CN105350048A - PCB electroplating production line - Google Patents
PCB electroplating production line Download PDFInfo
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- CN105350048A CN105350048A CN201510853401.6A CN201510853401A CN105350048A CN 105350048 A CN105350048 A CN 105350048A CN 201510853401 A CN201510853401 A CN 201510853401A CN 105350048 A CN105350048 A CN 105350048A
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- pcb board
- tank
- plating tank
- plating
- assembly line
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Abstract
The invention belongs to the technical field of PCB preparation, in particular, discloses a PCB electroplating production line, and is used for solving the problems of environmental pollution and potential safety hazard in a traditional electroplating tank. The PCB electroplating production line comprises an electroplating tank for placing electroplating liquid, a first water washing tank, a nitric acid tank and a second water washing tank, wherein the electroplating tank is provided with a generator; the generator comprises a heating barrel for accommodating ammonium bicarbonate, and a filter barrel for accommodating water; the heating barrel is communicated with the filter barrel by a pipe; the filter barrel is provided with an air intake pipe; the upper end of the air intake pipe is communicated with the pipe; an outlet of the lower end of the air intake pipe is lower than the height of the water; a liquid outlet is formed in the bottom end of the filter barrel; an air outlet is formed in the upper section of the filter barrel, and is communicated with an air pump by a pipe; an air inlet hole is formed in the electroplating tank; the setting position of the air inlet hole is higher than the electroplating liquid in the electroplating tank; and an outlet of the air pump is communicated with the air inlet hole by a pipe.
Description
Technical field
The invention belongs to pcb board preparing technical field, specifically disclose a kind of pcb board electroplating assembly line.
Background technology
Pcb board, also known as printed circuit board (PCB), is the supplier of electronic devices and components electrical connection.Its development has the history of more than 100 year; Its design mainly layout design; Adopt the major advantage of circuit card to be the mistake greatly reducing wiring and assembling, improve the gentle productive labor rate of Automated water.
In the process making pcb board, electroplate the operation that is absolutely necessary, increase hole copper and face copper thickness by galvanizing process, improve erosion resistance and the electroconductibility of pcb board.Technical literature about plating in prior art is also more, the PCB plating line of such as application number a kind of improvement that has been the disclosure of the invention of 201020508381.1, comprise PCB copper facing/erosion copper controller, hanger, copper plating groove, washing bath, nitric acid groove, chuck on hanger clamps PCB, PCB copper facing/erosion copper controller controls overhead traveling crane and drives hanger to run, after described nitric acid groove, before washing bath, establish drip trays, be used for collecting the liquid taken out of from nitric acid groove, in described PCB copper facing/erosion copper controller, corresponding sequence of control is set, controls the dropping liquid time of hanger on drip trays; Drip trays is provided with liquid level detection device, and described liquid level detection device is connected with described PCB copper facing/erosion copper controller.
Application number be 201220399046.1 utility model patent disclose a kind of PCB plating line, it comprises the copper plating groove be arranged in order, first washing bath, nitric acid groove, second washing bath, described copper plating groove, first washing bath, nitric acid groove, the top of the second washing bath is provided with connecting rod, described connecting rod is provided with hanger, hanger is provided with chuck, accompany plating bar, described chuck is provided with PCB, described hanger can move along described connecting rod, described connecting rod is provided with the sequence controller controlling hanger movement, described PCB plating line also comprises drip, described drip is arranged between nitric acid groove and the second washing bath, described drip is also provided with blowing device, two relative sidewalls of described drip offer through hole respectively, and the quantity of described blowing device is two, and described two blowing devices are separately positioned in two through holes, described blowing device is fan.
Application number be 201320598639.5 utility model patent disclose a kind of PCB electroplanting device, comprise plating solution cylinder and be arranged at least one anode of plating solution cylinder two relative edge inner face; The inner side of described anode is equipped with insulation barrier parallel with it; Described insulation barrier Lower Half is provided with via-hole array; Described insulation barrier upper end is higher than the highest plating solution position of plating solution cylinder; In described via-hole array, the spacing of each through hole is 5cm; In described via-hole array, the aperture of through hole is 1-2cm; Described insulation barrier is removably formed by connecting side by side by several piece insulation daughter board.
