CN213596442U

CN213596442U - Multifunctional electrolytic copper plating bath for laboratory

Info

Publication number: CN213596442U
Application number: CN202022494240.5U
Authority: CN
Inventors: 董光义; 刘建; 王芳; 王兴平
Original assignee: Cookson Enthone Chemistry Shanghai Co Ltd
Current assignee: Alent Enthone Chemistry Shanghai Co Ltd
Priority date: 2020-11-02
Filing date: 2020-11-02
Publication date: 2021-07-02
Anticipated expiration: 2030-11-02

Abstract

The utility model provides a laboratory is with multi-functional electrolytic copper plating groove, this electrolytic copper plating groove include control box and plating bath main part, are provided with pulse rectifier socket, direct current rectifier socket and swing controller in the control box, the plating bath main part is upper end open-ended square or cuboid, and its upper end is provided with the cathode bar that is used for hanging the product of waiting to electroplate and arranges two anode bars that are used for hanging the positive pole in the cathode bar both sides, and the cathode bar both ends are installed in the plating bath main part through the device that sways, and the both ends of every anode bar are installed through the portable seat that can follow plating bath main part edge removal in the plating bath main part, this laboratory is with multi-functional electrolytic copper plating groove still including the system of inflating, and the inflation pipe setting of this system of inflating is provided with the gas inflating hole inside the plating bath main part. The electro-coppering tank can simulate the electro-coppering mode of a vertical continuous electro-coppering line, and can also achieve the effect of the traditional gantry electro-coppering line, namely, the multi-purpose effect of one tank is realized.

Description

Multifunctional electrolytic copper plating bath for laboratory

Technical Field

The utility model belongs to the technical field of the electro-coppering, specifically speaking relates to a laboratory is with multi-functional electro-coppering groove.

Background

In the manufacturing process of Printed Circuit Boards (PCBs), since the electroplated copper layer has the advantages of good electrical conductivity, thermal conductivity, mechanical ductility and the like, the electroplated copper is an essential key process. The quality of the electroplated copper is closely related to the quality of the final PCB, and the conventional PCB electroplated copper process comprises whole board copper plating, pattern circuit copper plating, micropore filling or plated hole copper plating and the like. Most of the common plating solutions are acid sulfate plating solutions, and the electroplating modes comprise vertical gantry line electroplating, vertical continuous electroplating, horizontal electroplating and other modes.

With the miniaturization and multi-functionalization of electronic products, the electroplated copper of the PCB is increasingly refined, the quality control of the electroplated copper is increasingly strict, the previous large and thick electroplated copper process is increasingly unable to meet the requirements of the existing process, electroplating additive suppliers need to perform experiments more finely, and the product with more multifunction meets the requirements of the existing process.

The existing common laboratory copper plating bath can only meet 1-3 electroplating conditions at the same time, and if laboratories need different electroplating processes, the design of the bath body needs to be changed or new bath bodies need to be redesigned to meet the requirements of the different electroplating processes, so that the design of the multifunctional laboratory copper plating bath for the laboratories is very necessary to meet the requirements of various different electroplating processes.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a laboratory is with multi-functional electrolytic copper plating groove, electrolytic copper plating groove both can simulate the electroplating mode of perpendicular continuous electric plate wire, can also reach the effect of traditional longmen electric plate wire, can satisfy the needs of multiple different electrolytic copper plating technology.

In order to achieve the above purpose, the technical scheme of the utility model is as follows:

a multifunctional electrolytic copper plating tank for a laboratory comprises a control box and a plating tank main body, wherein a pulse rectifier socket, a direct current rectifier socket and a swing controller are arranged in the control box, the plating tank main body is a cube or a cuboid with an opening at the upper end, a cathode rod for hanging a product to be plated and two anode rods arranged at two sides of the cathode rod and used for hanging anodes are arranged at the upper end of the plating tank main body, two ends of each cathode rod are arranged on the plating tank main body through a swing device, two ends of each anode rod are arranged on the plating tank main body through movable seats capable of moving along the edge of the plating tank main body,

this laboratory is with multi-functional electrolytic copper plating groove still includes the system of inflating, and the system of inflating's inflation pipe sets up inside plating bath main part and is provided with a plurality of air inflating holes on its perisporium.

