CN105350047A - PCB electroplating tank having efficient stirring effect - Google Patents
PCB electroplating tank having efficient stirring effect Download PDFInfo
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- CN105350047A CN105350047A CN201510853715.6A CN201510853715A CN105350047A CN 105350047 A CN105350047 A CN 105350047A CN 201510853715 A CN201510853715 A CN 201510853715A CN 105350047 A CN105350047 A CN 105350047A
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- outlet
- inner casing
- stirring effect
- shell
- plating tank
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Abstract
The invention belongs to the technical field of PCB preparation, discloses a PCB electroplating tank having an efficient stirring effect, and is used for solving the problem of stirring nonuniformity in a traditional electroplating tank. The PCB electroplating tank comprises a circular tank body, wherein the tank body comprises a tank bottom and a side wall surrounding the tank bottom; the side wall comprises an inner shell and an outer shell; the outer shell coats the external of the inner shell; a spiral guide tank is formed between the inner shell and the outer shell; the guide tank is spirally formed downwards, and is provided with a liquid inlet and a liquid outlet; the liquid outlet is formed in the inner shell; the liquid inlet is formed in the outer shell; the liquid outlet is connected with a nozzle; and the nozzle is mounted on the inner shell tangentially.
Description
Technical field
The invention belongs to pcb board preparing technical field, specifically disclose a kind of pcb board plating tank with high-efficiency stirring effect.
Background technology
Pcb board, also known as printed circuit board (PCB), is the supplier of electronic devices and components electrical connection.Its development has the history of more than 100 year; Its design mainly layout design; Adopt the major advantage of circuit card to be the mistake greatly reducing wiring and assembling, improve the gentle productive labor rate of Automated water.
In the process making pcb board, electroplate the operation that is absolutely necessary, increase hole copper and face copper thickness by galvanizing process, improve erosion resistance and the electroconductibility of pcb board.Technical literature about plating in prior art is also more, such as application number be 201020508381.1 utility model disclose a kind of PCB plating line of improvement, comprise PCB copper facing/erosion copper controller, hanger, copper plating groove, washing bath, nitric acid groove, chuck on hanger clamps PCB, PCB copper facing/erosion copper controller controls overhead traveling crane and drives hanger to run, after described nitric acid groove, before washing bath, establish drip trays, be used for collecting the liquid taken out of from nitric acid groove, in described PCB copper facing/erosion copper controller, corresponding sequence of control is set, controls the dropping liquid time of hanger on drip trays; Drip trays is provided with liquid level detection device, and described liquid level detection device is connected with described PCB copper facing/erosion copper controller.
Application number be 201220399046.1 utility model patent disclose a kind of PCB plating line, it comprises the copper plating groove be arranged in order, first washing bath, nitric acid groove, second washing bath, described copper plating groove, first washing bath, nitric acid groove, the top of the second washing bath is provided with connecting rod, described connecting rod is provided with hanger, hanger is provided with chuck, accompany plating bar, described chuck is provided with PCB, described hanger can move along described connecting rod, described connecting rod is provided with the sequence controller controlling hanger movement, described PCB plating line also comprises drip, described drip is arranged between nitric acid groove and the second washing bath, described drip is also provided with blowing device, two relative sidewalls of described drip offer through hole respectively, and the quantity of described blowing device is two, and described two blowing devices are separately positioned in two through holes, described blowing device is fan.
Application number be 201320598639.5 utility model patent disclose a kind of PCB electroplanting device, comprise plating solution cylinder and be arranged at least one anode of plating solution cylinder two relative edge inner face; The inner side of described anode is equipped with insulation barrier parallel with it; Described insulation barrier Lower Half is provided with via-hole array; Described insulation barrier upper end is higher than the highest plating solution position of plating solution cylinder; In described via-hole array, the spacing of each through hole is 5cm; In described via-hole array, the aperture of through hole is 1-2cm; Described insulation barrier is removably formed by connecting side by side by several piece insulation daughter board.
