CN105101660A - Large-size backboard solder mask manufacturing method - Google Patents
Large-size backboard solder mask manufacturing method Download PDFInfo
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- CN105101660A CN105101660A CN201410196564.7A CN201410196564A CN105101660A CN 105101660 A CN105101660 A CN 105101660A CN 201410196564 A CN201410196564 A CN 201410196564A CN 105101660 A CN105101660 A CN 105101660A
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- large scale
- scale backboard
- backboard
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Abstract
The invention relates to the technical field of large-size backboard solder mask manufacturing and discloses a large-size backboard solder mask manufacturing method. The method comprises the following steps of preprocessing, plate loading, first face spraying, plate rotating, second face spraying, plate unloading, and plate baking. The preprocessing step comprises the following: gong plate processing is performed on the side end of a large-size backboard so as to make a step-shaped antiskid module formed on the side end of the large-size backboard; at least two grooves for positioning clamps in a clamping way are arranged in the step-shaped antiskid module; and the groove depth direction is consistent with the thickness direction of the large-size backboard. The step-shaped antiskid module formed on the side end of the large-size backboard is provided with the grooves for clamps to clamp. Therefore, the large-size backboard can be firmly clamped and positioned. Effective and accurate control on each parameter during spraying processes is guaranteed. Therefore, the quality problem of a large large-size backboard solder mask characterized by nonuniform thickness, great line chromatic aberration and plate edge oil accumulation can be solved.
Description
Technical field
The invention belongs to wiring board manufacturing technology field, particularly relate to a kind of large scale backboard solder-resisting manufacturing methods.
Background technology
When in prior art, production specification is the large scale backboard welding resistance of 660mm*810mm, electrostatic coating method is adopted to make solder mask, because backboard size is larger, backboard is thicker, when normal upper plate does electrostatic spraying, the not clamping edges of boards of fixture, backboard easily slides or drops, location is unstable, and the associated paint such as pressure, speed parameter is wayward in manufacturing process, thus finally cause occurring that backboard resist thickness is uneven, circuit aberration large (circuit occurs rubescent), edges of boards gather wet goods quality problem.
Summary of the invention
The object of the present invention is to provide a kind of large scale backboard solder-resisting manufacturing methods, be intended to solve the quality problem that large scale backboard resist thickness is uneven, circuit aberration is large, edges of boards gather oil of prior art.
Technical scheme of the present invention is: a kind of large scale backboard solder-resisting manufacturing methods, comprises the following steps:
Pre-treatment, namely carries out preliminary treatment to large scale backboard;
Upper plate, the station of described large scale backboard being inserted jet printer carries out clamping by fixture to it;
First surface sprays, and sprays the one side of described large scale backboard;
Flap, by described large scale backboard upset;
Second spraying, sprays the another side of described large scale backboard;
Lower plate, unloads from the station of described jet printer by described large scale backboard;
Baking sheet, namely toasts described large scale backboard;
In described pre-treatment step, include following steps:
Carry out the processing of gong plate at the side of described large scale backboard, to process anti-skid stepped module at the side of described large scale backboard, the outer surface of this anti-skid stepped module is a L shape cascaded surface; The L shape cascaded surface of described anti-skid stepped module is offered at least two grooves for holder location, and the depth direction of described groove is consistent with the thickness direction of described large scale backboard, each described groove is spaced.
Particularly, when carrying out the spraying of described first surface and described second spraying process, the spraying amount of movement of the nozzle in the vertical direction of described jet printer is 550mm.
Particularly, when carrying out the spraying of described first surface and second spraying process, the expulsion pressure of the nozzle of described jet printer is 0.35MPA.
Further, when carrying out the spraying of described first surface and second spraying process, the spraying translational speed of the nozzle of described jet printer is 460mm/s.
Particularly, when carrying out the spraying of described first surface and second spraying process, the translational speed of described fixture is 1.2m/min, to make the described large scale backboard corresponding translational speed producing 1.2m/min in the horizontal direction.
