CN110205657A - A kind of electrolytic copper foil plate electroplating experiments device - Google Patents
A kind of electrolytic copper foil plate electroplating experiments device Download PDFInfo
- Publication number
- CN110205657A CN110205657A CN201910554501.7A CN201910554501A CN110205657A CN 110205657 A CN110205657 A CN 110205657A CN 201910554501 A CN201910554501 A CN 201910554501A CN 110205657 A CN110205657 A CN 110205657A
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- Prior art keywords
- plate
- electrolytic cell
- copper foil
- overflow
- cathode
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/04—Wires; Strips; Foils
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/02—Heating or cooling
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/16—Regeneration of process solutions
- C25D21/18—Regeneration of process solutions of electrolytes
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Automation & Control Theory (AREA)
- Electrolytic Production Of Metals (AREA)
Abstract
The invention discloses a kind of electrolytic copper foil plate electroplating experiments devices comprising electrolytic cell, reservoir, electrolyte circulation system, temperature control system and power supply；Cathode titanium plates and anode plate are built-in in electrolytic cell；Power supply is the rectifier of a low voltage and high current；Electrolyte circulation system is by the magnetic drive pump that connects between reservoir and electrolytic cell, valve, flowmeter and pipeline, electrolytic cell two sides in overflow plate, overflow plate and formed positioned at overflow hole of electrolytic cell bottom plate etc.；Temperature control system is made of temperature controller and the heating rod connected to it for being placed on reservoir lower end；The parallel simultaneously adjustable distance of the anode plate and cathode plate.By this palte plating appts, the case where simulating electrolytic copper foil production line can be very good, and each technological parameter facilitates adjusting, is easy to analyze influence of each parameter to copper foil performance.
Description
Technical field
The present invention relates to a kind of electroplanting device more particularly to a kind of plate electroplating experiments devices of electrolytic copper foil.
Background technique
Most countries production electrolytic copper foil uses roll-type continuous electrolysis method in the world at present, and this method is with copper sulphate
Solution is electrolyte, is being the cathode roll of anode, constant speed rotary to be electrolysed in the electrolytic cell of cathode using insoluble material, molten
Copper deposition in liquid forms copper foil to the surface of cathode roller, then continuously removes from cathode roll, through washing, drying, batches,
Former foil is made, then former foil surface is handled according to requirements.And wherein the process flow of foil manufacture includes molten copper
Liquid making, filtration, purification, adjustment temperature etc., then electrolyte is added additive and enters foil machine, by foil machine electro-deposition foil,
Copper concentration reduces in electrolyte, and acid concentration increases, and the poor high acid electrolyte of copper comes back to molten copper slot, carries out molten copper liquid making.If
The exploring experiments of some technological parameters, such as current density, copper ion concentration, additive etc., meeting are carried out using the equipment of factory
Cause the very big waste of resource.
The experimental provision that common laboratory uses is to be put into electrolyte after cathode plate and anode plate being adjusted spacing, selection
Lesser work area controls certain electric current and starts copper facing.Circulation easy to operate, but being the absence of electrolyte is tested, can not be controlled
The flow velocity of electrolyte processed, the case where practical copper foil production line cannot be simulated well；And the copper foil area of preparation is small, Wu Fagen
Tensile sample is prepared according to national standard.
Summary of the invention
The purpose of the present invention is to design a kind of plate electroplating experiments device of electrolytic copper foil, overcomes existing experimental provision
The problem of practical electrolytic copper foil production line can not be simulated, conveniently carries out some exploring experiments.
For achieving the above object, technical scheme is as follows:
A kind of electrolytic copper foil plate electroplating experiments device comprising electrolytic cell, reservoir, electrolyte circulation system, temperature control
System and power supply；The cathode plate and anode plate being placed in parallel are built-in in electrolytic cell, the distance between cathode plate and anode plate can
It adjusts；Power supply is preferably the rectifier of low voltage and high current；Electrolyte circulation system includes connecting between reservoir and electrolytic cell
Magnetic drive pump, valve, flowmeter and pipeline；Temperature control system includes temperature controller and connected to it is placed on reservoir
The heating rod of bottom plate and the temperature sensor being placed in electrolytic cell that is connected with temperature controller.
In the two sides of electrolytic cell, it is additionally provided with overflow plate, and the height of overflow plate is lower than the depth of electrolytic cell, and overflow plate
There are gaps between electrolytic cell side plate in parallel.In the bottom plate of electrolytic cell, between overflow plate and electrolytic cell side plate
Gap is provided with overflow hole, and overflow hole is the through-hole on electrolytic cell bottom plate, and the electrolyte of spilling is direct by the overflow hole
It is flowed into the reservoir being located at immediately below electrolytic cell bottom plate；Meanwhile being arranged on the electrolytic cell bottom plate between two overflow plates
Several pores, and pipeline connection in pore and electrolyte circulation system.
