CN205474046U - PCB board electroplating production line - Google Patents
PCB board electroplating production line Download PDFInfo
- Publication number
- CN205474046U CN205474046U CN201520970416.6U CN201520970416U CN205474046U CN 205474046 U CN205474046 U CN 205474046U CN 201520970416 U CN201520970416 U CN 201520970416U CN 205474046 U CN205474046 U CN 205474046U
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- CN
- China
- Prior art keywords
- pcb board
- filter vat
- air inlet
- electroplating bath
- assembly line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The utility model belongs to the technical field of the preparation of PCB board, a PCB board electroplating production line is specifically disclosed for solve the polluted environment of current plating bath existence and the problem of potential safety hazard. The utility model discloses a plating bath, first wash bowl, nitric acid groove and second wash bowl for placing the plating solution, the plating bath has set the generator, the generator is including heating bucket that is used for splendid attire ammonium bicarbonate and the filter vat that is used for splendid attire water, the heating bucket is manage and is said and the filter vat intercommunication, the filter vat is equipped with the intake pipe, the upper end and the pipeline intercommunication of intake pipe, the lower extreme exit position of intake pipe is less than the height of the surface of water, the liquid outlet has been seted up to the bottom of filter vat, the gas outlet has been seted up to the upper segment of filter vat, manage and say that the intercommunication has the air pump in the gas outlet, the inlet port has been seted up to the plating bath, the position of offering of inlet port is higher than the electroplating liquid level in the plating bath, the gas delivery side of pump is in charge of and is said and the inlet port intercommunication.
Description
Technical field
This utility model belongs to pcb board preparing technical field, specifically discloses a kind of pcb board electroplating assembly line.
Background technology
Pcb board, also known as printed circuit board (PCB), is the supplier of electronic devices and components electrical connection.Its development history of existing more than 100 year；It is mainly designed to layout design；The major advantage using circuit board is to greatly reduce wiring and the mistake of assembling, improves Automated water gentle productive labor rate.
During making pcb board, plating is requisite operation, increases hole copper and face copper thickness by galvanizing process, improves corrosion resistance and the electric conductivity of pcb board.In prior art, the technical literature about plating is the most more, the such as utility model of Application No. 201020508381.1 discloses the PCB plating line of a kind of improvement, including PCB copper facing/erosion copper controller, hanger, copper plating groove, rinsing bowl, nitric acid groove, chuck on hanger clamps PCB, PCB copper facing/erosion copper controller controls overhead traveling crane and drives hanger to run, after described nitric acid groove, before rinsing bowl, set drip trays, it is used for collecting the medicinal liquid taken out of from nitric acid groove, described PCB copper facing/erosion copper controller arranges corresponding control program, controls the hanger dropping liquid time on drip trays；Drip trays is provided with liquid level detection device, and described liquid level detection device is connected with described PCB copper facing/erosion copper controller.
The utility model patent of Application No. 201220399046.1 discloses a kind of PCB plating line, it includes the copper plating groove being arranged in order, first rinsing bowl, nitric acid groove, second rinsing bowl, described copper plating groove, first rinsing bowl, nitric acid groove, second rinsing bowl be provided above connecting rod, it is provided with hanger on described connecting rod, chuck it is provided with on hanger, accompany plating bar, it is provided with PCB on described chuck, described hanger can move along described connecting rod, it is provided with on described connecting rod to control the cyclelog that hanger moves, described PCB plating line also includes drip, described drip is arranged between nitric acid groove and the second rinsing bowl, it is additionally provided with blowing device on described drip；Offering through hole respectively on relative two sidewall of described drip, the quantity of described blowing device is two, and said two blowing device is separately positioned in two through holes；Described blowing device is fan.
The utility model patent of Application No. 201320598639.5 discloses a kind of PCB electroplanting device, including plating solution cylinder and at least one anode of being arranged on plating solution cylinder two relative edge's inner face；The inner side of described anode is equipped with insulation barrier parallel with it；Described insulation barrier lower half is provided with via-hole array；Described insulation barrier upper end is higher than the highest plating solution position of plating solution cylinder；In described via-hole array, the spacing of each through hole is 5cm；In described via-hole array, the aperture of through hole is 1-2cm；Described insulation barrier is insulated by several piece, and daughter board is the most detachably connected to be formed.