Preferably, the gas injection pipe is arranged at the bottom of the plating bath main body and is positioned below a product to be plated.

Preferably, a pumping controller is further disposed in the control box for controlling the pumping amount.

Preferably, the copper electroplating tank further comprises a plating solution circulating system, and a circulating controller is further arranged in the control box and used for controlling the flow rate of the circulating plating solution.

Preferably, the plating solution circulating system comprises a jet pipe, a liquid outlet pipe, a circulating pump, a liquid inlet pipe, a flow meter and a filter, wherein the jet pipe is used for jetting the plating solution and is positioned inside the plating bath main body and connected with the tail end of the liquid inlet pipe.

Preferably, the filter and the flow meter are mounted at one end of the outlet pipe, and the filter is located upstream of the flow meter.

Preferably, the number of the liquid inlet pipes is 2, and each liquid inlet pipe is connected with a respective flowmeter and a respective filter.

Preferably, the jet pipe is arranged at the bottom of the plating bath main body and positioned at two sides and below a product to be plated, and a plurality of jet holes for jetting the plating solution are arranged on the side wall of the jet pipe facing the product to be plated.

Preferably, the jet pipes arranged at both sides of the product to be electroplated are comb-shaped, and the jet pipes arranged below the product to be electroplated are tubular.

Preferably, the electrolytic copper plating tank further comprises a vibration motor connected with the cathode rod, and a vibration regulator is further arranged in the control box and used for controlling the power of the vibration motor.

The utility model provides a power supply of the multifunctional electrolytic copper plating bath for the laboratory, which can use both direct current power supply and pulse power supply, thus realizing the selectivity of the power supply; the anode rod can be used for hanging different anodes (such as a soluble anode titanium basket and an insoluble anode titanium mesh), so that the versatility of the anode shape is increased; the distance between the anode rod and the cathode rod is adjustable, so that the distance between the anode rod and the cathode rod can be adjusted according to needs in the use process; the swinging device of the cathode can enable a product to be electroplated, which is hung on the cathode rod, to swing at an angle of 45 degrees or horizontally swing so as to reduce the influence of physical differences of electroplating solution in the copper electroplating tank on the electroplating uniformity; the electroplating solution circulating system enables the electroplating solution to be subjected to common filtering circulation, and can be matched with the swinging device and the inflating system to realize a multi-form flowing mode of the electroplating solution near a product to be electroplated so as to simulate an electroplating mode of a vertical continuous electroplating line (VCP). The utility model discloses a laboratory can also make the cooperation of shock motor and system of inflating with multi-functional copper-plating groove, reaches the effect of traditional longmen electric plate wire.

Therefore, the utility model discloses following beneficial effect has been reached:

the trough is multipurpose, not only can meet the efficacy of a common gantry electroplating line, but also can meet the requirements of a novel vertical continuous electroplating line; the stirring mode can be a pumping mode or a plating solution jet mode so as to meet the exchange capacity of the plating solution in the holes of the large through holes and the micro blind holes; meanwhile, the requirement of common direct current electroplating on the copper thickness in the hole can be met, and the requirement of pulse electroplating on the copper thickness of a thick plate with a large aspect ratio can also be met. Therefore, the utility model discloses a laboratory has really realized the multi-purpose effect in a groove with multi-functional copper electroplating tank.

Drawings

In order to illustrate the embodiments of the invention more clearly, reference will now be made briefly to the attached drawings of embodiments, it being understood that the drawings described below are only examples of some embodiments of the invention, and that other drawings may be derived from these drawings by a person skilled in the art without the inventive step in the forerunner.

Fig. 1 is a schematic perspective view of a multifunctional electroplated copper bath for a laboratory according to an embodiment of the present invention.

FIG. 2 is a plating tank main body of the copper electroplating tank of FIG. 1 in operation, with an anode and a product to be electroplated suspended therein.