Further, in described baking sheet step, comprise the following steps: first described large scale backboard is put into vacuum oven and toast, after reaching the scheduled time, more described large scale backboard is put into cabinet oven for baking.
Particularly, described large scale backboard puts into described vacuum oven when toasting, and baking time is 20 minutes, and baking temperature is 60 degree, and is segmentation baking, limit dry copy while limit vacuumize.
Particularly, when described cabinet oven for baking put into by described large scale backboard, baking time is 45 minutes, and baking temperature is 75 degree.
Large scale backboard solder-resisting manufacturing methods provided by the invention, it is by arranging anti-skid stepped module at the side of large scale backboard, and the groove arranged in this anti-skid stepped module for holder, thus large scale backboard can be made by firmly clamping position, to guarantee that spray parameters can be controlled efficiently and accurately when carrying out spraying coating process, thus the quality problem that large scale backboard resist thickness is uneven, circuit aberration is large, edges of boards gather oil can be solved.
Accompanying drawing explanation
Fig. 1 is the process chart of the large scale backboard welding resistance manufacture method that the embodiment of the present invention provides;
Fig. 2 is the schematic diagram of the anti-skidding module of the large scale backboard that the embodiment of the present invention provides.
Embodiment
In order to make object of the present invention, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
The invention provides a kind of large scale backboard solder-resisting manufacturing methods, comprise the following steps:
Pre-treatment, namely carries out preliminary treatment to large scale backboard;
Upper plate, the station of described large scale backboard being inserted jet printer carries out clamping with fixture to it, and now, large scale backboard is placed for erectting;
First surface sprays, and sprays the one side of described large scale backboard, during spraying, and described large scale backboard upper feeding in the horizontal direction, the nozzle in the vertical direction feeding of described jet printer;
Flap, by described large scale backboard upset;
Second spraying, sprays the another side of described large scale backboard;
Lower plate, unloads from the station of described jet printer by described large scale backboard;
Baking sheet, namely toasts described large scale backboard;
Wherein, in described pre-treatment step, following steps are included:
As depicted in figs. 1 and 2, carry out the processing of gong plate at the side of large scale backboard 1, to process anti-skid stepped module 11 at the side of described large scale backboard 1, the outer surface of described anti-skid stepped module 11 is a L shape cascaded surface; The L shape cascaded surface of described anti-skid stepped module 11 is offered at least two grooves 111 for holder location, and the depth direction of described groove 111 is consistent with the thickness direction of described large scale backboard 1, so that clamping, each described groove 111 is spaced, like this, when upper plate, when described in holder during large scale backboard 1, the chuck of fixture can just fall in described groove 111, thus when not changing the tooling devices such as fixture, large scale backboard 1 firmly can be located, avoid it slide when spraying coating process or drop.Certainly, groove 111 number is set and setting space can be adjusted accordingly according to fixture.
Large scale backboard welding resistance manufacture craft provided by the invention, it is by arranging anti-skid stepped module 11 at the side of large scale backboard 1, and the groove 111 arranged in this anti-skid stepped module 11 for holder, thus large scale backboard 1 can be made by firmly clamping position, guarantee that each spray parameters can be controlled efficiently and accurately when carrying out spraying coating process, thus the quality problem that large scale backboard 1 resist thickness is uneven, circuit aberration is large, edges of boards gather oil can be solved.
As a better embodiment, be advisable in the long limit that described anti-skid stepped module 11 is located at described large scale backboard 1, and described large scale backboard 1 now can be made to be clamped more firm.
In the present embodiment, when carrying out the spraying of described first surface and second spraying process, the spraying amount of movement of the nozzle in the vertical direction of described jet printer is 550mm, namely the displacement of the nozzle of in the vertical direction jet printer is 550mm, the spraying amount of movement of the nozzle in the vertical direction of jet printer is compared to existing technology generally 870mm, now spray comparatively even, and quantity of ink is moderate.
