CN207435578U - A kind of micropore copper plating device of HDI wiring boards - Google Patents
A kind of micropore copper plating device of HDI wiring boards Download PDFInfo
- Publication number
- CN207435578U CN207435578U CN201721489206.0U CN201721489206U CN207435578U CN 207435578 U CN207435578 U CN 207435578U CN 201721489206 U CN201721489206 U CN 201721489206U CN 207435578 U CN207435578 U CN 207435578U
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- CN
- China
- Prior art keywords
- copper plating
- wiring boards
- micropore
- reaction unit
- hdi wiring
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The utility model discloses a kind of micropore copper plating devices of HDI wiring boards, belong to HDI wiring board manufacturing fields, the micropore copper plating device of HDI wiring boards, including two slides, fixation device and reaction unit, two slides are individually fixed on the two sides of the reaction unit, the fixation device is located at the top of the reaction unit, the fixation device is slidably matched with the slide, and microetch slot, pre- immersion trough, activated bath, copper plating groove, tank for washing plate and dry slot have been set gradually in the reaction unit.The micropore copper plating device of HDI wiring boards disclosed in the utility model, pass through two slides, the various functions slot that fixation device clips polylith wiring board to sequentially enter to reaction unit setting goes to carry out the processing copper facing of each process, entire workflow is orderly, high degree of automation, many artificial steps are saved, production efficiency is high, substantially increases the copper-plated quality of wiring board micropore.
Description
Technical field
The utility model is related to HDI wiring board manufacturing fields, and in particular to a kind of, the micropore copper plating device of HDI wiring boards.
Background technology
With the rapid development of electronic technology, electronic product gradually tends to micromation, lighting, highly integrated, semiconductor
The encapsulation of component also tends to more pin fine-pitch, this HDI wiring board for such as requiring to carry semiconductor device accordingly also will
Minimize lightweight and densification.HDI substrates can densification depend on interlayer connection micropore and circuit, and combine electricity
Depending on the performance of sub- product, therefore micro-aperture technique becomes one of key technology of HDI industries.Micropore is included in printed wiring board
Through hole, buried via hole and blind hole etc..Traditional rectilinear direct current electrode position is to install hanger track, making sheet angle of inclination additional in copper plating groove
Hanging plate and fluidic device, to improve copper facing effect, but the device can not still meet HDI and the micro- of wiring board (is interconnected) between high-density layer
Hole plating copper quality requirement.
Utility model content
In order to overcome the defects of the prior art, the technical problem to be solved by the utility model is to propose a kind of HDI
The micropore copper plating device of wiring board.It can quickly and efficiently carry out wiring board the plated hole flow of some row flows, improve line
The copper-plated quality of road plate micropore.
For this purpose, the utility model uses following technical scheme：
The utility model provides a kind of micropore copper plating device of HDI wiring boards, including two slides, fixation device, with
And reaction unit, two slides are individually fixed on the two sides of the reaction unit, the fixation device is located at the reaction
The top of device, the fixation device are slidably matched with the slide, and microetch slot, preimpregnation have been set gradually in the reaction unit
Slot, activated bath, copper plating groove, tank for washing plate and dry slot.
In the utility model preferably technical solution, the fixation device includes multiple supporting rods, crossbeam and holds plate
Two supporting rods of device are arranged in parallel, and fluctuating orbit is provided on the supporting rod, and the both ends of the crossbeam pass through lift rail
Road is slidably matched for two respectively with the supporting rod, the lower section held plate device and be fixed on the crossbeam.
In the utility model preferably technical solution, the lower section for holding plate device is equipped with multiple clamping opening.
In the utility model preferably technical solution, included in the microetch slot filled with micro-corrosion liquid, the micro-corrosion liquid
There is copper ion.
In the utility model preferably technical solution, the pre- immersion trough madial wall is equipped with erosion shield, described pre-
Acid reaction solution is filled in immersion trough.
In the utility model preferably technical solution, the bottom of the activated bath sets having heaters, the activated bath
Outer wall be equipped with insulating layer.
In the utility model preferably technical solution, anticorrosive plate is configured on the madial wall of the copper plating groove, it is described
Anticorrosive plate is made of one kind in polyvinyl chloride, stereotype, titanium plate and ceramics.
In the utility model preferably technical solution, multiple cleaning sprayers are configured on the madial wall of the tank for washing plate.
In the utility model preferably technical solution, electric calorifier is provided on the madial wall of the dry slot.
The beneficial effects of the utility model are：
The micropore copper plating device of HDI wiring boards provided by the utility model, by two slides, fixation device clips polylith
Wiring board sequentially enters the processing copper facing that the various functions slot set to reaction unit goes to carry out each process, entire workflow
Cheng Youxu, high degree of automation save many artificial steps, and production efficiency is high, and it is copper-plated to substantially increase wiring board micropore
Quality.