Detailed Description

In the description of the utility model, the material for preparing the plating bath main body can be PP or PVC.

In the context of the present invention, the anode may be a commercially available product commonly used in the art, such as an anode titanium basket or mesh.

In the description of the present invention, "upstream" is referred to the direction of flow of the plating solution.

In order to make the technical means, creation features, achievement purposes and effects of the present invention easy to understand and understand, the present invention is further explained below with reference to the accompanying drawings.

As shown in fig. 1, the multifunctional electroplated copper tank 1 for the laboratory of the present invention comprises a control box 10, a plating tank main body 20, and a plating solution circulating unit 30. The control box 10 is internally provided with a pulse rectifier socket 11, a direct current rectifier socket 12, a circulation controller 13, a vibration regulator 14, a swing controller 15 and a pumping controller 16. The plating bath main body 20 is a rectangular parallelepiped with an open upper end, and a first anode rod 21 and a second anode rod 21' for suspending the anode and a cathode rod 22 for suspending the plating product are provided above the plating bath main body. Both ends of the first and second anode rods 21 and 21 'are respectively mounted on the edge of the plating bath body 20 through two movable seats 211, and the movable seats 211 may be clamps, which are clamped on the edge of the plating bath body 20 and can be moved along the edge to adjust the distance between the first and second anode rods 21 and 21' and the cathode rod 22. The cathode rods 22 are mounted at both ends thereof on the plating tank body 20 by the electrode swing device 221, and the electrode swing device 221 can provide various swing patterns and swing directions, for example, so that the product to be plated, which is hung on the cathode rods, swings at an angle of 45 degrees or horizontally. The laboratory is with multi-functional electrolytic copper plating groove 1 still includes the system of inflating, and the system of inflating 23 sets up in the bottom of plating bath main part 20 of this inflating. The gas injection pipe 23 is connected to a fan (not shown) provided outside the plating tank main body 20, and injects gas into the plating solution in the copper plating tank. As can be seen more clearly from FIG. 2, the gas injection pipe 23 is provided at the bottom of the main body of the electrolytic copper plating tank and below the product to be plated 102, and has a plurality of gas injection holes (not shown) provided in the peripheral wall thereof.

The circulation unit 30 includes a spout pipe 31, an outlet pipe 32, an inlet pipe 33, a filter 34, a flow meter 35, and a circulation pump 36. The jet pipe 31 is connected to one end of the liquid inlet pipe 33, the other end of the liquid inlet pipe 33 is directly connected to the circulating pump 36, one end of the liquid outlet pipe 32 close to the circulating pump 36 is connected to the filter 34, the filter 34 is connected to the upstream of the flow meter 35 (the arrow in the figure indicates the flow direction of the plating solution), which plays a role of protecting the flow meter, and the plating solution flowing out from the flow meter 35 directly enters the liquid chamber 361 of the circulating pump 36. There are two effluent pipes 32, the ends of the effluent pipes 32 being located at different points in the plating bath, and each effluent pipe being connected to a respective filter 34 and flow meter 35.

In the embodiment shown in fig. 1, the blast pipes 31 are composed of a pair of comb-shaped blast pipes symmetrically disposed on both sides of the product to be plated and a tubular blast pipe disposed below the product to be plated, and each of the blast pipes is provided with a blast hole (not shown in the figure) in a side wall portion facing the product to be plated so that the plating solution ejected from the blast pipe 31 is ejected toward the product to be plated.

The outer side wall of the plating bath main body 20 of the multifunctional electroplated copper bath 1 for the laboratory as shown in fig. 1 is also provided with a vibrating motor 50, and the vibrating motor 50 is directly connected with the cathode rod 22 and vibrates a product to be electroplated, which is hung on the cathode rod 22, when being started.

As shown in fig. 2, when in use, a required pulse rectifier socket or dc rectifier socket is selected; suspending an anode 101 and an anode 101 '(e.g., an insoluble anode titanium mesh) on a first anode bar 21 and a second anode bar 21', and a charged plating product 102 on a cathode bar 22; one or more of the plating liquid circulation system 30, the pump-up system, the vibration motor 50 and the swing device 221 are simultaneously turned on or selectively turned on as needed while being controlled by their respective controllers to plate the strip plated product 102.

