CN105256364A - Efficient plating device - Google Patents

Efficient plating device Download PDF

Info

Publication number
CN105256364A
CN105256364A CN201510851035.0A CN201510851035A CN105256364A CN 105256364 A CN105256364 A CN 105256364A CN 201510851035 A CN201510851035 A CN 201510851035A CN 105256364 A CN105256364 A CN 105256364A
Authority
CN
China
Prior art keywords
outlet
bath
inner casing
plating
diversion trench
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201510851035.0A
Other languages
Chinese (zh)
Inventor
贾强
唐刚
李靖
刘淑兰
张蓉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Chengdu Temmoku Electronics Equipment Co Ltd
Original Assignee
Chengdu Temmoku Electronics Equipment Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chengdu Temmoku Electronics Equipment Co Ltd filed Critical Chengdu Temmoku Electronics Equipment Co Ltd
Priority to CN201510851035.0A priority Critical patent/CN105256364A/en
Publication of CN105256364A publication Critical patent/CN105256364A/en
Pending legal-status Critical Current

Links

Landscapes

  • Electroplating Methods And Accessories (AREA)

Abstract

The invention belongs to the technical field of printed circuit board (PCB) manufacturing, and discloses an efficient plating device so as to solve the problem that for an existing plating bath, stirring is uneven. The efficient plating device comprises a plating bath, a first rinsing bath, a nitric acid bath and a second rinsing bath which are sequentially arranged in parallel and used for storing plating solutions. The efficient plating device is characterized in that a collection tank is arranged between the nitric acid bath and the second rinsing bath, an axial-flow fan is assembled to the collection tank, the plating bath comprises a round bath body, and the bath body comprises a bath bottom and a side wall arranged on the bath bottom in a surrounding mode; the side wall comprises an inner shell and an outer shell, the inner shell is sleeved with the outer shell, a spiral diversion trench is downwards formed between the inner shell and the outer shell, the diversion trench is provided with a liquid inlet and a liquid outlet, the liquid outlet is formed in the inner shell, and the liquid inlet is formed in the outer shell; the liquid outlet is connected with a nozzle which is arranged on the inner shell in the tangential direction .

