that: described ultra-violet curing glue (200) is acrylic ester type ultraviolet-curing resin。
4. method according to claim 3, it is characterised in that described ultra-violet curing glue (200) comprises:
The acrylic polymer of 50%～80% by weight；
The reactive diluent of 10%～40% by weight；With
The photoinitiator of 1%～10% by weight。
5. method according to claim 4, it is characterised in that described ultra-violet curing glue (200) comprises:
The polyurethane acrylate prepolymer of 60% by weight；
The isobornyl thiocyanoacetate of 35% by weight；
Dimethoxy-2-the phenyl acetophenone of 3% by weight；With
Other additives of 2% by weight。
6. method according to claim 1 and 2, it is characterised in that:
In described step S120, solidify the time of described ultra-violet curing glue (200) within the scope of 3 seconds to 5 seconds with ultraviolet (300)。
7. method according to claim 2, it is characterised in that:
In described step S140, remove the time of the ultra-violet curing glue (200) being electroplate with on the workpiece (100) of one layer of noble metal (500) less than 15 seconds。
8. method according to claim 1 and 2, it is characterised in that described ultra-violet curing glue (200) does not comprise organic solvent。
9. method according to claim 1 and 2, it is characterised in that
Described ultra-violet curing glue meets following corrosion stability condition: in the electroplate liquid more than 60 DEG C, experience will not be plated corrosion in more than 3 minutes。
10. method according to claim 1 and 2, it is characterised in that:
In described step S120, the technique of spraying, brushing, roller coating or silk screen printing is utilized described ultra-violet curing glue (200) to be coated on described workpiece (100)。
11. method according to claim 1 and 2, it is characterised in that:
In described step S120, form the plating on described workpiece (100) and protect the thickness of mask less than 40 microns。
12. method according to claim 1 and 2, it is characterised in that: described workpiece is circuit substrate, electric contact terminal or electronic chip。
13. a plating protection glue, it is characterised in that: described plating protection glue is made up of ultraviolet-curing resin。
14. plating protection glue according to claim 13, it is characterised in that: described ultraviolet-curing resin is acrylic ester type ultraviolet-curing resin。
15. plating protection glue according to claim 13, it is characterised in that described ultraviolet-curing resin comprises:
The acrylic polymer of 50%～80% by weight；
The reactive diluent of 10%～40% by weight；With
The photoinitiator of 1%～10% by weight。
16. plating protection glue according to claim 15, it is characterised in that described ultraviolet-curing resin comprises:
The polyurethane acrylate prepolymer of 60% by weight；
The isobornyl thiocyanoacetate of 35% by weight；
Dimethoxy-2-the phenyl acetophenone of 3% by weight；With
Other additives of 2% by weight。
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410695541.0A CN105696037A (en) | 2014-11-26 | 2014-11-26 | Electroplating method for workpiece and electroplating protective glue |
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| CN201410695541.0A CN105696037A (en) | 2014-11-26 | 2014-11-26 | Electroplating method for workpiece and electroplating protective glue |
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| CN112593265A (en) * | 2020-11-26 | 2021-04-02 | 中国电子科技集团公司第四十三研究所 | Local electroplating method |
| CN114178153A (en) * | 2021-12-16 | 2022-03-15 | 成都四威高科技产业园有限公司 | Local plating protection method suitable for automatic coating equipment |
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| CN110616053A (en) * | 2018-06-19 | 2019-12-27 | 无锡市祁达胶粘带有限公司 | Electroplating film adhesive formula and preparation method thereof |
| CN112593265A (en) * | 2020-11-26 | 2021-04-02 | 中国电子科技集团公司第四十三研究所 | Local electroplating method |
| CN114178153A (en) * | 2021-12-16 | 2022-03-15 | 成都四威高科技产业园有限公司 | Local plating protection method suitable for automatic coating equipment |
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