Description of the drawings
Fig. 1 is that the plan structure of the micropore copper plating device for the HDI wiring boards that specific embodiment of the present invention provides is shown
It is intended to；
Fig. 2 is that the facing structure of the micropore copper plating device for the HDI wiring boards that specific embodiment of the present invention provides is shown
It is intended to.
In figure：
1st, slide, 2, fixation device, 3, reaction unit, 21, supporting rod, 22, crossbeam, 23, hold plate device, 24, fluctuating orbit,
25th, clamping opening, 31, microetch slot, 32, pre- immersion trough, 33, activated bath, 34, copper plating groove, 35, tank for washing plate, 36, dry slot, 41, anticorrosion
Coating, 42, heater, 43, insulating layer, 44, anticorrosive plate, 45, cleaning sprayer, 46, electric calorifier.
Specific embodiment
Further illustrate the technical solution of the utility model below with reference to the accompanying drawings and specific embodiments.
As shown in Figure 1, a kind of micropore copper plating device of HDI wiring boards is provided in embodiment, including two slides 1, folder
Panel assembly 2 and reaction unit 3, two slides 1 are individually fixed on the two sides of reaction unit 3, and fixation device 2 is located at anti-
The top of device 3 is answered, fixation device 2 is slidably matched with slide 1, and microetch slot 31, pre- immersion trough have been set gradually in reaction unit 3
32nd, activated bath 33, copper plating groove 34, tank for washing plate 35 and dry slot 36.Fixation device 2 is by being arranged on 3 both sides of reaction unit
Slide 1 can hold wiring board to be processed, easily be moved in the top of reaction unit 3, and by setting gradually
Microetch slot 31, pre- immersion trough 32, activated bath 33, copper plating groove 34, tank for washing plate 35 and dry slot 36 carry out wiring board micro- successively
Erosion, preimpregnation, activation, copper facing, washing, these dry processes, entire production process is continuously uninterrupted, can be continuously right
Wiring board carries out micropore copper facing so that production effective.
In order to enable wiring board enters reaction unit 3 in successfully this year, further, as shown in Fig. 2, fixation device 2 is wrapped
It containing multiple supporting rods 21, crossbeam 22 and holds 23 two supporting rods 21 of plate device and is arranged in parallel, lift rail is provided on supporting rod 21
Road 24, the both ends of crossbeam 22 are slidably matched for two respectively with supporting rod 21 by fluctuating orbit 24, hold plate device 23 and be fixed on crossbeam
22 lower section.Fluctuating orbit 24 on supporting rod 21 allows crossbeam 22 to be moved up and down on supporting rod 21, and crossbeam 22 is again
Cooperation holds plate device 23 together, can be put into wiring board in each reactive tank of reaction unit 3 and go to carry out each process.
In order to enable fixation device 2 can clamp polylith wiring board, further, the lower section of plate device 23 is held equipped with multiple
Clamping opening 25 by clamping opening 25, can clamp wiring board, and multiple clamping opening 25 of setting can disposably clamp polylith wiring board,
It will together be processed by plurality of plates, greatly increase the work efficiency of equipment.
In order to carry out microetch to wiring board in advance, further, include in microetch slot 31 filled with micro-corrosion liquid, micro-corrosion liquid
Copper ion.Micro-corrosion liquid containing copper ion can carry out etching operation to wiring board in advance.
In order to be presoaked to wiring board, further, pre- 32 madial wall of immersion trough is equipped with erosion shield 41, pre- immersion trough
Acid reaction solution is filled in 32.
In order to ensure the characteristic of activated liquid, further, the bottom of activated bath 33 sets having heaters 42, activated bath 33
Outer wall be equipped with insulating layer 43.It, can be by the activating solution in activated bath 33 by the cooperation of heater 42 and insulating layer 43
It is maintained at specific temperature, it is preferable that when carrying out activation act, optimum temperature is 60 DEG C, therefore heater 42 determines temperature
At 60 DEG C or so.
In order to enable copper plating groove 34 is more durable, further, anticorrosive plate is configured on the madial wall of copper plating groove 34
44, anticorrosive plate 44 is made of one kind in polyvinyl chloride, stereotype, titanium plate and ceramics.It is made of these corrosion-resistant materials
Slot, can be whole more solid durable against the erosion of copper plating bath.
In order to wash away the various reaction solutions on wiring board, further, it is configured on the madial wall of tank for washing plate 35 multiple clear
Nozzle 45 is washed, cleaning sprayer 45 can remove and left in previous process to being rinsed into the wiring board in tank for washing plate 35
Various reaction liquids onboard.
