CN104661448A - Chemical copper deposition method of PCB with small aperture and high aspect ratio - Google Patents
Chemical copper deposition method of PCB with small aperture and high aspect ratio Download PDFInfo
- Publication number
- CN104661448A CN104661448A CN201310608431.1A CN201310608431A CN104661448A CN 104661448 A CN104661448 A CN 104661448A CN 201310608431 A CN201310608431 A CN 201310608431A CN 104661448 A CN104661448 A CN 104661448A
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- pcb board
- washing
- pcb
- heavy copper
- aspect ratio
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/422—Plated through-holes or plated via connections characterised by electroless plating method; pretreatment therefor
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- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemically Coating (AREA)
Abstract
The invention relates to the technical field of chemical copper deposition, and discloses a chemical copper deposition method of a PCB with a small aperture and a high aspect ratio. The chemical copper deposition method is characterized by comprising the following steps: 1) grinding the PCB on a grinding line, and 2) depositing copper on the PCB on a copper deposition line, wherein the PCB is grinded, washed with water and dried with strong wind sequentially in the step 1). By adopting the chemical copper deposition method provided by the invention, after the PCB passes through the grinding line and the copper deposition line and is washed with water on the grinding line in sequence, pores in the PCB can be relatively well washed, the walls of the pores are also completed wetted, and after the later strong wind blowing step, as the temperature of the strong wind is identical to the external temperature and no high temperature is generated, and the walls of the pores can be kept wet without being completed dried; as the walls of the pores are not affected by the surface tension, molten copper can be completely fed into the pores, the whole walls can be completely deposited with copper, the phenomenon of open circuit of the PCB can be avoided, and the quality of the PCB can be ensured.
Description
Technical field
The present invention relates to the technical field of electroless copper plating method, particularly relate to the electroless copper plating method of small-bore high aspect ratio pcb board.
Background technology
The Making programme of multi-layer PCB board is: sawing sheet → inner figure → internal layer etching → pressing → boring → electroless copper plating (comprising de-smear) → electric plating of whole board → outer graphics → graphic plating → skin etching → welding resistance → character → surface treatment → shaping → inspection at end → pack.Acting as of electroless copper plating forms conductive copper layer in hole, allows layer and interlayer mutual conduction, if electroless copper plating is bad, then can causes pcb board " open circuit " and cannot use.
Along with the continuous upgrading of electronic product, the designed lines of pcb board is more and more meticulousr, and form the pcb board of small-bore high aspect ratio, namely aperture is also more and more less, and aspect ratio (thickness of slab: minimum-value aperture) is increasing.
After pcb board boring, first will through nog plate line before entering electroless copper plating line, the step in nog plate line comprises: nog plate → washing → hyperthermia drying.Like this, after pcb board has crossed nog plate line, pcb board inserts in heavy copper basket by heavy copper operative employee, goes out a frame when having completed the pcb board of electroless copper plating in heavy copper cash, then the sub-basket sticking with the pcb board of electroless copper plating is taken off the female basket support of heavy copper, hang up the sub-basket of not heavy copper pcb board.
In prior art, the pcb board of small-bore high aspect ratio is after nog plate line, before entering electroless copper plating line, very dry in hole, cause it in the course of processing of electroless copper plating line, by capillary effect in hole, liquid medicine cannot in entering part aperture, and in causing hole, fail heavy upper copper, finally cause pcb board to occur using open circuit phenomenon.
Summary of the invention
The object of the present invention is to provide the electroless copper plating method of aperture high aspect ratio pcb board, be intended to solve in the electroless copper plating method of pcb board of the prior art, in the hole of the pcb board after nog plate too dry and fail in electroless copper plating line heavy on copper, cause pcb board to occur open circuit phenomenon, cannot use.
The present invention is achieved in that the electroless copper plating method of small-bore high aspect ratio pcb board, comprises the following steps:
1), in nog plate line, nog plate is carried out to described pcb board;
2), in heavy copper cash, heavy copper is carried out to the pcb board after the process of described nog plate line;
In described step 1), sequentially nog plate, washing and high wind are carried out to described pcb board and dry up.
Compared with prior art, in electroless copper plating method provided by the invention, pcb board is sequentially through nog plate line and heavy copper cash, and the water-washing step in nog plate line, can make the hole in pcb board be cleaned preferably, and hole wall also produces moistening completely, again after follow-up high wind dries up step, because the temperature of high wind is identical with ambient temperature, high temperature can not be produced, hole wall can keep good moistening, can not bone dry; Enter after heavy copper cash until pcb board, due to moistening hole wall can not be subject to capillary effect, liquid medicine can directly in fully enter openings, thus makes whole hole wall can sink copper, avoids pcb board to occur open circuit phenomenon, ensures the quality of pcb board.
Accompanying drawing explanation
Fig. 1 is the schematic flow sheet of the electroless copper plating method of the aperture high aspect ratio pcb board that inventive embodiments provides;
Fig. 2 is the work flow schematic diagram of pcb board in nog plate line that the embodiment of the present invention provides;
Fig. 3 is the work flow schematic diagram of pcb board in heavy copper cash that the embodiment of the present invention provides.