Pagoda connector of the electrolytic cell by matching with its base thread hole and the flow in electrolyte circulation system
Export pipeline is counted to be connected；The reservoir by the pagoda connector that is set to the threaded hole of side plate and matches with the threaded hole with
The valve export pipeline of electrolyte circulation system is connected.
Preferably, several slot positions are arranged in parallel in electrolytic cell, it is set for being placed in parallel cathode plate and anode plate
Slot position more than two, by the way that cathode plate and anode plate to be placed on to different slot positions, adjust between cathode plate and anode plate away from
From adjacent two slot positions distance is 10mm.
Preferably, by the way that the distance that screw rod adjusts cathode plate and anode plate is arranged in upper part of the electrolytic cell.
The electrolytic cell is the flat cuboid container of upper end opening, and cathode plate working size, which meets copper foil test, to be wanted
It asks.
The power supply, anode and cathode output end are connected by copper nose with corresponding anode plate and cathode plate.
The electrolytic cell and reservoir is bonded using acrylic board, and the pipeline of the circulatory system uses silicon rubber
Hose, valve, magnetic drive pump and flowmeter are all made of corrosion-resistant material.
Using above technical scheme, the present invention can reach following effect: the realization of the electrolyte of 1. reservoirs and electrolytic cell is followed
Ring can adjust flow velocity by valve and flowmeter, promote the diffusion of copper ion, reduce concentration polarization.2. cathode plate and anode plate
It is arranged in parallel and adjustable distance, two pole plates are fixed when experiment, and electrolyte enters electrolysis by row's pore of bottom plate
Slot, in a cell in parallel, high speed, one-way flow, overflow plate ensure that the liquid level of electrolyte in electrolytic cell stablize, can simulate
The case where electrolytic copper foil production line.3. temperature control system can guarantee that the temperature of electrolyte keeps in a certain range, preventing
Cupric sulphate crystal.4. it is relatively large by copper foil area prepared by this device, various tests can be carried out.
Detailed description of the invention
Fig. 1 is the overall structure diagram of electrolytic copper foil palte plating apptss of the present invention.
Fig. 2 is the electrolytic cell schematic diagram of electrolytic copper foil palte plating apptss of the present invention.
Fig. 3 is the electrolytic cell floor diagram of electrolytic copper foil palte plating apptss of the present invention.
Fig. 4 is the reservoir floor diagram of electrolytic copper foil palte plating apptss of the present invention.
Wherein in each attached drawing 1 be screw rod；2 be electrolytic cell；3 be flowmeter；4 be valve；5 be magnetic drive pump；6 control for temperature
Device；7 be heating rod；8 be reservoir；9 be overflow plate；10 be cathode can；11 be anode slot；12 be electrolytic cell side plate；13 be excessive
Discharge orifice；14 be pore；15 be threaded hole；16 be heating rod hole;17 be temperature sensor.
Specific embodiment
Below in conjunction with attached drawing, the invention will be further described.
Such as the overall structure diagram that attached drawing 1 is electrolytic copper foil plate electroplating experiments device provided by the invention, the plate
Electroplating experiments device includes electrolytic cell 2, reservoir 8, electrolyte circulation system, temperature control system and power supply.Wherein, electrolytic cell
Cathode plate and anode plate are placed in parallel in 2, the distance between cathode plate and anode plate is adjustable；Electrolyte circulation system includes liquid storage
Flowmeter 3, valve 4, magnetic drive pump 5 and the pipeline connected between slot and electrolytic cell；Temperature control system includes 6 He of temperature controller
The heating rod 7 connected to it for being placed on liquid storage trough floor, the temperature sensing for being placed in electrolytic cell 2 and being connect with temperature controller 6
Device 17, temperature of the temperature control system to monitor electrolyte in electrolytic cell 2 feds back through temperature control further according to the temperature
Device 6 processed controls heating rod 7 and heats to electrolyte in reservoir 8；Power supply is preferably the rectifier of low voltage and high current, power supply
Anode and cathode output end be connected with the anode plate and cathode plate in electrolytic cell by copper nose, opening power supply can carry out plate
Plating.
