CN210711793U

CN210711793U - PCB circuit board electroplating device

Info

Publication number: CN210711793U
Application number: CN201921321421.9U
Authority: CN
Inventors: 石林江
Original assignee: Huizhou Linghangda Technology Co ltd
Current assignee: Huizhou Linghangda Technology Co ltd
Priority date: 2019-08-15
Filing date: 2019-08-15
Publication date: 2020-06-09
Anticipated expiration: 2029-08-15

Abstract

The utility model discloses a PCB circuit board electroplating device, which comprises a frame, wherein the bottom of the frame is provided with two groups of electroplating baths with U-shaped cross sections, and the top of the frame is provided with a sliding rack for driving a hanging tool to move back and forth; the electroplating bath is internally provided with a detachable anode plate, two rows of circuit boards extending into the electroplating bath are hung on a hanger, the hanger is arranged on a sliding rack, and the sliding rack comprises two groups of transverse casters moving on the inner wall of a rack, two groups of vertical casters moving at the bottom of the rack and an air cylinder connected with the hanger; the utility model aims at providing a PCB circuit board electroplating device aims at the stability of lifting line board at the removal in-process, avoids circuit board and anode plate to bump, realizes adding fast the change to the anode plate simultaneously.

Description

PCB circuit board electroplating device

Technical Field

The utility model belongs to the technical field of the PCB circuit board processing technique and specifically relates to a PCB circuit board electroplating device is related to.

Background

The PCB circuit board is also called as a printed circuit board, is a provider for electrical connection of electronic components, and has the main advantages of greatly reducing errors of wiring and assembly and improving the automation level and the production labor rate; in the production and processing process of the PCB, the PCB needs to be subjected to surface treatment processes, such as pickling, full-board copper electroplating, pattern transfer, acid degreasing, secondary countercurrent rinsing, micro-etching, secondary pickling, tin plating, secondary countercurrent rinsing, gold acid, pattern copper electroplating, secondary countercurrent rinsing, nickel plating, secondary washing, citric acid leaching, gold plating, recovery, 2-3 grade pure washing, drying and the like, and for the PCB, the electroplating quality directly influences the quality of the PCB.

Among the prior art, the PCB board suspends in midair on the hanger usually, is moved in the plating bath by hanger pulling PCB board to carry out even electroplating, nevertheless remove the in-process, traditional equipment that drags makes the circuit board produce easily and rocks, and then causes and electroplate inhomogeneously, influences follow-up result of use, and the anode plate is the consumer simultaneously, and every period, need regularly change, but traditional anode plate setting is in the plating bath, when wanting to change, need open the plating bath, complex operation.

SUMMERY OF THE UTILITY MODEL

The utility model aims at above problem, provide a PCB circuit board electroplating device, aim at the stability of lifting line board at the removal in-process, avoid circuit board and anode plate to bump, realize adding fast the change to the anode plate simultaneously.

In order to realize the purpose, the utility model adopts the technical proposal that the device comprises a frame, the bottom of the frame is provided with two groups of plating baths with U-shaped cross sections, and the top of the frame is provided with a sliding rack for driving the rack to move back and forth; the electroplating bath is internally provided with a detachable anode plate, two rows of circuit boards extending into the electroplating bath are hung on a hanger, the hanger is arranged on a sliding rack, and the sliding rack comprises two groups of transverse trundles moving on the inner wall of a rack, two groups of vertical trundles moving at the bottom of the rack and a cylinder connected with the hanger.

Furthermore, the device also comprises a heating assembly arranged in the middle of the two U-shaped electroplating baths.

Furthermore, a plurality of groups of spray pipes are arranged in the electroplating bath at intervals, and the spray pipes are provided with nozzles.

Furthermore, the heating assembly is arranged in the closed space and forms a circuitous structure with the sections of the two electroplating baths.

Compared with the prior art, the utility model, the beneficial effects are that:

1. the two-way caster wheel slides along the rack, so that the stability of the anode plate during movement is improved, and the left-right shaking is reduced.

2. The anode plate can be rapidly detached and added, and the efficiency is improved.

3. The heating assembly is arranged in the middle of the two U-shaped structures, the two electroplating baths are heated by one heating assembly, the temperature consistency in the two electroplating baths is ensured, and the toughness and the thickness of the plating layers of the two rows of circuit boards are ensured to be consistent.

4. Other advantages of the present invention will be further explained in the detailed description of the invention.

Drawings

Fig. 1 is a schematic structural diagram of the present invention.

Fig. 2 is a schematic structural view of the sliding stage in fig. 1.