In the present embodiment, when carrying out the spraying of described first surface and second spraying process, the expulsion pressure of the nozzle of described jet printer is 0.35MPA, and the expulsion pressure of the nozzle of jet printer is compared to existing technology generally 0.3MPA, and now spraying effect is better.
In the present embodiment, when carrying out the spraying of described first surface and second spraying process, the spraying translational speed of the nozzle of described jet printer is 460mm/s, and the spraying translational speed of the nozzle of jet printer is compared to existing technology generally 710mm/s, now coating thickness relatively evenly.
In the present embodiment, when carrying out the spraying of described first surface and second spraying process, the translational speed of described fixture is 1.2m/min, to make the described large scale backboard 1 corresponding translational speed producing 1.2m/min in the horizontal direction, the translational speed of fixture is compared to existing technology generally 2.5m/min, and now spraying effect is better.
Further, in described baking sheet step, comprise the following steps: first described large scale backboard 1 is put into vacuum oven and toast, after reaching the scheduled time, again described large scale backboard 1 is put into common cabinet oven for baking, like this, barometric factor can be avoided to impact large scale backboard 1.
As a better embodiment, described large scale backboard 1 puts into described vacuum oven when toasting, baking time is 20 minutes, baking temperature is 60 degree, and be segmentation baking, while limit baking is copied, limit vacuumizes, like this, can ensure that large scale backboard 1 each several part obtains prebake conditions equably, thus get ready for follow-up continuation baking.
In the present embodiment, after large scale backboard 1 completes prebake conditions in vacuum oven, when described cabinet oven for baking put into by described large scale backboard 1, baking time is 45 minutes, baking temperature is 75 degree, now, can ensure that large scale backboard 1 obtains preferably spraying effect, the problem that simultaneously also there will not be circuit to produce the rubescent and edges of boards of aberration, circuit to gather oil.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, all any amendments done within the spirit and principles in the present invention, equivalent replacement or improvement etc., all should be included within protection scope of the present invention.
Claims (8)
1. a large scale backboard solder-resisting manufacturing methods, comprises the following steps:
Pre-treatment, namely carries out preliminary treatment to large scale backboard;
Upper plate, the station of described large scale backboard being inserted jet printer carries out clamping by fixture to it;
First surface sprays, and sprays the one side of described large scale backboard;
Flap, by described large scale backboard upset;
Second spraying, sprays the another side of described large scale backboard;
Lower plate, unloads from the station of described jet printer by described large scale backboard;
Baking sheet, namely toasts described large scale backboard;
It is characterized in that, in described pre-treatment step, include following steps:
Carry out the processing of gong plate at the side of described large scale backboard, to process anti-skid stepped module at the side of described large scale backboard, the outer surface of this anti-skid stepped module is a L shape cascaded surface; The L shape cascaded surface of described anti-skid stepped module is offered at least two grooves for holder location, and the depth direction of described groove is consistent with the thickness direction of described large scale backboard, each described groove is spaced.
2. large scale backboard solder-resisting manufacturing methods as claimed in claim 1, is characterized in that, when carrying out the spraying of described first surface and described second spraying process, the spraying amount of movement of the nozzle in the vertical direction of described jet printer is 550mm.
3. large scale backboard solder-resisting manufacturing methods as claimed in claim 1, is characterized in that, when carrying out the spraying of described first surface and second spraying process, the expulsion pressure of the nozzle of described jet printer is 0.35MPA.
4. large scale backboard solder-resisting manufacturing methods as claimed in claim 1, is characterized in that, when carrying out the spraying of described first surface and second spraying process, the spraying translational speed of the nozzle of described jet printer is 460mm/s.
5. the large scale backboard solder-resisting manufacturing methods as described in any one of Claims 1-4, it is characterized in that, when carrying out the spraying of described first surface and second spraying process, the translational speed of described fixture is 1.2m/min, to make the described large scale backboard corresponding translational speed producing 1.2m/min in the horizontal direction.
