CN105297119A - Electroplating production line - Google Patents
Electroplating production line Download PDFInfo
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- CN105297119A CN105297119A CN201510852901.8A CN201510852901A CN105297119A CN 105297119 A CN105297119 A CN 105297119A CN 201510852901 A CN201510852901 A CN 201510852901A CN 105297119 A CN105297119 A CN 105297119A
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- electroplating
- air inlet
- plating tank
- plating
- assembly line
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Abstract
The invention belongs to the technical field of PCB manufacturing, and particularly discloses an electroplating production line. The electroplating production line is used for solving the problems of environment pollution and potential safety hazards of an existing electroplating tank. The electroplating production line comprises an electroplating tank used for containing electroplating liquid, a first washing groove, a nitric acid groove and a second washing groove; the electroplating groove is provided with a generator which comprises a heating barrel used for containing ammonium bicarbonate and a filtering barrel for containing water, the heating barrel is communicated with the filtering barrel through a pipe, the filtering barrel is provided with an air inlet pipe, the upper end of the air inlet pipe is communicated with the pipe, and an outlet in the lower end of the air inlet pipe is lower than the height of the water face; and a liquid outlet is formed in the bottom end of the filtering barrel, an air outlet is formed in the upper section of the filtering barrel and communicated with an air pump through a pipe, an air inlet hole is formed in the electroplating tank, the arrangement position of the air inlet hole is higher than the electroplating liquid face in the electroplating groove, and an outlet of the air pump is communicated with the air inlet hole through a pipe.
Description
Technical field
The invention belongs to pcb board preparing technical field, specifically disclose a kind of electroplating assembly line.
Background technology
Pcb board, also known as printed circuit board (PCB), is the supplier of electronic devices and components electrical connection.Its development has the history of more than 100 year; Its design mainly layout design; Adopt the major advantage of circuit card to be the mistake greatly reducing wiring and assembling, improve the gentle productive labor rate of Automated water.
In the process making pcb board, electroplate the operation that is absolutely necessary, increase hole copper and face copper thickness by galvanizing process, improve erosion resistance and the electroconductibility of pcb board.Technical literature about plating in prior art is also more, such as application number be 201020508381.1 utility model disclose a kind of PCB plating line of improvement, comprise PCB copper facing/erosion copper controller, hanger, copper plating groove, washing bath, nitric acid groove, chuck on hanger clamps PCB, PCB copper facing/erosion copper controller controls overhead traveling crane and drives hanger to run, after described nitric acid groove, before washing bath, establish drip trays, be used for collecting the liquid taken out of from nitric acid groove, in described PCB copper facing/erosion copper controller, corresponding sequence of control is set, controls the dropping liquid time of hanger on drip trays; Drip trays is provided with liquid level detection device, and described liquid level detection device is connected with described PCB copper facing/erosion copper controller.
Application number be 201220399046.1 utility model patent disclose a kind of PCB plating line, it comprises the copper plating groove be arranged in order, first washing bath, nitric acid groove, second washing bath, described copper plating groove, first washing bath, nitric acid groove, the top of the second washing bath is provided with connecting rod, described connecting rod is provided with hanger, hanger is provided with chuck, accompany plating bar, described chuck is provided with PCB, described hanger can move along described connecting rod, described connecting rod is provided with the sequence controller controlling hanger movement, described PCB plating line also comprises drip, described drip is arranged between nitric acid groove and the second washing bath, described drip is also provided with blowing device, two relative sidewalls of described drip offer through hole respectively, and the quantity of described blowing device is two, and described two blowing devices are separately positioned in two through holes, described blowing device is fan.
Application number be 201320598639.5 utility model patent disclose a kind of PCB electroplanting device, comprise plating solution cylinder and be arranged at least one anode of plating solution cylinder two relative edge inner face; The inner side of described anode is equipped with insulation barrier parallel with it; Described insulation barrier Lower Half is provided with via-hole array; Described insulation barrier upper end is higher than the highest plating solution position of plating solution cylinder; In described via-hole array, the spacing of each through hole is 5cm; In described via-hole array, the aperture of through hole is 1-2cm; Described insulation barrier is removably formed by connecting side by side by several piece insulation daughter board.
