TW202307281A - Electroplating device structure for fan-out panel grade packaging and electroplating including an electroplating tank, an electrode driving unit and at least one hanging rack - Google Patents

Electroplating device structure for fan-out panel grade packaging and electroplating including an electroplating tank, an electrode driving unit and at least one hanging rack Download PDF

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TW202307281A
TW202307281A TW110130014A TW110130014A TW202307281A TW 202307281 A TW202307281 A TW 202307281A TW 110130014 A TW110130014 A TW 110130014A TW 110130014 A TW110130014 A TW 110130014A TW 202307281 A TW202307281 A TW 202307281A
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electroplating
tank
electrode plate
fan
out panel
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TW110130014A
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TWI765806B (en
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顏振益
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顏振益
林振煜
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Abstract

Provided is an electroplating device structure for fan-out panel grade packaging and electroplating, including an electroplating tank, an electrode driving unit and at least one hanging rack, wherein the electrode driving unit includes two corresponding rotating shafts which are eccentrically provided with a plurality of turntables. Each of the turntables is disposed in a turntable seat. Each of the turntable seats is combined with a driving frame. Each turntable is driven by a driving motor to eccentrically rotate and is linked with the driving frame to form circular arc motion. The at least one hanging rack is provided with an electrode plate and is disposed on the driving frame. The electrode plate is driven by the driving frame to synchronously form a circular arc motion in the electroplating tank, by which an electroplating solution in the electroplating tank can be uniformly stirred. The stirring range is wide, the temperature of the electroplating solution is uniform, and components of the electroplating solution surrounding an electroplated object are continuously updated, so that the optimal current density and deposition velocity are maintained, the efficiency of electroplating for thickening a clad layer of the electroplated object is increased, and the uniformity of the thickness, conductivity and aesthetics of the clad layer are improved.

Description

扇出型面板級封裝電鍍之電鍍設備構造 Electroplating equipment structure for fan-out panel level packaging electroplating

本發明係有關於一種扇出型面板級封裝電鍍之電鍍設備構造,為一種應用於電鍍加工可增進電鍍加工效率之電鍍設備構造。 The invention relates to an electroplating equipment structure for fan-out panel level packaging electroplating, which is an electroplating equipment structure that can improve the efficiency of electroplating processing when applied to electroplating processing.

目前電鍍加工技術主要係藉由電解作用,在金屬工件表面上沉積一薄層其它金屬。電鍍加工包含鍍前處理(如除油、除銹)、鍍上金屬層和鍍後處理(如鈍化、除氫)等過程。 At present, electroplating processing technology mainly deposits a thin layer of other metals on the surface of metal workpieces by electrolysis. Electroplating process includes pre-plating treatment (such as degreasing, derusting), plating metal layer and post-plating treatment (such as passivation, dehydrogenation) and other processes.

電鍍加工用於防止製品腐蝕,修復磨損部分,增加耐用性,反光性,導電性和美觀等。電鍍時將被鍍物作為陰極,與鍍層金屬相同的金屬材料作為陽極,分別掛於極棒上面浸入含有鍍層成分的電解液中,通入電流。所述極棒除了為銅製,還可以採用不銹鋼或者是鈦包銅材料製成的極棒。而陽極有分不溶性陽極(如:鈦板、鈦網、白金鈦網),再輔以銅粉添加銅離子,進行電鍍;此種陽極鈦板不會消失,但需定時添加銅粉。還有可溶性陽極(如:銅球、銅板),電鍍過程中銅球會慢慢溶解析出銅離子於電鍍液中。 Electroplating is used to prevent corrosion of products, repair worn parts, increase durability, reflectivity, conductivity and aesthetics, etc. During electroplating, the object to be plated is used as the cathode, and the same metal material as the plating metal is used as the anode, which are respectively hung on the pole rod and immersed in the electrolyte containing the plating composition, and the current is passed through. In addition to being made of copper, the pole can also be made of stainless steel or titanium-clad copper. The anode is divided into insoluble anodes (such as: titanium plate, titanium mesh, platinum titanium mesh), supplemented with copper powder to add copper ions for electroplating; this kind of anode titanium plate will not disappear, but copper powder needs to be added regularly. There are also soluble anodes (such as copper balls and copper plates). During the electroplating process, the copper balls will slowly dissolve and separate copper ions in the electroplating solution.