Application number be 201420028158.5 utility model patent disclose a kind of full-automatic PCB uniformly-coating device, include electroplating cell body, electroplating cell body forms opening up plating tank, electroplating cell body include just to and parallel interval arrange left plating cell wall and right plating cell wall, right plating cell wall is positioned at the right-hand member side of left plating cell wall, the interior side of left plating cell wall is equiped with left anode conducting busbar in plating tank, the interior side of right plating cell wall is equiped with right anode conducting busbar in plating tank, left anode conducting busbar) mount left titanium basket, right anode conducting busbar has mounted right titanium basket, be equiped with the vertical left conduct current plate extended in the right-hand member side of left titanium basket in plating tank, the vertical right conduct current plate extended is equiped with in the left end side of right titanium basket in plating tank, left conduct current plate and right conduct current plate just to and parallel interval arrange, the left and right transverse horizontal that left conduct current plate and right conduct current plate offers respectively runs through and the conduct current hole arranged in uniform intervals completely, the bottom of plating tank can be equiped with the left anode baffle vertically extended between left conduct current plate with left titanium basket up and downly relatively, the bottom of plating tank can be equiped with the right anode baffle vertically extended between right conduct current plate with right titanium basket up and downly relatively, the upper end of left plating cell wall and the upper end of right plating cell wall are equiped with baffle plate hoisting mechanism respectively, each baffle plate hoisting mechanism drives with the left anode baffle of corresponding side and right anode baffle respectively and is connected, each described baffle plate hoisting mechanism includes elevator motor and the elevator rotating shaft of described left plating cell wall and the described right plating cell wall upper end being installed in corresponding side, the power output shaft of each elevator motor is provided with worm screw respectively, the corresponding worm screw in end of each elevator rotating shaft is equiped with turbine respectively, turbine coordinates with corresponding worm screw, is provided with winch rope respectively between the described left anode baffle of each elevator rotating shaft and corresponding side and described right anode baffle.
In the process of plating, in order to ensure homogeneity and the planarization of coating, needing fully to stir the electroplate liquid in plating tank, keeping evenly to make each additive concentration.In prior art, PCB plating tank is pneumatic blending, and such as patent of invention CN201793793 discloses a kind of novel PC B and electroplates plating cylinder, pneumatic blending, and aspiration tube is all located at plating cylinder bottom portion, parallel current is in plate face, but this electroplanting device also exists the uneven problem of stirring.
Summary of the invention
The uneven problem of stirring that the present invention exists to solve existing plating tank, and a kind of pcb board plating tank with high-efficiency stirring effect is provided, have the advantages that to stir.
For solving the problems of the technologies described above, the technical solution adopted in the present invention is:
A kind of pcb board plating tank with high-efficiency stirring effect, comprise circular cell body, described cell body comprises bottom land and is located in the sidewall of bottom land, it is characterized in that, described sidewall comprises inner casing and shell, described casing is located at the outside of inner casing, spiral helicine diversion trench is formed between described inner casing and shell, setting under described diversion trench screw, described diversion trench offers fluid inlet and liquid outlet, and described liquid outlet is opened on inner casing, and described fluid inlet is opened on shell, described liquid outlet is connected with nozzle, and described nozzle is tangentially arranged on inner casing.
The bottom of described bottom land offers multiple outlet, and the center of circle of each outlet is on same circle.
Described outlet-inclined impeller vane be opened on bottom land, each outlet is all communicated with an exit passageway.
Each exit passageway forms a spirrillum, and identical with the hand of spiral of diversion trench.
Each exit passageway is all communicated with a pump, and described pump outlet is communicated with fluid inlet.
The front end of described nozzle is equipped with filtering net.