nullThe utility model patent of Application No. 201420028158.5 discloses a kind of full-automatic PCB uniformly-coating device，Include electroplating cell body，Electroplating cell body forms opening up electroplating bath，Electroplating cell body include just to and parallel interval arrange left plating cell wall and right plating cell wall，Right plating cell wall is positioned at the right-hand member side of left plating cell wall，The interior side of left plating cell wall is equiped with left anode conducting busbar in electroplating bath，The interior side of right plating cell wall is equiped with right anode conducting busbar in electroplating bath，Left anode conducting busbar) mount left titanium basket，Right anode conducting busbar has mounted right titanium basket，It is equiped with vertically extending left conduct current plate in the right-hand member side of left titanium basket in electroplating bath，In electroplating bath, the left end side in right titanium basket is equiped with vertically extending right conduct current plate，Left conduct current plate and right conduct current plate just to and parallel interval arrange，Left conduct current plate and right conduct current plate offer respectively left and right transverse horizontal completely through and in uniform intervals arrange conduct current hole，The bottom of electroplating bath relative can be equiped with vertically extending left anode baffle between left conduct current plate with left titanium basket up and downly，The bottom of electroplating bath relative can be equiped with vertically extending right anode baffle between right conduct current plate with right titanium basket up and downly，The upper end of left plating cell wall and the upper end of right plating cell wall are equiped with baffle plate hoisting mechanism respectively，Each baffle plate hoisting mechanism respectively with the left anode baffle of corresponding side and right anode baffle drive connection；Each described baffle plate hoisting mechanism includes and is installed in the described left plating cell wall of corresponding side and the elevator motor of described right plating cell wall upper end and elevator rotating shaft, the power output shaft of each elevator motor is provided with worm screw respectively, the end correspondence worm screw of each elevator rotating shaft is equiped with turbine respectively, turbine coordinates with corresponding worm screw, is provided with winch rope respectively between described left anode baffle and the described right anode baffle of each elevator rotating shaft and corresponding side.
As the above-mentioned existing electroplanting device told about, it is carried out continuously to improve production efficiency plating, it is thus desirable to electroplating bath upper end must be opened wide, various chemical substance is there is yet with electroplate liquid, in electroplating process, chemical substance can evaporate, and not only pollutes environment and the health on operator brings serious impact.
Utility model content
The electroplate liquid that this utility model exists to solve existing electroplating bath evaporates the problem polluted environment and operator bring potential safety hazard, and a kind of pcb board electroplating assembly line is provided, the volatilization of electrolyte can be reduced, reduce the pollution to environment, and ensure that staff's is healthy.
For solving above-mentioned technical problem, this utility model be the technical scheme is that
nullA kind of pcb board electroplating assembly line，Including setting gradually the electroplating bath for placing electroplate liquid being set up in parallel、First rinsing bowl、Nitric acid groove and the second rinsing bowl，Described electroplating bath、First rinsing bowl、Nitric acid groove and the second rinsing bowl be provided above connecting rod，It is provided with hanger on described connecting rod，It is provided with on described hanger and accompanies plating bar and for clamping the chuck of pcb board，It is characterized in that，Described electroplating bath is equipped with generator，Described generator includes the heating bucket for containing ammonium hydrogen carbonate and for containing the filter vat of water，Described heating bucket connects with filter vat through pipeline，Described filter vat is provided with air inlet pipe，The upper end of described air inlet pipe and pipeline communication，The exit position, lower end of described air inlet pipe is less than the height of the water surface，The bottom of described filter vat offers liquid outlet，The epimere of described filter vat offers gas outlet，There is air pump described gas outlet through pipeline communication，Described electroplating bath offers air inlet，Described air inlet offer position higher than the plating liquid level in electroplating bath，Described gas delivery side of pump connects with air inlet through pipeline.
The outer wall of described heating bucket is provided with electric heater unit.
The outer wall of described electric heater unit is coated with insulated thermal insulating layer, and described insulated thermal insulating layer uses ceramic fiber paper to make.
The upper end of described filter vat is equipped with the inlet for adding water, and described inlet is equipped with sealing lid.
Described air inlet offers the surrounding at electroplating bath uniformly.
Described air inlet is provided with nozzle, being arranged on electroplating bath of described nozzle inclination.
Downward being arranged on electroplating bath of described nozzle inclination.
Being provided with collecting tank between described nitric acid groove and the second rinsing bowl, described collecting tank is equipped with aerator.
Offering through hole respectively on two sidewalls of described collecting tank, the quantity of described aerator is 2, and described aerator is arranged in through hole.
