CN210596305U - Electroplating device for printed circuit board - Google Patents
Electroplating device for printed circuit board Download PDFInfo
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- CN210596305U CN210596305U CN201921576848.3U CN201921576848U CN210596305U CN 210596305 U CN210596305 U CN 210596305U CN 201921576848 U CN201921576848 U CN 201921576848U CN 210596305 U CN210596305 U CN 210596305U
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- tank
- electroplating
- printed circuit
- circuit board
- homogenizing
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Abstract
The utility model relates to a printed circuit board is with electroplating device, plating bath and homogeneity groove have set gradually from a left side to the right side on the upper plate, the plating bath communicates with the homogeneity groove through first passageway, the top intermediate position of plating bath is provided with first agitating unit, first agitating unit's both sides are provided with first electrode and second electrode respectively, the top intermediate position of homogeneity groove is provided with second agitating unit, the homogeneity groove is linked together through outlet conduit and rose tank, the top of rose tank is provided with the filter layer, the rose tank is linked together through second passageway and holding vessel, the holding vessel is linked together through third passageway and circulating pump, the circulating pump is connected with the homogeneity groove through inlet channel. The utility model discloses it is more convenient that the electroplating device produces deposit and impurity cleaning when electroplating, and the plating bath does not need frequent change and washing, and the treatment effeciency is higher, simple structure, and the practicality is stronger, easily uses widely on a large scale.
Description
Technical Field
The utility model relates to an electroplate relevant technical field, especially relate to an electroplating device for printed circuit board.
Background
Electroplating is a process of plating a thin layer of other metals or alloys on the surface of some metals by using the principle of electrolysis, and is a process of attaching a layer of metal film on the surface of a metal or other material product by using the action of electrolysis, and the appearance and various physical and chemical properties of the surface of a raw material, such as corrosion resistance, wear resistance, electrical property, magnetic property and the like, can be changed by electroplating, and the interior of a part can still maintain the original metallurgical and mechanical properties.
In order to ensure the quality of the plating layer, in addition to strictly controlling the process parameters such as temperature, current density, PH and the like, the influence of factors such as impurities in the plating solution on the quality of the plated part is required, and in order to prevent the impurities in the plating solution from influencing the plating of parts placed in the plating tank, the plating solution in the plating tank needs to be purified, filtered or replaced at intervals. And the former plating solution also need add the plating solution of certain proportion after filtering, and the plating bath needs to wash, and it is very troublesome to pour the plating solution into again after taking the plating solution out and washing the plating bath, can influence work efficiency.
In view of the above-mentioned drawbacks, the present inventors have made active research and innovation to create an electroplating apparatus for printed circuit boards, which has industrial application value.
SUMMERY OF THE UTILITY MODEL
In order to solve the above technical problems, an object of the present invention is to provide an electroplating apparatus for a printed circuit board.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the utility model provides an electroplating device for printed circuit board, including upper plate and lower plate, be connected through the support between upper plate and the lower plate, plating bath and homogeneity groove have set gradually from a left side to the right side on the upper plate, the plating bath communicates with the homogeneity groove through first passageway, the top intermediate position of plating bath is provided with first agitating unit, first agitating unit's both sides are provided with first electrode and second electrode respectively, the top intermediate position of homogeneity groove is provided with second agitating unit, one side of second agitating unit is provided with the thermometer, storage tank and rose tank have set gradually from a left side to the right side on the lower plate, the homogeneity groove is linked together with the rose tank through outlet conduit, the top of rose tank is provided with the filter layer, the rose tank is linked together with the storage tank through the second passageway, the storage tank is linked together with the circulating pump through the third passageway, the circulating pump is connected with the homogeneity groove through the inlet.
As a further improvement of the utility model, first agitating unit includes first motor, first pivot and first stirring vane, and first motor is connected with first stirring vane drive through first pivot.
As a further improvement, the second stirring device comprises a second motor, a second rotating shaft and a second stirring blade, and the second motor is connected with the second stirring blade through the second rotating shaft.
As a further improvement, the water outlet pipeline is provided with a first valve.
As a further improvement, the water inlet pipeline is provided with a second valve.
As a further improvement, the filter layer comprises a plurality of filter shafts, and the filter shafts are all provided with filter paper.