6. large scale backboard solder-resisting manufacturing methods as claimed in claim 1, it is characterized in that, in described baking sheet step, comprise the following steps: first described large scale backboard is put into vacuum oven and toast, after reaching the scheduled time, more described large scale backboard is put into cabinet oven for baking.
7. large scale backboard solder-resisting manufacturing methods as claimed in claim 6, is characterized in that, described large scale backboard puts into described vacuum oven when toasting, baking time is 20 minutes, baking temperature is 60 degree, and is segmentation baking, and while limit baking is copied, limit vacuumizes.
8. large scale backboard solder-resisting manufacturing methods as claimed in claim 6, it is characterized in that, when described cabinet oven for baking put into by described large scale backboard, baking time is 45 minutes, and baking temperature is 75 degree.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410196564.7A CN105101660B (en) | 2014-05-09 | 2014-05-09 | A kind of large scale backboard solder-resisting manufacturing methods |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410196564.7A CN105101660B (en) | 2014-05-09 | 2014-05-09 | A kind of large scale backboard solder-resisting manufacturing methods |
Publications (2)
| Publication Number | Publication Date |
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| CN105101660A true CN105101660A (en) | 2015-11-25 |
| CN105101660B CN105101660B (en) | 2018-05-11 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410196564.7A Expired - Fee Related CN105101660B (en) | 2014-05-09 | 2014-05-09 | A kind of large scale backboard solder-resisting manufacturing methods |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107567203A (en) * | 2017-10-25 | 2018-01-09 | 信利光电股份有限公司 | A kind of method of spray printing anti-solder ink |
| CN109922607A (en) * | 2019-03-19 | 2019-06-21 | 金禄（清远）精密科研投资有限公司 | A kind of low pressure spray welding resistance process for manufacturing circuit board |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006321097A (en) * | 2005-05-18 | 2006-11-30 | Puranikusu:Kk | Metal mask mounting frame |
| JP2008307718A (en) * | 2007-06-12 | 2008-12-25 | Alps Electric Co Ltd | Screen installing structure |
| CN102098878A (en) * | 2009-12-09 | 2011-06-15 | 深南电路有限公司 | Printed circuit board (PCB) spraying fixture |
| CN102625591A (en) * | 2012-03-31 | 2012-08-01 | 深圳崇达多层线路板有限公司 | Method for manufacturing solder mask of unit plate by using electrostatic spray coating machine |
| CN202958052U (en) * | 2012-11-29 | 2013-05-29 | 深圳市迈瑞特电路科技有限公司 | Board falling prevention device for electrostatic spraying |
-
2014
- 2014-05-09 CN CN201410196564.7A patent/CN105101660B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006321097A (en) * | 2005-05-18 | 2006-11-30 | Puranikusu:Kk | Metal mask mounting frame |
| JP2008307718A (en) * | 2007-06-12 | 2008-12-25 | Alps Electric Co Ltd | Screen installing structure |
| CN102098878A (en) * | 2009-12-09 | 2011-06-15 | 深南电路有限公司 | Printed circuit board (PCB) spraying fixture |
| CN102625591A (en) * | 2012-03-31 | 2012-08-01 | 深圳崇达多层线路板有限公司 | Method for manufacturing solder mask of unit plate by using electrostatic spray coating machine |
| CN202958052U (en) * | 2012-11-29 | 2013-05-29 | 深圳市迈瑞特电路科技有限公司 | Board falling prevention device for electrostatic spraying |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107567203A (en) * | 2017-10-25 | 2018-01-09 | 信利光电股份有限公司 | A kind of method of spray printing anti-solder ink |
| CN109922607A (en) * | 2019-03-19 | 2019-06-21 | 金禄（清远）精密科研投资有限公司 | A kind of low pressure spray welding resistance process for manufacturing circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105101660B (en) | 2018-05-11 |
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Granted publication date: 20180511 Termination date: 20200509 |