Embodiment
In order to make object of the present invention, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
Below in conjunction with specific embodiment, realization of the present invention is described in detail.
As shown in Figures 1 to 3, be a preferred embodiment provided by the invention.
The electroless copper plating method that the present embodiment provides, for carrying out electroless copper plating to the hole in aperture high aspect ratio pcb board, it comprises the following steps:
1), in nog plate line, nog plate is carried out to pcb board;
2), in heavy copper cash, heavy copper is carried out to the hole in pcb board.
In above-mentioned step 1), it sequentially carries out surperficial nog plate, washing and high wind to pcb board and dries up, and like this, high wind dries up later pcb board and then enters in heavy copper cash and carry out electroless copper plating.
In above-mentioned electroless copper plating method, pcb board is before entering heavy copper cash, first through nog plate line, the water-washing step in nog plate line, can make the hole in pcb board be cleaned preferably, and hole wall also produces moistening completely, again after follow-up high wind dries up step, because the temperature of high wind is identical with ambient temperature, high temperature can not be produced, hole wall can keep good moistening, can not bone dry; Enter after heavy copper cash until pcb board, due to hole wall can not be subject to capillary effect, liquid medicine can directly enter in the air completely, thus makes whole hole wall can sink copper, avoids pcb board to occur open circuit phenomenon, ensures the quality of pcb board.
In above-mentioned nog plate line, water-washing step comprise sequentially carry out pressurization washing, ultrasonic wave water washing and high-pressure washing, that is, pcb board is after entering nog plate line, and what it sequentially carried out is operating as: nog plate → pressurization washing → ultrasonic wave water washing → high-pressure washing → high wind dries up.
Certainly, the pressurization washing of above-mentioned water washing operations, ultrasonic wave water washing and high-pressure washing, its order also can change, and only might not be limited to the order in the present embodiment.
In the present embodiment, nog plate line adopts horizontal arrangement, that is, wherein each step is horizontal arrangement, and after pcb board enters nog plate line, the axis in hole is wherein in being arranged vertically, like this, after water washing operations, hole wall can be made completely moistening, and after drying up through high wind, hole wall can keep preferably moistening.
Owing to constantly carrying out heavy copper operation to pcb board in heavy copper cash, therefore, from nog plate line, pcb board out may need to wait for certain hour, and after the pcb board namely waiting in heavy copper cash completes heavy copper, from nog plate line, the pcb board treating heavy copper out just enters in heavy copper cash.In order to make the pcb board after nog plate line before entering heavy copper cash, hole wall can keep moisture state always, and for effectively to prevent pcb board to be oxidized, the pcb board after nog plate line, before entering heavy copper cash, is immersed in sulfuric acid cylinder.
Certainly, above-mentioned sulfuric acid cylinder can be various modes, and in the present embodiment, sulfuric acid cylinder is manual sulfuric acid cylinder, or, also can be automatic sulfuric acid cylinder.
In order to realize the batch processing of pcb board, in the present embodiment, from the pcb board device after the process of nog plate line heavy copper basket, whole heavy copper basket being soaked in sulfuric acid cylinder, thus whole pcb boards are wherein immersed in sulfuric acid cylinder.
When pcb board need to enter in heavy copper cash carry out electroless copper plating time, whole heavy copper basket is placed in heavy copper cash, like this, then heavy copper cash can be made to carry out heavy copper operation to multiple pcb board simultaneously.
Particularly, in heavy copper cash, be provided with heavy copper basket support, like this, will through persulfuric acid cylinder soak and device has the heavy copper basket of pcb board to be placed on heavy copper basket support, directly enter in heavy copper cash and carry out heavy copper operation.
In the present embodiment, as follows to the operating process of pcb board in heavy copper cash: expansion → washing → de-smear → washing → neutralization → washing → oil removing → washing → microetch → washing → preimpregnation → activation → washing → speedization → washing → heavy copper → washing → lower plate.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, all any amendments done within the spirit and principles in the present invention, equivalent replacement and improvement etc., all should be included within protection scope of the present invention.
Claims (7)
1. the electroless copper plating method of small-bore high aspect ratio pcb board, is characterized in that, comprise the following steps:
1), in nog plate line, nog plate is carried out to described pcb board;
2), in heavy copper cash, heavy copper is carried out to the pcb board after the process of described nog plate line;
In described step 1), sequentially nog plate, washing and high wind are carried out to described pcb board and dry up.
2. the electroless copper plating method of small-bore as claimed in claim 1 high aspect ratio pcb board, it is characterized in that, described nog plate line is horizontal arrangement, and described pcb board is in described nog plate line, and the axis in hole is wherein in being arranged vertically.
3. the electroless copper plating method of small-bore as claimed in claim 1 or 2 high aspect ratio pcb board, is characterized in that the pcb board after the process of described nog plate line, before entering described heavy copper cash, is soaked in sulfuric acid cylinder.