Application number be 201420028158.5 utility model patent disclose a kind of full-automatic PCB uniformly-coating device, include electroplating cell body, electroplating cell body forms opening up plating tank, electroplating cell body include just to and parallel interval arrange left plating cell wall and right plating cell wall, right plating cell wall is positioned at the right-hand member side of left plating cell wall, the interior side of left plating cell wall is equiped with left anode conducting busbar in plating tank, the interior side of right plating cell wall is equiped with right anode conducting busbar in plating tank, left anode conducting busbar) mount left titanium basket, right anode conducting busbar has mounted right titanium basket, be equiped with the vertical left conduct current plate extended in the right-hand member side of left titanium basket in plating tank, the vertical right conduct current plate extended is equiped with in the left end side of right titanium basket in plating tank, left conduct current plate and right conduct current plate just to and parallel interval arrange, the left and right transverse horizontal that left conduct current plate and right conduct current plate offers respectively runs through and the conduct current hole arranged in uniform intervals completely, the bottom of plating tank can be equiped with the left anode baffle vertically extended between left conduct current plate with left titanium basket up and downly relatively, the bottom of plating tank can be equiped with the right anode baffle vertically extended between right conduct current plate with right titanium basket up and downly relatively, the upper end of left plating cell wall and the upper end of right plating cell wall are equiped with baffle plate hoisting mechanism respectively, each baffle plate hoisting mechanism drives with the left anode baffle of corresponding side and right anode baffle respectively and is connected, each described baffle plate hoisting mechanism includes elevator motor and the elevator rotating shaft of described left plating cell wall and the described right plating cell wall upper end being installed in corresponding side, the power output shaft of each elevator motor is provided with worm screw respectively, the corresponding worm screw in end of each elevator rotating shaft is equiped with turbine respectively, turbine coordinates with corresponding worm screw, is provided with winch rope respectively between the described left anode baffle of each elevator rotating shaft and corresponding side and described right anode baffle.
As the above-mentioned existing electroplanting device told about, in order to enhance productivity, plating is carried out continuously, therefore plating tank upper end is needed to open wide, but there is various chemical substance due to electroplate liquid, in electroplating process, chemical substance can evaporate, not only contaminate environment and bring serious impact to the health of operator.
Summary of the invention
The present invention in order to solve existing plating tank exist electroplate liquid evaporate contaminate environment and operator brought to the problem of potential safety hazard, and a kind of pcb board electroplating assembly line is provided, the volatilization of electrolytic solution can be reduced, reduce the pollution to environment, and ensure that staff's is healthy.
For solving the problems of the technologies described above, the technical solution adopted in the present invention is:
A kind of pcb board electroplating assembly line, comprise the plating tank for placing electroplate liquid setting gradually and be set up in parallel, first washing bath, nitric acid groove and the second washing bath, described plating tank, first washing bath, the top of nitric acid groove and the second washing bath is provided with connecting rod, described connecting rod is provided with hanger, described hanger is provided with and accompanies plating bar and the chuck for clamping pcb board, it is characterized in that, described plating tank is equipped with producer, described producer comprises for the thermotank of splendid attire bicarbonate of ammonia and the filter vat for splendid attire water, described thermotank is communicated with filter vat through pipeline, described filter vat is provided with inlet pipe, the upper end of described inlet pipe and pipeline communication, the outlet position, lower end of described inlet pipe is lower than the height of the water surface, the bottom of described filter vat offers liquid outlet, the epimere of described filter vat offers air outlet, there is air pump described air outlet through pipeline communication, described plating tank offers air inlet port, described air inlet port offer position higher than the plating liquid level in plating tank, described gas pump outlet is communicated with air inlet port through pipeline.
The outer wall of described thermotank is provided with electric heater unit.
The outer wall of described electric heater unit is coated with insulated thermal insulating layer, and described insulated thermal insulating layer adopts ceramic fiber paper to make.
The upper end of described filter vat is equipped with the fluid inlet for adding water, and described fluid inlet is equipped with sealing cover.
