CN205295528U - High -efficient PCB board plating bath - Google Patents
High -efficient PCB board plating bath Download PDFInfo
- Publication number
- CN205295528U CN205295528U CN201520970056.XU CN201520970056U CN205295528U CN 205295528 U CN205295528 U CN 205295528U CN 201520970056 U CN201520970056 U CN 201520970056U CN 205295528 U CN205295528 U CN 205295528U
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- CN
- China
- Prior art keywords
- electroplating bath
- filter vat
- pcb board
- air inlet
- shell
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The utility model belongs to the technical field of the preparation of PCB board, a high -efficient PCB board plating bath is disclosed for solve the polluted environment of current plating bath existence and the problem of potential safety hazard. The utility model discloses a plating bath, the plating bath has set the generator, the generator is including being used for the heating bucket and being used for the filter vat, the heating bucket is manage and is said and the filter vat intercommunication, the filter vat is equipped with the intake pipe, the upper end and the pipeline intercommunication of intake pipe, the lower extreme exit position of intake pipe is less than the height of the surface of water, the liquid outlet has been seted up to the bottom of filter vat, the gas outlet has been seted up to the upper segment of filter vat, manage and say that the intercommunication has the air pump in the gas outlet, the inlet port has been seted up to the plating bath, the position of offering of inlet port is higher than the electroplating liquid level, the gas delivery side of pump is in charge of and is said and the inlet port intercommunication, heating bucket is including shell and inner shell, and outer shell is established on the outer wall of inner shell and the steam chamber of vacuum production, and the inner wall upper berth in steam chamber is equipped with the imbibition core, and the steam intracavity is packed there is working liquid, and the cladding has the electric heating wire layer on the outer wall of shell.
Description
Technical field
This utility model belongs to pcb board preparing technical field, specifically discloses a kind of efficiently pcb board electroplating bath.
Background technology
Pcb board, also known as printed circuit board (PCB), is the supplier of electronic devices and components electrical connection. Its development history of existing more than 100 year; It is mainly designed to layout design; What adopt circuit board has the advantages that the mistake greatly reducing wiring and assembling, improves the gentle productive labor rate of Automated water.
In the process making pcb board, plating is requisite operation, is increased hole copper and face copper thickness by galvanizing process, improves corrosion resistance and the electric conductivity of pcb board. In prior art about plating technical literature also more, such as application number be 201020508381.1 utility model disclose the PCB plating line of a kind of improvement, including PCB copper facing/erosion copper controller, hanger, copper plating groove, rinsing bowl, nitric acid groove, chuck on hanger clamps PCB, PCB copper facing/erosion copper controller controls overhead traveling crane and drives hanger to run, after described nitric acid groove, before rinsing bowl, set drip trays, it is used for collecting the medicinal liquid taken out of from nitric acid groove, described PCB copper facing/erosion copper controller arranges corresponding control program, controls the hanger dropping liquid time on drip trays; Drip trays is provided with liquid level detection device, and described liquid level detection device is connected with described PCB copper facing/erosion copper controller.
Application number be 201220399046.1 utility model patent disclose a kind of PCB plating line, it includes the copper plating groove being arranged in order, first rinsing bowl, nitric acid groove, second rinsing bowl, described copper plating groove, first rinsing bowl, nitric acid groove, second rinsing bowl be provided above connecting rod, described connecting rod is provided with hanger, hanger is provided with chuck, accompany plating bar, described chuck is provided with PCB, described hanger can move along described connecting rod, described connecting rod is provided with control the cyclelog that hanger moves, described PCB plating line also includes drip, described drip is arranged between nitric acid groove and the second rinsing bowl, described drip is additionally provided with blowing device, offering through hole respectively on relative two sidewall of described drip, the quantity of described blowing device is two, and said two blowing device is separately positioned in two through holes, described blowing device is fan.
Application number be 201320598639.5 utility model patent disclose a kind of PCB electroplanting device, including plating solution cylinder and at least one anode being arranged on plating solution cylinder two relative edge's inner face;The inner side of described anode is equipped with insulation barrier parallel with it; Described insulation barrier lower half is provided with via-hole array; Described insulation barrier upper end is higher than the highest plating solution position of plating solution cylinder; In described via-hole array, the spacing of each through hole is 5cm; In described via-hole array, the aperture of through hole is 1-2cm; Described insulation barrier is insulated by several piece, and daughter board is detachably connected side by side to be formed.