Application number be 201420028158.5 utility model patent disclose a kind of full-automatic PCB uniformly-coating device, include electroplating cell body, electroplating cell body forms opening up plating tank, electroplating cell body include just to and parallel interval arrange left plating cell wall and right plating cell wall, right plating cell wall is positioned at the right-hand member side of left plating cell wall, the interior side of left plating cell wall is equiped with left anode conducting busbar in plating tank, the interior side of right plating cell wall is equiped with right anode conducting busbar in plating tank, left anode conducting busbar) mount left titanium basket, right anode conducting busbar has mounted right titanium basket, be equiped with the vertical left conduct current plate extended in the right-hand member side of left titanium basket in plating tank, the vertical right conduct current plate extended is equiped with in the left end side of right titanium basket in plating tank, left conduct current plate and right conduct current plate just to and parallel interval arrange, the left and right transverse horizontal that left conduct current plate and right conduct current plate offers respectively runs through and the conduct current hole arranged in uniform intervals completely, the bottom of plating tank can be equiped with the left anode baffle vertically extended between left conduct current plate with left titanium basket up and downly relatively, the bottom of plating tank can be equiped with the right anode baffle vertically extended between right conduct current plate with right titanium basket up and downly relatively, the upper end of left plating cell wall and the upper end of right plating cell wall are equiped with baffle plate hoisting mechanism respectively, each baffle plate hoisting mechanism drives with the left anode baffle of corresponding side and right anode baffle respectively and is connected, each described baffle plate hoisting mechanism includes elevator motor and the elevator rotating shaft of described left plating cell wall and the described right plating cell wall upper end being installed in corresponding side, the power output shaft of each elevator motor is provided with worm screw respectively, the corresponding worm screw in end of each elevator rotating shaft is equiped with turbine respectively, turbine coordinates with corresponding worm screw, is provided with winch rope respectively between the described left anode baffle of each elevator rotating shaft and corresponding side and described right anode baffle.
As the above-mentioned existing electroplanting device told about, in order to enhance productivity, plating is carried out continuously, therefore plating tank upper end is needed to open wide, but there is various chemical substance due to electroplate liquid, in electroplating process, chemical substance can evaporate, not only contaminate environment and bring serious impact to the health of operator.
Summary of the invention
The present invention in order to solve existing plating tank exist electroplate liquid evaporate contaminate environment and operator brought to the problem of potential safety hazard, and a kind of electroplating assembly line is provided, the volatilization of electrolytic solution can be reduced, reduce the pollution to environment, and ensure that staff's is healthy.
For solving the problems of the technologies described above, the technical solution adopted in the present invention is:
A kind of electroplating assembly line, comprise the plating tank for placing electroplate liquid setting gradually and be set up in parallel, first washing bath, nitric acid groove and the second washing bath, described plating tank, first washing bath, the top of nitric acid groove and the second washing bath is provided with connecting rod, described connecting rod is provided with hanger, described hanger is provided with and accompanies plating bar and the chuck for clamping pcb board, it is characterized in that, described plating tank is equipped with producer, described producer comprises for the thermotank of splendid attire bicarbonate of ammonia and the filter vat for splendid attire water, described thermotank is communicated with filter vat through pipeline, described filter vat is provided with inlet pipe, the upper end of described inlet pipe and pipeline communication, the outlet position, lower end of described inlet pipe is lower than the height of the water surface, the bottom of described filter vat offers liquid outlet, the epimere of described filter vat offers air outlet, there is air pump described air outlet through pipeline communication, described plating tank offers air inlet port, described air inlet port offer position higher than the plating liquid level in plating tank, described gas pump outlet is communicated with air inlet port through pipeline, described thermotank comprises shell and inner casing, the outer wall that described casing is located at inner casing forms the vapor chamber of vacuum, the inwall of described vapor chamber is equipped with wick, in described vapor chamber, is filled with working liquid, the outer wall of described shell is coated with electrical heating wire layer.
The outer wall of described electrical heating wire layer is coated with insulated thermal insulating layer, and described insulated thermal insulating layer adopts ceramic fiber paper to make.
Described shell and inner casing are made up of stainless steel, and described working liquid is water; Described wick is copperly roll silk screen wick.