4. the electroless copper plating method of small-bore as claimed in claim 3 high aspect ratio pcb board, it is characterized in that, described sulfuric acid cylinder is manual sulfuric acid cylinder.
5. the electroless copper plating method of small-bore as claimed in claim 3 high aspect ratio pcb board, it is characterized in that, adopt the heavy multiple pcb board after the process of described nog plate line of copper basket device, and before described pcb board enters described heavy copper cash, described heavy copper basket is soaked in described sulfuric acid cylinder.
6. the electroless copper plating method of small-bore as claimed in claim 5 high aspect ratio pcb board, it is characterized in that, in described heavy copper cash, there is heavy copper basket support, described heavy copper basket after persulfuric acid cylinder dip is placed on described heavy copper basket support, enters in described heavy copper cash to make multiple described pcb board wherein and carry out heavy copper.
7. the electroless copper plating method of small-bore as claimed in claim 1 or 2 high aspect ratio pcb board, it is characterized in that, described heavy copper cash to the operating process of described pcb board is: expansion → washing → de-smear → washing → neutralization → washing → oil removing → washing → microetch → washing → preimpregnation → activation → washing → speedization → washing → heavy copper → washing → lower plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310608431.1A CN104661448A (en) | 2013-11-25 | 2013-11-25 | Chemical copper deposition method of PCB with small aperture and high aspect ratio |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310608431.1A CN104661448A (en) | 2013-11-25 | 2013-11-25 | Chemical copper deposition method of PCB with small aperture and high aspect ratio |
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| CN104661448A true CN104661448A (en) | 2015-05-27 |
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| CN201310608431.1A Pending CN104661448A (en) | 2013-11-25 | 2013-11-25 | Chemical copper deposition method of PCB with small aperture and high aspect ratio |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106211613A (en) * | 2016-08-05 | 2016-12-07 | 广州美维电子有限公司 | A kind of horizontal removing glue technique producing pcb board |
| CN106413289A (en) * | 2016-11-21 | 2017-02-15 | 奥士康精密电路（惠州）有限公司 | Copper deposition method for preventing occurrence of copper-free hole |
| CN108697008A (en) * | 2018-07-27 | 2018-10-23 | 江西景旺精密电路有限公司 | It is a kind of to prevent electro-plating method of the high aspect ratio PCB aperture without copper |
| CN110831335A (en) * | 2019-11-05 | 2020-02-21 | 东莞市科佳电路有限公司 | Drilling deslagging electroplating process for FPC board |
| CN110856370A (en) * | 2019-12-02 | 2020-02-28 | 上海第二工业大学 | Resistance welding pretreatment method for 5G high-frequency circuit board |
| CN114703518A (en) * | 2021-12-29 | 2022-07-05 | 龙南骏亚电子科技有限公司 | Copper deposition and electroplating integrated system and device |
| CN115003032A (en) * | 2022-06-21 | 2022-09-02 | 东莞市国盈电子有限公司 | Motor drive control circuit board and manufacturing process thereof |
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| US20010053562A1 (en) * | 2000-06-19 | 2001-12-20 | Ngk Spark Plug Co., Ltd. | Process for producing a substrate and plating apparatus |
| CN201908149U (en) * | 2010-12-19 | 2011-07-27 | 惠州中京电子科技股份有限公司 | PCB (printed circuit board) copper plating sub-basket |
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2013
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| US20010053562A1 (en) * | 2000-06-19 | 2001-12-20 | Ngk Spark Plug Co., Ltd. | Process for producing a substrate and plating apparatus |
| CN201908149U (en) * | 2010-12-19 | 2011-07-27 | 惠州中京电子科技股份有限公司 | PCB (printed circuit board) copper plating sub-basket |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106211613A (en) * | 2016-08-05 | 2016-12-07 | 广州美维电子有限公司 | A kind of horizontal removing glue technique producing pcb board |
| CN106413289A (en) * | 2016-11-21 | 2017-02-15 | 奥士康精密电路（惠州）有限公司 | Copper deposition method for preventing occurrence of copper-free hole |
| CN108697008A (en) * | 2018-07-27 | 2018-10-23 | 江西景旺精密电路有限公司 | It is a kind of to prevent electro-plating method of the high aspect ratio PCB aperture without copper |
| CN110831335A (en) * | 2019-11-05 | 2020-02-21 | 东莞市科佳电路有限公司 | Drilling deslagging electroplating process for FPC board |
| CN110856370A (en) * | 2019-12-02 | 2020-02-28 | 上海第二工业大学 | Resistance welding pretreatment method for 5G high-frequency circuit board |
| CN114703518A (en) * | 2021-12-29 | 2022-07-05 | 龙南骏亚电子科技有限公司 | Copper deposition and electroplating integrated system and device |
| CN115003032A (en) * | 2022-06-21 | 2022-09-02 | 东莞市国盈电子有限公司 | Motor drive control circuit board and manufacturing process thereof |
| CN115003032B (en) * | 2022-06-21 | 2023-03-07 | 东莞市国盈电子有限公司 | Motor drive control circuit board and manufacturing process thereof |
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Application publication date: 20150527 |