CN216156004U

CN216156004U - Novel electroplating bath scraping rod stirring device

Info

Publication number: CN216156004U
Application number: CN202121915912.3U
Authority: CN
Inventors: 罗继业; 梁剑伦; 廖代辉; 谭柏照; 高攀; 霍延平
Original assignee: Guangdong University of Technology
Current assignee: Guangdong University of Technology
Priority date: 2021-08-16
Filing date: 2021-08-16
Publication date: 2022-04-01
Anticipated expiration: 2031-08-16

Abstract

The utility model belongs to the technical field of electroplating equipment, and discloses a novel electroplating bath scraping rod stirring device.A plating bath and an overflow groove are separated by a side clapboard with a plurality of overflow ports, and the upper end of the plating bath is provided with a circulating swinging scraping rod; the lower ends of the two sides of the electroplating bath are respectively provided with a reflux inlet and a reflux outlet which are connected with a reflux filtering device; the upper electroplating bath and the lower electroplating bath are communicated through a bottom clapboard with a plurality of gaps, and the lower electroplating bath and the overflow groove are separated through an overflow groove bottom clapboard. The utility model has flexible speed control and position regulation functions, can obtain a coating with uniform height, has smoother coating surface, can effectively avoid the result of unidirectional inclination of the coating by using the scraping rod stirring device to replace an air bubbling device, and can filter and purify impurities generated in the electroplating process and pollutants brought by air by the reflux filtering device, thereby improving the quality of the coating.

Description

Novel electroplating bath scraping rod stirring device

Technical Field

The utility model belongs to the technical field of electroplating equipment, and particularly relates to a novel scraping rod stirring device for an electroplating bath.

Background

At present: electroplating is a process for plating a thin layer of other metals or alloys on the surface of some metals by using the principle of electrolysis, and is a process for attaching a layer of metal film on the surface of a metal or other material workpiece by using the action of electrolysis, thereby playing the roles of preventing metal oxidation, improving wear resistance, conductivity, light reflection, corrosion resistance, enhancing the appearance and the like. To obtain a high quality plated part, various factors related to electroplating, such as convection strength, current density, temperature, pH, etc., are often controlled. In order to reduce the concentration polarization phenomenon of the solution and prevent the occurrence of pinholes, pits and the like on the surface of a plated part, obviously, the convection strength is particularly important in the production of high-precision plated parts, the traditional air bubbling device easily causes the conditions that the surface of the plated part is inclined and the uniformity of a plating layer does not reach the standard, and pollutants such as oil stains, dust and the like can be introduced into the plating solution, so that the quality of the plating layer of the plated part is influenced.

Through the above analysis, the problems and defects of the prior art are as follows:

the traditional air bubbling device is easy to cause the conditions that the surface of a plated part is inclined and the uniformity of a plating layer does not reach the standard, and pollutants such as oil stain, dust and the like can be introduced into the plating solution, so that the quality of the plating layer of the plated part is influenced.

SUMMERY OF THE UTILITY MODEL

Aiming at the problems in the prior art, the utility model provides a novel scraping rod stirring device for an electroplating bath.

The utility model is realized in such a way that a novel electroplating bath scraping rod stirring device is provided with:

an electroplating bath and an overflow bath;

the electroplating bath and the overflow groove are separated by a side clapboard with a plurality of overflow ports, the upper end of the electroplating bath is provided with a circulating swinging scraping rod, and the circulating swinging scraping rod is connected with a controller through a connecting circuit;

the lower ends of the two sides of the electroplating bath are respectively provided with a reflux inlet and a reflux outlet which are connected with a reflux filtering device;

the electroplating bath is provided with an upper electroplating bath and a lower electroplating bath, the upper electroplating bath and the lower electroplating bath are communicated through a bottom partition plate with a plurality of gaps, and the lower electroplating bath is separated from the bottom of the overflow tank through an overflow tank bottom partition plate with a liquid discharge hole.

Further, a cathode electrode sleeve and an anode electrode sleeve are arranged in the upper electroplating bath, the cathode electrode sleeve and the anode electrode sleeve are clamped above the upper electroplating bath, a cathode is arranged on the cathode electrode sleeve, and an anode is arranged on the anode electrode sleeve; the cathode is fixed, a reflux inlet is arranged below the cathode, and the anode is adjustable.

Further, the backflow filtering device is provided with a circulating pump and a filtering device which are communicated, the circulating pump is communicated with the backflow liquid outlet through a connecting pipeline, and the filtering device is communicated with the backflow liquid inlet through a connecting pipeline.