Described air inlet port offers the surrounding at plating tank uniformly.
Described air inlet port is provided with nozzle, being arranged on plating tank of described nozzle inclination.
Downward being arranged on plating tank of described nozzle inclination.
Be provided with receiving tank between described nitric acid groove and the second washing bath, described receiving tank is equipped with gas blower.
Two sidewalls of described receiving tank offer through hole respectively, and the quantity of described gas blower is 2, and described gas blower is arranged in through hole.
Compared with prior art, the present invention has following beneficial effect:
Pcb board electroplating assembly line of the present invention, by arranging producer on plating tank, in the process used, thermotank heating makes bicarbonate of ammonia volatilize, a large amount of titanium dioxide covers and ammonia is produced after bicarbonate of ammonia volatilization, by the filteration of water, ammonia is molten is easy to water, by ammonia and carbon dioxide separation, by the effect of air pump, carbonic acid gas is inputed in plating tank, make to form carbon dioxide sequestration layer at the upper surface of electroplate liquid, thus reduce the volatilization of electroplate liquid, reduce the pollution to environment, decrease the impact on staff's health simultaneously.The carbon dioxide sequestration layer that the present invention is formed, can ensure the normal and continuous operation of electroplating activity.
Meanwhile, the present invention, by arranging receiving tank, for collecting nitric acid, reduces the nitric acid amount in the second washing bath, saving water resource and nitric acid resource.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention;
Mark in figure: 1, plating tank, 2, thermotank, 3, filter vat, 4, inlet pipe, 5, electric heater unit, 6, insulated thermal insulating layer, 7, sealing cover, 8, air pump, 9, pipeline, 10, air inlet port, 11, the first washing bath, 12, nitric acid groove, 13, receiving tank, 14, the second washing bath, 15, connecting rod, 16, chuck, 17, hanger, 18, accompany plating bar, 19, gas blower.
Embodiment
Below in conjunction with embodiment, the invention will be further described, and described embodiment is only the present invention's part embodiment, is not whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making other embodiments used obtained under creative work prerequisite, belongs to protection scope of the present invention.
By reference to the accompanying drawings, pcb board electroplating assembly line of the present invention, comprise the plating tank 1 for placing electroplate liquid setting gradually and be set up in parallel, first washing bath 11, nitric acid groove 12 and the second washing bath 14, described plating tank 1, first washing bath 11, the top of nitric acid groove 12 and the second washing bath 14 is provided with connecting rod 15, described connecting rod 15 is provided with hanger 17, described hanger 17 is provided with and accompanies plating bar 18 and the chuck 16 for clamping pcb board, wherein, hanger 17 can slide on connecting rod 15, connecting rod 15 is equipped with the control device for controlling hanger 17 movement, control device belongs to prior art products, those skilled in the art understands and understands, do not repeat them here.Described plating tank 1 is equipped with producer, described producer comprises the thermotank 2 for splendid attire bicarbonate of ammonia and the filter vat 3 for splendid attire water, described thermotank 2 is communicated with filter vat 3 through pipeline, described filter vat 3 is provided with inlet pipe 4, the upper end of described inlet pipe 4 and pipeline communication, the outlet position, lower end of described inlet pipe 4 is lower than the height of the water surface, the bottom of described filter vat 3 offers liquid outlet, the epimere of described filter vat 3 offers air outlet, described air outlet is communicated with air pump 8 through pipeline 9, described plating tank 1 offers air inlet port 10, described air inlet port 10 offer position higher than the plating liquid level in plating tank 1, the outlet of described air pump 8 is communicated with air inlet port 10 through pipeline 9.Working process of the present invention is, thermotank heating makes the bicarbonate of ammonia decomposes in thermotank, and produce a large amount of carbonic acid gas and ammonia, soluble in water according to ammonia, carbonic acid gas does not allow the characteristic in the Yishui River; By the filteration of water, carbonic acid gas is separated with water.Carbonic acid gas enters into plating tank by air pump and pipeline, makes to form carbon dioxide sequestration layer at the upper surface of electroplate liquid, thus reduces the volatilization of electroplate liquid, reduces the pollution to environment, decreases the impact on staff's health simultaneously.The carbon dioxide sequestration layer that the present invention is formed, can ensure the normal and continuous operation of electroplating activity.