The upper end of described filter vat is equipped with the fluid inlet for adding water, and described fluid inlet is equipped with sealing cover.
Described air inlet port offers the surrounding at plating tank uniformly.
Described air inlet port is provided with nozzle, being arranged on plating tank of described nozzle inclination.
Downward being arranged on plating tank of described nozzle inclination.
Be provided with receiving tank between described nitric acid groove and the second washing bath, described receiving tank is equipped with gas blower.
Two sidewalls of described receiving tank offer through hole respectively, and the quantity of described gas blower is 2, and described gas blower is arranged in through hole.
Compared with prior art, the present invention has following beneficial effect:
Electroplating assembly line of the present invention, by arranging producer on plating tank, in the process used, thermotank heating makes bicarbonate of ammonia volatilize, a large amount of titanium dioxide covers and ammonia is produced after bicarbonate of ammonia volatilization, by the filteration of water, ammonia is molten is easy to water, by ammonia and carbon dioxide separation, by the effect of air pump, carbonic acid gas is inputed in plating tank, make to form carbon dioxide sequestration layer at the upper surface of electroplate liquid, thus reduce the volatilization of electroplate liquid, reduce the pollution to environment, decrease the impact on staff's health simultaneously.The carbon dioxide sequestration layer that the present invention is formed, can ensure the normal and continuous operation of electroplating activity.
Thermotank of the present invention has homogeneous heating, the feature that heating efficiency is high.
Meanwhile, the present invention, by arranging receiving tank, for collecting nitric acid, reduces the nitric acid amount in the second washing bath, saving water resource and nitric acid resource.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention;
Fig. 2 is the structural representation of thermotank of the present invention;
Mark in figure: 1, plating tank, 2, thermotank, 3, filter vat, 4, inlet pipe, 5, air pump, 6, pipeline, 7, sealing cover, 8, air inlet port, the 9, first washing bath, 10, nitric acid groove, 11, receiving tank, the 12, second washing bath, 13, connecting rod, 14, chuck, 15, hanger, 16, plating bar is accompanied, 17, gas blower.
Embodiment
Below in conjunction with embodiment, the invention will be further described, and described embodiment is only the present invention's part embodiment, is not whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making other embodiments used obtained under creative work prerequisite, belongs to protection scope of the present invention.
By reference to the accompanying drawings, electroplating assembly line of the present invention, comprise the plating tank 1 for placing electroplate liquid setting gradually and be set up in parallel, first washing bath 9, nitric acid groove 10 and the second washing bath 12, described plating tank 1, first washing bath 9, the top of nitric acid groove 10 and the second washing bath 12 is provided with connecting rod 13, described connecting rod 13 is provided with hanger 15, described hanger 15 is provided with and accompanies plating bar 16 and the chuck 14 for clamping pcb board, wherein, hanger 15 can slide on connecting rod 13, connecting rod 13 is equipped with the control device for controlling hanger 15 movement, control device belongs to prior art products, those skilled in the art understands and understands, do not repeat them here.Described plating tank 1 is equipped with producer, described producer comprises the thermotank 2 for splendid attire bicarbonate of ammonia and the filter vat 3 for splendid attire water, described thermotank 2 is communicated with filter vat 3 through pipeline, described filter vat 3 is provided with inlet pipe 4, the upper end of described inlet pipe 4 and pipeline communication, the outlet position, lower end of described inlet pipe 4 is lower than the height of the water surface, the bottom of described filter vat 3 offers liquid outlet, the epimere of described filter vat 3 offers air outlet, described air outlet is communicated with air pump 5 through pipeline 6, described plating tank 1 offers air inlet port 8, described air inlet port 8 offer position higher than the plating liquid level in plating tank 1, the outlet of described air pump 5 is communicated with air inlet port 8 through pipeline 6, described thermotank 2 comprises shell 22 and inner casing 21, the outer wall that described shell 22 is set in inner casing 21 forms the vapor chamber 23 of vacuum, the inwall of described vapor chamber 23 is equipped with wick 24, be filled with working liquid in described vapor chamber 23, the outer wall of described shell 22 is coated with electrical heating wire layer 25.Working process of the present invention is, thermotank heating makes the bicarbonate of ammonia decomposes in thermotank, and produce a large amount of carbonic acid gas and ammonia, soluble in water according to ammonia, carbonic acid gas does not allow the characteristic in the Yishui River; By the filteration of water, carbonic acid gas is separated with water.Carbonic acid gas enters into plating tank by air pump and pipeline, makes to form carbon dioxide sequestration layer at the upper surface of electroplate liquid, thus reduces the volatilization of electroplate liquid, reduces the pollution to environment, decreases the impact on staff's health simultaneously.The carbon dioxide sequestration layer that the present invention is formed, can ensure the normal and continuous operation of electroplating activity.Thermotank of the present invention has homogeneous heating, the feature that heating efficiency is high.