Compared with prior art, this utility model has the advantages that
Pcb board electroplating assembly line of the present utility model, by arranging generator on electroplating bath, during using, heating bucket heating makes ammonium hydrogen carbonate volatilize, substantial amounts of titanium dioxide set and ammonia is produced after ammonium hydrogen carbonate volatilization, by the filtration of water, ammonia is molten is prone to water, by ammonia and carbon dioxide separation, by the effect of air pump by carbon dioxide input to electroplating bath so that the upper surface at electroplate liquid forms carbon dioxide sequestration layer, thus reduces the volatilization of electroplate liquid, reduce the pollution to environment, decrease the impact healthy on staff simultaneously.The carbon dioxide sequestration layer that this utility model is formed, it is possible to ensure the normal and continuous operation of electroplating activity.
Meanwhile, this utility model, by arranging collecting tank, is used for collecting nitric acid, reduces the nitric acid amount in the second rinsing bowl, saving water resource and nitric acid resource.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model；
Labelling in figure: 1, electroplating bath, 2, heating bucket, 3, filter vat, 4, air inlet pipe, 5, electric heater unit, 6, insulated thermal insulating layer, 7, seal lid, 8, air pump, 9, pipeline, 10, air inlet, 11, the first rinsing bowl, 12, nitric acid groove, 13, collecting tank, 14, the second rinsing bowl, 15, connecting rod, 16, chuck, 17, hanger, 18, accompany plating bar, 19, aerator.
Detailed description of the invention
Below in conjunction with embodiment, the utility model will be further described, and described embodiment is only a part of embodiment of this utility model, is not whole embodiments.Based on the embodiment in this utility model, those of ordinary skill in the art obtained under not making creative work premise other used by embodiment, broadly fall into protection domain of the present utility model.
In conjunction with accompanying drawing, pcb board electroplating assembly line of the present utility model, including setting gradually the electroplating bath 1 for placing electroplate liquid being set up in parallel, first rinsing bowl 11, nitric acid groove 12 and the second rinsing bowl 14, described electroplating bath 1, first rinsing bowl 11, nitric acid groove 12 and the second rinsing bowl 14 be provided above connecting rod 15, it is provided with hanger 17 on described connecting rod 15, it is provided with on described hanger 17 and accompanies plating bar 18 and for clamping the chuck 16 of pcb board, wherein, hanger 17 can slide on connecting rod 15, it is equipped with for controlling the control device that hanger 17 moves on connecting rod 15, control device and belong to prior art products, those skilled in the art is appreciated and understood that, do not repeat them here.Described electroplating bath 1 is equipped with generator, described generator includes the heating bucket 2 for containing ammonium hydrogen carbonate and for containing the filter vat 3 of water, described heating bucket 2 connects with filter vat 3 through pipeline, described filter vat 3 is provided with air inlet pipe 4, the upper end of described air inlet pipe 4 and pipeline communication, the exit position, lower end of described air inlet pipe 4 is less than the height of the water surface, the bottom of described filter vat 3 offers liquid outlet, the epimere of described filter vat 3 offers gas outlet, described gas outlet is communicated with air pump 8 through pipeline 9, described electroplating bath 1 offers air inlet 10, described air inlet 10 offer position higher than the plating liquid level in electroplating bath 1, the outlet of described air pump 8 connects with air inlet 10 through pipeline 9.Work process of the present utility model is, heating bucket heating makes to heat the ammonium hydrogen carbonate decomposes in bucket, produces substantial amounts of carbon dioxide and ammonia, and soluble in water according to ammonia, carbon dioxide does not allows the characteristic in the Yishui River；By the filtration of water so that carbon dioxide separates with water.Carbon dioxide enters in electroplating bath by air pump and pipeline so that the upper surface at electroplate liquid forms carbon dioxide sequestration layer, thus reduces the volatilization of electroplate liquid, reduces the pollution to environment, decreases the impact healthy on staff simultaneously.The carbon dioxide sequestration layer that this utility model is formed, it is possible to ensure the normal and continuous operation of electroplating activity.
As a kind of preferably mode of this utility model, the outer wall of described heating bucket 2 is provided with electric heater unit 5, is realized the heat effect of heating bucket 2 by the effect of electric heater unit 5 so that this utility model has simple in construction, easy to operate feature.
In order to reduce scattering and disappearing of heat energy, improving the utilization rate of heat energy, the outer wall of electric heater unit 5 of the present utility model is coated with insulated thermal insulating layer 6, it is preferable that described insulated thermal insulating layer 6 uses ceramic fiber paper to make.
For the ease of continuous firing, the upper end of filter vat 3 of the present utility model is equipped with the inlet for adding water, and described inlet is equipped with sealing lid 7, by arranging inlet and liquid outlet, it is easy to water is circulated effect, prevents at ammonia saturated, it is ensured that filtration of the present utility model.