Description

A kind of high-efficiency electroplating equipment
Technical field
The invention belongs to pcb board preparing technical field, specifically disclose a kind of high-efficiency electroplating equipment.
Background technology
Pcb board, also known as printed circuit board (PCB), is the supplier of electronic devices and components electrical connection.Its development has the history of more than 100 year; Its design mainly layout design; Adopt the major advantage of circuit card to be the mistake greatly reducing wiring and assembling, improve the gentle productive labor rate of Automated water.
In the process making pcb board, electroplate the operation that is absolutely necessary, increase hole copper and face copper thickness by galvanizing process, improve erosion resistance and the electroconductibility of pcb board.Technical literature about plating in prior art is also more, such as application number be 201020508381.1 utility model disclose a kind of PCB plating line of improvement, comprise PCB copper facing/erosion copper controller, hanger, copper plating groove, washing bath, nitric acid groove, chuck on hanger clamps PCB, PCB copper facing/erosion copper controller controls overhead traveling crane and drives hanger to run, after described nitric acid groove, before washing bath, establish drip trays, be used for collecting the liquid taken out of from nitric acid groove, in described PCB copper facing/erosion copper controller, corresponding sequence of control is set, controls the dropping liquid time of hanger on drip trays; Drip trays is provided with liquid level detection device, and described liquid level detection device is connected with described PCB copper facing/erosion copper controller.
Application number be 201220399046.1 utility model patent disclose a kind of PCB plating line, it comprises the copper plating groove be arranged in order, first washing bath, nitric acid groove, second washing bath, described copper plating groove, first washing bath, nitric acid groove, the top of the second washing bath is provided with connecting rod, described connecting rod is provided with hanger, hanger is provided with chuck, accompany plating bar, described chuck is provided with PCB, described hanger can move along described connecting rod, described connecting rod is provided with the sequence controller controlling hanger movement, described PCB plating line also comprises drip, described drip is arranged between nitric acid groove and the second washing bath, described drip is also provided with blowing device, two relative sidewalls of described drip offer through hole respectively, and the quantity of described blowing device is two, and described two blowing devices are separately positioned in two through holes, described blowing device is fan.
Application number be 201320598639.5 utility model patent disclose a kind of PCB electroplanting device, comprise plating solution cylinder and be arranged at least one anode of plating solution cylinder two relative edge inner face; The inner side of described anode is equipped with insulation barrier parallel with it; Described insulation barrier Lower Half is provided with via-hole array; Described insulation barrier upper end is higher than the highest plating solution position of plating solution cylinder; In described via-hole array, the spacing of each through hole is 5cm; In described via-hole array, the aperture of through hole is 1-2cm; Described insulation barrier is removably formed by connecting side by side by several piece insulation daughter board.
Application number be 201420028158.5 utility model patent disclose a kind of full-automatic PCB uniformly-coating device, include electroplating cell body, electroplating cell body forms opening up plating tank, electroplating cell body include just to and parallel interval arrange left plating cell wall and right plating cell wall, right plating cell wall is positioned at the right-hand member side of left plating cell wall, the interior side of left plating cell wall is equiped with left anode conducting busbar in plating tank, the interior side of right plating cell wall is equiped with right anode conducting busbar in plating tank, left anode conducting busbar) mount left titanium basket, right anode conducting busbar has mounted right titanium basket, be equiped with the vertical left conduct current plate extended in the right-hand member side of left titanium basket in plating tank, the vertical right conduct current plate extended is equiped with in the left end side of right titanium basket in plating tank, left conduct current plate and right conduct current plate just to and parallel interval arrange, the left and right transverse horizontal that left conduct current plate and right conduct current plate offers respectively runs through and the conduct current hole arranged in uniform intervals completely, the bottom of plating tank can be equiped with the left anode baffle vertically extended between left conduct current plate with left titanium basket up and downly relatively, the bottom of plating tank can be equiped with the right anode baffle vertically extended between right conduct current plate with right titanium basket up and downly relatively, the upper end of left plating cell wall and the upper end of right plating cell wall are equiped with baffle plate hoisting mechanism respectively, each baffle plate hoisting mechanism drives with the left anode baffle of corresponding side and right anode baffle respectively and is connected, each described baffle plate hoisting mechanism includes elevator motor and the elevator rotating shaft of described left plating cell wall and the described right plating cell wall upper end being installed in corresponding side, the power output shaft of each elevator motor is provided with worm screw respectively, the corresponding worm screw in end of each elevator rotating shaft is equiped with turbine respectively, turbine coordinates with corresponding worm screw, is provided with winch rope respectively between the described left anode baffle of each elevator rotating shaft and corresponding side and described right anode baffle.
In the process of plating, in order to ensure homogeneity and the planarization of coating, needing fully to stir the electroplate liquid in plating tank, keeping evenly to make each additive concentration.In prior art, PCB plating tank is pneumatic blending, and such as patent of invention CN201793793 discloses a kind of novel PC B and electroplates plating cylinder, pneumatic blending, and aspiration tube is all located at plating cylinder bottom portion, parallel current is in plate face, but this electroplanting device also exists the uneven problem of stirring.
Summary of the invention
The uneven problem of stirring that the present invention exists to solve existing plating tank, and a kind of high-efficiency electroplating equipment is provided, have the advantages that to stir.