但是在電鍍加工時,在被鍍物或電極板的邊緣和尖端,通常會聚集著較多的電力線,也就是聚集較多之陽離子,這種現象叫尖端效應或叫邊緣效應。 However, during the electroplating process, more electric lines of force are usually gathered at the edge and tip of the plated object or electrode plate, that is, more cations are gathered. This phenomenon is called the tip effect or the edge effect.

尖端效應或邊緣效應往往會使被鍍物產品的尖端或邊緣產 生鍍層加厚、毛刺,或者燒焦等現象。例如扇出型面板級封裝的電鍍載體因為規格尺寸較大或圖型電鍍電路密集、高縱橫比,若以目前之電鍍加工技術進行電鍍,所產生之尖端效應或邊緣效應會更大。 Tip effect or edge effect tends to make the tip or edge of the plated product produce Thickening, burrs, or scorching of the raw plating layer. For example, the electroplating carrier of fan-out panel level package has a large size or dense pattern electroplating circuit and high aspect ratio. If electroplating is performed with the current electroplating processing technology, the tip effect or edge effect will be greater.

再者,扇出型面板級封裝的電鍍載體為非導電面板,其係利用濺鍍機濺鍍薄銅先使表層金屬化,之後進行電鍍銅層,但是因為電鍍載體面積大,電鍍銅層的電阻值偏高,造成鍍層增厚之電鍍加工效率較差,且鍍層厚度較不平均,導電性及美觀性也不佳。 Furthermore, the electroplating carrier of fan-out panel-level packaging is a non-conductive panel. It uses a sputtering machine to sputter thin copper to metallize the surface layer, and then electroplate the copper layer. However, due to the large area of the electroplating carrier, the electroplating copper layer The resistance value is too high, resulting in poor electroplating processing efficiency of thickened coating, and the thickness of the coating is uneven, and the conductivity and aesthetics are not good.

目前雖然有些電鍍設備試圖藉由將電鍍載體在電鍍槽中左右往復移動對電鍍液進行均勻攪拌,來克服上述之問題,但是電鍍載體僅是單純地進行左右方向移動攪拌動作,並無法對電鍍液中左右方向以外之其他方向進行攪拌,因此無法對電鍍液均勻攪拌作用且攪拌範圍較小,電鍍加工效率仍然不佳。 At present, although some electroplating equipment tries to overcome the above-mentioned problems by moving the electroplating carrier back and forth in the electroplating tank to uniformly stir the electroplating solution, the electroplating carrier only simply moves left and right and cannot stir the electroplating solution. Stirring is performed in directions other than the middle, left, and right directions, so the electroplating solution cannot be stirred evenly and the stirring range is small, and the electroplating processing efficiency is still not good.

爰是,本發明人基於產品不斷改良創新之理念,乃本著多年從事該領域之專業實務經驗,以及積極潛心研發思考,經由無數次之實際設計實驗,致有本發明之產生。 Yes, based on the concept of continuous improvement and innovation of products, the inventor of the present invention is based on years of professional experience in this field, as well as active research and development thinking, through countless actual design experiments, resulting in the generation of the present invention.

本發明之目的,係在提供一種應用於電鍍加工可增進電鍍加工效率之扇出型面板級封裝電鍍之電鍍設備構造。 The purpose of the present invention is to provide an electroplating equipment structure for fan-out panel level packaging electroplating which can improve the efficiency of electroplating processing.