Compared with prior art, the present invention has following beneficial effect:
The pcb board plating tank with high-efficiency stirring effect of the present invention, comprise circular cell body, described cell body comprises bottom land and is located in the sidewall of bottom land, described sidewall comprises inner casing and shell, described casing is located at the outside of inner casing, spiral helicine diversion trench is formed between described inner casing and shell, setting under described diversion trench screw, described diversion trench offers fluid inlet and liquid outlet, described liquid outlet is opened on inner casing, described fluid inlet is opened on shell, and described liquid outlet is connected with nozzle, and described nozzle is tangentially arranged on inner casing.In the process used, each nozzle of the present invention forms spirrillum and forms eddy current, thus improves the effect stirred.Outlet of the present invention simultaneously also can form a spiral helicine eddy current, and outlet all forms the identical eddy current of the hand of spiral with nozzle, improves mixing effect of the present invention further.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention;
Mark in figure: 1, inner casing, 2, shell, 3, diversion trench, 4, bottom land, 5, outlet, 6, exit passageway, 7, pump.
Embodiment
Below in conjunction with embodiment, the invention will be further described, and described embodiment is only the present invention's part embodiment, is not whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making other embodiments used obtained under creative work prerequisite, belongs to protection scope of the present invention.
By reference to the accompanying drawings, the pcb board plating tank with high-efficiency stirring effect of the present invention, comprise circular cell body, described cell body comprises bottom land 4 and is located in the sidewall of bottom land, described sidewall comprises inner casing 1 and shell 2, described shell 2 is set in the outside of inner casing 1, spiral helicine diversion trench 3 is formed between described inner casing 1 and shell 2, setting under described diversion trench 3 screw, described diversion trench 3 offers fluid inlet and liquid outlet, described liquid outlet is opened on inner casing 1, described fluid inlet is opened on shell 2, described liquid outlet is connected with nozzle, described nozzle is tangentially arranged on inner casing 1.As a kind of preferred mode of the present invention, described liquid outlet to be opened in uniformly on inner casing 1 and to be communicated with diversion trench.In the process used, each nozzle of the present invention forms spirrillum and forms eddy current, thus improves the effect stirred.
As a kind of preferred mode of the present invention, the bottom of bottom land 4 offers multiple outlet 5, and the center of circle of each outlet 5 is on same circle.
What described outlet 5 was tilted is opened on bottom land, and each outlet 5 is all communicated with an exit passageway 6.
Each exit passageway 5 forms a spirrillum, and identical with the hand of spiral of diversion trench 3.
Each exit passageway 6 is all communicated with a pump 7, and the outlet of described pump 7 is communicated with fluid inlet.
In order to improve practicality of the present invention, prevent the blocking of nozzle, the front end of described nozzle is equipped with filtering net.Wherein nozzle belongs to prior art products, and those skilled in the art can understand and understand, and does not repeat them here.
Outlet of the present invention also can form a spiral helicine eddy current, and outlet all forms the identical eddy current of the hand of spiral with nozzle, improves mixing effect of the present invention further.
Embodiment one
The pcb board plating tank with high-efficiency stirring effect of the present embodiment, comprise circular cell body, described cell body comprises bottom land and is located in the sidewall of bottom land, described sidewall comprises inner casing and shell, described casing is located at the outside of inner casing, spiral helicine diversion trench is formed between described inner casing and shell, setting under described diversion trench screw, described diversion trench offers fluid inlet and liquid outlet, described liquid outlet is opened on inner casing, described fluid inlet is opened on shell, and described liquid outlet is connected with nozzle, and described nozzle is tangentially arranged on inner casing.
Embodiment two
The pcb board plating tank with high-efficiency stirring effect of the present embodiment, comprise circular cell body, described cell body comprises bottom land and is located in the sidewall of bottom land, described sidewall comprises inner casing and shell, described casing is located at the outside of inner casing, spiral helicine diversion trench is formed between described inner casing and shell, setting under described diversion trench screw, described diversion trench offers fluid inlet and liquid outlet, described liquid outlet is opened on inner casing, described fluid inlet is opened on shell, and described liquid outlet is connected with nozzle, and described nozzle is tangentially arranged on inner casing; The bottom of described bottom land offers multiple outlet, and the center of circle of each outlet is on same circle.