It is the structural schematic diagram of electrolytic cell such as attached drawing 2.As shown, a kind of preferred embodiment: being provided with cathode in electrolytic cell
Slot 10 and anode slot 11, for being placed in parallel cathode plate and anode plate, set cathode can and anode slot are no less than two respectively
It is a, by the way that cathode plate and anode plate to be placed on to different slot positions, adjust the distance between cathode plate and anode plate；It is another excellent
Scheme is selected, in attached drawing 1: by the way that the distance that screw rod 1 adjusts cathode plate and anode plate is arranged in upper part of the electrolytic cell.Such as 2 institute of attached drawing
Show, in the two sides of electrolytic cell, be additionally provided with overflow plate 9, and the height of overflow plate is lower than the depth of electrolytic cell, and overflow plate 9 with
There are gaps between the side plate 12 of electrolytic cell.Such as attached drawing 3, in the bottom plate of electrolytic cell, positioned at the side plate 12 of overflow plate 9 and electrolytic cell
Between gap, be provided with overflow hole 13, and overflow hole 13 is the through-hole on electrolytic cell bottom plate；Meanwhile be located at two overflow plates 9 it
Between electrolytic cell bottom plate on be provided with several pores 14, and pipeline connection in pore 14 and electrolyte circulation system；It is being electrolysed
The bottom plate of slot is additionally provided with the threaded hole 15 to connect pipeline in electrolytic cell and electrolyte circulation system.If attached drawing 4 is liquid storage
Trough floor schematic diagram, liquid storage trough floor are provided with the heating rod hole 16 to place heating rod 7.
When work, after cathode plate and anode plate place, electrolyte is added in reservoir 8, opens temperature controller 6
Switch, heating rod 7 start to the electrolyte heating in reservoir.Magnetic drive pump 5 is opened, electrolyte passes through valve 4 from reservoir 8,
Magnetic drive pump 5 and flowmeter 3, pipeline, then electrolytic cell 2 is entered by the pore 14 of electrolytic cell bottom plate, guarantee that electrolyte is being electrolysed
Parallel, high speed, one-way flow in slot；Temperature controller 6 is monitored in electrolytic cell 2 by being placed in the temperature sensor 17 of electrolytic cell
The temperature of electrolyte controls the switch of heating rod 7 with this, guarantees the temperature of electrolyte in a suitable range.Electrolytic cell
After interior liquid level of electrolyte reaches certain altitude, electrolyte spilling overflow plate 9, the gap between side plate 12 and overflow plate 9,
It is fed directly in the reservoir 8 immediately below electrolytic cell bottom plate by the overflow hole 13 of electrolytic cell bottom plate again, realizes electrolysis
The circulation of liquid.
Claims (7)
1. a kind of electrolytic copper foil plate electroplating experiments device, it is characterised in that: the plate electroplating experiments device include electrolytic cell,
Reservoir, electrolyte circulation system, temperature control system and power supply；
The electrolytic cell is built-in with the cathode plate and anode plate being placed in parallel, and the distance between cathode plate and anode plate can be adjusted；
Power supply be low voltage and high current rectifier, the power supply anode and cathode output end respectively with the anode plate and yin
Pole plate is connected；
The temperature control system includes temperature controller and the heating rod connected to it for being placed on liquid storage trough floor, Yi Jiyu
The connected temperature sensor being placed in electrolytic cell of temperature controller；
The electrolyte circulation system includes the magnetic drive pump connected between reservoir and electrolytic cell, valve, flowmeter and pipeline；
The electrolyte circulation system further include:
Several pores, several pores are set on the electrolytic cell bottom plate between two overflow plates, and pore and electrolyte recycle
Pipeline connection in system, electrolyte flow into the pore through the pipeline in electrolyte circulation system by reservoir, through described thin
Hole flows into electrolytic cell；
Overflow plate, the overflow plate are set in the two sides of electrolytic cell, and the height of overflow plate is lower than the depth of electrolytic cell, and overflows
There are gaps between flowing plate and electrolytic cell side plate in parallel；
Overflow hole, the overflow hole be set on the bottom plate of electrolytic cell and on electrolytic cell bottom plate through-hole, be located at overflow plate with
Gap between electrolytic cell side plate, the electrolyte overflowed through the overflow plate is fed directly to by the overflow hole is located at electrolysis
In reservoir immediately below trough floor.
2. a kind of electrolytic copper foil plate electroplating experiments device according to claim 1, it is characterised in that: the electrolytic cell is logical
The pagoda connector to match with its base thread hole is crossed to be connected with the flowmeter outlet pipeline in electrolyte circulation system；The storage
Liquid bath passes through the valve of the pagoda connector and electrolyte circulation system that are set to the threaded hole of side plate and match with the threaded hole
Export pipeline is connected.
3. a kind of electrolytic copper foil plate electroplating experiments device according to claim 1, it is characterised in that: in the electrolytic cell
Be arranged in parallel with several slot positions, for being placed in parallel the cathode plate and anode plate, set slot position more than two, pass through by
Cathode plate and anode plate are placed on different slot positions, adjust the distance between cathode plate and anode plate, two adjacent slot positions away from
From for 10mm.
4. a kind of electrolytic copper foil plate electroplating experiments device according to claim 1, it is characterised in that: by electrolytic cell
The distance that screw rod adjusts cathode plate and anode plate is arranged in top.