為達上述之目的,本發明扇出型面板級封裝電鍍之電鍍設備構造係包含一電鍍槽、一電極驅動單元、至少一掛架,其中,該電鍍槽用以容置電鍍液;該電極驅動單元鄰近於該電鍍槽,該電極驅動單元包含一固定架,該固定架樞接有二相對應之轉軸,該些轉軸以偏心狀設置數個轉 盤,各所述轉盤設置於一轉盤座中,各所述轉盤座共同結合一驅動架,該驅動架配置於該電鍍槽上方,而一驅動馬達藉一驅動軸使該轉軸轉動並連動該轉盤偏心狀轉動,藉該轉盤偏心狀轉動連動該轉盤座、該驅動架形成圓弧狀運動;該掛架用以設置一電極板,該電極板用以設置一被鍍物,該掛架掛設於該驅動架,使該電極板位於該電鍍槽中。 In order to achieve the above-mentioned purpose, the structure of the electroplating equipment for fan-out panel level packaging electroplating of the present invention includes an electroplating tank, an electrode driving unit, and at least one hanger, wherein the electroplating tank is used to accommodate the electroplating solution; the electrode driving unit The unit is adjacent to the electroplating tank. The electrode drive unit includes a fixed frame, and the fixed frame is pivotally connected with two corresponding rotating shafts. Each of the turntables is arranged in a turntable seat, and each of the turntable seats is jointly combined with a drive frame, which is arranged above the electroplating tank, and a drive motor uses a drive shaft to rotate the shaft and drive the turntable Eccentric rotation, the eccentric rotation of the turntable drives the turntable seat and the drive frame to form an arc-shaped movement; the hanger is used to set an electrode plate, and the electrode plate is used to set an object to be plated. On the driving frame, the electrode plate is placed in the electroplating tank.

藉由驅動架之驅動使電極板於電鍍槽中同步形成圓弧狀運動,可對電鍍槽中之電鍍液進行均勻攪拌作用且攪拌範圍大,令電鍍液溫度均勻,以及使被鍍物周圍之電鍍液成分持續更新,以保持最佳的電流密度和沉積速度,增進被鍍物鍍層增厚之電鍍加工效率,以及增進鍍層厚度之平均性、導電性及美觀性。 Driven by the drive frame, the electrode plate moves synchronously in an arc shape in the electroplating tank, which can uniformly stir the electroplating solution in the electroplating tank with a large stirring range, so that the temperature of the electroplating solution is uniform, and the surrounding area of the plated object can be uniformly stirred. The composition of the electroplating solution is continuously updated to maintain the best current density and deposition speed, improve the efficiency of the electroplating process for thickening the coating of the plated object, and improve the uniformity, conductivity and aesthetics of the coating thickness.

以下僅藉由具體實施例,且佐以圖式作詳細之說明,俾使貴審查委員能對於本發明之各項功能、特點,有更進一步之了解與認識。 The following is only a detailed description based on specific embodiments and drawings, so that your review committee can have a further understanding and understanding of the various functions and characteristics of the present invention.

10:電鍍槽 10: Plating tank

11:噴流管 11: jet pipe

12:冷卻管 12: Cooling pipe

13:溢流槽 13: overflow tank

14:供液管 14: Liquid supply pipe

15:過濾單元 15: Filter unit

16:回收管 16: Recovery tube

17:循環泵 17:Circulation pump

18:過濾器 18: filter

111:噴嘴 111: Nozzle

141:流量視窗 141: Flow window

20:電極驅動單元 20: Electrode drive unit

21:固定架 21: fixed frame

22:轉軸 22: Shaft

23:轉盤 23: turntable

24:轉盤座 24: turntable seat

25:驅動架 25: Drive frame

26:驅動馬達 26: Drive motor

27:驅動軸 27: drive shaft

251:插槽 251: slot

30:掛架 30: hanger

31:電極板 31: electrode plate

32:被鍍物 32: to be plated

33:電極遮板 33: Electrode shutter

301:插置部 301: inserting part

311:電極板本體 311: electrode plate body

312:面板 312: panel

40:電極板放置單元 40: electrode plate placement unit

41:凹槽 41: Groove

50:控制單元 50: Control unit

60:壓制單元 60: Press unit

61:壓桿 61: Pressure rod

70:吊掛裝置 70: Hanging device

第1圖係本發明之立體圖。 Fig. 1 is a perspective view of the present invention.

第2圖係本發明與電極板之立體分解圖。 Figure 2 is a three-dimensional exploded view of the present invention and electrode plates.

第3圖係本發明電極板放置單元之使用例立體圖。 Fig. 3 is a perspective view of an example of use of the electrode plate placement unit of the present invention.

第4圖係本發明電鍍槽之局部剖面立體圖。 Fig. 4 is a partially cutaway perspective view of an electroplating tank of the present invention.

第5圖係本發明電鍍槽外部所設電鍍液循環回流管路構造之立體圖。 Fig. 5 is a perspective view of the structure of the circulation and return pipeline of the electroplating solution installed outside the electroplating bath of the present invention.