Embodiment three
The pcb board plating tank with high-efficiency stirring effect of the present embodiment, comprise circular cell body, described cell body comprises bottom land and is located in the sidewall of bottom land, described sidewall comprises inner casing and shell, described casing is located at the outside of inner casing, spiral helicine diversion trench is formed between described inner casing and shell, setting under described diversion trench screw, described diversion trench offers fluid inlet and liquid outlet, described liquid outlet is opened on inner casing, described fluid inlet is opened on shell, and described liquid outlet is connected with nozzle, and described nozzle is tangentially arranged on inner casing; The bottom of described bottom land offers multiple outlet, and the center of circle of each outlet is on same circle; Described outlet-inclined impeller vane be opened on bottom land, each outlet is all communicated with an exit passageway.
Embodiment four
The pcb board plating tank with high-efficiency stirring effect of the present embodiment, comprise circular cell body, described cell body comprises bottom land and is located in the sidewall of bottom land, described sidewall comprises inner casing and shell, described casing is located at the outside of inner casing, spiral helicine diversion trench is formed between described inner casing and shell, setting under described diversion trench screw, described diversion trench offers fluid inlet and liquid outlet, described liquid outlet is opened on inner casing, described fluid inlet is opened on shell, and described liquid outlet is connected with nozzle, and described nozzle is tangentially arranged on inner casing; The bottom of described bottom land offers multiple outlet, and the center of circle of each outlet is on same circle; Described outlet-inclined impeller vane be opened on bottom land, each outlet is all communicated with an exit passageway; Each exit passageway forms a spirrillum, and identical with the hand of spiral of diversion trench.
Embodiment five
The pcb board plating tank with high-efficiency stirring effect of the present embodiment, comprise circular cell body, described cell body comprises bottom land and is located in the sidewall of bottom land, described sidewall comprises inner casing and shell, described casing is located at the outside of inner casing, spiral helicine diversion trench is formed between described inner casing and shell, setting under described diversion trench screw, described diversion trench offers fluid inlet and liquid outlet, described liquid outlet is opened on inner casing, described fluid inlet is opened on shell, and described liquid outlet is connected with nozzle, and described nozzle is tangentially arranged on inner casing; The bottom of described bottom land offers multiple outlet, and the center of circle of each outlet is on same circle; Described outlet-inclined impeller vane be opened on bottom land, each outlet is all communicated with an exit passageway; Each exit passageway forms a spirrillum, and identical with the hand of spiral of diversion trench; Each exit passageway is all communicated with a pump, and described pump outlet is communicated with fluid inlet.
Embodiment six
On the basis of above-mentioned any embodiment, the front end of described nozzle is equipped with filtering net.
Claims (6)
1. one kind has the pcb board plating tank of high-efficiency stirring effect, comprise circular cell body, described cell body comprises bottom land and is located in the sidewall of bottom land, it is characterized in that, described sidewall comprises inner casing and shell, described casing is located at the outside of inner casing, spiral helicine diversion trench is formed between described inner casing and shell, setting under described diversion trench screw, described diversion trench offers fluid inlet and liquid outlet, and described liquid outlet is opened on inner casing, and described fluid inlet is opened on shell, described liquid outlet is connected with nozzle, and described nozzle is tangentially arranged on inner casing.
2. the pcb board plating tank with high-efficiency stirring effect according to claim 1, is characterized in that, the bottom of described bottom land offers multiple outlet, and the center of circle of each outlet is on same circle.
3. the pcb board plating tank with high-efficiency stirring effect according to claim 2, is characterized in that, described outlet-inclined impeller vane be opened on bottom land, each outlet is all communicated with an exit passageway.
4. the pcb board plating tank with high-efficiency stirring effect according to claim 3, is characterized in that, each exit passageway forms spirrillum, and identical with the hand of spiral of diversion trench.
5. the pcb board plating tank with high-efficiency stirring effect according to claim 4, it is characterized in that, each exit passageway is all communicated with a pump, and described pump outlet is communicated with fluid inlet.