For solving the problems of the technologies described above, the technical solution adopted in the present invention is:
A kind of high-efficiency electroplating equipment, comprise the plating tank for placing electroplate liquid be set up in parallel successively, first washing bath, nitric acid groove and the second washing bath, it is characterized in that, receiving tank is provided with between described nitric acid groove and the second washing bath, described receiving tank is equipped with aerofoil fan, described plating tank comprises circular cell body, described cell body comprises bottom land and is located in the sidewall of bottom land, described sidewall comprises inner casing and shell, described casing is located at the outside of inner casing, spiral helicine diversion trench is formed between described inner casing and shell, setting under described diversion trench screw, described diversion trench offers fluid inlet and liquid outlet, described liquid outlet is opened on inner casing, described fluid inlet is opened on shell, described liquid outlet is connected with nozzle, described nozzle is tangentially arranged on inner casing.
The bottom of described bottom land offers multiple outlet, and the center of circle of each outlet is on same circle.
Described outlet-inclined impeller vane be opened on bottom land, each outlet is all communicated with an exit passageway.
Each exit passageway forms a spirrillum, and identical with the hand of spiral of diversion trench.
Each exit passageway is all communicated with a pump, and described pump outlet is communicated with fluid inlet.
The front end of described nozzle is equipped with filtering net.
Two sidewalls of described receiving tank offer through hole respectively, and the quantity of described aerofoil fan is 2, and described aerofoil fan is arranged in through hole.
Compared with prior art, the present invention has following beneficial effect:
High-efficiency electroplating equipment of the present invention, comprise the plating tank for placing electroplate liquid be set up in parallel successively, first washing bath, nitric acid groove and the second washing bath, receiving tank is provided with between described nitric acid groove and the second washing bath, described receiving tank is equipped with aerofoil fan, described plating tank comprises circular cell body, described cell body comprises bottom land and is located in the sidewall of bottom land, described sidewall comprises inner casing and shell, described casing is located at the outside of inner casing, spiral helicine diversion trench is formed between described inner casing and shell, setting under described diversion trench screw, described diversion trench offers fluid inlet and liquid outlet, described liquid outlet is opened on inner casing, described fluid inlet is opened on shell, described liquid outlet is connected with nozzle, described nozzle is tangentially arranged on inner casing.In the process used, each nozzle of the present invention forms spirrillum and forms eddy current, thus improves the effect stirred.Outlet of the present invention simultaneously also can form a spiral helicine eddy current, and outlet all forms the identical eddy current of the hand of spiral with nozzle, improves mixing effect of the present invention further.
The present invention, by arranging receiving tank between nitric acid groove and the second washing bath, for collecting nitric acid, reduces the nitric acid amount, saving water resource and the nitric acid resource that enter in the second washing bath.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention;
Fig. 2 is the structural representation of plating tank of the present invention;
Mark in figure: 1, plating tank, the 2, first washing bath, 3, nitric acid groove, 4, receiving tank, the 5, second washing bath, 6, aerofoil fan, 11, inner casing, 12, shell, 13, diversion trench, 14, bottom land, 15, outlet, 16, exit passageway, 17, pump.
Embodiment
Below in conjunction with embodiment, the invention will be further described, and described embodiment is only the present invention's part embodiment, is not whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making other embodiments used obtained under creative work prerequisite, belongs to protection scope of the present invention.
By reference to the accompanying drawings, high-efficiency electroplating equipment of the present invention, comprise the plating tank 1 for placing electroplate liquid be set up in parallel successively, first washing bath 2, nitric acid groove 3 and the second washing bath 5, receiving tank 4 is provided with between described nitric acid groove 3 and the second washing bath 5, described receiving tank 4 is equipped with aerofoil fan 6, described plating tank 1 comprises circular cell body, described cell body comprises bottom land 14 and is located in the sidewall of bottom land, described sidewall comprises inner casing 11 and shell 12, described shell 12 is set in the outside of inner casing 11, spiral helicine diversion trench 13 is formed between described inner casing 11 and shell 12, setting under described diversion trench 13 screw, described diversion trench 13 offers fluid inlet and liquid outlet, described liquid outlet is opened on inner casing 11, described fluid inlet is opened on shell 12, described liquid outlet is connected with nozzle, described nozzle is tangentially arranged on inner casing 11.As a kind of preferred mode of the present invention, described liquid outlet to be opened in uniformly on inner casing 11 and to be communicated with diversion trench.In the process used, each nozzle of the present invention forms spirrillum and forms eddy current, thus improves the effect stirred.
The present invention, by arranging receiving tank between nitric acid groove and the second washing bath, for collecting nitric acid, reduces the nitric acid amount, saving water resource and the nitric acid resource that enter in the second washing bath.
As a kind of preferred mode of the present invention, the bottom of bottom land 14 offers multiple outlet 15, and the center of circle of each outlet 15 is on same circle.
What described outlet 15 was tilted is opened on bottom land, and each outlet 15 is all communicated with an exit passageway 16.
Each exit passageway 15 forms a spirrillum, and identical with the hand of spiral of diversion trench 13.
Each exit passageway 16 is all communicated with a pump 17, and the outlet of described pump 17 is communicated with fluid inlet.
In order to improve practicality of the present invention, prevent the blocking of nozzle, the front end of described nozzle is equipped with filtering net.Wherein nozzle belongs to prior art products, and those skilled in the art can understand and understand, and does not repeat them here.
Outlet of the present invention also can form a spiral helicine eddy current, and outlet all forms the identical eddy current of the hand of spiral with nozzle, improves mixing effect of the present invention further.