As a kind of preferably mode of this utility model, described air inlet 10 offers the surrounding at electroplating bath 1 uniformly, it is easy to form carbon dioxide sequestration layer, owing to the density of carbon dioxide is bigger than air, therefore, carbon dioxide layer floats over the upper surface of electroplate liquid and is difficult to distribute, and does not interferes with being carried out continuously of plating simultaneously.
In order to improve practicality of the present utility model, air inlet 10 of the present utility model is provided with nozzle, and being arranged on electroplating bath 1 of described nozzle inclination, wherein nozzle belongs to prior art products, and those skilled in the art can be appreciated and understood that, does not repeats them here.
As a kind of preferably mode of this utility model, what described nozzle inclination was downward is arranged on electroplating bath 1, it is simple to quickly form carbon dioxide sequestration layer.
It is provided with collecting tank 13 between nitric acid groove 12 of the present utility model and the second rinsing bowl 14, described collecting tank 13 is equipped with aerator 19, during using, after entering nitric acid groove 12, staying for some time on collecting tank 13, by the effect of aerator, by the nitric acid of adhesion, from accompanying, plating blows off bar, chuck and pcb board reclaims, reduce the nitric acid amount entered in the second rinsing bowl 14, thus save nitric acid and water resource.
As a kind of preferably mode of this utility model, two sidewalls of described collecting tank 13 offering through hole respectively, the quantity of described aerator 19 is 2, and described aerator 19 is arranged in through hole.
Embodiment one
nullThe pcb board electroplating assembly line of the present embodiment，Including setting gradually the electroplating bath for placing electroplate liquid being set up in parallel、First rinsing bowl、Nitric acid groove and the second rinsing bowl，Described electroplating bath、First rinsing bowl、Nitric acid groove and the second rinsing bowl be provided above connecting rod，It is provided with hanger on described connecting rod，It is provided with on described hanger and accompanies plating bar and for clamping the chuck of pcb board，Described electroplating bath is equipped with generator，Described generator includes the heating bucket for containing ammonium hydrogen carbonate and for containing the filter vat of water，Described heating bucket connects with filter vat through pipeline，Described filter vat is provided with air inlet pipe，The upper end of described air inlet pipe and pipeline communication，The exit position, lower end of described air inlet pipe is less than the height of the water surface，The bottom of described filter vat offers liquid outlet，The epimere of described filter vat offers gas outlet，There is air pump described gas outlet through pipeline communication，Described electroplating bath offers air inlet，Described air inlet offer position higher than the plating liquid level in electroplating bath，Described gas delivery side of pump connects with air inlet through pipeline.
Embodiment two
nullThe pcb board electroplating assembly line of the present embodiment，Including setting gradually the electroplating bath for placing electroplate liquid being set up in parallel、First rinsing bowl、Nitric acid groove and the second rinsing bowl，Described electroplating bath、First rinsing bowl、Nitric acid groove and the second rinsing bowl be provided above connecting rod，It is provided with hanger on described connecting rod，It is provided with on described hanger and accompanies plating bar and for clamping the chuck of pcb board，Described electroplating bath is equipped with generator，Described generator includes the heating bucket for containing ammonium hydrogen carbonate and for containing the filter vat of water，Described heating bucket connects with filter vat through pipeline，Described filter vat is provided with air inlet pipe，The upper end of described air inlet pipe and pipeline communication，The exit position, lower end of described air inlet pipe is less than the height of the water surface，The bottom of described filter vat offers liquid outlet，The epimere of described filter vat offers gas outlet，There is air pump described gas outlet through pipeline communication，Described electroplating bath offers air inlet，Described air inlet offer position higher than the plating liquid level in electroplating bath，Described gas delivery side of pump connects with air inlet through pipeline；The outer wall of described heating bucket is provided with electric heater unit.
Embodiment three
nullThe pcb board electroplating assembly line of the present embodiment，Including setting gradually the electroplating bath for placing electroplate liquid being set up in parallel、First rinsing bowl、Nitric acid groove and the second rinsing bowl，Described electroplating bath、First rinsing bowl、Nitric acid groove and the second rinsing bowl be provided above connecting rod，It is provided with hanger on described connecting rod，It is provided with on described hanger and accompanies plating bar and for clamping the chuck of pcb board，Described electroplating bath is equipped with generator，Described generator includes the heating bucket for containing ammonium hydrogen carbonate and for containing the filter vat of water，Described heating bucket connects with filter vat through pipeline，Described filter vat is provided with air inlet pipe，The upper end of described air inlet pipe and pipeline communication，The exit position, lower end of described air inlet pipe is less than the height of the water surface，The bottom of described filter vat offers liquid outlet，The epimere of described filter vat offers gas outlet，There is air pump described gas outlet through pipeline communication，Described electroplating bath offers air inlet，Described air inlet offer position higher than the plating liquid level in electroplating bath，Described gas delivery side of pump connects with air inlet through pipeline；The outer wall of described heating bucket is provided with electric heater unit；The outer wall of described electric heater unit is coated with insulated thermal insulating layer, and described insulated thermal insulating layer uses ceramic fiber paper to make.