第6圖係本發明掛架、電極板掛設於該電極驅動單元之驅動架之使用例立體圖。 Fig. 6 is a perspective view of the use example of the hanger and the electrode plate hung on the drive frame of the electrode drive unit of the present invention.

第6A圖係本發明壓制單元之使用例立體圖。 Figure 6A is a perspective view of an example of use of the pressing unit of the present invention.

第7圖至第10圖係本發明對被鍍物進行電鍍加工之使用例圖。 Fig. 7 to Fig. 10 are diagrams showing examples of electroplating of the object to be plated according to the present invention.

請參第1至4圖所示,本發明扇出型面板級封裝電鍍之電鍍設備構造係包含一電鍍槽10、一電極驅動單元20、至少一掛架30。下文將詳細說明之: Please refer to FIG. 1 to FIG. 4 , the structure of the electroplating equipment for fan-out panel level packaging electroplating of the present invention includes an electroplating tank 10 , an electrode driving unit 20 , and at least one hanger 30 . It will be explained in detail below:

該電鍍槽10用以容置電鍍液。 The electroplating tank 10 is used for accommodating electroplating solution.

該電極驅動單元20鄰近於該電鍍槽10,該電極驅動單元20包含一固定架21,該固定架21樞接有二相對應之轉軸22,該些轉軸22以偏心狀設置數個轉盤23,各所述轉盤23設置於一轉盤座24中,各所述轉盤座24共同結合一驅動架25,該驅動架25配置於該電鍍槽10上方,而一驅動馬達26藉一驅動軸27使該轉軸22轉動並連動該轉盤23偏心狀轉動,藉該轉盤23偏心狀轉動連動該轉盤座24、該驅動架25形成圓弧狀運動。 The electrode driving unit 20 is adjacent to the electroplating tank 10, and the electrode driving unit 20 includes a fixed frame 21, the fixed frame 21 is pivotally connected with two corresponding rotating shafts 22, and the rotating shafts 22 are provided with several rotating disks 23 in an eccentric shape, Each of the turntables 23 is arranged in a turntable seat 24, and each of the turntable seats 24 is jointly combined with a drive frame 25, which is arranged above the electroplating tank 10, and a drive motor 26 drives the drive frame 27 by a drive shaft 27. The rotating shaft 22 rotates and drives the turntable 23 to rotate eccentrically, and the turntable seat 24 and the driving frame 25 form an arc-shaped movement by means of the eccentric rotation of the turntable 23 .

其中該驅動軸27二端更可藉由齒輪機構而變換方向同時連動該轉軸22同步轉動。 Wherein the two ends of the drive shaft 27 can change directions through the gear mechanism and simultaneously drive the rotating shaft 22 to rotate synchronously.

該掛架30用以設置一電極板31,該電極板31用以設置一被鍍物32,該掛架30掛設於該驅動架25,使該電極板31位於該電鍍槽10中。 The hanger 30 is used for setting an electrode plate 31 , and the electrode plate 31 is used for setting an object to be plated 32 . The hanger 30 is hung on the driving frame 25 so that the electrode plate 31 is located in the electroplating tank 10 .

值得一提的是被鍍物32實施例可包含但不限於扇出型面板級封裝的電鍍載體。 It is worth mentioning that an embodiment of the object to be plated 32 may include but not limited to a plated carrier of a fan-out panel level package.

於一實施例,更包含一電極板放置單元40,該電極板放置單元40上側具有數個對應狀凹槽41,用以該掛架30可掛設於該凹槽41,該電極板31可掛設於該掛架30,該電極板放置單元40提供該電極板31在未進行電鍍 加工時之暫放處。 In one embodiment, it further includes an electrode plate placing unit 40, and the upper side of the electrode plate placing unit 40 has several corresponding grooves 41, so that the hanger 30 can be hung in the grooves 41, and the electrode plate 31 can be Hanging on the hanger 30, the electrode plate placement unit 40 provides the electrode plate 31 without electroplating Temporary storage during processing.

於一實施例,更包含一控制單元50,用以設定、調整各種電鍍加工控制參數值及操控動作、功能。 In one embodiment, it further includes a control unit 50 for setting and adjusting various electroplating process control parameter values and control actions and functions.