Application number be 201420028158.5 utility model patent disclose a kind of full-automatic PCB uniformly-coating device, include electroplating cell body, electroplating cell body forms opening up electroplating bath, electroplating cell body include just to and parallel interval arrange left plating cell wall and right plating cell wall, right plating cell wall is positioned at the right-hand member side of left plating cell wall, the interior side of left plating cell wall is equiped with left anode conducting busbar in electroplating bath, the interior side of right plating cell wall is equiped with right anode conducting busbar in electroplating bath, left anode conducting busbar) mount left titanium basket, right anode conducting busbar has mounted right titanium basket, it is equiped with vertically extending left conduct current plate in the right-hand member side of left titanium basket in electroplating bath, in electroplating bath, the left end side in right titanium basket is equiped with vertically extending right conduct current plate, left conduct current plate and right conduct current plate just to and parallel interval arrange, left conduct current plate and right conduct current plate offer respectively left and right transverse horizontal completely through and in uniform intervals arrange conduct current hole, the bottom of electroplating bath relative can be equiped with vertically extending left anode baffle between left conduct current plate with left titanium basket up and downly, the bottom of electroplating bath relative can be equiped with vertically extending right anode baffle between right conduct current plate with right titanium basket up and downly, the upper end of left plating cell wall and the upper end of right plating cell wall are equiped with baffle plate hoisting mechanism respectively, each baffle plate hoisting mechanism drives with the left anode baffle of corresponding side and right anode baffle respectively and is connected, each described baffle plate hoisting mechanism includes elevator motor and the elevator rotating shaft of the described left plating cell wall being installed in corresponding side and described right plating cell wall upper end, the power output shaft of each elevator motor is provided with worm screw respectively, the end correspondence worm screw of each elevator rotating shaft is equiped with turbine respectively, turbine coordinates with corresponding worm screw, is provided with winch rope respectively between described left anode baffle and the described right anode baffle of each elevator rotating shaft and corresponding side.
As the above-mentioned existing electroplanting device told about, continuously perform to improve production efficiency plating, it is thus desirable to electroplating bath upper end must be opened wide, various chemical substance is there is yet with electroplate liquid, in electroplating process, chemical substance can evaporate, and not only contaminated environment and the health on operator bring serious impact.
Utility model content
The electroplate liquid that this utility model exists to solve existing electroplating bath evaporates contaminated environment and the problem that operator bring potential safety hazard, and a kind of efficiently pcb board electroplating bath is provided, the volatilization of electrolyte can be reduced, reduce the pollution to environment, and ensure that staff's is healthy.
For solving above-mentioned technical problem, this utility model be the technical scheme is that
A kind of efficiently pcb board electroplating bath, including the electroplating bath for placing electroplate liquid, it is characterized in that, described electroplating bath is equipped with generator, described generator includes the heating bucket for containing ammonium hydrogen carbonate and for containing the filter vat of water, described heating bucket connects with filter vat through pipeline, described filter vat is provided with air inlet pipe, the upper end of described air inlet pipe and pipeline communication, the exit position, lower end of described air inlet pipe is lower than the height of the water surface, the bottom of described filter vat offers liquid outlet, the epimere of described filter vat offers gas outlet, there is air pump described gas outlet through pipeline communication, described electroplating bath offers air inlet, described air inlet offer position higher than the plating liquid level in electroplating bath, described gas delivery side of pump connects with air inlet through pipeline, described heating bucket includes shell and inner shell, described casing is located on the outer wall of inner shell and forms the vapor chamber of vacuum, the inwall of described vapor chamber is equipped with wick, is filled with hydraulic fluid in described vapor chamber, the outer wall of described shell is coated with electrical heating wire layer.
The outer wall of described electrical heating wire layer is coated with insulated thermal insulating layer, and described insulated thermal insulating layer adopts ceramic fiber paper to make.
Described shell and inner shell are made of stainless steel, and described hydraulic fluid is water.
Described wick is copper roll silk screen wick.
The upper end of described filter vat is equipped with the inlet for adding water, and described inlet is equipped with sealing lid.