6., according to the arbitrary described pcb board plating tank with high-efficiency stirring effect of claim 1-5, it is characterized in that, the front end of described nozzle is equipped with filtering net.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510853715.6A CN105350047A (en) | 2015-11-30 | 2015-11-30 | PCB electroplating tank having efficient stirring effect |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510853715.6A CN105350047A (en) | 2015-11-30 | 2015-11-30 | PCB electroplating tank having efficient stirring effect |
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| Publication Number | Publication Date |
|---|---|
| CN105350047A true CN105350047A (en) | 2016-02-24 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510853715.6A Pending CN105350047A (en) | 2015-11-30 | 2015-11-30 | PCB electroplating tank having efficient stirring effect |
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| Country | Link |
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| CN (1) | CN105350047A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114367211A (en) * | 2021-12-17 | 2022-04-19 | 颀中科技（苏州）有限公司 | Pneumatic reaction liquid stirring device for chip packaging |
| CN117265609A (en) * | 2023-11-20 | 2023-12-22 | 圆周率半导体(南通)有限公司 | Electroplating equipment and method for improving uniformity of PCB hole filling electroplating copper plating |
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| US6103085A (en) * | 1998-12-04 | 2000-08-15 | Advanced Micro Devices, Inc. | Electroplating uniformity by diffuser design |
| CN101023204A (en) * | 2004-06-16 | 2007-08-22 | 本田技研工业株式会社 | Plating apparatus |
| CN101403132A (en) * | 2007-11-08 | 2009-04-08 | 匡优新 | Ejection apparatus for electroplating assembly line |
| CN203007457U (en) * | 2012-11-30 | 2013-06-19 | 东莞市富默克化工有限公司 | PCB (Printed Circuit Board) electroplating tank |
| CN203625508U (en) * | 2013-12-06 | 2014-06-04 | 东莞市常晋凹版模具有限公司 | Improved electroplating apparatus |
| CN104911637A (en) * | 2014-09-02 | 2015-09-16 | 李新华 | Direct electrodeposition equipment |
| CN205313692U (en) * | 2015-11-30 | 2016-06-15 | 成都市天目电子设备有限公司 | PCB board plating bath with high -efficient mixing effect |
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2015
- 2015-11-30 CN CN201510853715.6A patent/CN105350047A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6103085A (en) * | 1998-12-04 | 2000-08-15 | Advanced Micro Devices, Inc. | Electroplating uniformity by diffuser design |
| CN101023204A (en) * | 2004-06-16 | 2007-08-22 | 本田技研工业株式会社 | Plating apparatus |
| CN101403132A (en) * | 2007-11-08 | 2009-04-08 | 匡优新 | Ejection apparatus for electroplating assembly line |
| CN203007457U (en) * | 2012-11-30 | 2013-06-19 | 东莞市富默克化工有限公司 | PCB (Printed Circuit Board) electroplating tank |
| CN203625508U (en) * | 2013-12-06 | 2014-06-04 | 东莞市常晋凹版模具有限公司 | Improved electroplating apparatus |
| CN104911637A (en) * | 2014-09-02 | 2015-09-16 | 李新华 | Direct electrodeposition equipment |
| CN205313692U (en) * | 2015-11-30 | 2016-06-15 | 成都市天目电子设备有限公司 | PCB board plating bath with high -efficient mixing effect |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114367211A (en) * | 2021-12-17 | 2022-04-19 | 颀中科技（苏州）有限公司 | Pneumatic reaction liquid stirring device for chip packaging |
| CN117265609A (en) * | 2023-11-20 | 2023-12-22 | 圆周率半导体(南通)有限公司 | Electroplating equipment and method for improving uniformity of PCB hole filling electroplating copper plating |
| CN117265609B (en) * | 2023-11-20 | 2024-04-09 | 圆周率半导体(南通)有限公司 | Electroplating equipment and method for improving uniformity of PCB hole filling electroplating copper plating |
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Application publication date: 20160224 |
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| RJ01 | Rejection of invention patent application after publication |