The text labels in the figures are represented as: 1. a frame; 2. an electroplating bath; 3. an anode plate; 4. a hanger; 5. a sliding rack; 6. a circuit board; 7. a radio guide station; 8. a heating assembly; 9. a nozzle; 51. a lateral caster; 52. a vertical caster; 53. a cylinder; 91. and (4) a nozzle.

Detailed Description

In order to make the technical solution of the present invention better understood, the present invention is described in detail below with reference to the accompanying drawings, and the description of the present invention is only exemplary and explanatory, and should not be construed as limiting the scope of the present invention.

Fig. 1 is a schematic view showing an internal structure of an electroplating apparatus according to the present invention;

the utility model discloses a PCB circuit board electroplating device, which comprises a frame 1, wherein the bottom of the frame 1 is provided with two groups of electroplating baths 2 with U-shaped cross sections, and the top of the frame is provided with a sliding rack 5 for driving a hanger 4 to move back and forth; the electroplating bath 2 is internally provided with a detachable anode plate 3, the anode plate 3 is fixed on an external conductive table 7, two rows of circuit boards 6 extending into the electroplating bath 2 are hung on a hanger 4, the hanger 4 is arranged on a sliding rack 5, and the sliding rack 5 comprises two groups of transverse casters 51 moving on the inner wall of the rack 1, two groups of vertical casters 52 moving at the bottom of the rack 1 and a cylinder 53 connected with the hanger 4.

Specifically, the moving process of the driving circuit board 6, please refer to fig. 2, the belt is driven by a motor (not shown), so that the sliding rack 5 is driven by the driving belt to move, because the sliding rack 5 has the horizontal casters 51 facing to both sides, so that in the moving process, the casters always contact with the side wall of the rack 1 and move on the side wall of the rack 1, the phenomenon of left-right shaking is prevented, meanwhile, the sliding rack 5 also has the vertical casters 52 facing downwards, the sliding rack 5 is supported, and the stability is improved by the arrangement of the casters in both directions.

As above-mentioned technical scheme's preferred, temperature regulation apparatus's setting changes the setting from plating bath 2 inside to in plating bath 2 outsides, and is concrete, the utility model discloses a heating element 8 installs in the airtight space at 2 middle parts of two "U" type plating baths, forms circuitous structure with 2 cross-sections of two plating baths, realizes heating two plating baths 2 simultaneously, is favorable to maintaining and installing this heating element 8 moreover.

Preferably, a plurality of groups of spray pipes 9 are arranged in the electroplating bath 2 at intervals, and the spray pipes 9 are provided with nozzles 91, so that the flow of electroplating solution is accelerated, and the electroplating efficiency is improved.

It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

The principles and embodiments of the present invention have been explained herein using specific examples, which are presented only to assist in understanding the methods and their core concepts. The foregoing is only a preferred embodiment of the present invention, and it should be noted that there are objectively infinite specific structures due to the limited character expressions, and it will be apparent to those skilled in the art that a plurality of modifications, decorations or changes can be made without departing from the principle of the present invention, and the above technical features can be combined in a proper manner; the application of these modifications, variations or combinations, or the application of the concepts and solutions of the present invention in other contexts without modification, is not intended to be considered as a limitation of the present invention.

Claims

1. The PCB electroplating equipment is characterized by comprising a rack (1), wherein two groups of electroplating baths (2) with U-shaped sections are arranged at the bottom of the rack (1), and a sliding rack (5) for driving a hanger (4) to move back and forth is arranged at the top of the rack (1); the electroplating bath is characterized in that a detachable anode plate (3) is installed in the electroplating bath (2), two rows of circuit boards (6) extending into the electroplating bath (2) are hung on a hanger (4), the hanger (4) is arranged on a sliding rack (5), and the sliding rack (5) comprises two groups of transverse casters (51) moving on the inner wall of a rack (1), two groups of vertical casters (52) moving at the bottom of the rack (1) and a cylinder (53) connected with the hanger (4).

2. The PCB electroplating equipment according to claim 1, characterized in that it further comprises a heating component (8) arranged in the middle of the two "U" -shaped electroplating baths (2).

3. The PCB electroplating equipment according to claim 1, wherein a plurality of groups of spray pipes (9) are arranged in the electroplating bath (2) at intervals, and nozzles (91) are arranged on the spray pipes (9).

4. The PCB electroplating equipment according to claim 2, wherein the heating component (8) is arranged in the closed space and forms a circuitous structure with the cross section of the two electroplating baths (2).