Through the above description, can see the utility model discloses laboratory is with multi-functional electrolytic copper plating bath, satisfy the multifunctionality of electroplating the experimental groove, satisfy the requirement of different processes of different products to the electrolytic copper plating, realize the multi-functional multifunctionality of a groove, the requirement of different functional cell bodies to experiment place and cost has been reduced, and produced waste water environmental protection cost when having reduced because of the human cost that the transfer plating solution that brings to different process requirements consumes and the washtrough, reduced cost has been realized in the true sense, the place, save time, the requirement of environmental protection.

From the above description, it can be seen that the distance between the cathode and the anode of the copper electroplating bath of the present invention is adjustable, so that the copper electroplating bath can meet the requirements of different electroplating processes for different samples to be electroplated on the distance between the cathode and the anode.

The foregoing shows and describes the general principles, essential features and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. A multifunctional electroplating copper tank for a laboratory is characterized by comprising a control box and an electroplating tank main body, wherein a pulse rectifier socket, a direct current rectifier socket and a swing controller are arranged in the control box, the electroplating tank main body is a square or cuboid with an opening at the upper end, a cathode rod for hanging a product to be electroplated and two anode rods arranged on two sides of the cathode rod and used for hanging anodes are arranged on the upper end of the electroplating tank main body, two ends of each cathode rod are arranged on the electroplating tank main body through a swing device, two ends of each anode rod are arranged on the electroplating tank main body through movable seats capable of moving along the edge of the electroplating tank main body,

the multifunctional electroplating copper tank for the laboratory further comprises an inflating system, wherein an inflating pipe of the inflating system is arranged in the electroplating tank main body, and a plurality of inflating holes are formed in the peripheral wall of the electroplating tank main body.

2. The laboratory multifunctional electroplated copper tank of claim 1, wherein the gas injection pipe is arranged at the bottom of the electroplating tank main body and below a product to be electroplated.

3. The laboratory multifunctional electrolytic copper plating bath according to claim 1 or 2, wherein a gas pumping controller is further arranged in the control box and used for controlling the gas pumping amount.

4. The laboratory multifunctional electroplated copper tank according to claim 1 or 2, wherein the electroplated copper tank further comprises a plating solution circulating system, and a circulating controller is further arranged in the control box and used for controlling the flow rate of the circulating plating solution.

5. The multifunctional laboratory-use electrolytic copper plating tank according to claim 4, wherein the plating solution circulation system comprises a jet pipe, a drain pipe, a circulation pump, a liquid inlet pipe, a flow meter, a filter, and a circulation pump, the jet pipe is used for jetting the plating solution, and is located inside the plating tank main body and connected to an end of the liquid inlet pipe.

6. The laboratory multi-functional electro-coppering tank as claimed in claim 5, wherein the filter and the flow meter are mounted at one end of the effluent pipe and the filter is located upstream of the flow meter.

7. The laboratory multifunctional electrolytic copper plating bath according to claim 5, wherein the number of the liquid inlet pipes is 2, and each liquid inlet pipe is connected with a respective flow meter and a filter.

8. The laboratory multifunctional electrolytic copper plating tank according to claim 5, wherein the jet pipe is provided at the bottom of the plating tank main body on both sides and below a product to be plated, and a side wall of the jet pipe facing the product to be plated is provided with a plurality of jet holes for jetting the plating solution.

9. The laboratory multifunctional electrolytic copper plating bath according to claim 8, wherein the blast pipes disposed at both sides of the product to be electroplated are comb-shaped, and the blast pipes disposed below the product to be electroplated are tubular.

10. The laboratory multifunctional electrolytic copper plating bath according to claim 1 or 2, wherein the electrolytic copper plating bath further comprises a vibration motor connected with the cathode rod, and a vibration regulator is further arranged in the control box for controlling the power of the vibration motor.