5. a kind of electrolytic copper foil plate electroplating experiments device according to claim 1, it is characterised in that: the electrolytic cell is
The flat cuboid container of upper end opening, the cathode board size meet copper foil test request.
6. a kind of electrolytic copper foil plate electroplating experiments device according to claim 1, it is characterised in that: the power supply is just
Pole and cathode output end are connected by copper nose with the anode plate and cathode plate.
7. a kind of electrolytic copper foil plate electroplating experiments device according to claim 1, it is characterised in that: the electrolytic cell and
Reservoir is bonded using acrylic board, and the pipeline of the electrolyte circulation system uses silicon rubber hose, valve, magnetic drive pump
Corrosion-resistant material is all made of with flowmeter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910554501.7A CN110205657A (en) | 2019-06-25 | 2019-06-25 | A kind of electrolytic copper foil plate electroplating experiments device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910554501.7A CN110205657A (en) | 2019-06-25 | 2019-06-25 | A kind of electrolytic copper foil plate electroplating experiments device |
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| Publication Number | Publication Date |
|---|---|
| CN110205657A true CN110205657A (en) | 2019-09-06 |
Family
ID=67794458
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910554501.7A Withdrawn CN110205657A (en) | 2019-06-25 | 2019-06-25 | A kind of electrolytic copper foil plate electroplating experiments device |
Country Status (1)
| Country | Link |
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| CN (1) | CN110205657A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110541180A (en) * | 2019-10-12 | 2019-12-06 | 深圳市宜诺自动化设备有限公司 | Aluminum foil continuous oxidation equipment with anode conducting device |
| CN111172566A (en) * | 2020-02-17 | 2020-05-19 | 广东嘉元科技股份有限公司 | Production process for eliminating white spots of electrolytic copper foil, foil forming machine and pole distance control method |
| CN111172565A (en) * | 2020-01-13 | 2020-05-19 | 江西理工大学 | System for electrolytic copper foil experimental research and using method thereof |
| CN112301383A (en) * | 2020-09-07 | 2021-02-02 | 浙江大学 | Method for researching initial electro-crystallization of copper foil and electro-deposition system |
| CN113293413A (en) * | 2021-06-17 | 2021-08-24 | 九江德福科技股份有限公司 | Electrolytic copper foil lab scale experiment groove |
| CN113881974A (en) * | 2021-10-12 | 2022-01-04 | 云南大泽电极科技股份有限公司 | Hydrometallurgy electrolysis simulation experiment system and method |
| CN114481233A (en) * | 2021-11-29 | 2022-05-13 | 龙岩学院 | Foil generating device for preparing ultrathin electrolytic copper foil and application thereof |
| CN115466992A (en) * | 2022-11-01 | 2022-12-13 | 圣达电气有限公司 | Electrolytic copper foil generating device and generating method |
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| CN201817560U (en) * | 2010-09-27 | 2011-05-04 | 重庆建设摩托车股份有限公司 | Novel composite electroplating experimental bath |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110541180A (en) * | 2019-10-12 | 2019-12-06 | 深圳市宜诺自动化设备有限公司 | Aluminum foil continuous oxidation equipment with anode conducting device |
| CN111172565A (en) * | 2020-01-13 | 2020-05-19 | 江西理工大学 | System for electrolytic copper foil experimental research and using method thereof |
| CN111172565B (en) * | 2020-01-13 | 2021-11-30 | 江西理工大学 | System for electrolytic copper foil experimental research and using method thereof |
| CN111172566A (en) * | 2020-02-17 | 2020-05-19 | 广东嘉元科技股份有限公司 | Production process for eliminating white spots of electrolytic copper foil, foil forming machine and pole distance control method |
| CN112301383A (en) * | 2020-09-07 | 2021-02-02 | 浙江大学 | Method for researching initial electro-crystallization of copper foil and electro-deposition system |
| CN113293413A (en) * | 2021-06-17 | 2021-08-24 | 九江德福科技股份有限公司 | Electrolytic copper foil lab scale experiment groove |
| CN113881974A (en) * | 2021-10-12 | 2022-01-04 | 云南大泽电极科技股份有限公司 | Hydrometallurgy electrolysis simulation experiment system and method |
| CN113881974B (en) * | 2021-10-12 | 2023-06-02 | 云南大泽电极科技股份有限公司 | Hydrometallurgical electrolysis simulation experiment system and method |
| CN114481233A (en) * | 2021-11-29 | 2022-05-13 | 龙岩学院 | Foil generating device for preparing ultrathin electrolytic copper foil and application thereof |
| CN115466992A (en) * | 2022-11-01 | 2022-12-13 | 圣达电气有限公司 | Electrolytic copper foil generating device and generating method |
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Application publication date: 20190906 |
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