請參第2圖所示,於一實施例,該電極板31包含有可供活動組拆、更換之一電極板本體311、一面板312,用以便於裝設、更換該被鍍物32。 Please refer to FIG. 2 , in one embodiment, the electrode plate 31 includes an electrode plate body 311 and a panel 312 that can be disassembled and replaced, so as to facilitate the installation and replacement of the object to be plated 32 .

請參第3圖所示,該電極板31進一步可搭配結合一電極遮板33,藉由該電極遮板33對電鍍液噴流之導流、導引作用,可增進被鍍物32之電鍍加工效率。 Please refer to Figure 3, the electrode plate 31 can further be combined with an electrode shield 33, and the electroplating process of the object to be plated 32 can be enhanced by the diversion and guidance of the electrode shield 33 to the electroplating solution jet. efficiency.

請參第4圖所示,於一實施例,該電鍍槽10中具有數個噴流管11,該噴流管11可藉由設置數個噴嘴111而朝該電極板31噴出電鍍液噴流,而可對該電極板31之被鍍物32進行電鍍加工作業。 Please refer to Fig. 4, in one embodiment, the electroplating tank 10 has several spray pipes 11, and the spray pipe 11 can eject the electroplating solution jet flow toward the electrode plate 31 by setting several nozzles 111, so that The plating process is performed on the object 32 of the electrode plate 31 .

於一實施例,該電鍍槽10中具有一組冷卻管12,該冷卻管12界定為曲折迴路狀,該冷卻管12內容置流動狀冰水,用以控制維持該電鍍槽10內電鍍液於適當之溫度,避免溫度過高或過低,因為被鍍物於電鍍銅層過程中,電鍍液之溫度高低會影響銅的層積,當溫度太高時,會影響電鍍液藥水的裂解,當溫度太低時,則會影響銅的層積效率。 In one embodiment, there is a set of cooling pipes 12 in the electroplating tank 10, and the cooling pipes 12 are defined as zigzag loops. Flowing ice water is placed in the cooling pipes 12 to control and maintain the electroplating solution in the electroplating tank 10. Appropriate temperature, avoid the temperature being too high or too low, because the temperature of the electroplating solution will affect the layering of copper during the copper plating process of the plated object. When the temperature is too high, it will affect the cracking of the electroplating solution. When the temperature is too low, the layering efficiency of copper will be affected.

於一實施例,該電鍍槽10一側設有一溢流槽13,用以該電鍍槽10內電鍍液液位高度過高時,可由該溢流槽13表面所設之通孔排出。 In one embodiment, an overflow tank 13 is provided on one side of the electroplating tank 10, so that when the liquid level of the electroplating solution in the electroplating tank 10 is too high, it can be discharged from the through hole provided on the surface of the overflow tank 13.

請參第5圖所示,於一實施例,該些噴流管11連通於一供液管14,該供液管14連接於一過濾單元15,該電鍍槽10外接連通一回收管16,該回收管16連通一循環泵17,且該循環泵17另一端連通該過濾單元15,用以 該循環泵17可抽吸該電鍍槽10內之電鍍液,並將電鍍液經由該過濾單元15、該供液管14、該些噴流管11送入該電鍍槽10而構成電鍍液之循環回流作用,且藉由該過濾單元15過濾該電鍍液以維持品質。 Please refer to shown in Fig. 5, in one embodiment, these spray pipes 11 are communicated with a liquid supply pipe 14, and this liquid supply pipe 14 is connected with a filtration unit 15, and this electroplating tank 10 is externally connected with a recovery pipe 16, the The recovery pipe 16 communicates with a circulation pump 17, and the other end of the circulation pump 17 communicates with the filter unit 15 for The circulation pump 17 can suck the electroplating solution in the electroplating tank 10, and send the electroplating solution into the electroplating tank 10 through the filter unit 15, the liquid supply pipe 14, and the jet tubes 11 to form a circulation backflow of the electroplating solution function, and the electroplating solution is filtered by the filter unit 15 to maintain the quality.

該供液管14可具有數個流量視窗141,用以便於觀測、感測電鍍液輸送之流量及狀態,以便控制電鍍液輸送之流量。 The liquid supply pipe 14 may have several flow windows 141 for observing and sensing the flow and status of the electroplating solution, so as to control the flow of the electroplating solution.