In order to be dried to wiring board, further, electric calorifier 46 is provided on the madial wall of dry slot 36, is passed through
Electric calorifier 46 thinks that wiring board brushes the distinguished and admirable of low-grade fever, accelerates the drying of wiring board, facilitates in subsequent step, can be quickly line
Road plate installs various circuits.
The utility model is described with reference to the preferred embodiments, and those skilled in the art know, is not departing from this reality
In the case of with new spirit and scope, various changes or equivalence replacement can be carried out to these features and embodiment.This reality
It is not limited to the particular embodiment disclosed with new, other embodiments fallen into claims hereof all belong to
In the scope of the utility model protection.
Claims (9)
1. a kind of micropore copper plating device of HDI wiring boards, it is characterised in that：Including two slides (1), fixation device (2) and
Reaction unit (3), two slides (1) are individually fixed on the two sides of the reaction unit (3)；Fixation device (2) position
In the top of the reaction unit (3)；The fixation device (2) is slidably matched with the slide (1)；
Microetch slot (31), pre- immersion trough (32) have been set gradually in the reaction unit (3), activated bath (33), copper plating groove (34), has been washed
Board slot (35) and dry slot (36).
2. the micropore copper plating device of HDI wiring boards according to claim 1, it is characterised in that：
The fixation device (2) includes multiple supporting rods (21), crossbeam (22) and holds plate device (23)；
Two supporting rods (21) are arranged in parallel；
Fluctuating orbit (24) is provided on the supporting rod (21)；
The both ends of the crossbeam (22) are slidably matched for two by fluctuating orbit (24) with the supporting rod (21) respectively；
The lower section held plate device (23) and be fixed on the crossbeam (22).
3. the micropore copper plating device of HDI wiring boards according to claim 2, it is characterised in that：
The lower section for holding plate device (23) is equipped with multiple clamping opening (25).
4. the micropore copper plating device of HDI wiring boards according to claim 1, it is characterised in that：
Micro-corrosion liquid is filled in the microetch slot (31)；
The micro-corrosion liquid includes copper ion.
5. the micropore copper plating device of HDI wiring boards according to claim 1, it is characterised in that：
Pre- immersion trough (32) madial wall is equipped with erosion shield (41)；
Acid reaction solution is filled in the pre- immersion trough (32).
6. the micropore copper plating device of HDI wiring boards according to claim 1, it is characterised in that：
The bottom of the activated bath (33) sets having heaters (42)；
The outer wall of the activated bath (33) is equipped with insulating layer (43).
7. the micropore copper plating device of HDI wiring boards according to claim 1, it is characterised in that：
Anticorrosive plate (44) is configured on the madial wall of the copper plating groove (34)；
The anticorrosive plate (44) is made of one kind in polyvinyl chloride, stereotype, titanium plate and ceramics.
8. the micropore copper plating device of HDI wiring boards according to claim 1, it is characterised in that：
Multiple cleaning sprayers (45) are configured on the madial wall of the tank for washing plate (35).
9. the micropore copper plating device of HDI wiring boards according to claim 1, it is characterised in that：
Electric calorifier (46) is provided on the madial wall of the dry slot (36).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721489206.0U CN207435578U (en) | 2017-11-09 | 2017-11-09 | A kind of micropore copper plating device of HDI wiring boards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721489206.0U CN207435578U (en) | 2017-11-09 | 2017-11-09 | A kind of micropore copper plating device of HDI wiring boards |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207435578U true CN207435578U (en) | 2018-06-01 |
Family
ID=62288303
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721489206.0U Expired - Fee Related CN207435578U (en) | 2017-11-09 | 2017-11-09 | A kind of micropore copper plating device of HDI wiring boards |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207435578U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112410766A (en) * | 2020-10-29 | 2021-02-26 | 太仓市广聚德科技有限公司 | PTH chemical copper deposition automatic equipment line and production process thereof |
| CN114599156A (en) * | 2021-09-01 | 2022-06-07 | 常州澳弘电子股份有限公司 | Surface treatment process of HDI board based on chemical nickel-gold plating coating |
-
2017
- 2017-11-09 CN CN201721489206.0U patent/CN207435578U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112410766A (en) * | 2020-10-29 | 2021-02-26 | 太仓市广聚德科技有限公司 | PTH chemical copper deposition automatic equipment line and production process thereof |
| CN114599156A (en) * | 2021-09-01 | 2022-06-07 | 常州澳弘电子股份有限公司 | Surface treatment process of HDI board based on chemical nickel-gold plating coating |
| CN114599156B (en) * | 2021-09-01 | 2023-07-21 | 常州澳弘电子股份有限公司 | Surface treatment process of HDI board based on electroless nickel gold coating |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180601 Termination date: 20181109 |