As a kind of preferred mode of the present invention, two sidewalls of described receiving tank 4 offer through hole respectively, and the quantity of described aerofoil fan 6 is 2, and described aerofoil fan 6 is arranged in through hole.
Embodiment one
The high-efficiency electroplating equipment of the present embodiment, comprise the plating tank for placing electroplate liquid be set up in parallel successively, first washing bath, nitric acid groove and the second washing bath, receiving tank is provided with between described nitric acid groove and the second washing bath, described receiving tank is equipped with aerofoil fan, described plating tank comprises circular cell body, described cell body comprises bottom land and is located in the sidewall of bottom land, described sidewall comprises inner casing and shell, described casing is located at the outside of inner casing, spiral helicine diversion trench is formed between described inner casing and shell, setting under described diversion trench screw, described diversion trench offers fluid inlet and liquid outlet, described liquid outlet is opened on inner casing, described fluid inlet is opened on shell, described liquid outlet is connected with nozzle, described nozzle is tangentially arranged on inner casing.
Embodiment two
The high-efficiency electroplating equipment of the present embodiment, comprise the plating tank for placing electroplate liquid be set up in parallel successively, first washing bath, nitric acid groove and the second washing bath, receiving tank is provided with between described nitric acid groove and the second washing bath, described receiving tank is equipped with aerofoil fan, described plating tank comprises circular cell body, described cell body comprises bottom land and is located in the sidewall of bottom land, described sidewall comprises inner casing and shell, described casing is located at the outside of inner casing, spiral helicine diversion trench is formed between described inner casing and shell, setting under described diversion trench screw, described diversion trench offers fluid inlet and liquid outlet, described liquid outlet is opened on inner casing, described fluid inlet is opened on shell, described liquid outlet is connected with nozzle, described nozzle is tangentially arranged on inner casing, the bottom of described bottom land offers multiple outlet, and the center of circle of each outlet is on same circle.
Embodiment three
The high-efficiency electroplating equipment of the present embodiment, comprise the plating tank for placing electroplate liquid be set up in parallel successively, first washing bath, nitric acid groove and the second washing bath, receiving tank is provided with between described nitric acid groove and the second washing bath, described receiving tank is equipped with aerofoil fan, described plating tank comprises circular cell body, described cell body comprises bottom land and is located in the sidewall of bottom land, described sidewall comprises inner casing and shell, described casing is located at the outside of inner casing, spiral helicine diversion trench is formed between described inner casing and shell, setting under described diversion trench screw, described diversion trench offers fluid inlet and liquid outlet, described liquid outlet is opened on inner casing, described fluid inlet is opened on shell, described liquid outlet is connected with nozzle, described nozzle is tangentially arranged on inner casing, the bottom of described bottom land offers multiple outlet, and the center of circle of each outlet is on same circle, described outlet-inclined impeller vane be opened on bottom land, each outlet is all communicated with an exit passageway.
Embodiment four
The high-efficiency electroplating equipment of the present embodiment, comprise the plating tank for placing electroplate liquid be set up in parallel successively, first washing bath, nitric acid groove and the second washing bath, receiving tank is provided with between described nitric acid groove and the second washing bath, described receiving tank is equipped with aerofoil fan, described plating tank comprises circular cell body, described cell body comprises bottom land and is located in the sidewall of bottom land, described sidewall comprises inner casing and shell, described casing is located at the outside of inner casing, spiral helicine diversion trench is formed between described inner casing and shell, setting under described diversion trench screw, described diversion trench offers fluid inlet and liquid outlet, described liquid outlet is opened on inner casing, described fluid inlet is opened on shell, described liquid outlet is connected with nozzle, described nozzle is tangentially arranged on inner casing, the bottom of described bottom land offers multiple outlet, and the center of circle of each outlet is on same circle, described outlet-inclined impeller vane be opened on bottom land, each outlet is all communicated with an exit passageway, each exit passageway forms a spirrillum, and identical with the hand of spiral of diversion trench.
Embodiment five
The high-efficiency electroplating equipment of the present embodiment, comprise the plating tank for placing electroplate liquid be set up in parallel successively, first washing bath, nitric acid groove and the second washing bath, receiving tank is provided with between described nitric acid groove and the second washing bath, described receiving tank is equipped with aerofoil fan, described plating tank comprises circular cell body, described cell body comprises bottom land and is located in the sidewall of bottom land, described sidewall comprises inner casing and shell, described casing is located at the outside of inner casing, spiral helicine diversion trench is formed between described inner casing and shell, setting under described diversion trench screw, described diversion trench offers fluid inlet and liquid outlet, described liquid outlet is opened on inner casing, described fluid inlet is opened on shell, described liquid outlet is connected with nozzle, described nozzle is tangentially arranged on inner casing, the bottom of described bottom land offers multiple outlet, and the center of circle of each outlet is on same circle, described outlet-inclined impeller vane be opened on bottom land, each outlet is all communicated with an exit passageway, each exit passageway forms a spirrillum, and identical with the hand of spiral of diversion trench, each exit passageway is all communicated with a pump, and described pump outlet is communicated with fluid inlet.
Embodiment six
On the basis of above-mentioned any embodiment, the front end of described nozzle is equipped with filtering net.
Embodiment seven
On the basis of above-mentioned any embodiment, two sidewalls of described receiving tank offer through hole respectively, the quantity of described aerofoil fan is 2, and described aerofoil fan is arranged in through hole.