Described air inlet offers the surrounding at electroplating bath uniformly.
Described air inlet is provided with nozzle, being arranged on electroplating bath of described nozzle inclination.
Downward being arranged on electroplating bath of described nozzle inclination.
Compared with prior art, this utility model has the advantages that
Efficient pcb board electroplating bath of the present utility model, by arranging generator on electroplating bath, in the process used, heating bucket heating makes ammonium hydrogen carbonate volatilize, substantial amounts of titanium dioxide set and ammonia is produced after ammonium hydrogen carbonate volatilization, by the filtration of water, ammonia is molten is prone to water, by ammonia and carbon dioxide separation, by the effect of air pump by carbon dioxide input to electroplating bath so that the upper surface at electroplate liquid forms carbon dioxide sequestration layer, thus reducing the volatilization of electroplate liquid, reduce the pollution to environment, decrease the impact that staff is healthy simultaneously. The carbon dioxide sequestration layer that this utility model is formed, it is possible to ensure the normal and continuous operation of electroplating activity.
Heating bucket of the present utility model has homogeneous heating simultaneously, the feature that the efficiency of heating surface is high.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model;
Fig. 2 is the structural representation of heating bucket of the present utility model;
Labelling in figure: 1, electroplating bath, 2, heating bucket, 3, filter vat, 4, air inlet pipe, 5, seal lid, 6, air pump, 7, pipeline, 8, air inlet, 21, inner shell, 22, shell, 23, vapor chamber, 24, wick, 25, electrical heating wire layer, 26, insulated thermal insulating layer.
Detailed description of the invention
Below in conjunction with embodiment, the utility model will be further described, and described embodiment is only a part of embodiment of this utility model, is not whole embodiments. Based on the embodiment in this utility model, those of ordinary skill in the art obtain under not making creative work premise other used by embodiment, broadly fall into protection domain of the present utility model.
In conjunction with accompanying drawing, efficient pcb board electroplating bath of the present utility model, including the electroplating bath 1 for placing electroplate liquid, described electroplating bath 1 is equipped with generator, described generator includes the heating bucket 2 for containing ammonium hydrogen carbonate and for containing the filter vat 3 of water, described heating bucket 2 connects with filter vat 3 through pipeline, described filter vat 3 is provided with air inlet pipe 4, the upper end of described air inlet pipe 4 and pipeline communication, the exit position, lower end of described air inlet pipe 4 is lower than the height of the water surface, the bottom of described filter vat 3 offers liquid outlet, the epimere of described filter vat 3 offers gas outlet, described gas outlet is communicated with air pump 6 through pipeline 7, described electroplating bath 1 offers air inlet 8, described air inlet 8 offer position higher than the plating liquid level in electroplating bath 1, the outlet of described air pump 6 connects with air inlet 8 through pipeline 7, described heating bucket 2 includes shell 22 and inner shell 21, described shell 22 is set on the outer wall of inner shell 21 and is formed the vapor chamber 23 of vacuum, the inwall of described vapor chamber 23 is equipped with wick 24, it is filled with hydraulic fluid in described vapor chamber 23, the outer wall of described shell 22 is coated with electrical heating wire layer 25. work process of the present utility model is, heating bucket heating makes the ammonium hydrogen carbonate decomposes in heating bucket, produces substantial amounts of carbon dioxide and ammonia, and soluble in water according to ammonia, carbon dioxide does not allow the characteristic in the Yishui River, by the filtration of water so that carbon dioxide separates with water. carbon dioxide enters in electroplating bath by air pump and pipeline so that the upper surface at electroplate liquid forms carbon dioxide sequestration layer, thus reducing the volatilization of electroplate liquid, reducing the pollution to environment, decreasing the impact that staff is healthy simultaneously. the carbon dioxide sequestration layer that this utility model is formed, it is possible to ensure the normal and continuous operation of electroplating activity.
Meanwhile, heating bucket of the present utility model has homogeneous heating, the feature that the efficiency of heating surface is high.
In order to reduce scattering and disappearing of heat energy, improving the utilization rate of heat energy, the outer wall of electrical heating wire layer 25 of the present utility model is coated with insulated thermal insulating layer 26, it is preferable that described insulated thermal insulating layer 26 adopts ceramic fiber paper to make.