As a further improvement of the utility model, a filter screen is arranged between the filter tank and the second channel.
As a further improvement, the two ends of the lower bottom plate are provided with bolt assemblies.
As a further improvement, the two ends of the first channel are connected with the plating bath and the homogenizing groove through threads, the two ends of the water outlet pipeline are connected with the homogenizing groove and the filter tank through threads, the two ends of the second channel are connected with the filter tank and the storage tank through threads, the two ends of the third channel are connected with the storage tank and the circulating pump through threads, and the two ends of the water inlet pipeline are connected with the circulating pump and the homogenizing groove through threads.
As a further improvement, the circulating pump is a hydraulic pump.
Borrow by above-mentioned scheme, the utility model discloses at least, have following advantage:
the electroplating device for the printed circuit board of the utility model has the advantages that through the structural arrangement among the electroplating bath, the homogenizing tank, the filter tank and the storage tank, the cleaning work of the sediment and the impurities generated by the electroplating device during electroplating is more convenient, the electroplating bath does not need to be frequently replaced and cleaned, the treatment efficiency is higher, the structure is simple, the practicability is stronger, and the electroplating device is easy to be popularized and used in a large range; through the internal circulation flow among the homogenizing tank, the water outlet pipeline, the filter tank, the storage tank and the water inlet pipeline, the electroplating solution is more conveniently stored and reflows when the electroplating bath is cleaned, the complicated step of pouring the electroplating solution again is avoided, and the process of cleaning the electroplating bath is simplified; stirring the electroplating bath and the homogenizing tank by a stirring device to accelerate the reaction rate; the temperature condition in the tank can be monitored in real time through the thermometer; the condition in the tank can be monitored in real time simultaneously through the control of the first valve and the second valve so as to control the electroplating process.
The above description is only an overview of the technical solution of the present invention, and in order to make the technical means of the present invention clearer and can be implemented according to the content of the description, the following detailed description is made with reference to the preferred embodiments of the present invention and accompanying drawings.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
FIG. 1 is a schematic structural view of an electroplating apparatus for a printed circuit board according to the present invention.
In the drawings, the meanings of the reference numerals are as follows.
1 plating bath 2 first electrode
3 first electric machine 4 first rotating shaft
5 second electrode 6 first stirring blade
7 first channel 8 homogenizing groove
9 second motor 10 second shaft
11 thermometer 12 second stirring blade
13 first valve 14 water outlet pipeline
15 upper base plate 16 support
17 filter layer 18 filter tank
19 bolt assembly 20 lower plate
21 Filter screen 22 second channel
23 storage tank 24 third channel
25 circulating pump 26 water inlet pipeline
27 second valve
Detailed Description
The following detailed description of the embodiments of the present invention is provided with reference to the accompanying drawings and examples. The following examples are intended to illustrate the invention, but are not intended to limit the scope of the invention.
In order to make the technical solution of the present invention better understood, the technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. The components of embodiments of the present invention, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiment of the present invention, all other embodiments obtained by the person skilled in the art without creative work belong to the protection scope of the present invention.
Examples
As shown in figure 1 of the drawings, in which,
an electroplating device for a printed circuit board comprises an upper base plate 15 and a lower base plate 20, wherein the upper base plate 15 is connected with the lower base plate 20 through a bracket 16, an electroplating bath 1 and a homogenizing tank 8 are sequentially arranged on the upper base plate 15 from left to right, the electroplating bath 1 is communicated with the homogenizing tank 8 through a first channel 7, a first stirring device is arranged at the middle position of the top of the electroplating bath 1, a first electrode 2 and a second electrode 5 are respectively arranged at two sides of the first stirring device, a second stirring device is arranged at the middle position of the top of the homogenizing tank 8, a thermometer 11 is arranged at one side of the second stirring device, a storage tank 23 and a filter tank 18 are sequentially arranged on the lower base plate 20 from left to right, the homogenizing tank 8 is communicated with the filter tank 18 through a water outlet pipeline 14, a filter layer 17 is arranged at the top of the filter tank 18, the filter tank 18 is communicated with the storage tank 23 through a second channel 22, the storage tank 23, the circulating pump 25 is connected to the homogenizing tank 8 through a water inlet line 26.