In order to reduce scattering and disappearing of heat energy, improve the utilization ratio of heat energy, the outer wall of electrical heating wire layer 25 of the present invention is coated with insulated thermal insulating layer 26, and preferably, described insulated thermal insulating layer 26 adopts ceramic fiber paper to make.
Shell 22 of the present invention and inner casing 21 are made up of stainless steel, and described working liquid is water; Described wick 24 rolls silk screen wick for copper.
For the ease of continuous firing, the upper end of filter vat 3 of the present invention is equipped with the fluid inlet for adding water, and described fluid inlet is equipped with sealing cover 7, by arranging fluid inlet and liquid outlet, be convenient to carry out Circulation to water, prevent at ammonia saturated, ensure filteration of the present invention.
As a kind of preferred mode of the present invention, described air inlet port 8 offers the surrounding at plating tank 1 uniformly, be convenient to form carbon dioxide sequestration layer, because the density ratio air of carbonic acid gas is large, therefore, carbon dioxide layer floats over the upper surface of electroplate liquid and not easily distributes, and can not affect carrying out continuously of plating simultaneously.
In order to improve practicality of the present invention, air inlet port 8 of the present invention is provided with nozzle, being arranged on plating tank 1 of described nozzle inclination, and wherein nozzle belongs to prior art products, and those skilled in the art can understand and understand, and does not repeat them here.
As a kind of preferred mode of the present invention, what described nozzle inclination was downward is arranged on plating tank 1, is convenient to form carbon dioxide sequestration layer fast.
Receiving tank 11 is provided with between nitric acid groove 10 of the present invention and the second washing bath 12, described receiving tank 11 is equipped with gas blower 17, in the process used, after entering nitric acid groove 10, receiving tank 11 staying for some time, by the effect of gas blower 17, the nitric acid of adhesion being reclaimed from accompanying plating bar, chuck and pcb board blowing up to drop into row, reduce the nitric acid amount entered in the second washing bath 12, thus save nitric acid and water resources.
As a kind of preferred mode of the present invention, two sidewalls of described receiving tank 11 offer through hole respectively, and the quantity of described gas blower 17 is 2, and described gas blower 17 is arranged in through hole.
Embodiment one
The electroplating assembly line of the present embodiment, comprise the plating tank for placing electroplate liquid setting gradually and be set up in parallel, first washing bath, nitric acid groove and the second washing bath, described plating tank, first washing bath, the top of nitric acid groove and the second washing bath is provided with connecting rod, described connecting rod is provided with hanger, described hanger is provided with and accompanies plating bar and the chuck for clamping pcb board, described plating tank is equipped with producer, described producer comprises for the thermotank of splendid attire bicarbonate of ammonia and the filter vat for splendid attire water, described thermotank is communicated with filter vat through pipeline, described filter vat is provided with inlet pipe, the upper end of described inlet pipe and pipeline communication, the outlet position, lower end of described inlet pipe is lower than the height of the water surface, the bottom of described filter vat offers liquid outlet, the epimere of described filter vat offers air outlet, there is air pump described air outlet through pipeline communication, described plating tank offers air inlet port, described air inlet port offer position higher than the plating liquid level in plating tank, described gas pump outlet is communicated with air inlet port through pipeline, described thermotank comprises shell and inner casing, the outer wall that described casing is located at inner casing forms the vapor chamber of vacuum, the inwall of described vapor chamber is equipped with wick, in described vapor chamber, is filled with working liquid, the outer wall of described shell is coated with electrical heating wire layer.