請參第6圖、6A圖所示,於一實施例,該掛架30分別於二側設有一插置部301,該驅動架25上對應該插置部301而設有一插槽251,將該插置部301插設於該插槽251,該驅動架25上、該插槽251一側設一壓制單元60,該壓制單元60可選自油壓機構並具有一壓桿61,用以藉該壓桿61強力壓下該插置部301插設於該插槽251中,進而增進該掛架30設置之穩固性以及導電性。 Please refer to Figures 6 and 6A, in one embodiment, the hanger 30 is provided with an insertion portion 301 on both sides respectively, and the drive frame 25 is provided with a slot 251 corresponding to the insertion portion 301. The insertion part 301 is inserted into the slot 251, and a pressing unit 60 is arranged on the drive frame 25 and one side of the slot 251. The pressing unit 60 can be selected from a hydraulic mechanism and has a pressing rod 61 for The insertion portion 301 is strongly pressed down by the pressing rod 61 to be inserted into the slot 251 , thereby improving the stability and conductivity of the hanger 30 .

上述為本發明之各部構件及其組成方式介紹,接著再將本發明之使用特點、功效介紹如下: The above is the introduction of each component of the present invention and its composition, and then the use characteristics and effects of the present invention are introduced as follows:

請參第6、6A圖所示,可藉由一吊掛裝置70將該掛架30、電極板31掛設於該電極驅動單元20之驅動架25。 Please refer to Figures 6 and 6A, the hanger 30 and the electrode plate 31 can be hung on the driving frame 25 of the electrode driving unit 20 by a hanging device 70 .

請參第7至10圖所示,本發明可藉由該電極驅動單元20之驅動馬達26驅動該驅動架25形成圓弧狀運動,再藉由驅動架25之驅動使電極板31於電鍍槽10中同步形成圓弧狀運動,可對電鍍槽10中之電鍍液進行均勻攪拌作用且攪拌範圍大,令電鍍液溫度均勻,以及使被鍍物32周圍之電鍍液成分持續更新,以保持最佳的電流密度和沉積速度,增進被鍍物32鍍層增厚之電鍍加工效率,以及增進鍍層厚度之平均性、導電性及美觀性。 Please refer to Figures 7 to 10, the present invention can drive the driving frame 25 to form an arc-shaped movement through the driving motor 26 of the electrode driving unit 20, and then drive the driving frame 25 to make the electrode plate 31 in the electroplating tank 10 synchronously forms an arc-like movement, which can uniformly stir the electroplating solution in the electroplating tank 10 and has a large stirring range, so that the temperature of the electroplating solution is uniform, and the composition of the electroplating solution around the object 32 to be plated is continuously updated to maintain the best Excellent current density and deposition speed can improve the electroplating processing efficiency of the plated object 32 to thicken the coating, and improve the uniformity, conductivity and aesthetics of the coating thickness.

請參第10圖所示,於一實施例,該電鍍槽10內底部具有一 過濾器18,用以防止較大異物如螺件流入電鍍液循環回流管路中。 Please refer to shown in Figure 10, in one embodiment, the bottom of the electroplating tank 10 has a The filter 18 is used to prevent relatively large foreign matters such as screws from flowing into the circulation and return pipeline of the electroplating solution.

以上為本案所舉之實施例,僅為便於說明而設,當不能以此限制本案之意義,即大凡依所列申請專利範圍所為之各種變換設計,均應包含在本案之專利範圍中。 The above is the embodiment of this case, which is only for the convenience of explanation, and should not limit the meaning of this case, that is, all kinds of transformation designs made according to the scope of the listed patent application should be included in the scope of the patent of this case.

10:電鍍槽 10: Plating tank

11:噴流管 11: jet pipe

13:溢流槽 13: overflow tank

15:過濾單元 15: Filter unit

16:回收管 16: Recovery tube

20:電極驅動單元 20: Electrode drive unit

21:固定架 21: fixed frame

22:轉軸 22: Shaft

23:轉盤 23: turntable

24:轉盤座 24: turntable seat

25:驅動架 25: Drive frame

26:驅動馬達 26: Drive motor

27:驅動軸 27: drive shaft

30:掛架 30: hanger

31:電極板 31: electrode plate

33:電極遮板 33: Electrode shutter

301:插置部 301: inserting part

40:電極板放置單元 40: electrode plate placement unit

50:控制單元 50: Control unit

60:壓制單元 60: Press unit

61:壓桿 61: Pressure rod

Claims (10)