Embodiment four
On the basis of any of the above-described embodiment, the upper end of described filter vat is equipped with the inlet for adding water, and described inlet is equipped with sealing lid.
Embodiment five
On the basis of any of the above-described embodiment, described air inlet offers the surrounding at electroplating bath uniformly.
Embodiment six
On the basis of embodiment five, described air inlet is provided with nozzle, being arranged on electroplating bath of described nozzle inclination.
Embodiment seven
On the basis of embodiment six, downward being arranged on electroplating bath of described nozzle inclination.
Embodiment eight
On the basis of any of the above-described embodiment, being provided with collecting tank between described nitric acid groove and the second rinsing bowl, described collecting tank is equipped with aerator.
Embodiment nine
On the basis of embodiment eight, two sidewalls of described collecting tank offering through hole respectively, the quantity of described aerator is 2, and described aerator is arranged in through hole.
Claims (9)
- null1. a pcb board electroplating assembly line，Including setting gradually the electroplating bath for placing electroplate liquid being set up in parallel、First rinsing bowl、Nitric acid groove and the second rinsing bowl，Described electroplating bath、First rinsing bowl、Nitric acid groove and the second rinsing bowl be provided above connecting rod，It is provided with hanger on described connecting rod，It is provided with on described hanger and accompanies plating bar and for clamping the chuck of pcb board，It is characterized in that，Described electroplating bath is equipped with generator，Described generator includes the heating bucket for containing ammonium hydrogen carbonate and for containing the filter vat of water，Described heating bucket connects with filter vat through pipeline，Described filter vat is provided with air inlet pipe，The upper end of described air inlet pipe and pipeline communication，The exit position, lower end of described air inlet pipe is less than the height of the water surface，The bottom of described filter vat offers liquid outlet，The epimere of described filter vat offers gas outlet，There is air pump described gas outlet through pipeline communication，Described electroplating bath offers air inlet，Described air inlet offer position higher than the plating liquid level in electroplating bath，Described gas delivery side of pump connects with air inlet through pipeline.
- Pcb board electroplating assembly line the most according to claim 1, it is characterised in that the outer wall of described heating bucket is provided with electric heater unit.
- Pcb board electroplating assembly line the most according to claim 2, it is characterised in that the outer wall of described electric heater unit is coated with insulated thermal insulating layer, described insulated thermal insulating layer uses ceramic fiber paper to make.
- Pcb board electroplating assembly line the most according to claim 1, it is characterised in that the upper end of described filter vat is equipped with the inlet for adding water, described inlet is equipped with sealing lid.
- 5. according to the arbitrary described pcb board electroplating assembly line of claim 1-4, it is characterised in that described air inlet offers the surrounding at electroplating bath uniformly.
- Pcb board electroplating assembly line the most according to claim 5, it is characterised in that described air inlet is provided with nozzle, being arranged on electroplating bath of described nozzle inclination.
- Pcb board electroplating assembly line the most according to claim 6, it is characterised in that downward being arranged on electroplating bath of described nozzle inclination.
- Pcb board electroplating assembly line the most according to claim 1, it is characterised in that be provided with collecting tank between described nitric acid groove and the second rinsing bowl, described collecting tank is equipped with aerator.
- Pcb board electroplating assembly line the most according to claim 8, it is characterised in that offering through hole respectively on two sidewalls of described collecting tank, the quantity of described aerator is 2, and described aerator is arranged in through hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520970416.6U CN205474046U (en) | 2015-11-30 | 2015-11-30 | PCB board electroplating production line |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520970416.6U CN205474046U (en) | 2015-11-30 | 2015-11-30 | PCB board electroplating production line |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205474046U true CN205474046U (en) | 2016-08-17 |
Family
ID=56660044
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520970416.6U Expired - Fee Related CN205474046U (en) | 2015-11-30 | 2015-11-30 | PCB board electroplating production line |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205474046U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105350048A (en) * | 2015-11-30 | 2016-02-24 | 成都市天目电子设备有限公司 | PCB electroplating production line |
-
2015
- 2015-11-30 CN CN201520970416.6U patent/CN205474046U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105350048A (en) * | 2015-11-30 | 2016-02-24 | 成都市天目电子设备有限公司 | PCB electroplating production line |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160817 Termination date: 20161130 |