As a kind of preferred mode of the present invention, the outer wall of described thermotank 2 is provided with electric heater unit 5, is realized the heat effect of thermotank 2 by the effect of electric heater unit 5, makes the present invention have structure simple, easy to operate feature.
In order to reduce scattering and disappearing of heat energy, improve the utilization ratio of heat energy, the outer wall of electric heater unit 5 of the present invention is coated with insulated thermal insulating layer 6, and preferably, described insulated thermal insulating layer 6 adopts ceramic fiber paper to make.
For the ease of continuous firing, the upper end of filter vat 3 of the present invention is equipped with the fluid inlet for adding water, and described fluid inlet is equipped with sealing cover 7, by arranging fluid inlet and liquid outlet, be convenient to carry out Circulation to water, prevent at ammonia saturated, ensure filteration of the present invention.
As a kind of preferred mode of the present invention, described air inlet port 10 offers the surrounding at plating tank 1 uniformly, be convenient to form carbon dioxide sequestration layer, because the density ratio air of carbonic acid gas is large, therefore, carbon dioxide layer floats over the upper surface of electroplate liquid and not easily distributes, and can not affect carrying out continuously of plating simultaneously.
In order to improve practicality of the present invention, air inlet port 10 of the present invention is provided with nozzle, being arranged on plating tank 1 of described nozzle inclination, and wherein nozzle belongs to prior art products, and those skilled in the art can understand and understand, and does not repeat them here.
As a kind of preferred mode of the present invention, what described nozzle inclination was downward is arranged on plating tank 1, is convenient to form carbon dioxide sequestration layer fast.
Receiving tank 13 is provided with between nitric acid groove 12 of the present invention and the second washing bath 14, described receiving tank 13 is equipped with gas blower 19, in the process used, after entering nitric acid groove 12, receiving tank 13 staying for some time, by the effect of gas blower, the nitric acid of adhesion being reclaimed from accompanying plating bar, chuck and pcb board blowing up to drop into row, reduce the nitric acid amount entered in the second washing bath 14, thus save nitric acid and water resources.
As a kind of preferred mode of the present invention, two sidewalls of described receiving tank 13 offer through hole respectively, and the quantity of described gas blower 19 is 2, and described gas blower 19 is arranged in through hole.
Embodiment one
The pcb board electroplating assembly line of the present embodiment, comprise the plating tank for placing electroplate liquid setting gradually and be set up in parallel, first washing bath, nitric acid groove and the second washing bath, described plating tank, first washing bath, the top of nitric acid groove and the second washing bath is provided with connecting rod, described connecting rod is provided with hanger, described hanger is provided with and accompanies plating bar and the chuck for clamping pcb board, described plating tank is equipped with producer, described producer comprises for the thermotank of splendid attire bicarbonate of ammonia and the filter vat for splendid attire water, described thermotank is communicated with filter vat through pipeline, described filter vat is provided with inlet pipe, the upper end of described inlet pipe and pipeline communication, the outlet position, lower end of described inlet pipe is lower than the height of the water surface, the bottom of described filter vat offers liquid outlet, the epimere of described filter vat offers air outlet, there is air pump described air outlet through pipeline communication, described plating tank offers air inlet port, described air inlet port offer position higher than the plating liquid level in plating tank, described gas pump outlet is communicated with air inlet port through pipeline.
Embodiment two
The pcb board electroplating assembly line of the present embodiment, comprise the plating tank for placing electroplate liquid setting gradually and be set up in parallel, first washing bath, nitric acid groove and the second washing bath, described plating tank, first washing bath, the top of nitric acid groove and the second washing bath is provided with connecting rod, described connecting rod is provided with hanger, described hanger is provided with and accompanies plating bar and the chuck for clamping pcb board, described plating tank is equipped with producer, described producer comprises for the thermotank of splendid attire bicarbonate of ammonia and the filter vat for splendid attire water, described thermotank is communicated with filter vat through pipeline, described filter vat is provided with inlet pipe, the upper end of described inlet pipe and pipeline communication, the outlet position, lower end of described inlet pipe is lower than the height of the water surface, the bottom of described filter vat offers liquid outlet, the epimere of described filter vat offers air outlet, there is air pump described air outlet through pipeline communication, described plating tank offers air inlet port, described air inlet port offer position higher than the plating liquid level in plating tank, described gas pump outlet is communicated with air inlet port through pipeline, the outer wall of described thermotank is provided with electric heater unit.
Embodiment three
The pcb board electroplating assembly line of the present embodiment, comprise the plating tank for placing electroplate liquid setting gradually and be set up in parallel, first washing bath, nitric acid groove and the second washing bath, described plating tank, first washing bath, the top of nitric acid groove and the second washing bath is provided with connecting rod, described connecting rod is provided with hanger, described hanger is provided with and accompanies plating bar and the chuck for clamping pcb board, described plating tank is equipped with producer, described producer comprises for the thermotank of splendid attire bicarbonate of ammonia and the filter vat for splendid attire water, described thermotank is communicated with filter vat through pipeline, described filter vat is provided with inlet pipe, the upper end of described inlet pipe and pipeline communication, the outlet position, lower end of described inlet pipe is lower than the height of the water surface, the bottom of described filter vat offers liquid outlet, the epimere of described filter vat offers air outlet, there is air pump described air outlet through pipeline communication, described plating tank offers air inlet port, described air inlet port offer position higher than the plating liquid level in plating tank, described gas pump outlet is communicated with air inlet port through pipeline, the outer wall of described thermotank is provided with electric heater unit, the outer wall of described electric heater unit is coated with insulated thermal insulating layer, and described insulated thermal insulating layer adopts ceramic fiber paper to make.
Embodiment four
On the basis of above-mentioned any embodiment, the upper end of described filter vat is equipped with the fluid inlet for adding water, and described fluid inlet is equipped with sealing cover.
Embodiment five
On the basis of above-mentioned any embodiment, described air inlet port offers the surrounding at plating tank uniformly.
Embodiment six
On the basis of embodiment five, described air inlet port is provided with nozzle, being arranged on plating tank of described nozzle inclination.
Embodiment seven
On the basis of embodiment six, downward being arranged on plating tank of described nozzle inclination.
Embodiment eight
On the basis of above-mentioned any embodiment, be provided with receiving tank between described nitric acid groove and the second washing bath, described receiving tank is equipped with gas blower.
Embodiment nine
On the basis of embodiment eight, two sidewalls of described receiving tank offer through hole respectively, the quantity of described gas blower is 2, and described gas blower is arranged in through hole.
Claims (9)
1. a pcb board electroplating assembly line, comprise the plating tank for placing electroplate liquid setting gradually and be set up in parallel, first washing bath, nitric acid groove and the second washing bath, described plating tank, first washing bath, the top of nitric acid groove and the second washing bath is provided with connecting rod, described connecting rod is provided with hanger, described hanger is provided with and accompanies plating bar and the chuck for clamping pcb board, it is characterized in that, described plating tank is equipped with producer, described producer comprises for the thermotank of splendid attire bicarbonate of ammonia and the filter vat for splendid attire water, described thermotank is communicated with filter vat through pipeline, described filter vat is provided with inlet pipe, the upper end of described inlet pipe and pipeline communication, the outlet position, lower end of described inlet pipe is lower than the height of the water surface, the bottom of described filter vat offers liquid outlet, the epimere of described filter vat offers air outlet, there is air pump described air outlet through pipeline communication, described plating tank offers air inlet port, described air inlet port offer position higher than the plating liquid level in plating tank, described gas pump outlet is communicated with air inlet port through pipeline.
2. pcb board electroplating assembly line according to claim 1, is characterized in that, the outer wall of described thermotank is provided with electric heater unit.
3. pcb board electroplating assembly line according to claim 2, is characterized in that, the outer wall of described electric heater unit is coated with insulated thermal insulating layer, and described insulated thermal insulating layer adopts ceramic fiber paper to make.
4. pcb board electroplating assembly line according to claim 1, is characterized in that, the upper end of described filter vat is equipped with the fluid inlet for adding water, and described fluid inlet is equipped with sealing cover.
5., according to the arbitrary described pcb board electroplating assembly line of claim 1-4, it is characterized in that, described air inlet port offers the surrounding at plating tank uniformly.
6. pcb board electroplating assembly line according to claim 5, is characterized in that, described air inlet port is provided with nozzle, being arranged on plating tank of described nozzle inclination.
7. pcb board electroplating assembly line according to claim 6, is characterized in that, downward being arranged on plating tank of described nozzle inclination.
8. pcb board electroplating assembly line according to claim 1, is characterized in that, be provided with receiving tank between described nitric acid groove and the second washing bath, described receiving tank is equipped with gas blower.
9. pcb board electroplating assembly line according to claim 8, is characterized in that, two sidewalls of described receiving tank offer through hole respectively, and the quantity of described gas blower is 2, and described gas blower is arranged in through hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510853401.6A CN105350048A (en) | 2015-11-30 | 2015-11-30 | PCB electroplating production line |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510853401.6A CN105350048A (en) | 2015-11-30 | 2015-11-30 | PCB electroplating production line |
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| Publication Number | Publication Date |
|---|---|
| CN105350048A true CN105350048A (en) | 2016-02-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510853401.6A Pending CN105350048A (en) | 2015-11-30 | 2015-11-30 | PCB electroplating production line |
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Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6071387A (en) * | 1997-10-30 | 2000-06-06 | Ohba; Kazuo | Automatic plating method and apparatus thereof |
| CN2411667Y (en) * | 2000-03-20 | 2000-12-27 | 尹思 | CO2 generator |
| JP2001247992A (en) * | 2000-03-08 | 2001-09-14 | Toppan Printing Co Ltd | Electroplating device |
| CN101545116A (en) * | 2008-03-28 | 2009-09-30 | 中国科学院金属研究所 | Method for electroplating inorganic molten salt on surface of magnesium and magnesium alloy with aluminum |
| CN201793791U (en) * | 2010-08-27 | 2011-04-13 | 昆山元茂电子科技有限公司 | Improved PCB (printed circuit board) plating line |
| CN202705535U (en) * | 2012-08-17 | 2013-01-30 | 惠州中京电子科技股份有限公司 | Copper electroplating device for circuit board |
| CN202705546U (en) * | 2012-08-13 | 2013-01-30 | 统盟（无锡）电子有限公司 | PCB (Printed Circuit Board) electroplating wire line |
| CN205474046U (en) * | 2015-11-30 | 2016-08-17 | 成都市天目电子设备有限公司 | PCB board electroplating production line |
-
2015
- 2015-11-30 CN CN201510853401.6A patent/CN105350048A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6071387A (en) * | 1997-10-30 | 2000-06-06 | Ohba; Kazuo | Automatic plating method and apparatus thereof |
| JP2001247992A (en) * | 2000-03-08 | 2001-09-14 | Toppan Printing Co Ltd | Electroplating device |
| CN2411667Y (en) * | 2000-03-20 | 2000-12-27 | 尹思 | CO2 generator |
| CN101545116A (en) * | 2008-03-28 | 2009-09-30 | 中国科学院金属研究所 | Method for electroplating inorganic molten salt on surface of magnesium and magnesium alloy with aluminum |
| CN201793791U (en) * | 2010-08-27 | 2011-04-13 | 昆山元茂电子科技有限公司 | Improved PCB (printed circuit board) plating line |
| CN202705546U (en) * | 2012-08-13 | 2013-01-30 | 统盟（无锡）电子有限公司 | PCB (Printed Circuit Board) electroplating wire line |
| CN202705535U (en) * | 2012-08-17 | 2013-01-30 | 惠州中京电子科技股份有限公司 | Copper electroplating device for circuit board |
| CN205474046U (en) * | 2015-11-30 | 2016-08-17 | 成都市天目电子设备有限公司 | PCB board electroplating production line |
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Application publication date: 20160224 |