Shell 22 of the present utility model and inner shell 21 are made of stainless steel, and described hydraulic fluid is water.
Described wick 24 rolls silk screen wick for copper.
For the ease of continuous firing, the upper end of filter vat 3 of the present utility model is equipped with the inlet for adding water, and described inlet is equipped with sealing lid 5, by arranging inlet and liquid outlet, it is easy to water is circulated effect, it is prevented that saturated at ammonia, it is ensured that filtration of the present utility model.
As a kind of preferred mode of this utility model, described air inlet 8 offers the surrounding at electroplating bath 1 uniformly, it is easy to form carbon dioxide sequestration layer, owing to the density ratio air of carbon dioxide is big, therefore, carbon dioxide layer floats over the upper surface of electroplate liquid and not easily distributes, simultaneously continuously performing without influence on plating.
In order to improve practicality of the present utility model, air inlet 8 of the present utility model is provided with nozzle, described nozzle inclination be arranged on electroplating bath 1, wherein nozzle belongs to prior art products, and those skilled in the art can be appreciated and understood that, does not repeat them here.
As a kind of preferred mode of this utility model, what described nozzle inclination was downward is arranged on electroplating bath 1, it is simple to quickly form carbon dioxide sequestration layer.
Embodiment one
The efficient pcb board electroplating bath of the present embodiment, including the electroplating bath for placing electroplate liquid, described electroplating bath is equipped with generator, described generator includes the heating bucket for containing ammonium hydrogen carbonate and for containing the filter vat of water, described heating bucket connects with filter vat through pipeline, described filter vat is provided with air inlet pipe, the upper end of described air inlet pipe and pipeline communication, the exit position, lower end of described air inlet pipe is lower than the height of the water surface, the bottom of described filter vat offers liquid outlet, the epimere of described filter vat offers gas outlet, there is air pump described gas outlet through pipeline communication, described electroplating bath offers air inlet, described air inlet offer position higher than the plating liquid level in electroplating bath, described gas delivery side of pump connects with air inlet through pipeline, described heating bucket includes shell and inner shell, described casing is located on the outer wall of inner shell and forms the vapor chamber of vacuum, the inwall of described vapor chamber is equipped with wick, is filled with hydraulic fluid in described vapor chamber, the outer wall of described shell is coated with electrical heating wire layer.
Embodiment two
The efficient pcb board electroplating bath of the present embodiment, including the electroplating bath for placing electroplate liquid, described electroplating bath is equipped with generator, described generator includes the heating bucket for containing ammonium hydrogen carbonate and for containing the filter vat of water, described heating bucket connects with filter vat through pipeline, described filter vat is provided with air inlet pipe, the upper end of described air inlet pipe and pipeline communication, the exit position, lower end of described air inlet pipe is lower than the height of the water surface, the bottom of described filter vat offers liquid outlet, the epimere of described filter vat offers gas outlet, there is air pump described gas outlet through pipeline communication, described electroplating bath offers air inlet, described air inlet offer position higher than the plating liquid level in electroplating bath, described gas delivery side of pump connects with air inlet through pipeline, described heating bucket includes shell and inner shell, described casing is located on the outer wall of inner shell and forms the vapor chamber of vacuum, the inwall of described vapor chamber is equipped with wick, is filled with hydraulic fluid in described vapor chamber, the outer wall of described shell is coated with electrical heating wire layer, the outer wall of described electrical heating wire layer is coated with insulated thermal insulating layer, and described insulated thermal insulating layer adopts ceramic fiber paper to make.
Embodiment three
The efficient pcb board electroplating bath of the present embodiment, including the electroplating bath for placing electroplate liquid, described electroplating bath is equipped with generator, described generator includes the heating bucket for containing ammonium hydrogen carbonate and for containing the filter vat of water, described heating bucket connects with filter vat through pipeline, described filter vat is provided with air inlet pipe, the upper end of described air inlet pipe and pipeline communication, the exit position, lower end of described air inlet pipe is lower than the height of the water surface, the bottom of described filter vat offers liquid outlet, the epimere of described filter vat offers gas outlet, there is air pump described gas outlet through pipeline communication, described electroplating bath offers air inlet, described air inlet offer position higher than the plating liquid level in electroplating bath, described gas delivery side of pump connects with air inlet through pipeline,Described heating bucket includes shell and inner shell, described casing is located on the outer wall of inner shell and forms the vapor chamber of vacuum, the inwall of described vapor chamber is equipped with wick, is filled with hydraulic fluid in described vapor chamber, the outer wall of described shell is coated with electrical heating wire layer; The outer wall of described electrical heating wire layer is coated with insulated thermal insulating layer, and described insulated thermal insulating layer adopts ceramic fiber paper to make; Described shell and inner shell are made of stainless steel, and described hydraulic fluid is water.