Claims (7)

1. a high-efficiency electroplating equipment, comprise the plating tank for placing electroplate liquid be set up in parallel successively, first washing bath, nitric acid groove and the second washing bath, it is characterized in that, receiving tank is provided with between described nitric acid groove and the second washing bath, described receiving tank is equipped with aerofoil fan, described plating tank comprises circular cell body, described cell body comprises bottom land and is located in the sidewall of bottom land, described sidewall comprises inner casing and shell, described casing is located at the outside of inner casing, spiral helicine diversion trench is formed between described inner casing and shell, setting under described diversion trench screw, described diversion trench offers fluid inlet and liquid outlet, described liquid outlet is opened on inner casing, described fluid inlet is opened on shell, described liquid outlet is connected with nozzle, described nozzle is tangentially arranged on inner casing.
2. high-efficiency electroplating equipment according to claim 1, is characterized in that, the bottom of described bottom land offers multiple outlet, and the center of circle of each outlet is on same circle.
3. high-efficiency electroplating equipment according to claim 2, is characterized in that, described outlet-inclined impeller vane be opened on bottom land, each outlet is all communicated with an exit passageway.
4. high-efficiency electroplating equipment according to claim 3, is characterized in that, each exit passageway forms a spirrillum, and identical with the hand of spiral of diversion trench.
5. high-efficiency electroplating equipment according to claim 4, is characterized in that, each exit passageway is all communicated with a pump, and described pump outlet is communicated with fluid inlet.
6., according to the arbitrary described high-efficiency electroplating equipment of claim 1-5, it is characterized in that, the front end of described nozzle is equipped with filtering net.
7. high-efficiency electroplating equipment according to claim 6, is characterized in that, two sidewalls of described receiving tank offer through hole respectively, and the quantity of described aerofoil fan is 2, and described aerofoil fan is arranged in through hole.
CN201510851035.0A 2015-11-30 2015-11-30 Efficient plating device Pending CN105256364A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201510851035.0A CN105256364A (en) 2015-11-30 2015-11-30 Efficient plating device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201510851035.0A CN105256364A (en) 2015-11-30 2015-11-30 Efficient plating device

Publications (1)

Publication Number Publication Date
CN105256364A true CN105256364A (en) 2016-01-20

Family

ID=55096288

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510851035.0A Pending CN105256364A (en) 2015-11-30 2015-11-30 Efficient plating device

Country Status (1)

Country Link
CN (1) CN105256364A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107653483A (en) * 2017-11-30 2018-02-02 河南恒星科技股份有限公司 Exempt from stirring energy-conservation female groove
CN107675235A (en) * 2017-11-30 2018-02-09 河南恒星科技股份有限公司 Sand device on ultra-fine diamond scroll saw
CN111118551A (en) * 2018-10-31 2020-05-08 和谐工业有限责任公司 Electroforming system and method