一種扇出型面板級封裝電鍍之電鍍設備構造,係包含有: An electroplating equipment structure for fan-out panel level packaging electroplating, including: 一電鍍槽,用以容置電鍍液; An electroplating tank for containing electroplating solution; 一電極驅動單元,鄰近於該電鍍槽,該電極驅動單元包含一固定架,該固定架樞接有二相對應之轉軸,該些轉軸以偏心狀設置數個轉盤,各所述轉盤設置於一轉盤座中,各所述轉盤座共同結合一驅動架,該驅動架配置於該電鍍槽上方,而一驅動馬達藉一驅動軸使該轉軸轉動並連動該轉盤偏心狀轉動,藉該轉盤偏心狀轉動連動該轉盤座、該驅動架形成圓弧狀運動;及 An electrode driving unit is adjacent to the electroplating tank. The electrode driving unit includes a fixed frame, and the fixed frame is pivotally connected with two corresponding rotating shafts. The rotating shafts are provided with several rotating discs in an eccentric shape, and each of the rotating discs is arranged on a In the turntable seat, each of the turntable seats is combined with a driving frame, which is arranged above the electroplating tank, and a driving motor rotates the rotating shaft through a drive shaft and drives the eccentric rotation of the turntable, and the eccentric shape of the turntable Rotate and link the turntable seat and the driving frame to form an arc-shaped motion; and 至少一掛架,用以設置一電極板,該電極板用以設置一被鍍物,該掛架掛設於該驅動架,使該電極板位於該電鍍槽中。 At least one hanger is used to set an electrode plate, and the electrode plate is used to set an object to be plated. The hanger is hung on the driving frame so that the electrode plate is located in the electroplating tank. 如請求項1所述之扇出型面板級封裝電鍍之電鍍設備構造,其中,更包含一電極板放置單元,該電極板放置單元上側具有數個對應狀凹槽,用以該掛架可掛設於該凹槽,該電極板可掛設於該掛架。 The electroplating equipment structure for fan-out panel level packaging electroplating as described in claim 1, which further includes an electrode plate placement unit, and the upper side of the electrode plate placement unit has several corresponding grooves for the hanger to hang Located in the groove, the electrode plate can be hung on the hanger. 如請求項1所述之扇出型面板級封裝電鍍之電鍍設備構造,其中,更包含一控制單元,用以設定、調整電鍍加工控制參數值及操控動作、功能。 The structure of electroplating equipment for fan-out panel level packaging electroplating as described in claim 1, further comprising a control unit for setting and adjusting control parameter values of electroplating processing and controlling actions and functions. 如請求項1所述之扇出型面板級封裝電鍍之電鍍設備構造,其中,該電極板包含有可供活動組拆、更換之一電極板本體、一面板。 The electroplating equipment structure for fan-out panel level packaging electroplating as described in claim 1, wherein the electrode plate includes an electrode plate body and a panel that can be movably assembled, disassembled and replaced. 如請求項1所述之扇出型面板級封裝電鍍之電鍍設備構造,其中,該電鍍槽中具有數個噴流管,該噴流管可藉由設置數個噴嘴而朝該電極板噴出電鍍液噴流,而可對該電極板之被鍍物進行電鍍加工作業。 The electroplating equipment structure for fan-out panel level packaging electroplating according to claim 1, wherein the electroplating tank has several spray pipes, and the spray pipes can spray the electroplating solution jet flow towards the electrode plate by arranging several nozzles , and the electroplating process can be performed on the plated object of the electrode plate. 如請求項1所述之扇出型面板級封裝電鍍之電鍍設備構造,其中,該電鍍 槽中具有一組冷卻管,該冷卻管界定為曲折迴路狀,該冷卻管內容置流動狀冰水,用以控制維持該電鍍槽內電鍍液之溫度。 The electroplating equipment structure for fan-out panel level packaging electroplating as described in claim 1, wherein the electroplating There is a group of cooling pipes in the tank, and the cooling pipes are defined as zigzag loops. Flowing ice water is placed in the cooling pipes to control and maintain the temperature of the electroplating solution in the electroplating tank. 如請求項1所述之扇出型面板級封裝電鍍之電鍍設備構造,其中,該電鍍槽一側設有一溢流槽,用以該電鍍槽內電鍍液液位高度過高時,可由該溢流槽表面所設之通孔排出。 