Preferably, the first stirring device comprises a first motor 3, a first rotating shaft 4 and a first stirring blade 6, and the first motor 3 is in driving connection with the first stirring blade 6 through the first rotating shaft 4.
Preferably, the second stirring device comprises a second motor 9, a second rotating shaft 10 and a second stirring blade 12, and the second motor 9 is in driving connection with the second stirring blade 12 through the second rotating shaft 10.
The first stirring device and the second stirring device respectively stir the liquid in the electroplating bath 1 and the homogeneous bath 8, so that the circulation and the reaction rate between the electroplating bath 1 and the homogeneous bath 8 are accelerated.
Preferably, the outlet line 14 is provided with a first valve 13.
Preferably, a second valve 27 is provided in the inlet line 26.
Preferably, the filtering layer 17 comprises a plurality of filtering shafts, and the filtering shafts are provided with filtering paper.
Preferably, a filter screen 21 is disposed between the filter tank 18 and the second passage 22.
The filter paper and the filter screen 21 are conventional means in the art, and the detailed structure and model thereof are not limited.
Preferably, the bolt assemblies 19 are provided at both ends of the lower plate 20. The lower plate 20 is fixed by a bolt assembly 19.
Preferably, both ends of the first channel 7 are connected with the electroplating bath 1 and the homogenizing tank 8 through threads, both ends of the water outlet pipeline 14 are connected with the homogenizing tank 8 and the filtering tank 18 through threads, both ends of the second channel 22 are connected with the filtering tank 18 and the storage tank 23 through threads, both ends of the third channel 24 are connected with the storage tank 23 and the circulating pump 25 through threads, and both ends of the water inlet pipeline 26 are connected with the circulating pump 25 and the homogenizing tank 8 through threads.
Preferably, the circulation pump 25 is a hydraulic pump.
The electroplating device for the printed circuit board of the utility model, an electroplating bath 1 is an electroplating reaction device; homogenizing treatment is carried out in the homogenizing tank 8, so that non-metal particles and the like are uniformly distributed in the electroplating solution, and then the electroplating solution is conveyed to the electroplating tank 1 for electroplating work; the electroplating solution flows into the filter tank 18 through the water outlet pipeline 14, and is filtered by the filter layer 17, and the filtered electroplating solution is stored in the storage tank 23; the plating solution in the storage tank 23 is periodically transferred to the homogenizing tank 8 through the circulation pump 25 and the water inlet line 26, and the circulation exchange is performed between the homogenizing tank 8 and the plating tank 1 through the first passage 7.
The electroplating device for the printed circuit board of the utility model has the advantages that through the structural arrangement among the electroplating bath 1, the homogenizing tank 8, the filter tank 18 and the storage tank 23, the deposition and impurity cleaning work of the electroplating device during electroplating is more convenient, the electroplating bath 1 does not need to be frequently replaced and cleaned, the treatment efficiency is higher, the structure is simple, the practicability is stronger, and the large-scale popularization and use is easy; through the internal circulation flow among the homogenizing tank 8, the water outlet pipeline 14, the filter tank 18, the storage tank 23 and the water inlet pipeline 26, the electroplating solution is more conveniently stored and reflows when the electroplating bath 1 is cleaned, the complicated step of pouring out and pouring in the electroplating solution is avoided, and the process of cleaning the electroplating bath 1 is simplified; the electroplating bath 1 and the homogenizing bath 8 are stirred by a stirring device, so that the reaction rate is accelerated; the temperature condition in the tank can be monitored in real time through the thermometer 11; by controlling the first valve 13 and the second valve 27, the condition in the tank can be monitored in real time at the same time so as to control the progress of electroplating.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention, and it should be noted that, for those skilled in the art, a plurality of modifications and variations can be made without departing from the technical principle of the present invention, and these modifications and variations should also be regarded as the protection scope of the present invention.
Claims (10)
1. An electroplating device for a printed circuit board is characterized by comprising an upper base plate (15) and a lower base plate (20), wherein the upper base plate (15) and the lower base plate (20) are connected through a support (16), an electroplating bath (1) and a homogenizing bath (8) are sequentially arranged on the upper base plate (15) from left to right, the electroplating bath (1) is communicated with the homogenizing bath (8) through a first channel (7), a first stirring device is arranged in the middle of the top of the electroplating bath (1), a first electrode (2) and a second electrode (5) are respectively arranged on two sides of the first stirring device, a second stirring device is arranged in the middle of the top of the homogenizing bath (8), a thermometer (11) is arranged on one side of the second stirring device, a storage tank (23) and a filter tank (18) are sequentially arranged on the lower base plate (20) from right to left, the homogenizing tank (8) is communicated with the filtering tank (18) through a water outlet pipeline (14), the top of the filtering tank (18) is provided with a filtering layer (17), the filtering tank (18) is communicated with the storage tank (23) through a second channel (22), the storage tank (23) is communicated with the circulating pump (25) through a third channel (24), and the circulating pump (25) is connected with the homogenizing tank (8) through a water inlet pipeline (26).
2. The electroplating apparatus for the printed circuit board according to claim 1, wherein the first stirring device comprises a first motor (3), a first rotating shaft (4) and a first stirring blade (6), and the first motor (3) is in driving connection with the first stirring blade (6) through the first rotating shaft (4).
3. A plating apparatus for a printed circuit board according to claim 1, wherein the second stirring means comprises a second motor (9), a second rotating shaft (10) and a second stirring blade (12), and the second motor (9) is drivingly connected to the second stirring blade (12) through the second rotating shaft (10).
4. An electroplating apparatus for printed circuit boards according to claim 1, wherein the water outlet line (14) is provided with a first valve (13).
5. An electroplating apparatus for a printed circuit board according to claim 1, wherein the water inlet line (26) is provided with a second valve (27).
6. An electroplating apparatus for a printed circuit board according to claim 1, wherein the filter layer (17) comprises a plurality of filter shafts, and filter paper is disposed on each of the filter shafts.
7. An electroplating apparatus for a printed circuit board according to claim 1, wherein a filter screen (21) is provided between the filter tank (18) and the second passage (22).
8. An electroplating apparatus for a printed circuit board according to claim 1, wherein the bolt assembly (19) is provided at both ends of the lower plate (20).
9. The electroplating apparatus for the printed circuit board according to claim 1, wherein both ends of the first channel (7) are connected to the electroplating bath (1) and the homogenizing tank (8) by screws, both ends of the water outlet pipeline (14) are connected to the homogenizing tank (8) and the filtering tank (18) by screws, both ends of the second channel (22) are connected to the filtering tank (18) and the storage tank (23) by screws, both ends of the third channel (24) are connected to the storage tank (23) and the circulation pump (25) by screws, and both ends of the water inlet pipeline (26) are connected to the circulation pump (25) and the homogenizing tank (8) by screws.
10. A plating apparatus for a printed circuit board according to claim 1, wherein said circulation pump (25) is a hydraulic pump.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921576848.3U CN210596305U (en) | 2019-09-20 | 2019-09-20 | Electroplating device for printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921576848.3U CN210596305U (en) | 2019-09-20 | 2019-09-20 | Electroplating device for printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210596305U true CN210596305U (en) | 2020-05-22 |
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ID=70712711
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921576848.3U Active CN210596305U (en) | 2019-09-20 | 2019-09-20 | Electroplating device for printed circuit board |
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| Country | Link |
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| CN (1) | CN210596305U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111575745A (en) * | 2020-06-01 | 2020-08-25 | 赣州逸豪新材料股份有限公司 | Intelligent preparation equipment of electrolyte for multi-functional electrolytic copper foil |
| CN114481280A (en) * | 2022-02-11 | 2022-05-13 | 苏州华超金属材料有限公司 | Electroplating device for processing metal material |
-
2019
- 2019-09-20 CN CN201921576848.3U patent/CN210596305U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111575745A (en) * | 2020-06-01 | 2020-08-25 | 赣州逸豪新材料股份有限公司 | Intelligent preparation equipment of electrolyte for multi-functional electrolytic copper foil |
| CN114481280A (en) * | 2022-02-11 | 2022-05-13 | 苏州华超金属材料有限公司 | Electroplating device for processing metal material |
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