Embodiment four
On the basis of embodiment three, described wick is copper roll silk screen wick.
Embodiment five
On the basis of any of the above-described embodiment, the upper end of described filter vat is equipped with the inlet for adding water, and described inlet is equipped with sealing lid.
Embodiment six
On the basis of any of the above-described embodiment, described air inlet offers the surrounding at electroplating bath uniformly.
Embodiment seven
On the basis of embodiment six, described air inlet is provided with nozzle, being arranged on electroplating bath of described nozzle inclination.
Embodiment eight
On the basis of embodiment seven, described downward being arranged on electroplating bath of nozzle inclination.
Claims (8)
1. an efficient pcb board electroplating bath, including the electroplating bath for placing electroplate liquid, it is characterized in that, described electroplating bath is equipped with generator, described generator includes the heating bucket for containing ammonium hydrogen carbonate and for containing the filter vat of water, described heating bucket connects with filter vat through pipeline, described filter vat is provided with air inlet pipe, the upper end of described air inlet pipe and pipeline communication, the exit position, lower end of described air inlet pipe is lower than the height of the water surface, the bottom of described filter vat offers liquid outlet, the epimere of described filter vat offers gas outlet, there is air pump described gas outlet through pipeline communication, described electroplating bath offers air inlet, described air inlet offer position higher than the plating liquid level in electroplating bath, described gas delivery side of pump connects with air inlet through pipeline, described heating bucket includes shell and inner shell, described casing is located on the outer wall of inner shell and forms the vapor chamber of vacuum, the inwall of described vapor chamber is equipped with wick, is filled with hydraulic fluid in described vapor chamber, the outer wall of described shell is coated with electrical heating wire layer.
2. efficient pcb board electroplating bath according to claim 1, it is characterised in that the outer wall of described electrical heating wire layer is coated with insulated thermal insulating layer, described insulated thermal insulating layer adopts ceramic fiber paper to make.
3. efficient pcb board electroplating bath according to claim 2, it is characterised in that described shell and inner shell are made of stainless steel, and described hydraulic fluid is water.
4. efficient pcb board electroplating bath according to claim 3, it is characterised in that described wick is copper roll silk screen wick.
5. efficient pcb board electroplating bath according to claim 1, it is characterised in that the upper end of described filter vat is equipped with the inlet for adding water, described inlet is equipped with sealing lid.
6. according to the arbitrary described efficient pcb board electroplating bath of claim 1-5, it is characterised in that described air inlet offers the surrounding at electroplating bath uniformly.
7. efficient pcb board electroplating bath according to claim 6, it is characterised in that described air inlet is provided with nozzle, being arranged on electroplating bath of described nozzle inclination.
8. efficient pcb board electroplating bath according to claim 7, it is characterised in that downward being arranged on electroplating bath of described nozzle inclination.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520970056.XU CN205295528U (en) | 2015-11-30 | 2015-11-30 | High -efficient PCB board plating bath |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520970056.XU CN205295528U (en) | 2015-11-30 | 2015-11-30 | High -efficient PCB board plating bath |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205295528U true CN205295528U (en) | 2016-06-08 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520970056.XU Expired - Fee Related CN205295528U (en) | 2015-11-30 | 2015-11-30 | High -efficient PCB board plating bath |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205295528U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105297123A (en) * | 2015-11-30 | 2016-02-03 | 成都市天目电子设备有限公司 | High-efficient PCB (Printed Circuit Board) plating tank |
-
2015
- 2015-11-30 CN CN201520970056.XU patent/CN205295528U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105297123A (en) * | 2015-11-30 | 2016-02-03 | 成都市天目电子设备有限公司 | High-efficient PCB (Printed Circuit Board) plating tank |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160608 Termination date: 20201130 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |