CN205223398U - Plating bath device for electrolytic copper foil - Google Patents
Plating bath device for electrolytic copper foil Download PDFInfo
- Publication number
- CN205223398U CN205223398U CN201521058621.1U CN201521058621U CN205223398U CN 205223398 U CN205223398 U CN 205223398U CN 201521058621 U CN201521058621 U CN 201521058621U CN 205223398 U CN205223398 U CN 205223398U
- Authority
- CN
- China
- Prior art keywords
- plating bath
- plating tank
- copper foil
- cistern
- electrolytic copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000007747 plating Methods 0.000 title claims abstract description 42
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 16
- 239000011889 copper foil Substances 0.000 title claims abstract description 16
- 239000007788 liquid Substances 0.000 claims description 34
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 abstract 2
- 238000005457 optimization Methods 0.000 abstract 1
- 239000008151 electrolyte solution Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910001416 lithium ion Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
Landscapes
- Electrolytic Production Of Metals (AREA)
Abstract
The utility model discloses a plating bath device for electrolytic copper foil, including constant current constant potential rectifier and time cistern, go back to the cistern upper end and be equipped with the apron, fixed surface has the plating bath on the apron, one side of returning the cistern is equipped with the circulating pump, is connected with first back flow and second back flow on the circulating pump, and first back flow is linked together with the lower part of returning the cistern, and the second back flow is linked together with the lower part of plating bath, the plating bath outside is equipped with the discharge pipe, and the upper end of discharge pipe is linked together with the upper end of plating bath lateral wall, and the lower extreme of discharge pipe stretches into back in the cistern, be equipped with negative pole and positive pole in the plating bath, the symmetry is equipped with for negative pole and the spacing draw -in groove of positive pole in the plating bath, negative pole and anodal upper end middle part are provided with the lead wire separately to electrode interface with constant current constant potential rectifier is connected through the lead wire. The utility model discloses compact structure, stability, the test operation of being convenient for helps the control and the research of each item parameter, produces for extensive optimization and lays a good foundation.
Description
Technical field
The utility model belongs to electrolytic copper foil technical field, is specifically related to a kind of electrolytic copper foil plating bath arrangement.
Background technology
In recent decades, electrolytic copper foil is applied widely in printed circuit board (PCB), copper-clad plate industry and lithium ion battery industry, brings the production in enormous quantities of electrolytic copper foil and rapid development.In the manufacture production process of electrolytic copper foil, solution and galvanic process parameter have very important effect, and often because various condition limits in producing, technician needs employing to carry out lab scale research in the lab, and then are applied to the mode on production line.When carrying out lab scale research, apparatus structure and parameters is needed to keep the stable of height.
Utility model content
For the ease of the research of laboratory electrolytic copper foil, the utility model object is to provide a kind of electrolytic copper foil plating bath arrangement.
To achieve these goals, the technical scheme taked of the utility model is as follows:
A kind of electrolytic copper foil plating bath arrangement, comprise continuous current/potentiostat and liquid return trough, liquid return trough upper end is provided with cover plate, and cover plate upper surface is fixed with plating tank; The side of liquid return trough is provided with recycle pump, and recycle pump is connected with the first return line and the second return line, the first return line is connected with the bottom of liquid return trough, and the second return line is connected with the bottom of plating tank; Plating tank outside is provided with liquid overflow pipe, and the upper end of liquid overflow pipe is connected with the upper end of plating tank sidewall, and the lower end of liquid overflow pipe is stretched in liquid return trough; Be provided with the negative electrode and anode that are parallel to each other in plating tank, and in plating tank, correspondence is provided with the draw-in groove in order to negative electrode and anode limiting; The upper center of negative electrode and anode is provided with lead-in wire separately, and is connected with the electrode interface of continuous current/potentiostat by lead-in wire.
Preferably, be provided with base plate, described liquid return trough and recycle pump are all fixed on base plate.
Preferably, described negative electrode and anode are Ti electrode plate.
The utility model compact construction, stable, be convenient to test operation, contribute to control and the research of parameters, produce for large-scale optimizatoin and lay a good foundation.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model;
Fig. 2 is the mode of connection schematic diagram of plating tank inner cathode and anode and draw-in groove in Fig. 1.
Embodiment
As shown in Figure 1 and Figure 2, a kind of electrolytic copper foil plating bath arrangement, comprise continuous current/potentiostat 1 and base plate 10, base plate 10 is fixed with liquid return trough 12, liquid return trough 12 upper end is provided with cover plate 7, cover plate 7 upper surface is fixed with plating tank 5, and the front side of liquid return trough 12 is provided with recycle pump 8, and recycle pump 8 is fixed on base plate 10.Recycle pump 8 is connected with the first return line 11 and the second return line 9, first return line 11 is connected with the bottom of liquid return trough 12, the second return line 9 is connected with the bottom of plating tank 5; The arranged on left and right sides of plating tank 5 is equipped with liquid overflow pipe 6, and the upper end of liquid overflow pipe 6 is connected with the upper end of the left and right sidewall of plating tank 5, and the lower end of liquid overflow pipe 6 is stretched in liquid return trough 12.After adding electrolytic solution in liquid return trough 12, electrolytic solution is under the effect of recycle pump 8, can enter in plating tank 5 by the first return line 11 and the second return line 9 in liquid return trough 12, when in plating tank 5, liquid level reaches liquid overflow pipe 6 position, flowed in liquid return trough 12 by liquid overflow pipe 6 again, realize the circulation of electrolytic solution.Front and rear sides in groove plating tank 5 is respectively equipped with negative electrode 4 and anode 2, left and right in plating tank 5 is arranged with in order to negative electrode 4 and the spacing draw-in groove 3 of anode 2, draw-in groove 3 has and negative electrode 4 and the suitable notch of anode 2, described draw-in groove 3 can be fixed on the left and right sidewall in plating tank 5, also can not be fixed in plating tank 5, but the left and right edge lengths needing to make the length of draw-in groove 3 and plating tank 5 is suitable, and draw-in groove 3 clamps negative electrode 4 and anode 2 respectively, then can directly put into plating tank 5.The upper center of negative electrode 4 and anode 2 is provided with lead-in wire separately, and is connected with the electrode interface of continuous current/potentiostat 1 by lead-in wire.Wherein, described negative electrode 4 and anode 2 are Ti electrode plate.
During use, first negative electrode 4 and anode 2 are put into respectively on corresponding position, and be connected with continuous current/potentiostat 1; Get the copper sulfate electrolyte 5L configured, pour in liquid return trough 12, open recycle pump 8, and by the temperature regulator that adds and supporting heating jacket, preheating is carried out to whole system, make the electroplating temperature that electrolytic solution reaches best; Then stop preheating, regulating constant electric current/potentiostat 1 to constant current mode, carries out electrolytic reaction.Question response is complete, closes continuous current/potentiostat 1, is taken out by negative electrode 4 and after rinsing, drying up, is stripped down by Copper Foil lightly with guarded blade utility knife.
After test, soaked by the dilute nitric acid solution that negative electrode 4 puts into 10% ~ 20%, and clean with clear water, use sand papering smooth, anode 2, plating tank 5 and liquid return trough 12 are all rinsed well with clear water, can carry out test next time.
Claims (3)
1. an electrolytic copper foil plating bath arrangement, is characterized in that: comprise continuous current/potentiostat and liquid return trough, and liquid return trough upper end is provided with cover plate, and cover plate upper surface is fixed with plating tank; The side of liquid return trough is provided with recycle pump, and recycle pump is connected with the first return line and the second return line, the first return line is connected with the bottom of liquid return trough, and the second return line is connected with the bottom of plating tank; Plating tank outside is provided with liquid overflow pipe, and the upper end of liquid overflow pipe is connected with the upper end of plating tank sidewall, and the lower end of liquid overflow pipe is stretched in liquid return trough; Be provided with the negative electrode and anode that are parallel to each other in plating tank, and in plating tank, correspondence is provided with the draw-in groove in order to negative electrode and anode limiting; The upper center of negative electrode and anode is provided with lead-in wire separately, and is connected with the electrode interface of continuous current/potentiostat by lead-in wire.
2. electrolytic copper foil plating bath arrangement according to claim 1, is characterized in that: be provided with base plate, and described liquid return trough and recycle pump are all fixed on base plate.
3. electrolytic copper foil plating bath arrangement according to claim 1, is characterized in that: described negative electrode and anode are Ti electrode plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521058621.1U CN205223398U (en) | 2015-12-18 | 2015-12-18 | Plating bath device for electrolytic copper foil |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521058621.1U CN205223398U (en) | 2015-12-18 | 2015-12-18 | Plating bath device for electrolytic copper foil |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205223398U true CN205223398U (en) | 2016-05-11 |
Family
ID=55898475
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201521058621.1U Expired - Fee Related CN205223398U (en) | 2015-12-18 | 2015-12-18 | Plating bath device for electrolytic copper foil |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205223398U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108560026A (en) * | 2018-06-15 | 2018-09-21 | 九江德福科技股份有限公司 | A kind of small test system of electrolysis foil |
| CN110205657A (en) * | 2019-06-25 | 2019-09-06 | 浙江大学 | A kind of electrolytic copper foil plate electroplating experiments device |
| CN112517859A (en) * | 2020-11-24 | 2021-03-19 | 太仓史密斯理查森精密制造有限公司 | Environment-friendly anti-discoloration corrosion-resistant tin plating preparation process for chaplet |
| CN114481233A (en) * | 2021-11-29 | 2022-05-13 | 龙岩学院 | Foil generating device for preparing ultrathin electrolytic copper foil and application thereof |
| CN115044958A (en) * | 2022-06-07 | 2022-09-13 | 赛莱克斯微系统科技（北京）有限公司 | Wafer electroplating liquid return pipe and wafer electroplating equipment |
-
2015
- 2015-12-18 CN CN201521058621.1U patent/CN205223398U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108560026A (en) * | 2018-06-15 | 2018-09-21 | 九江德福科技股份有限公司 | A kind of small test system of electrolysis foil |
| CN110205657A (en) * | 2019-06-25 | 2019-09-06 | 浙江大学 | A kind of electrolytic copper foil plate electroplating experiments device |
| CN112517859A (en) * | 2020-11-24 | 2021-03-19 | 太仓史密斯理查森精密制造有限公司 | Environment-friendly anti-discoloration corrosion-resistant tin plating preparation process for chaplet |
| CN114481233A (en) * | 2021-11-29 | 2022-05-13 | 龙岩学院 | Foil generating device for preparing ultrathin electrolytic copper foil and application thereof |
| CN115044958A (en) * | 2022-06-07 | 2022-09-13 | 赛莱克斯微系统科技（北京）有限公司 | Wafer electroplating liquid return pipe and wafer electroplating equipment |
| CN115044958B (en) * | 2022-06-07 | 2024-05-28 | 赛莱克斯微系统科技（北京）有限公司 | Wafer electroplating liquid return pipe and wafer electroplating equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160511 |