According to the electroplating equipment structure for fan-out panel level packaging electroplating as described in claim 1, an overflow tank is provided on one side of the electroplating tank, which can be used for the overflow tank when the liquid level of the electroplating solution in the electroplating tank is too high. The through hole set on the surface of the launder discharges. 如請求項1所述之扇出型面板級封裝電鍍之電鍍設備構造,其中,該些噴流管連通於一供液管,該供液管連接於一過濾單元,該電鍍槽外接連通一回收管,該回收管連通一循環泵,且該循環泵另一端連通該過濾單元,用以該循環泵可抽吸該電鍍槽內之電鍍液,並將電鍍液經由該過濾單元、該供液管、該些噴流管送入該電鍍槽而構成電鍍液之循環回流作用,且藉由該過濾單元過濾該電鍍液;以及該供液管具有數個流量視窗。 The electroplating equipment structure for fan-out panel level packaging electroplating as described in Claim 1, wherein, the spray pipes are connected to a liquid supply pipe, the liquid supply pipe is connected to a filter unit, and the electroplating tank is externally connected to a recovery pipe , the recovery pipe is connected to a circulation pump, and the other end of the circulation pump is connected to the filter unit, so that the circulation pump can suck the electroplating solution in the electroplating tank, and pass the electroplating solution through the filter unit, the liquid supply pipe, The spray pipes are sent into the electroplating tank to form the circulation and backflow of the electroplating solution, and the electroplating solution is filtered by the filter unit; and the liquid supply pipe has several flow windows. 如請求項1所述之扇出型面板級封裝電鍍之電鍍設備構造,其中,該掛架分別於二側設有一插置部,該驅動架上對應該插置部而設有一插槽,將該插置部插設於該插槽,該驅動架上、該插槽一側設一壓制單元,該壓制單元可選自油壓機構並具有一壓桿,用以藉該壓桿強力壓下該插置部插設於該插槽中。 The electroplating equipment structure for fan-out panel level packaging electroplating as described in claim 1, wherein, the hanger is respectively provided with an insertion part on both sides, and the drive frame is provided with a slot corresponding to the insertion part, and The insertion part is inserted into the slot, and a pressing unit is provided on the drive frame and one side of the slot. The pressing unit can be selected from a hydraulic mechanism and has a pressing rod, which can be used to forcefully press down the The insertion part is inserted into the slot. 如請求項1所述之扇出型面板級封裝電鍍之電鍍設備構造,其中,該電鍍槽內底部具有一過濾器,用以防止較大異物流入電鍍液循環回流管路中。 The electroplating equipment structure for fan-out panel level packaging electroplating as described in claim 1, wherein the bottom of the electroplating tank has a filter to prevent relatively large foreign matter from flowing into the electroplating solution circulation return line.
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CN117187926A (en) * 2023-11-03 2023-12-08 合肥矽迈微电子科技有限公司 Roller structure for electroplating packaging body, electroplating device and method

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DE550284C (en) * 1929-10-18 1932-08-04 Siemens & Halske Akt Ges Process for the galvanic coating of mass-produced goods and equipment for this
JP3046594B1 (en) * 1999-04-02 2000-05-29 日本テクノ株式会社 Anodizing system for metals utilizing vibrating flow agitation
TWM361505U (en) * 2009-03-06 2009-07-21 Yui Tai Entpr Co Ltd Vehicle for rack plating
CN112160015B (en) * 2020-08-30 2023-12-19 义乌市子鱼创意设计有限公司 Stainless steel surface silver plating device
CN112410863A (en) * 2020-11-10 2021-02-26 上海贵携机械有限公司 Electroplating is with upper and lower formula hanger that sways
TWM622850U (en) * 2021-08-13 2022-02-01 顏振益 Electroplating equipment structure for fan-out panel level package electroplating

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CN117187926A (en) * 2023-11-03 2023-12-08 合肥矽迈微电子科技有限公司 Roller structure for electroplating packaging body, electroplating device and method
CN117187926B (en) * 2023-11-03 2024-02-13 合肥矽迈微电子科技有限公司 Roller structure for electroplating packaging body, electroplating device and method

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