Furthermore, a return valve is arranged on a connecting pipeline between the circulating pump and the return liquid outlet.

Further, the liquid discharging hole is communicated with a waste liquid discharging port, the waste liquid discharging port is provided with the side face of the electroplating bath, and the waste liquid discharging port is communicated with a waste liquid valve through a connecting pipeline.

Further, the liquid discharging hole is connected with a liquid discharging switch.

By combining all the technical schemes, the utility model has the advantages and positive effects that:

the utility model uses a circular scraping rod stirring device to replace an air bubbling device. In the electroplating process, the convection strength and the convection mode have great influence on the quality of the coating. For air bubbling, the convection direction is unidirectional, so that the unidirectional inclination of the coating is easily caused, and the scraping rod stirring device is a device which circularly swings and stirs at a constant speed, so that the convection strength of the surface of the coating is basically equal, the surface of the coating with higher uniformity can be obtained, and the surface of the coating is smoother. And when the circulating scraping rod stirring device is used together with the reflux filtering device, impurities generated in the electroplating process and pollutants brought by air can be filtered and purified, so that the quality of the plating layer is improved.

The utility model has flexible speed control and position regulation functions, and can ensure that the convection intensity of the surface of the coating is equal, and obtain a highly uniform coating, so that the scraping rod stirring device is used for replacing an air bubbling device, and the result of unidirectional inclination of the coating can be effectively avoided. The utility model has the advantages of simple matching, good electroplating effect and convenient cleaning and maintenance.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments of the present application will be briefly described below, and it is obvious that the drawings described below are only some embodiments of the present application, and it is obvious for those skilled in the art that other drawings can be obtained from the drawings without creative efforts.

FIG. 1 is a schematic structural view of a novel stirring device for a plating bath scraping rod provided by an embodiment of the utility model.

Fig. 2 is a schematic top view of a novel stirring device for a plating bath scraping rod provided by an embodiment of the utility model.

In the figure: 1. an electroplating bath; 2. an overflow trough; 3. circularly swinging the scraping rod; 4. a return valve; 5. a circulation pump; 6. a filtration device; 7. a cathode; 8. an anode; 10. a waste liquid valve; 11. a bottom partition; 12. a reflux inlet; 13. a waste liquid discharge port; 21. a side partition plate; 22. a bottom clapboard of the overflow tank; 23. a reflux liquid outlet; 24. a tapping hole; 25. a liquid discharging switch.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail with reference to the following embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the utility model and are not intended to limit the utility model.

Aiming at the problems in the prior art, the utility model provides a novel scraping rod stirring device for an electroplating bath, and the utility model is described in detail below with reference to the attached drawings.

As shown in fig. 1 and 2, the novel scraping rod stirring device for an electroplating tank provided by the embodiment of the utility model comprises an electroplating tank 1, an overflow tank 2, a circulating swinging scraping rod 3 and a filtering device 6.

The electroplating bath 1 is divided into two layers, a cathode 7 fixed position and an adjustable anode 8 position are arranged in the upper layer, a backflow liquid inlet 12 and a waste liquid outlet 13 are arranged in the lower layer, the backflow liquid inlet 12 and the waste liquid outlet 13 are used for circulating plating liquid of a backflow filtering device, a valve 10 is connected behind the waste liquid outlet 13, the upper layer and the lower layer of the electroplating bath are communicated by a bottom clapboard 11 with a plurality of gaps, a side clapboard 21 with a plurality of overflow ports and a bottom clapboard 22 with a liquid discharge hole 24 are arranged between the electroplating bath and an overflow groove at a certain height and separated, the liquid discharge hole 24 is provided with a liquid discharge switch 25, a circulating swinging scraping rod device 3 with controllable speed and adjustable position is arranged above the electroplating bath, and the circulating swinging scraping rod device 3 is connected with a controller. The reflux liquid outlet 23 under the bottom of the overflow tank is connected with a reflux valve 4 and then connected with a circulating pump 5, and the filtrate after passing through the filtering device 6 flows back to the original plating solution from the reflux liquid inlet 12 of the plating tank to play a role in purifying the plating solution.

The circulating swing scraping rod device 3 arranged above the electroplating bath 1 can flexibly adjust the back-and-forth swing speed of the circulating swing scraping rod 3 and the relative distance between the circulating swing scraping rod 3 and a plated part (cathode 7) according to the requirements of the electroplating process, ensure that the swing path of the circulating swing scraping rod 3 is parallel to the plating surface, ensure that the convection intensity of the surface of the part to be plated is equal, and obtain a plating layer with uniform height.