Embodiment two
The electroplating assembly line of the present embodiment, comprise the plating tank for placing electroplate liquid setting gradually and be set up in parallel, first washing bath, nitric acid groove and the second washing bath, described plating tank, first washing bath, the top of nitric acid groove and the second washing bath is provided with connecting rod, described connecting rod is provided with hanger, described hanger is provided with and accompanies plating bar and the chuck for clamping pcb board, described plating tank is equipped with producer, described producer comprises for the thermotank of splendid attire bicarbonate of ammonia and the filter vat for splendid attire water, described thermotank is communicated with filter vat through pipeline, described filter vat is provided with inlet pipe, the upper end of described inlet pipe and pipeline communication, the outlet position, lower end of described inlet pipe is lower than the height of the water surface, the bottom of described filter vat offers liquid outlet, the epimere of described filter vat offers air outlet, there is air pump described air outlet through pipeline communication, described plating tank offers air inlet port, described air inlet port offer position higher than the plating liquid level in plating tank, described gas pump outlet is communicated with air inlet port through pipeline, described thermotank comprises shell and inner casing, the outer wall that described casing is located at inner casing forms the vapor chamber of vacuum, the inwall of described vapor chamber is equipped with wick, in described vapor chamber, is filled with working liquid, the outer wall of described shell is coated with electrical heating wire layer, the outer wall of described electrical heating wire layer is coated with insulated thermal insulating layer, and described insulated thermal insulating layer adopts ceramic fiber paper to make.
Embodiment three
The electroplating assembly line of the present embodiment, comprise the plating tank for placing electroplate liquid setting gradually and be set up in parallel, first washing bath, nitric acid groove and the second washing bath, described plating tank, first washing bath, the top of nitric acid groove and the second washing bath is provided with connecting rod, described connecting rod is provided with hanger, described hanger is provided with and accompanies plating bar and the chuck for clamping pcb board, described plating tank is equipped with producer, described producer comprises for the thermotank of splendid attire bicarbonate of ammonia and the filter vat for splendid attire water, described thermotank is communicated with filter vat through pipeline, described filter vat is provided with inlet pipe, the upper end of described inlet pipe and pipeline communication, the outlet position, lower end of described inlet pipe is lower than the height of the water surface, the bottom of described filter vat offers liquid outlet, the epimere of described filter vat offers air outlet, there is air pump described air outlet through pipeline communication, described plating tank offers air inlet port, described air inlet port offer position higher than the plating liquid level in plating tank, described gas pump outlet is communicated with air inlet port through pipeline, described thermotank comprises shell and inner casing, the outer wall that described casing is located at inner casing forms the vapor chamber of vacuum, the inwall of described vapor chamber is equipped with wick, in described vapor chamber, is filled with working liquid, the outer wall of described shell is coated with electrical heating wire layer, the outer wall of described electrical heating wire layer is coated with insulated thermal insulating layer, and described insulated thermal insulating layer adopts ceramic fiber paper to make, state shell and inner casing is made up of stainless steel, described working liquid is water, described wick is copperly roll silk screen wick.
Embodiment four
On the basis of above-mentioned any embodiment, the upper end of described filter vat is equipped with the fluid inlet for adding water, and described fluid inlet is equipped with sealing cover.
Embodiment five
On the basis of above-mentioned any embodiment, described air inlet port offers the surrounding at plating tank uniformly.
Embodiment six
On the basis of enforcement five, described air inlet port is provided with nozzle, being arranged on plating tank of described nozzle inclination.
Embodiment seven
On the basis of embodiment six, downward being arranged on plating tank of described nozzle inclination.
Embodiment eight
On the basis of above-mentioned any embodiment, be provided with receiving tank between described nitric acid groove and the second washing bath, described receiving tank is equipped with gas blower.
Embodiment nine
On the basis of embodiment eight, two sidewalls of described receiving tank offer through hole respectively, the quantity of described gas blower is 2, and described gas blower is arranged in through hole.