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6103085A (en) * 1998-12-04 2000-08-15 Advanced Micro Devices, Inc. Electroplating uniformity by diffuser design
JP2004043873A (en) * 2002-07-10 2004-02-12 Aisin Keikinzoku Co Ltd Method for surface treatment of aluminum alloy
CN101023204A (en) * 2004-06-16 2007-08-22 本田技研工业株式会社 Plating apparatus
CN202705546U (en) * 2012-08-13 2013-01-30 统盟(无锡)电子有限公司 PCB (Printed Circuit Board) electroplating wire line
CN203007457U (en) * 2012-11-30 2013-06-19 东莞市富默克化工有限公司 PCB (Printed Circuit Board) electroplating tank
CN104379819A (en) * 2012-07-02 2015-02-25 新日铁住金株式会社 Electroplating device
CN205590822U (en) * 2015-11-30 2016-09-21 广州镭勒电子有限公司 High -efficient electroplating device

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6103085A (en) * 1998-12-04 2000-08-15 Advanced Micro Devices, Inc. Electroplating uniformity by diffuser design
JP2004043873A (en) * 2002-07-10 2004-02-12 Aisin Keikinzoku Co Ltd Method for surface treatment of aluminum alloy
CN101023204A (en) * 2004-06-16 2007-08-22 本田技研工业株式会社 Plating apparatus
CN104379819A (en) * 2012-07-02 2015-02-25 新日铁住金株式会社 Electroplating device
CN202705546U (en) * 2012-08-13 2013-01-30 统盟(无锡)电子有限公司 PCB (Printed Circuit Board) electroplating wire line
CN203007457U (en) * 2012-11-30 2013-06-19 东莞市富默克化工有限公司 PCB (Printed Circuit Board) electroplating tank
CN205590822U (en) * 2015-11-30 2016-09-21 广州镭勒电子有限公司 High -efficient electroplating device

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
刘仁志: "《电镀生产管理8讲》", 31 January 2007 *

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107653483A (en) * 2017-11-30 2018-02-02 河南恒星科技股份有限公司 Exempt from stirring energy-conservation female groove
CN107675235A (en) * 2017-11-30 2018-02-09 河南恒星科技股份有限公司 Sand device on ultra-fine diamond scroll saw
CN111118551A (en) * 2018-10-31 2020-05-08 和谐工业有限责任公司 Electroforming system and method
US11142840B2 (en) 2018-10-31 2021-10-12 Unison Industries, Llc Electroforming system and method

Similar Documents

Publication Publication Date Title
CN105256364A (en) Efficient plating device
CN105256366A (en) Copper plating device
CN205313692U (en) PCB board plating bath with high -efficient mixing effect
CN105350047A (en) PCB electroplating tank having efficient stirring effect
CN205590822U (en) High -efficient electroplating device
CN207596991U (en) A kind of aeration backwash electroplating bath of metal parts surface metal coating
CN211771641U (en) Automatic electrolytic plating cleaning equipment
CN205474094U (en) Copper -coated device
CN202705546U (en) PCB (Printed Circuit Board) electroplating wire line
WO2016023162A1 (en) Electroplating tank and electroplating device
CN105297119A (en) Electroplating production line
CN205474046U (en) PCB board electroplating production line
CN205590828U (en) Device is electroplated to environment -friendly PCB board
CN205474060U (en) Electroplating production line
CN207672140U (en) Electroplanting device with locomotive function jet flow bar
CN205295528U (en) High -efficient PCB board plating bath
CN105986306B (en) A kind of PCB electroplating systems and its relevant device
CN105350048A (en) PCB electroplating production line
CN203754831U (en) Full-automatic PCB uniform electroplating device
CN105256365A (en) Environment-friendly printed circuit board (PCB) plating device
CN109809600A (en) The quickly device of processing chemical nickel Ageing solution
CN101951732A (en) Improved printed circuit board (PCB) plating line
CN207294928U (en) Horizontal electroplating production line of circuit board
CN210420161U (en) Phosphating production system
CN209890755U (en) Automatic electroplating device

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication

Application publication date: 20160120

RJ01 Rejection of invention patent application after publication