The plating solution is stirred by the scraping rod which moves at a uniform speed in the circularly swinging scraping rod 3, so that the convection strength of the surface of the plated part is uniform; a reflux inlet 12 is arranged below the cathode, so that the position of the cathode is fixed, and the influence on the convection strength of a plated part is avoided when the reflux flows back; the anode can be adjusted because the distance between the cathode and the anode has an effect on the coating during electroplating.

The working principle of the utility model is as follows:

when the utility model is used, after the plating bath 1 is filled with the plating solution, the plating solution overflows to the overflow groove 2 from the side partition plate 21 with a plurality of overflow ports, the reflux valve 4 and the circulating pump 5 are opened to convey the plating solution to the filtering device 6 from the discharge port 23 below the bottom of the overflow groove, and the filtered and purified filtrate is conveyed to the original plating solution of the plating bath 1 through a pipeline.

The filtering device can effectively remove impurities generated in the electroplating process and introduced in the environment, so that the surface quality of the coating is ensured.

The upper layer and the lower layer of the electroplating bath are communicated by using a bottom clapboard 11 with a plurality of gaps, the electroplating bath is refluxed to the original electroplating bath from a reflux inlet 12 after being subjected to circulating reflux filtration, and the bottom clapboard 11 can obviously weaken the influence of the reflux on the convection condition of the electroplating bath on the upper layer of the electroplating bath, thereby avoiding the condition of poor uniformity of the plating layer.

The circulating swinging scraping rod device 3 can enable the convection condition of the surface of a plated part to be equal, impurities generated in the electroplating process and introduced in the environment can be effectively removed by the overflow groove plating solution through the filtering backflow device, so that the surface quality of a plating layer is ensured, and the uniformity and the quality of the plating layer can be effectively improved when the circulating swinging scraping rod device 3 is used with the backflow filtering device in the electroplating process.

When electroplating copper column was carried out to the novel plating bath scraping rod agitating unit of using plating bath air bubbling device respectively, can find, obvious tilt up-and-down phenomenon appeared in air bubbling device's electroplating result, and can obtain smooth copper column using scraping rod agitating unit.

After the electroplating is finished, the liquid discharging hole 24 and the valve 10 in the partition plate 22 at the bottom of the overflow tank are opened, so that all the residual plating solution is discharged from the waste liquid discharge port 13, and the electroplating tank is easy to clean and convenient to maintain.

In the description of the present invention, "a plurality" means two or more unless otherwise specified; the terms "upper", "lower", "left", "right", "inner", "outer", "front", "rear", "head", "tail", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are only for convenience in describing and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, should not be construed as limiting the utility model. Furthermore, the terms "first," "second," "third," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

The above description is only for the purpose of illustrating the present invention and the appended claims are not to be construed as limiting the scope of the utility model, which is intended to cover all modifications, equivalents and improvements that are within the spirit and scope of the utility model as defined by the appended claims.

Claims

1. The utility model provides a novel plating bath scraping rod stirring device, its characterized in that, novel plating bath scraping rod stirring device is provided with:

an electroplating bath and an overflow bath;

2. The novel scraping rod stirring device for the electroplating bath as claimed in claim 1, wherein a cathode electrode sleeve and an anode electrode sleeve are arranged in the upper electroplating bath, the cathode electrode sleeve and the anode electrode sleeve are clamped above the upper electroplating bath, a cathode is arranged on the cathode electrode sleeve, and an anode is arranged on the anode electrode sleeve; the cathode is fixed, a reflux inlet is arranged below the cathode, and the anode is adjustable.

3. The novel scraping rod stirring device for the electroplating bath as claimed in claim 1, wherein the reflux filtering device is provided with a circulating pump and a filtering device which are communicated, the circulating pump is communicated with the reflux liquid outlet through a connecting pipeline, and the filtering device is communicated with the reflux liquid inlet through a connecting pipeline.

4. The novel scraping rod stirring device for the electroplating tank as claimed in claim 3, wherein a return valve is arranged on a connecting pipeline between the circulating pump and the return liquid discharge port.

5. The novel plating bath scraping rod stirring device as claimed in claim 1, wherein the tapping hole is communicated with a waste liquid discharge port, the waste liquid discharge port is provided with a plating bath side surface, and the waste liquid discharge port is communicated with a waste liquid valve through a connecting pipeline.

6. The novel plating bath scraping rod stirring device as claimed in claim 1, wherein a tapping switch is connected to the tapping hole.