Claims (9)
1. an electroplating assembly line, comprise the plating tank for placing electroplate liquid setting gradually and be set up in parallel, first washing bath, nitric acid groove and the second washing bath, described plating tank, first washing bath, the top of nitric acid groove and the second washing bath is provided with connecting rod, described connecting rod is provided with hanger, described hanger is provided with and accompanies plating bar and the chuck for clamping pcb board, it is characterized in that, described plating tank is equipped with producer, described producer comprises for the thermotank of splendid attire bicarbonate of ammonia and the filter vat for splendid attire water, described thermotank is communicated with filter vat through pipeline, described filter vat is provided with inlet pipe, the upper end of described inlet pipe and pipeline communication, the outlet position, lower end of described inlet pipe is lower than the height of the water surface, the bottom of described filter vat offers liquid outlet, the epimere of described filter vat offers air outlet, there is air pump described air outlet through pipeline communication, described plating tank offers air inlet port, described air inlet port offer position higher than the plating liquid level in plating tank, described gas pump outlet is communicated with air inlet port through pipeline, described thermotank comprises shell and inner casing, the outer wall that described casing is located at inner casing forms the vapor chamber of vacuum, the inwall of described vapor chamber is equipped with wick, in described vapor chamber, is filled with working liquid, the outer wall of described shell is coated with electrical heating wire layer.
2. electroplating assembly line according to claim 1, is characterized in that, the outer wall of described electrical heating wire layer is coated with insulated thermal insulating layer, and described insulated thermal insulating layer adopts ceramic fiber paper to make.
3. electroplating assembly line according to claim 2, is characterized in that, described shell and inner casing are made up of stainless steel, and described working liquid is water; Described wick is copperly roll silk screen wick.
4. electroplating assembly line according to claim 1, is characterized in that, the upper end of described filter vat is equipped with the fluid inlet for adding water, and described fluid inlet is equipped with sealing cover.
5., according to the arbitrary described electroplating assembly line of claim 1-4, it is characterized in that, described air inlet port offers the surrounding at plating tank uniformly.
6. electroplating assembly line according to claim 5, is characterized in that, described air inlet port is provided with nozzle, being arranged on plating tank of described nozzle inclination.
7. electroplating assembly line according to claim 6, is characterized in that, downward being arranged on plating tank of described nozzle inclination.
8. electroplating assembly line according to claim 1, is characterized in that, be provided with receiving tank between described nitric acid groove and the second washing bath, described receiving tank is equipped with gas blower.
9. electroplating assembly line according to claim 8, is characterized in that, two sidewalls of described receiving tank offer through hole respectively, and the quantity of described gas blower is 2, and described gas blower is arranged in through hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510852901.8A CN105297119A (en) | 2015-11-30 | 2015-11-30 | Electroplating production line |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510852901.8A CN105297119A (en) | 2015-11-30 | 2015-11-30 | Electroplating production line |
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| Publication Number | Publication Date |
|---|---|
| CN105297119A true CN105297119A (en) | 2016-02-03 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510852901.8A Pending CN105297119A (en) | 2015-11-30 | 2015-11-30 | Electroplating production line |
Country Status (1)
| Country | Link |
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| CN (1) | CN105297119A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113481578A (en) * | 2021-08-09 | 2021-10-08 | 苏州润玺环保设备有限公司 | Full-automatic annular vertical lifting type electroplating production line |
| US11939690B2 (en) * | 2016-04-05 | 2024-03-26 | Snap-On Incorporated | Portable and modular production electroplating system |
| CN118639300A (en) * | 2024-08-19 | 2024-09-13 | 内江威士凯电子有限公司 | PCB multilayer board and electroplating device thereof |
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| JPS5177542A (en) * | 1974-12-28 | 1976-07-05 | Riken Keikinzoku Kogyo Kk | Aruminiumu moshikuhaaruminiumugokinzaino hyomenshoriho |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11939690B2 (en) * | 2016-04-05 | 2024-03-26 | Snap-On Incorporated | Portable and modular production electroplating system |
| CN113481578A (en) * | 2021-08-09 | 2021-10-08 | 苏州润玺环保设备有限公司 | Full-automatic annular vertical lifting type electroplating production line |
| CN118639300A (en) * | 2024-08-19 | 2024-09-13 | 内江威士凯电子有限公司 | PCB multilayer board and electroplating device thereof |
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Application publication date: 20160203 |